Mag Layers MHQC-2520C User Manual

(1) SHAPES AND DIMENSIONS
A: 2.90 Max. mm
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
B: 2.54 Max. mm C: 2.03 Max. mm D: 1.3 Typ. mm E: 0.45± 0.1 mm
SEE TABLE 1
TEST INSTRUMENTS L,Q : HP 4291B IMPEDANCE ANALYZER (or equivalent) SRF : ENA E5071B NETWORK ANALYZER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-2 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO.
MHQC-2520C-4N1 MHQC-2520C-7N8 MHQC-2520C-10N MHQC-2520C-12N MHQC-2520C-18N MHQC-2520C-22N MHQC-2520C-33N MHQC-2520C-36N MHQC-2520C-39N MHQC-2520C-47N MHQC-2520C-56N MHQC-2520C-68N MHQC-2520C-82N MHQC-2520C-R10 MHQC-2520C-R12 MHQC-2520C-R15 MHQC-2520C-R18 MHQC-2520C-R22 MHQC-2520C-R27 MHQC-2520C-R33 MHQC-2520C-R39
Inductance Percent L Freq. Quality Q Freq. SRF DCR IDC
L(nH) Tolerance (MHz) Min. (MHz) (MHz)Min. (Ω) Max. (mA) Max.
4.1 J,K 50 75 1500 6000 0.05 1600
7.8 S,J,K 50 70 500 3800 0.05 1600 10 J,K 50 60 500 3600 0.06 1600 12 J,K 50 60 500 2800 0.06 1500 18 G,J,K 50 62 350 2700 0.07 1400 22 G,J,K 50 62 350 2050 0.07 1400 33 G,J,K 50 75 350 1700 0.09 1300 36 G,J,K 50 75 350 1500 0.12 1300 39 G,J,K 50 75 350 1300 0.09 1300 47 G,J,K 50 75 350 1450 0.12 1200 56 G,J,K 50 75 350 1200 0.12 1200 68 G,J,K 50 80 350 1150 0.13 1100 82 G,J,K 50 80 350 1060 0.16 1100
100 G,J,K 50 62 350 1000 0.18 1000 120 G,J,K 25 50 100 870 0.18 1000 150 G,J,K 25 50 100 850 0.23 1000 180 G,J,K 25 50 100 800 0.30 1000 220 G,J,K 25 50 100 750 0.35 1000 270 G,J,K 25 48 100 630 0.40 900 330 G,J,K 25 48 100 570 0.47 900 390 G,J,K 25 48 100 500 0.62 900
1.specify the inductance tolerance, S(±0.3%),G(±2%),J(±5%),K(±10%)
2. IDC : Based on temperature rise(T=15 Typ.) at 25 ambient.
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(4) RELIABILITY TEST METHOD
Item Specifications Test conditions
Solderability The metalized area must have 95% Dip pads in flux and dip in solder pot
minimum solder coverage. (96.5 Sn/3.5 Ag solder) at 255°C ±5°C. Resistance to There must be no case deformation Inductors shall be reflowed onto a PC board soldering heat or change in dimensions. using 96.5 Sn/3.5 Ag solder paste.
Inductance must not change more Solder process shall be at a maximum
than the stated tolerance. temperature of 260°C.
For 96.5 Sn/3.5 Ag solder paste:>217°C for 90 seconds
Vibration There must be no case deformation Solder specimen inductor on the test printed
or change in dimensions. circuit board.
Inductance must not change more Apply vibrations in each of the x,y and z directions
than the stated tolerance. for 2 house for a total of 6 hours.
Frequency : 10~50 Hz Amplitude : 1.5mm
High There must be no case deformation Inductors shall be subjected to temperature temperature or change in dimensions.
resistance
Static Inductors must not have a shorted Inductors shall be subjected to temperature Humidity or open winding.
Component Inductors shall be subjected to Inductors shall be reflow soldered (255°C adhesion 1.8Kg ±5°C for 10 seconds) to a tinned copper (push test) substrate. A force gauge shall be applied
Inductance must not change more Measure the test items after leaving the
than the stated tolerance. inductors at room temperature and humidity
Measure the test items after leaving the
125±2 for 50±12 hours.
for 2 hours.
85±2 and 90 to 95%RH. for ten 24-hours.
inductors at room temperature and humidity for 2 hours.
to the side of the component. The device must withstand the stated force without a failure of the termination.
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Item Specifications Test conditions Low There must be no case deformation Inductors shall be subjected to temperature temperature or change in dimensions. storage Inductance must not change more Measure the test items after leaving the
than the stated tolerance. inductors at room temperature and humidity
Resistance to There must be no case deformation, Inductors must withstand 6 minutes of solvent change in dimensions, or alcohol or water.
obliteration of marking. Thermal There must be no case deformation Inductors shall be subjected to 10 cycles shock or change in dimensions. to the the following temperature cycle:
Inductance must not change more
than the stated tolerance.
-40±2 for 48±12 hours.
for 1 to 2 hours.
1 cycle
30 min.
+125
30 sec
-40 30 min.
Measure the test items after leaving the inductors at room temperature and humidity for 2 hours.
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MHQC-2520C-SERIES Page-4/7
(5) RECOMMENDED SOLDERING CONDITIONS
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
Unit: mm
1.27
1.02
1.02
2.54
(5)-2 RECOMMENED REFLOW PATTERN
Temperature()
300 260 200 150 100
50
Preheating
Solding
260
10 sec1 to 4 min. more than 2 min.
Natural Cooling
Time
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering iron tip directly touch the Ceramic body outside of terminal electrode. 3 seconds max. at 260.
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(6) PACKAGING
W : 8.0
P : 4.0
P0 : 4.0
P1 : 2.0
t : 0.22
(6)-1 CARRIER TAPE DIMENSIONS (mm)
P
1
t
mm mm mm mm mm
W
P
P
0
(6)-2 TAPING DIMENSIONS (mm)
There shall not continuation more than two vacancies of the product.
(360 mm)
Leader.
ChipBlank
(50 pitches)
Blank
(70 pitches)
(6)-3 REEL DIMENSIONS
MAG.LAYERS
C
AB
MHQC-2520C-SERIES
D
A : 180 mm B : 60.0 mm C : 13.0 mm D : 14.4 mm E : 8.4 mm
E
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(6)-4 TOP TAPE PEEL STRENGTH
The force for tearing off cover tape is 0.1~0.6(N) in the arrow direction at the following conditions:
Temperature : 5 ~ 35 Humidity : 45 ~ 85% Atmospheric pressure : 860 ~ 1060 hpa
160 ~ 180
Top cover tape
Base tape
(6)-5 QUANTITY
2000 pcs/Reel
(6)-6 The products are packaged so that no damage will be sustained.
(7) ATTENTION IN CASE OF USING
In case of using product ,please avoid following matters: Splashing water or salt water Dew condenses Toxic gas (Hydrogen sulfide, Sulfurous acid ,Chlorine, Ammonia) Vibrations or shocks which exceed the specified condition Please be careful for the stress to this product by board flexure or something after the mounting.
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TYPICAL ELECTRICAL CHARACTERISTICS
MAG.LAYERS
MHQC-2520C-SERIES
ATTACHMENT-1
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