Mag Layers MHSC-2012C User Manual
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
B
Terminal
E
A
G
F
E
Terminal wraparound :
Approx. 0.38mm both ends
C
D
A : 2.2 ± 0.2 mm
B : 1.45 ± 0.2 mm
C : 1.30 ± 0.15 mm
D : 0.65± 0.25 mm
E : 0.44 ± 0.1 mm
F : 1.15 ± 0.1 mm
G : 1.27± 0.1 mm
Equivalent circuit
No Polarity
SEE TABLE 1
TEST INSTRUMENTS
L,Q : HP 4291B IMPEDANCE ANALYZER (or equivalent)
SRF : ENA E5071B NETWORK ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
(3)-2 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MHSC-2012C-SERIES Page-1/7
TABLE 1
MAGLAYERS
PT/NO.
MHSC-2012C-2N2□
MHSC-2012C-2N7□
MHSC-2012C-2N8□
MHSC-2012C-3N0□
MHSC-2012C-3N3□
MHSC-2012C-5N1□
MHSC-2012C-5N6□
MHSC-2012C-6N2□
MHSC-2012C-6N8□
MHSC-2012C-7N5□
MHSC-2012C-8N2□
MHSC-2012C-8N7□
MHSC-2012C-10N□
MHSC-2012C-12N□
MHSC-2012C-14N□
MHSC-2012C-15N□
MHSC-2012C-16N□
MHSC-2012C-18N□
MHSC-2012C-22N□
MHSC-2012C-24N□
MHSC-2012C-27N□
MHSC-2012C-33N□
MHSC-2012C-36N□
MHSC-2012C-39N□
MHSC-2012C-43N□
MHSC-2012C-47N□
MHSC-2012C-56N□
MHSC-2012C-68N□
MHSC-2012C-75N□
MHSC-2012C-82N□
MHSC-2012C-91N□
MHSC-2012C-R10□
MHSC-2012C-R11□
MHSC-2012C-R12□
MHSC-2012C-R15□
MHSC-2012C-R16□
MHSC-2012C-R18□
MHSC-2012C-R20□
MHSC-2012C-R22□
MHSC-2012C-R24□
MHSC-2012C-R25□
MHSC-2012C-R27□
MHSC-2012C-R33□
MHSC-2012C-R36□
MHSC-2012C-R39□
MHSC-2012C-R43□
MHSC-2012C-R47□
MHSC-2012C-R56□
MHSC-2012C-R62□
MHSC-2012C-R68□
MHSC-2012C-R75□
MHSC-2012C-R82□
MHSC-2012C-R91□
MHSC-2012C-1R0□
MHSC-2012C-1R2□
MHSC-2012C-1R5□
MHSC-2012C-1R8□
MHSC-2012C-2R2□
MHSC-2012C-2R7□
※ 1. Please specify the inductance tolerance, G(±2%),J(±5%),K(±10%)
2. IDC for a 15°C rise above 25°C ambient.
Inductance Percent L Freq. Quality Q Freq. SRF DCR IDC
L(nH) Tolerance (MHz) Min. (MHz) (MHz)Min. (Ω) Max. (mA) Max.
2.2 K 250 50 1000 7900 0.05 800
2.7 J,K 250 50 1500 7900 0.058 800
2.8 J,K 250 55 1500 7900 0.06 800
3.0 J,K 250 55 1500 7900 0.08 800
3.3 J,K 250 45 1500 7900 0.12 600
5.1 J,K 250 60 1000 5800 0.06 600
5.6 J,K 250 65 1000 5500 0.08 600
6.2 J,K 250 50 1000 5500 0.11 800
6.8 J,K 250 50 1000 5500 0.11 600
7.5 J,K 250 50 1000 4500 0.14 600
8.2 J,K 250 50 1000 4700 0.16 600
8.7 J,K 250 50 1000 4700 0.23 600
10 G,J,K 250 60 500 4200 0.10 600
12 G,J,K 250 50 500 4000 0.15 600
14 G,J,K 250 50 500 3400 0.17 600
15 G,J,K 250 50 500 3400 0.17 700
16 G,J,K 250 50 500 3300 0.19 600
18 G,J,K 250 50 500 3300 0.20 600
22 G,J,K 250 55 500 2600 0.22 500
24 G,J,K 250 50 500 2000 0.22 500
27 G,J,K 250 55 500 2500 0.25 500
33 G,J,K 250 60 500 2050 0.27 500
36 G,J,K 250 55 500 1700 0.27 500
39 G,J,K 250 60 500 2000 0.29 500
43 G,J,K 200 60 500 1650 0.34 500
47 G,J,K 200 60 500 1650 0.31 700
56 G,J,K 200 60 500 1550 0.34 500
68 G,J,K 200 60 500 1450 0.38 500
75 G,J,K 200 60 500 1400 0.40 400
82 G,J,K 150 65 500 1300 0.42 400
91 G,J,K 150 65 500 1200 0.48 400
100 G,J,K 150 65 500 1200 0.46 400
110 G,J,K 150 50 250 1000 0.48 400
120 G,J,K 150 50 250 1100 0.51 400
150 G,J,K 100 50 250 920 0.56 400
160 G,J,K 100 50 250 900 0.60 400
180 G,J,K 100 50 250 870 0.64 400
200 G,J,K 100 50 250 865 0.68 400
220 G,J,K 100 50 250 850 0.70 400
240 G,J,K 100 44 250 690 1.00 350
250 G,J,K 100 48 250 680 1.00 350
270 G,J,K 100 48 250 650 1.00 350
330 G,J,K 100 48 250 750 1.40 310
360 G,J,K 100 48 250 650 1.45 300
390 G,J,K 100 48 250 560 1.50 290
430 G,J,K 50 33 100 430 1.70 290
470 G,J,K 50 30 100 375 1.76 250
560 G,J,K 25 23 50 340 1.90 230
620 G,J,K 25 23 50 220 2.20 210
680 G,J,K 25 23 50 188 2.20 190
750 G,J,K 25 23 50 200 2.30 180
820 G,J,K 25 23 50 215 2.35 180
910 J,K 25 22 50 210 2.40 180
1000 G,J,K 25 22 50 200 2.45 180
1200 G,J,K 7.9 16 7.9 160 2.45 170
1500 G,J,K 7.9 16 7.9 120 2.50 170
1800 G,J,K 7.9 16 7.9 80 2.50 170
2200 G,J,K 7.9 16 7.9 60 2.70 160
2700 G,J,K 7.9 16 7.9 50 3.80 160
MAG.LAYERS
MHSC-2012C-SERIES
Page-2/7
(4) RELIABILITY TEST METHOD
Item Specifications Test conditions
Solderability The metalized area must have 90% Dip pads in flux and dip in solder pot
minimum solder coverage. (96.5 Sn/3.5 Ag solder) at 260°C ±5°C.
Resistance to There must be no case deformation Inductors shall be reflowed onto a PC board
soldering heat or change in dimensions. using 96.5 Sn/3.5 Ag solder paste.
Inductance must not change more Solder process shall be at a maximum
than the stated tolerance. temperature of 260°C.
For 96.5 Sn/3.5 Ag solder paste:>217°C for
90 seconds
Vibration There must be no case deformation Solder specimen inductor on the test printed
or change in dimensions. circuit board.
Inductance must not change more Apply vibrations in each of the x,y and z
than the stated tolerance. directions for 2 house for a total of
6 hours.
Frequency : 10～50 Hz
Amplitude : 1.5 mm
High There must be no case deformation Inductors shall be subjected to temperature
temperature or change in dimensions.
resistance
Static Inductors must not have a shorted Inductors shall be subjected to temperature
Humidity or open winding.
Component Inductors shall be subjected to Inductors shall be reflow soldered (260°C
adhesion 1.8Kg ±5°C for 10 seconds) to a tinned copper
(push test) substrate. A force gauge shall be applied
Inductance must not change more Measure the test items after leaving the
than the stated tolerance. inductors at room temperature and humidity
Measure the test items after leaving the
125±2℃ for 50±12 hours.
for 2 hours.
85±2℃ and 90 to 95%RH. for ten 24-hours.
inductors at room temperature and humidity
for 2 hours.
to the side of the component.
The device must withstand the stated force
without a failure of the termination.
MAG.LAYERS
MHSC-2012C-SERIES Page-3/7
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