Mag Layers MCM-7060M User Manual
Ⅰ
. SCOPE
：
This specification applies to the Pb Free high current type SMD Common mode filter
for MCM-7060M-SERIES
PRODUCT INDENTIFICATION
MCM-7060M- 301
① ② ③
① Product Code
② Dimensions Code
③ Impedance Code
(1) SHAPES AND DIMENSIONS
A: 7.0±0.5 mm
B: 6.0±0.5 mm
C: 3.8Max. mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
Z : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Temperature rise …................... ＋40℃ Max.
(3)-2 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
D: 3.5Typ. mm
E: 1.5±0.2 mm
F: 1.5±0.2 mm
G: 1.75±0.2 mm
(3)-3 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MCM-7060M-SERIES
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TABLE 1
CHARACTERISTICS(REFERENCE)
Impedance(Ω)
Common mode
Differential mode
Common mode
Common mode
MAGLAYERS PT/NO. at 100MHz
MCM-7060M-101
MCM-7060M-301
MCM-7060M-501
MCM-7060M-601
MCM-7060M-701
MCM-7060M-102
MCM-7060M-132
Min. Typ. (A) Max. (MΩ) Min.
100 140 10m 9 10 80
225 300 10m 5 10 80
275 350 10m 5 10 80
500 700 15m 4 10 80
500 700 15m 4 10 80
800 1020 17m 3 10 80
910 1300 21m 2.5 10 80
Resistance RDC(Ω)
Max.(1 line)
Rated Insulation
Current Resistance
Rated
Voltage
(V)Max.
10000
MCM-7060M-301
1000
100
10
IMPEDANCE(Ohm)
1
1 10 100 1000
FREQUENCY(MHz)
10000
1000
100
MCM-7060M-701
Differential mode
10000
1000
100
10
IMPEDANCE(Ohm)
1
1 10 100 1000
MCM-7060M-601
Common mode
Differential mode
FREQUENCY(MHz)
MCM-7060M-102
10000
1000
100
10
IMPEDANCE(Ohm)
1
1 10 100 1000
FREQUENCY(MHz)
CIRCUIT DIAGRAM
MAG.LAYERS
10
IMPEDANCE(Ohm)
1
MCM-7060M-SERIES
1 10 100 1000
FREQUENCY(MHz)
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(4) RELIABILITY TEST METHOD
2 min
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder ability The product shall be connected to the test Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm). Refer to clause 8 for Reflow profile.
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering
Soldering heat
(reflow soldering)
300
250
200
150
100
Sodering temperature (℃)
50
soldering
(Peak temperature 260±3℃ 10 sec
30 sec Min
Pre-heating
150 ~ 180℃
10
sec.
+0
Slow cooling
(Stored at room
temperature)
2 min. or more
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength The terminal electrode and the ferrite must Solder a chip to test substrate , and then laterally apply
not damaged. a load 9.8N in the arrow direction.
Strength on PC boardThe terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
bending not damaged.
High
temperature
resistance
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit
Insulation resistance and DC resistance on the board,the test shall be done.
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min.
The terminal electrode and the ferrite must not
Temperature : +85±2℃
damaged. Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
MAG.LAYERS
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