Ⅰ
. SCOPE
(1) SHAPES AND DIMENSIONS
：
This specification applies to the Pb Free high current type SMD Common mode filter
for MCM-9070M-SERIES
PRODUCT INDENTIFICATION
MCM - 9070M - 301
① ② ③
① Product Code
② Dimensions Code
③ Impedance Code
A: 9.0±0.5 mm
B: 7.0±0.5 mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
Z : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
I.R : CHROMA MODEL 19073 AC/DC/IR HIPOT TESTER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Temperature rise …................... ＋40℃ Max.
(3)-2 Ambient temperature ……......... ＋60℃ Max.
C: 4.8Max. mm
D: 5.7Typ. mm
E: 1.5±0.2 mm
F: 2.0±0.2 mm
G: 1.7±0.2 mm
(3)-3 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
(3)-4 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MCM-9070M-SERIES
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TABLE 1
MAGLAYERS PT/NO.
MCM-9070M-301
MCM-9070M-501
MCM-9070M-701
MCM-9070M-102
Impedance(Ω)
at 100MHz
Min. Typ. (A) Max. (MΩ) Min.
225 300 6m 6.0 10 50
450 600 8m 5.5 10 50
500 700 10m 5.0 10 50
750 1000 13m 4.0 10 50
Resistance RDC(Ω)
Max.(1 line)
Rated Insulation
Current Resistance
Rated
Voltage
(V)Max.
MAG.LAYERS
MCM-9070M-SERIES
Page 2/8
(4) RELIABILITY TEST METHOD
2 min
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder ability The product shall be connected to the test Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm). Refer to clause 8 for Reflow profile.
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering
Soldering heat
(reflow soldering)
300
250
200
150
100
Sodering temperature (℃)
50
soldering
(Peak temperature 260±3℃ 10 sec
30 sec Min
Pre-heating
150 ~ 180℃
10
sec.
+0
Slow cooling
(Stored at room
temperature)
2 min. or more
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength The terminal electrode and the ferrite must Solder a chip to test substrate , and then laterally apply
not damaged. a load 9.8N in the arrow direction.
Strength on PC boardThe terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
bending not damaged.
High
temperature
resistance
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit
Insulation resistance and DC resistance on the board,the test shall be done.
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min.
The terminal electrode and the ferrite must not
Temperature : +85±2℃
damaged. Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
MAG.LAYERS
MCM-9070M-SERIES Page 3/8
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