Page 1
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GMLB chip beads can be used in a variety of electronic applications
including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
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the latest in multilayer technology, we have developed chip beads that are able
to resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
High Reliability
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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
The monolithic inorganic materials used to construct GMLB chips restrain magnetic
flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely
effective with unstable grounding.
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Small Chip-Shaped Design
The chip-shaped design makes GMLB chip beads ideal for automatic mounting.
High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
Sharp High Frequency Characteristics
The GMLB high frequency chip series has sharp impedance characteristics, which
make it suitable for high-speed signal lines.
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G M L B - 0 6 0 3 0 3 - 0 0 3 0 A - N 8
Product Code
Dimension Code
Impedance (at 100 MHz)
Series Type
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Design Code
Code for Special Specification
MAG.LAYERS
GMLB-060303-P Series
Page 2
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PRODUCT NO. A B C D
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NOTE：Dimensions in mm
GMLB-060303
(0201)
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In operating temperatures exceeding +85℃, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
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0.6±0.03
(0.024±0.001)
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7
6
5
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0.3±0.03
(0.012±0.001)
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0.3±0.03
(0.012±0.001)
0.15±0.05
(0.006±0.002)
4
3
Rated Current (A)
2
1.5
1
Operating Temperature(℃)
85 125
MAG.LAYERS
GMLB-060303-P Series
Page 3
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Part Number
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Impedance (Ω)
at 100 MHz
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RDC (Ω)
Max.
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DC
Max.
(mA)
Operating
Temp. Range (℃)
GMLB-060303-0022P-N8 22±25% 0.065 900
GMLB-060303-0033P-N8 33±25% 0.070 500
Temperature rise should be less than 40℃ for P-type and less than 25℃ for other
types when rated current is applied.
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Test Instrument:
Z:
Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
RDC: Agilent 34401A
Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
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-55 ~ +125
MAG.LAYERS
GMLB-060303-P Series
Page 4
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(
T
＝＝＝＝
2
5
℃℃℃℃
)
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(
2
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＝＝＝＝
2
5
5
℃℃℃℃
℃℃℃℃
)
)
GMLB-060303-0022P-N8
40
35
30
25
20
15
10
Impedance(ohm)
5
0
1 10 100 1000
Frequency(MHz)
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R
X
GMLB-060303-0033P-N8
50
45
40
35
30
25
20
15
Impedance(ohm)
10
5
0
1 10 100 1000
Frequency(MHz)
Z
R
X
MAG.LAYERS
GMLB-060303-P Series
Page 5
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Peel-off Force
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The force for peeling off cover tape is 10 grams in the arrow direction.
Dimension (Unit: mm)
A
B
C
D
TOP COVER TAPE
F
TYPE
8 mm 178±1
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1
E
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B
60 +0.5
-0
C D E
- 13 ±0.2 9 ±0.5 12 ±0.5
165° TO 180°
BASE TAPE
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TYPE SIZE A B W P T CHIPS/REEL
GMLB 060303 0.4 0.7 8 2 0.45 15000
MAG.LAYERS
GMLB-060303-P Series
Page 6
Taping Quantity
SERIES 060303
PCS/Reel 15000
Tape Packing Case
W
No. of
Reels
W
L H
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2
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3
4
5
18±0.5 18±0.5 2.4±0.2
18±0.5 18±0.5 3.6±0.2
18±0.5 18±0.5 4.8±0.2
18±0.5 18±0.5 6.0±0.2
Unit: cm
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Solder-resist
C
Component
AB B
Type 060303
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pattern
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Component
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L
Unit: mm
L 0.6
Size
W
A 0.2~0.3
B 0.2~0.3
C 0.25~0.40
MAG.LAYERS
0.3
GMLB-060303-P Series
Page 7
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More than 90% of the terminal electrode shall
More than 75% of the terminal electrode shall
The sample shall be soldered onto the
and when a vibration
and a
frequency of from 10 to 55Hz/1 minute
be applied to the 3
Dropped onto printed circuit board from
and humidity should be less than
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•MECHANICAL PERFORMANCE TEST
ITEM SPECIFICATION TEST CONDITION
be covered with fresh solder.
Solderability
Soldering Heat
Resistance
Bending Strength
The chip shall not crack.
be covered with solder.
The chip shall not crack.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
Impedance shall be within ± 20% of the initial
printed circuit board
having an amplitude of 1.52mm
repeated should
directions (X,Y,Z) for 2 hours each.
100cm height three times in x, y, z directions.
The terminals shall be protected.
Vibration
Drop shock
value.
There shall be no mechanical damage.
No apparent damage
• CLIMATIC TEST
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Humidity Resistance
High Temperature
Resistance
Low Temperature
Resistance
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃
75% RH. The product should be used within 6 months from the time of delivery.
Impedance shall be within ± 20% of the initial
value.
Temperature: -55℃~125℃ for 30
minutes each, 100 cycles.
Temperature : 60℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
MAG.LAYERS
GMLB-060303-P Series
Page 8
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Ramp-up
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max
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Temperature
min
t=25
t
S
Preheat
℃℃℃℃
to Peak
Time
t
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Critical Zone
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TL to T
Ramp-down
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Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Preheat
Average ramp-up rate (T
Time main above
Peak temperature (TP)
Time within 5℃ of actual peak
temperature (tP)
Ramp-down rate
Time 25℃ to peak temperature
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Temperature (TL)
Time (tL) 60~150 seconds 60~150 seconds
smin
smax
smax
to TP)
100℃ 150℃
150℃ 200℃
3℃/second max. 3℃/second max.
183℃ 217℃
230℃ 250~260℃
10 seconds 10 seconds
6℃/sec max. 6℃/sec max.
6 minutes max. 8 minutes max.
The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.
MAG.LAYERS
GMLB-060303-P Series
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