
■
A
P
P
L
I
C
A
T
I
O
N
■
A
P
P
L
I
C
A
■
A
P
P
L
GMLB chip beads can be used in a variety of electronic applications including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
■
F
E
A
■
F
■
the latest in multilayer technology, we have developed chip beads that are able to
resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
Multi-line EMI Suppression
High Density Packaging
T
E
A
F
T
E
A
T
The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
M-series chip arrays contain four ferrite beads in a single package. This compact
design makes the M-series perfect for EMI suppression on multiple-lines.
M-series chip arrays have a compact package design that is an ideal for high density
packaging.
I
U
U
U
C
R
R
R
A
E
E
E
T
T
S
S
S
I
O
N
I
O
N
Multi-frequency Applications
M-series chip arrays are available in A-type and B-type. The A-type chip arrays are
designed for lower frequency applications. The B-type chip arrays are designed for
high frequency applications.
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P
R
O
D
U
C
T
I
D
E
N
T
I
F
I
C
A
T
I
O
N
■
P
R
O
D
U
C
T
I
D
E
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P
R
O
D
U
C
T
G M L B -
Product Code
Dimension Code
Impedance (at 100 MHz)
Series Type
Design Code
Code for Special Specification
*N8=A Type,N7=B Type
N
I
D
E
N
3 2 1 6 - 0 1 2 0 M 4 - N 8
T
T
I
F
I
C
A
I
F
T
I
C
A
T
I
O
N
I
O
N
□
□
□□
MAG.LAYERS
GMLB-3216-A Series

P
P
P
R
R
R
O
O
O
D
D
D
U
U
U
C
C
C
T
T
T
D
I
M
E
N
S
I
O
N
D
I
M
E
N
D
I
M
E
N
S
S
I
O
N
I
O
N
E
A
D P
PRODUCT
NO.
GMLB-3216
■
C
U
R
■
C
■
C
In operating temperatures exceeding +85℃, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
U
U
R
R
R
R
R
A B C D E P
3.2±0.2
(0.126±0.008)
E
N
T
N
N
T
T
D
D
D
E
E
(0.063±0.008)
E
R
A
E
R
A
E
R
A
1.6±0.2
T
I
N
T
I
N
T
I
N
B
G
G
G
C
(0.035±0.008)
0.9±0.2
0.4±0.2
(0.015±0.008)
NOTE:Dimensions in mm
0.3±0.2
(0.012±0.008)
0.8±0.1
(0.031±0.004)
Rated Current (A)
7
6
5
4
3
2
1.5
1
85 125
Operating Temperature(℃)
MAG.LAYERS
GMLB-3216-A Series

E
E
■ E
L
L
L
E
E
E
C
C
C
T
T
T
R
R
R
I
C
A
L
R
E
Q
U
I
R
E
M
E
N
T
I
C
A
L
R
E
Q
U
I
R
E
M
I
C
A
L
R
E
Q
U
I
R
E
M
E
E
N
N
T
T
S
S
S
Part Number
GMLB-3216-0030M4-N8
GMLB-3216-0060M4-N8
GMLB-3216-0120M4-N8
GMLB-3216-0240M4-N8
GMLB-3216-0300M4-N8
GMLB-3216-0470M4-N8
GMLB-3216-0600M4-N8
GMLB-3216-1000M4-N8
Temperature rise should be less than 40℃ for P-type and less than 25℃ for other
types when rated current is applied.
Impedance (Ω)
at 100 MHz
30±25% 350
60±25%
120±25%
240±25%
300±25%
470±25% 1.0
600±25% 1.5 100
1000±25% 1.7 50
RDC (Ω)
Max.
0.4
0.8
Rated Current
(mA) Max.
250
150
Operating
Temp. Range (℃)
-55 ~ +125
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E
A
S
U
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I
N
G
■
M
E
A
S
U
R
■
M
E
A
S
Test Instrument:
Z:
Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
RDC: Agilent 34401A
Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
U
R
I
I
N
N
G
G
M
M
M
E
E
E
T
T
T
H
H
H
O
O
O
D
D
D
/
C
O
N
D
I
T
I
O
N
/
C
O
N
D
I
/
C
O
N
D
T
I
T
I
O
N
I
O
N
MAG.LAYERS
GMLB-3216-A Series

P
A
C
P
A
C
P
A
C
Peel-off Force
K
K
K
A
A
A
G
G
G
I
N
G
I
N
G
I
N
G
The force for peeling off cover tape is 10 grams in the arrow direction.
Dimension (Unit: mm)
A
B
C
D
TOP COVER TAPE
F
TYPE
8 mm 178±1
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1
E
A
B
60 +0.5
-0
C D E
- 13 ±0.2 9 ±0.5 12 ±0.5
165° TO 180°
BASE TAPE
F
-
TYPE SIZE A B W P T CHIPS/REEL
GMLB 3216 1.9 3.5 8 4 1.5 3000
MAG.LAYERS
GMLB-3216-A Series

Taping Quantity
SERIES 3216
PCS/Reel 3000
Tape Packing Case
W
No. of
Reels
W
L H
H
■
■
■
2
L
`
3
4
5
18±0.5 18±0.5 2.4±0.2
18±0.5 18±0.5 3.6±0.2
18±0.5 18±0.5 4.8±0.2
18±0.5 18±0.5 6.0±0.2
Unit: cm
R
E
C
O
M
M
E
N
D
E
D
P
C
B
L
A
Y
O
U
T
R
E
C
O
M
M
E
N
D
E
D
P
C
B
L
A
Y
R
E
C
O
M
M
E
N
D
E
D
P
C
B
L
A
B
A
C
D
O
A
Y
O
Solder-resist
Component
Land pattern
U
U
T
T
L
W
Unit: mm
Type 3216
L 3.2
Size
W
1.6
A 0.7~0.9
B 0.8~1.0
C 0.4~0.5
D 0.8
MAG.LAYERS
GMLB-3216-A Series

f the terminal electrode shall
n 75% of the terminal electrode shall
R
E
L
I
A
B
I
L
T
Y
T
E
S
T
R
E
L
I
A
B
I
L
T
Y
R
E
L
I
A
B
I
L
T
Y
T
T
E
E
S
S
T
T
•Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
More than 90% o
Solderability
Soldering Heat
Resistance
be covered with fresh solder.
The chip shall not crack.
More tha
be covered with solder.
The terminal electrode shall not be broken off
nor the ferrite damaged.
Solder: 96.5Sn-3.0Ag-0.5Cu
Solder Temperature: 245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
Bending Strength
Bending Test
Vibration
Drop shock
W
No mechanical damage.
The ferrite shall not be damaged.
R0.5
Appearance: No damage
Impedance shall be within ± 20% of the initial
value.
There shall be no mechanical damage.
No apparent damage
1.0
Chip
P
A
GMLB-2012-M4 0.2 10 ±2
GMLB-3216-M4 0.5
TYPE A(MM) P(KGF)
GMLB-2012-M4 1.74 0.2
GMLB-3216-M4 2.0 2.0
Substrate: PCB(100mm×40mm×1.6mm)
Solder: Reflow
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
The sample shall be soldered onto the printed
circuit board and when a vibration having an
amplitude of 1.52mm and a frequency of from 10
to 55Hz/1 minute repeated should be applied to
the 3 directions (X,Y,Z) for 2 hours each.
Dropped onto printed circuit board from 100cm
height three times in x, y, z directions. The
terminals shall be protected.
10 ±2
• Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Humidity Resistance
High Temperature
Resistance
Low Temperature
Resistance
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃ and humidity should be less than 75% RH.
The product should be used within 6 months from the time of delivery.
Impedance shall be within ±
value.
Temperature cycle : -55℃ ~125℃
minutes each.
Total: 100 cycles.
Temperature : +60℃
Humidity: 90% RH
Applied current: rated current
Time: 1000 ± 12 hours
Temperature : 80℃
Applied current: rated current
Time: 1000 ± 12 hours
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
MAG.LAYERS
GMLB-3216-A Series

■
■
■
R
E
C
O
M
M
E
N
D
E
D
R
E
F
L
O
W
S
O
L
D
E
R
I
N
G
P
R
O
F
I
L
E
R
E
C
O
M
M
E
N
D
E
D
R
E
F
L
O
W
S
O
L
D
E
R
I
N
G
P
R
O
R
E
C
O
M
M
E
N
D
E
D
R
E
F
L
O
W
S
O
L
D
E
R
I
N
G
P
t
P
T
P
Ramp-up
T
L
T
s
max
T
s
Temperature
min
t=25
t
S
Preheat
℃℃℃℃
to Peak
Time
t
L
Critical Zone
F
R
O
F
TL to T
Ramp-down
I
L
E
I
L
E
P
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Preheat
Average ramp-up rate (T
Time main above
Peak temperature (TP)
Time within 5℃ of actual peak
temperature (tP)
Ramp-down rate
Time 25℃ to peak temperature
T
smin
T
smax
to TP)
smax
Temperature (TL)
Time (tL) 60~150 seconds 60~150 seconds
100℃ 150℃
150℃ 200℃
3℃/second max. 3℃/second max.
183℃ 217℃
230℃ 250~260℃
10 seconds 10 seconds
6℃/sec max. 6℃/sec max.
6 minutes max. 8 minutes max.
■
N
O
T
E
S
■
■
N
O
T
N
O
T
E
E
S
S
The contents of this data sheet are subject to change without notice. Please confirm
the specifications and delivery conditions when placing your order.
MAG.LAYERS
GMLB-3216-A Series