Ⅰ
. SCOPE
：
This specification applies to the Pb Free high current type SMD Common mode filter
for MCM-1211M-SERIES
PRODUCT INDENTIFICATION
MCM - 1211M - 701
① ② ③
① Product Code
② Dimensions Code
③ Impedance Code
(1) SHAPES AND DIMENSIONS
A: 12.0±0.5 mm
B: 10.8±0.5 mm
C: 6.4 Max. mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
Z : HP 4291B IMPEDANCE ANALYZER (or equivalent)
Z : HP 4285 IMPEDANCE ANALYZER (or equivalent) (For MCM-1211F-272)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
I.R : CHROMA MODEL 19073 AC/DC/IR HIPOT TESTER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature ……......... ＋60℃ Max.
(3)-2 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
D: 7.0 Typ. mm
E: 2.7±0.2 mm
F: 2.5±0.2 mm
G: 2.5±0.2 mm
(3)-3 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MCM-1211M-SERIES
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TABLE 1
MAGLAYERS PT/NO.
MCM-1211M-800
MCM-1211M-701
MCM-1211M-102
MCM-1211M-222
MCM-1211M-272
Impedance(Ω)
Min. Typ. (A) Max. (MΩ) Min.
80 230 100MHz/0.5V 2.0m 10.0 10 125
500 700 100MHz/0.5V 6.0m 8.0 10 125
750 1000 100MHz/0.5V 14 m 6.0 10 125
2200 2500 10MHz/0.5V 35 m 1.8 10 125
2300 2700 10MHz/0.5V 50 m 1.5 10 125
Test
Frequency
Resistance RDC(Ω)
Max.(1 line)
Rated Insulation
Current Resistance
Rated
Voltage
(V)Max.
MAG.LAYERS
MCM-1211M-SERIES
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(4) RELIABILITY TEST METHOD
Soldering temperature
2 min
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder ability The product shall be connected to the test Apply cream solder to the printed circuit board .
circuit board by the fillet (the height is 0.2mm). Refer to clause 8 for Reflow profile.
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering
Soldering heat
(reflow soldering)
300
250
200
150
100
soldering
(Peak temperature 260±3℃ 10 sec
Pre-heating
150 ~ 180℃
30 sec Min
+0
Slow cooling
(Stored at room
temperature)
50
10
sec.
2 min. or more
The specimen shall be passed through the reflow oven
with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric
eric conditions for 1 hour, after which the measurement
shall be made.
Terminal strength The terminal electrode and the ferrite must Solder a chip to test substrate , and then laterally apply
not damaged. a load 9.8N in the arrow direction.
Strength on PC board The terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
bending not damaged.
High
temperature
resistance
MAG.LAYERS
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test circuit
Insulation resistance and DC resistance on the board,the test shall be done.
specification(refer to clause 2-1) shall be met. Measurement : After placing for 24 hours min.
The terminal electrode and the ferrite must not
Temperature : +85±2℃
damaged. Applied voltage : Rated voltage
Applied current : Rated current
Testing time : 500±12 hours
MCM-1211M-SERIES
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