Mag Layers MCM-9070M User Manual

. SCOPE
(1) SHAPES AND DIMENSIONS
This specification applies to the Pb Free high current type SMD Common mode filter for MCM-9070M-SERIES
PRODUCT INDENTIFICATION MCM - 9070M - 301
Product Code Dimensions Code Impedance Code
A: 9.0±0.5 mm B: 7.0±0.5 mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS Z : HP 4291B IMPEDANCE ANALYZER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent) I.R : CHROMA MODEL 19073 AC/DC/IR HIPOT TESTER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Temperature rise ................... 40 Max.
(3)-2 Ambient temperature ……......... 60 Max.
C: 4.8Max. mm D: 5.7Typ. mm E: 1.5±0.2 mm F: 2.0±0.2 mm G: 1.7±0.2 mm
(3)-3 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-4 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS PT/NO.
MCM-9070M-301 MCM-9070M-501 MCM-9070M-701 MCM-9070M-102
Impedance(Ω)
at 100MHz
Min. Typ. (A) Max. (MΩ) Min.
225 300 6m 6.0 10 50 450 600 8m 5.5 10 50 500 700 10m 5.0 10 50 750 1000 13m 4.0 10 50
Resistance RDC(Ω)
Max.(1 line)
Rated Insulation
Current Resistance
Rated Voltage (V)Max.
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(4) RELIABILITY TEST METHOD
2 min
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder ability The product shall be connected to the test Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm). Refer to clause 8 for Reflow profile.
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering Soldering heat (reflow soldering)
300 250
200
150
100
Sodering temperature ()
50
soldering (Peak temperature 260±3 10 sec
30 sec Min
Pre-heating
150 ~ 180
10 sec.
+0
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength The terminal electrode and the ferrite must Solder a chip to test substrate , and then laterally apply
not damaged. a load 9.8N in the arrow direction.
Strength on PC boardThe terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load. bending not damaged.
High temperature resistance
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit Insulation resistance and DC resistance on the board,the test shall be done. specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min. The terminal electrode and the ferrite must not
Temperature : +85±2
damaged. Applied voltage : Rated voltage
Applied current : Rated current Testing time : 500±12 hours
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS Humidity Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit resistance Insulation resistance and DC resistance on the board,the test shall be done.
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min. The terminal electrode and the ferrite must not damaged. Applied voltage : Rated voltage
Thermal shock Impedance:Within± 20% of the initial value.
Insulation resistance and DC resistance on the specification(refer to clause 2-1) shall be met. The terminal electrode and the ferrite must not damaged.
Temperature : +60±2 , Humidity : 90 to 95 %RH
Applied current : Rated current Testing time : 500±12 hours
Low temperature
storage
Vibration Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit
Solderability
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test Insulation resistance and DC resistance on the circuit board,the test shall be done.
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min. The terminal electrode and the ferrite must not damaged. Testing time : 500±12 hours
Insulation resistance and DC resistance on board,the test shall be done. the specification(refer to clause 2-1) Frequency : 10 to 55 Hz shall be met. Amplitude : 1.52 mm The terminal electrode and the ferrite must Dimension and times : X ,Y and Z directions not damaged. for 2 hours each.
New solder More than 75% Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
Temperature : -40±2
over the whole of the sample before hard, the sample shall then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth
0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 75% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN) Unit:mm
(6) TEST EQUIPMENT
(6)-1 Impedance
Measured by using HP4291B RF Impedance Analyzer.
Measurement terminal
(6)-2 DC Resistance Measured by using Chroma 16502 milliohm meter.
Measurement terminal
(6)-3 Insulation Resistance
Measured by using Chroma 19073 Measurement voltage : 50v ,Measurement time : 60 sec.
Measurement terminal
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
700pcs/Reel The products are packaged so that no damage will be sustained.
:24
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TYPICAL ELECTRICAL CHARACTERISTICS
Common Mode Differential Mode
10000
1000
100
Impedance(Ω)
MCM-9070M-301
10
1
1 10 100 1000
Frequency(MHz)
MCM-9070M-501
10000
1000
100
Impedance(Ω)
10
1
1 10 100 1000
Frequency(MHz)
Common Mode Differential Mode
MCM-9070M-701
10000
1000
100
Impedance(Ω)
10
1
1 10 100 1000
10000
1000
100
10
Impedance(Ω)
1
Frequency(MHz)
MCM-9070M-102
Common Mode Differential Mode
Common Mode Differential Mode
1 10 100 1000
Frequency(MHz)
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