Mag Layers MCI-2012 User Manual

SCOPE

：

This specification applies to the Pb Free Common mode filters

(1) SHAPES AND DIMENSIONS

(2) ELECTRICAL SPECIFICATIONS

(3) CHARACTERISTICS

for MCI-2012-SERIES-□□

PRODUCT INDENTIFICATION
MCI- 2012 - 900 -□□

① ② ③ ④

① Product Code
② Dimensions Code
③ Impedance Code
④ Inner Control Code

A: 2.0±0.20 mm
B: 1.2±0.20 mm
C: 0.17 Typ. mm
D: 1.2±0.20 mm
E: 0.45 Typ. mm
F: 0.40 Typ. mm

SEE TABLE 1

TEST INSTRUMENTS
Z : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
I.R : CHROMA MODEL 19073 AC/DC/IR HIPOT TESTER (or equivalent)

(3)-1 Temperature rise ...................... ＋20℃ Max.

(3)-2 Ambient temperature ................ ＋60℃ Max.

(3)-3 Operate temperature range …... －25℃～＋85℃
(Including self temp. rise)

(3)-4 Storage temperature range ...... －40℃～＋85℃

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TABLE 1

MAGLAYERS

PT/NO.
MCI-2012-670 67 ±25% 0.25 50 400 125 10
MCI-2012-900 90 ±25% 0.35 50 330 125 10
MCI-2012-121 120±25% 0.30 50 370 125 10
MCI-2012-181 180±25% 0.35 50 330 125 10
MCI-2012-201 200±25% 0.35 50 330 125 10
MCI-2012-261 260±25% 0.40 50 300 125 10
MCI-2012-371 370±25% 0.40 50 280 125 10

Impedance Z(Ω)

@ 100MHz/0.5V

RDC (Ω)

Max.

Rated Voltage

Vdc(V)

Idc

Max.(mA)

Withstanding

Voltage

Vdc(V)

TEST EQUIPMENT

1. Impedance
Measured by using HP 4291B RF Impedance Analyzer.

Insulation

Resistance

(MΩ)Min.

2. DC Resistance
Measured by using Chroma 16502 mill ohm meter

3. Insulation Resistance
Measured by using Chroma 19073
Measurement voltage: 50v, Measurement time: 60 sec.

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MCI-2012-SERIES Page-2/7

(4) RELIABILITY TEST METHOD

Item

Solder ability It can be connected on the Apply cream solder to the test circuit board .

Recommendation soldering condition. It is mounted on the recommendation soldering condition.

Terminal The terminal electrode and the ferrite Solder a chip to test substrate , and then laterally
strength must not be damaged. apply a load 0.5Kg in the arrow direction.

The terminal electrode and the ferrite Soldering a chip to a test substrate ,
must not be damaged. bend the substrate by 2mm and then return.

Specifications Test conditions

Dip pads in flux and dip in solder pot ( 96.5 Sn/3.5 Ag
solder) at 260°C ±5°C.

45

40

45

Width side

Strength on
pc board
bending

10

100

length

20

R10
Test board : Glass base epoxy multiplayer board pc board pattern.
PC board pattern : Recommended PC board pattern.

Force

Dimensions in mm

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MCI-2012-SERIES

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