Mag Layers GMLB-3216 A User Manual

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GMLB chip beads can be used in a variety of electronic applications including:
Computers and Computer Peripherals Cellular Communication Equipment Digital Cameras Digital Televisions Audio Equipment
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the latest in multilayer technology, we have developed chip beads that are able to resolve all EMI/EMC issues. High quality, reliability, and versatility make the GMLB series chip beads suitable for all your design needs.
Multi-line EMI Suppression
High Density Packaging
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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
M-series chip arrays contain four ferrite beads in a single package. This compact design makes the M-series perfect for EMI suppression on multiple-lines.
M-series chip arrays have a compact package design that is an ideal for high density packaging.
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Multi-frequency Applications
M-series chip arrays are available in A-type and B-type. The A-type chip arrays are designed for lower frequency applications. The B-type chip arrays are designed for high frequency applications.
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G M L B -
Product Code Dimension Code Impedance (at 100 MHz) Series Type Design Code Code for Special Specification
N8=A Type,N7=B Type
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N
3 2 1 6 - 0 1 2 0 M 4 - N 8
T
T
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A
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N
MAG.LAYERS
GMLB-3216-A Series
P
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D P
PRODUCT
NO.
GMLB-3216
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C
In operating temperatures exceeding +85, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve shown below according to the operating temperature.
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R
A B C D E P
3.2±0.2
(0.126±0.008)
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D
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(0.063±0.008)
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1.6±0.2
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B
G
G
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C
(0.035±0.008)
0.9±0.2
0.4±0.2
(0.015±0.008)
NOTEDimensions in mm
0.3±0.2
(0.012±0.008)
0.8±0.1
(0.031±0.004)
Rated Current (A)
7 6 5 4 3 2
1.5 1
85 125
Operating Temperature()
MAG.LAYERS
GMLB-3216-A Series
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Part Number
GMLB-3216-0030M4-N8
GMLB-3216-0060M4-N8
GMLB-3216-0120M4-N8
GMLB-3216-0240M4-N8
GMLB-3216-0300M4-N8
GMLB-3216-0470M4-N8
GMLB-3216-0600M4-N8
GMLB-3216-1000M4-N8
Temperature rise should be less than 40 for P-type and less than 25 for other
types when rated current is applied.
Impedance ()
at 100 MHz
30±25% 350
60±25%
120±25%
240±25%
300±25%
470±25% 1.0
600±25% 1.5 100
1000±25% 1.7 50
RDC (Ω)
Max.
0.4
0.8
Rated Current
(mA) Max.
250
150
Operating
Temp. Range ()
-55 ~ +125
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Test Instrument:
Z:
Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192 Osc. Level: 500mV
RDC: Agilent 34401A
Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
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N
MAG.LAYERS
GMLB-3216-A Series
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S
(
T
=
2
5
℃℃℃℃
)
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=
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2
(
T
=
2
5
5
℃℃℃℃
℃℃℃℃
)
)
GMLB-3216-0030M4-N8
60 50 40 30 20 10
0
1 10 10 0 10 0 0
GMLB-3216-0120M4-N8
250
200
150
100
Impedance(Ohm)
50
0
1 10 100 1000
Frequency(MHz)
GMLB-3216-0300M4-N8
600
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R
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R
GMLB-3216-0060M4-N8
140 120 100
80 60
X
X
40 20
0
1 10 100 1000
GMLB-3216-0240M4-N8
500
400
300
200
Impedance(Ohm)
100
0
1 10 100 1000
Frequency(MHz)
GMLB-3216-0470M4-N8
500
Z
X
R
Z
X
R
500 400 300 200 100
0
1 10 100 1000
GMLB-3216-0600M4-N8
800 700 600 500 400 300
Impedance(Ohm)
200 100
0
1 10 100 1000
Frequency(MHz)
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R
Z
R
400
300
200
X
X
Impedance(Ohm)
100
0
1 10 100 1000
Frequency(MHz)
GMLB-3216-1000M4-N8
1200 1000
800 600 400
Impedance(Ohm)
200
0
1 10 100 1000
Frequency(MHz)
Z
X
R
Z
X
R
MAG.LAYERS
GMLB-3216-A Series
P
A
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Peel-off Force
K
K
K
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A
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The force for peeling off cover tape is 10 grams in the arrow direction.
Dimension (Unit: mm)
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TOP COVER TAPE
F
TYPE
8 mm 178±1
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1
E
A
B
60 +0.5
-0
C D E
- 13 ±0.2 9 ±0.5 12 ±0.5
165° TO 180°
BASE TAPE
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TYPE SIZE A B W P T CHIPS/REEL
GMLB 3216 1.9 3.5 8 4 1.5 3000
MAG.LAYERS
GMLB-3216-A Series
Taping Quantity
SERIES 3216
PCS/Reel 3000
Tape Packing Case
W
No. of
Reels
W
L H
H
2
L
`
3 4 5
18±0.5 18±0.5 2.4±0.2 18±0.5 18±0.5 3.6±0.2 18±0.5 18±0.5 4.8±0.2 18±0.5 18±0.5 6.0±0.2
Unit: cm
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A B A
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Solder-resist
Component
Land pattern
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Unit: mm
Type 3216
L 3.2
Size
W
1.6 A 0.7~0.9 B 0.8~1.0 C 0.4~0.5 D 0.8
MAG.LAYERS
GMLB-3216-A Series
f the terminal electrode shall
n 75% of the terminal electrode shall
for 30
20% of the initial
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Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
More than 90% o
Solderability
Soldering Heat Resistance
be covered with fresh solder.
The chip shall not crack. More tha be covered with solder.
The terminal electrode shall not be broken off nor the ferrite damaged.
Solder: 96.5Sn-3.0Ag-0.5Cu Solder Temperature: 245 ± 5
Flux: Rosin Dip Time: 3 ± 1 Seconds Solder temperature : 260 ± 5
Flux: Rosin Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
Bending Strength
Bending Test
Vibration
Drop shock
W
No mechanical damage. The ferrite shall not be damaged.
R0.5
Appearance: No damage
Impedance shall be within ± 20% of the initial value. There shall be no mechanical damage.
No apparent damage
1.0 Chip
P
A
GMLB-2012-M4 0.2 10 ±2
GMLB-3216-M4 0.5
TYPE A(MM) P(KGF)
GMLB-2012-M4 1.74 0.2
GMLB-3216-M4 2.0 2.0
Substrate: PCB(100mm×40mm×1.6mm) Solder: Reflow
Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 30 s
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm and a frequency of from 10 to 55Hz/1 minute repeated should be applied to the 3 directions (X,Y,Z) for 2 hours each. Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected.
10 ±2
Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock (Temperature Cycle)
Humidity Resistance
High Temperature Resistance
Low Temperature Resistance
1. Operating Temperature Range: -55 TO +125
2. Storage Condition: The temperature should be within -40~85 and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery.
Impedance shall be within ± value.
Temperature cycle : -55~125 minutes each.
Total: 100 cycles. Temperature : +60 Humidity: 90% RH Applied current: rated current Time: 1000 ± 12 hours Temperature : 80 Applied current: rated current Time: 1000 ± 12 hours
Temperature : -40±2 Time: 1000 ± 12 Hours
MAG.LAYERS
GMLB-3216-A Series
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P
Ramp-up
T
L
T
s
max
T
s
Temperature
min
t=25
t
S
Preheat
℃℃℃℃
to Peak
Time
t
L
Critical Zone
F
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TL to T
Ramp-down
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E
P
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Preheat
Average ramp-up rate (T
Time main above
Peak temperature (TP) Time within 5 of actual peak
temperature (tP) Ramp-down rate
Time 25 to peak temperature
T
smin
T
smax
to TP)
smax
Temperature (TL) Time (tL) 60~150 seconds 60~150 seconds
100 150 150 200
3/second max. 3/second max.
183 217
230 250~260
10 seconds 10 seconds
6/sec max. 6/sec max.
6 minutes max. 8 minutes max.
N
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S
N
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N
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S
S
The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
MAG.LAYERS
GMLB-3216-A Series
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