※ 1. □ Specify the inductance tolerance, G(±2%),J(±5%),K(±10%)
2. IDC:Based on temperature rise(△T=15℃ Typ.) at 25℃ ambient.
MAG.LAYERS
MHSC-1608C-SERIES
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(4) RELIABILITY TEST METHOD
Item SpecificationsTest conditions
SolderabilityThe metalized area must have 90%Dip pads in flux and dip in solder pot
minimum solder coverage.(96.5 Sn/3.5 Ag solder) at 255°C ±5°C.
Resistance toThere must be no case deformation Inductors shall be reflowed onto a PC board
soldering heator change in dimensions.using 96.5 Sn/3.5 Ag solder paste.
Inductance must not change more Solder process shall be at a maximum
than the stated tolerance.temperature of 260°C.
For 96.5 Sn/3.5 Ag solder paste:>217°C for
90 seconds
Vibration There must be no case deformation Solder specimen inductor on the test printed
or change in dimensions.circuit board.
Inductance must not change moreApply vibrations in each of the x,y and z directions
than the stated tolerance. for 2 house for a total of 6 hours.
Frequency : 10~50 Hz
Amplitude : 1.5mm
High There must be no case deformationInductors shall be subjected to temperature
temperatureor change in dimensions.
resistance
StaticInductors must not have a shortedInductors shall be subjected to temperature
Humidityor open winding.
ComponentInductors shall be subjected to Inductors shall be reflow soldered (255°C
adhesion0.90Kg±5°C for 10 seconds) to a tinned copper
(push test)substrate. A force gauge shall be applied
Inductance must not change moreMeasure the test items after leaving the
than the stated tolerance.inductors at room temperature and humidity
Measure the test items after leaving the
125±2℃ for 50±12 hours.
for 2 hours.
85±2℃ and 90 to 95%RH. for ten 24-hours.
inductors at room temperature and humidity
for 2 hours.
to the side of the component.
The device must withstand the stated force
without a failure of the termination.
MAG.LAYERS
MHSC-1608C-SERIES
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Item SpecificationsTest conditions
Low There must be no case deformationInductors shall be subjected to temperature
temperatureor change in dimensions.
storageInductance must not change moreMeasure the test items after leaving the
than the stated tolerance.inductors at room temperature and humidity
Resistance toThere must be no case deformation,Inductors must withstand 6 minutes of
solventchange in dimensions, or alcohol or water.
obliteration of marking.
Thermal There must be no case deformationInductors shall be subjected to 10 cycles
shockor change in dimensions.to the the following temperature cycle:
Inductance must not change more
than the stated tolerance.
-40±2℃ for 48±12 hours.
for 1 to 2 hours.
1 cycle
30 min.
+125℃
30 sec
-40℃
30 min.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
MAG.LAYERS
MHSC-1608C-SERIESPage 5/8
(5) RECOMMENDED SOLDERING CONDITIONS
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
Unit: mm
0.64
0.64
(5)-2 RECOMMENED REFLOW PATTERN
0.64
1.02
Temperature(℃)
300
260
200
150
100
50
Preheating
Solding
260℃
Natural Cooling
10 sec1 to 4 min.more than 2 min.
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering
iron tip directly touch the Ceramic body outside of terminal electrode.
3 seconds max. at 260℃.
Time
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MHSC-1608C-SERIES
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(6) PACKAGING
W : 8.0
P : 4.0
P0 : 4.0
P1 : 2.0
(6)-1 CARRIER TAPE DIMENSIONS (mm)
P
1
mm
mm
mm
mm
W
P
P
0
(6)-2 TAPING DIMENSIONS (mm)
There shall not continuation more than two vacancies of the product.
(360 mm)
Leader.
(50 pitches)
ChipBlank
Blank
(70 pitches)
(6)-3 REEL DIMENSIONS
C
MAG.LAYERS
D
AB
MHSC-1608C-SERIES
A : 180 mm
B : 60.0 mm
C : 13.0 mm
D : 12.0 mm
E : 8.4 mm
E
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(6)-4 TOP TAPE PEEL STRENGTH
The force for tearing off Top tape is 0.1~0.6(N) in the arrow direction at
the following conditions:
(6)-6 The products are packaged so that no damage will be sustained.
(7) ATTENTION IN CASE OF USING
In case of using product ,please avoid following matters:
Splashing water or salt water
Dew condenses
Toxic gas (Hydrogen sulfide, Sulfurous acid ,Chlorine, Ammonia)
Vibrations or shocks which exceed the specified condition
Please be careful for the stress to this product by board flexure or something
after the mounting.
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MHSC-1608C-SERIES
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TYPICAL ELECTRICAL CHARACTERISTICS
MAG.LAYERS
MHSC-1608C-SERIES
ATTACHMENT-1
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