Mag Layers MHQC-2520C User Manual

(1) SHAPES AND DIMENSIONS

A: 2.90 Max. mm

(2) ELECTRICAL SPECIFICATIONS

(3) CHARACTERISTICS

B: 2.54 Max. mm
C: 2.03 Max. mm
D: 1.3 Typ. mm
E: 0.45± 0.1 mm

SEE TABLE 1

TEST INSTRUMENTS
L,Q : HP 4291B IMPEDANCE ANALYZER (or equivalent)
SRF : ENA E5071B NETWORK ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3)-1 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-2 Storage temperature range ...... －40℃～＋125℃

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MHQC-2520C-SERIES

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TABLE 1

MAGLAYERS

PT/NO.

MHQC-2520C-4N1□
MHQC-2520C-7N8□
MHQC-2520C-10N□
MHQC-2520C-12N□
MHQC-2520C-18N□
MHQC-2520C-22N□
MHQC-2520C-33N□
MHQC-2520C-36N□
MHQC-2520C-39N□
MHQC-2520C-47N□
MHQC-2520C-56N□
MHQC-2520C-68N□
MHQC-2520C-82N□
MHQC-2520C-R10□
MHQC-2520C-R12□
MHQC-2520C-R15□
MHQC-2520C-R18□
MHQC-2520C-R22□
MHQC-2520C-R27□
MHQC-2520C-R33□
MHQC-2520C-R39□

Inductance Percent L Freq. Quality Q Freq. SRF DCR IDC

L(nH) Tolerance (MHz) Min. (MHz) (MHz)Min. (Ω) Max. (mA) Max.

4.1 J,K 50 75 1500 6000 0.05 1600

7.8 S,J,K 50 70 500 3800 0.05 1600
10 J,K 50 60 500 3600 0.06 1600
12 J,K 50 60 500 2800 0.06 1500
18 G,J,K 50 62 350 2700 0.07 1400
22 G,J,K 50 62 350 2050 0.07 1400
33 G,J,K 50 75 350 1700 0.09 1300
36 G,J,K 50 75 350 1500 0.12 1300
39 G,J,K 50 75 350 1300 0.09 1300
47 G,J,K 50 75 350 1450 0.12 1200
56 G,J,K 50 75 350 1200 0.12 1200
68 G,J,K 50 80 350 1150 0.13 1100
82 G,J,K 50 80 350 1060 0.16 1100

100 G,J,K 50 62 350 1000 0.18 1000
120 G,J,K 25 50 100 870 0.18 1000
150 G,J,K 25 50 100 850 0.23 1000
180 G,J,K 25 50 100 800 0.30 1000
220 G,J,K 25 50 100 750 0.35 1000
270 G,J,K 25 48 100 630 0.40 900
330 G,J,K 25 48 100 570 0.47 900
390 G,J,K 25 48 100 500 0.62 900

※ 1.specify the inductance tolerance, S(±0.3%),G(±2%),J(±5%),K(±10%)

2. IDC : Based on temperature rise(△T=15℃ Typ.) at 25℃ ambient.

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(4) RELIABILITY TEST METHOD

Item Specifications Test conditions

Solderability The metalized area must have 95% Dip pads in flux and dip in solder pot

minimum solder coverage. (96.5 Sn/3.5 Ag solder) at 255°C ±5°C.
Resistance to There must be no case deformation Inductors shall be reflowed onto a PC board
soldering heat or change in dimensions. using 96.5 Sn/3.5 Ag solder paste.

Inductance must not change more Solder process shall be at a maximum

than the stated tolerance. temperature of 260°C.

For 96.5 Sn/3.5 Ag solder paste:>217°C for
90 seconds

Vibration There must be no case deformation Solder specimen inductor on the test printed

or change in dimensions. circuit board.

Inductance must not change more Apply vibrations in each of the x,y and z directions

than the stated tolerance. for 2 house for a total of 6 hours.

Frequency : 10~50 Hz
Amplitude : 1.5mm

High There must be no case deformation Inductors shall be subjected to temperature
temperature or change in dimensions.

resistance

Static Inductors must not have a shorted Inductors shall be subjected to temperature
Humidity or open winding.

Component Inductors shall be subjected to Inductors shall be reflow soldered (255°C
adhesion 1.8Kg ±5°C for 10 seconds) to a tinned copper
(push test) substrate. A force gauge shall be applied

Inductance must not change more Measure the test items after leaving the

than the stated tolerance. inductors at room temperature and humidity

Measure the test items after leaving the

125±2℃ for 50±12 hours.

for 2 hours.

85±2℃ and 90 to 95%RH. for ten 24-hours.

inductors at room temperature and humidity
for 2 hours.

to the side of the component.
The device must withstand the stated force
without a failure of the termination.

MAG.LAYERS

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