Mag Layers GMLB-060303 User Manual

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GMLB chip beads can be used in a variety of electronic applications

including:

 Computers and Computer Peripherals  Cellular Communication Equipment  Digital Cameras  Digital Televisions  Audio Equipment

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the latest in multilayer technology, we have developed chip beads that are able to resolve all EMI/EMC issues. High quality, reliability, and versatility make the GMLB series chip beads suitable for all your design needs.

 High Reliability

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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using

The monolithic inorganic materials used to construct GMLB chips restrain magnetic flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely effective with unstable grounding.

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 Small Chip-Shaped Design

The chip-shaped design makes GMLB chip beads ideal for automatic mounting.

 High Soldering Heat Resistance

High quality termination allows both flow and re-flow soldering methods to be applied.

 Sharp High Frequency Characteristics

The GMLB high frequency chip series has sharp impedance characteristics, which make it suitable for high-speed signal lines.

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G M L B - 0 6 0 3 0 3 - 0 0 3 0 A - N 8



 Product Code  Dimension Code  Impedance (at 100 MHz)  Series Type

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 

 Design Code  Code for Special Specification

MAG.LAYERS

GMLB-060303-P Series

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PRODUCT NO. A B C D

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NOTE：Dimensions in mm

GMLB-060303

(0201)

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In operating temperatures exceeding +85℃, derating of current is necessary for chip

ferrite beads for which rated current is 1.5A or over. Please apply the derating curve shown below according to the operating temperature.

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0.6±0.03

(0.024±0.001)

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7 6 5

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0.3±0.03

(0.012±0.001)

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0.3±0.03

(0.012±0.001)

0.15±0.05

(0.006±0.002)

4 3

Rated Current (A)

2

1.5 1

Operating Temperature(℃)

85 125

MAG.LAYERS

GMLB-060303-P Series

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Part Number

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Impedance (Ω)

at 100 MHz

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RDC (Ω)

Max.

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DC

Max.

(mA)

Operating

Temp. Range (℃) GMLB-060303-0022P-N8 22±25% 0.065 900 GMLB-060303-0033P-N8 33±25% 0.070 500

 Temperature rise should be less than 40℃ for P-type and less than 25℃ for other

types when rated current is applied.

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Test Instrument:

Z:

Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192 Osc. Level: 500mV

RDC: Agilent 34401A

Test Condition:

< Unless otherwise specified >

Temperature: 15°C to 35°C Humidity: 25% to 85% RH

< In case of doubt >

Temperature: 25°C ± 2°C Humidity: 60% to 70% RH

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-55 ~ +125

MAG.LAYERS

GMLB-060303-P Series

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(

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＝＝＝＝

2

5

℃℃℃℃

)

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(

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℃℃℃℃

)

GMLB-060303-0022P-N8

40 35 30 25 20 15 10

Impedance(ohm)

5 0

1 10 100 1000

Frequency(MHz)

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X

GMLB-060303-0033P-N8

50 45 40 35 30 25 20 15

Impedance(ohm)

10

5 0

1 10 100 1000

Frequency(MHz)

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X

MAG.LAYERS

GMLB-060303-P Series

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Peel-off Force

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The force for peeling off cover tape is 10 grams in the arrow direction.

 Dimension (Unit: mm)

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TOP COVER TAPE

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TYPE

8 mm 178±1

12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1

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60 +0.5

-0

C D E

- 13 ±0.2 9 ±0.5 12 ±0.5

165° TO 180°

BASE TAPE

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TYPE SIZE A B W P T CHIPS/REEL

GMLB 060303 0.4 0.7 8 2 0.45 15000

MAG.LAYERS

GMLB-060303-P Series

 Taping Quantity

SERIES 060303

PCS/Reel 15000

 Tape Packing Case

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No. of

Reels

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3 4 5

18±0.5 18±0.5 2.4±0.2 18±0.5 18±0.5 3.6±0.2 18±0.5 18±0.5 4.8±0.2 18±0.5 18±0.5 6.0±0.2

Unit: cm

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Solder-resist

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Component

AB B

Type 060303

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pattern

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Component

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Unit: mm

L 0.6

Size

W A 0.2~0.3 B 0.2~0.3 C 0.25~0.40

MAG.LAYERS

0.3

GMLB-060303-P Series

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More than 90% of the terminal electrode shall

More than 75% of the terminal electrode shall

The sample shall be soldered onto the

and when a vibration

and a

frequency of from 10 to 55Hz/1 minute

be applied to the 3

Dropped onto printed circuit board from

and humidity should be less than

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•MECHANICAL PERFORMANCE TEST

ITEM SPECIFICATION TEST CONDITION

be covered with fresh solder.

Solderability

Soldering Heat Resistance

Bending Strength

The chip shall not crack. be covered with solder.

The chip shall not crack.

Solder:

Sn-3.0Ag-0.5Cu

Solder Temperature:

245 ± 5℃ Flux: Rosin Dip Time: 3 ± 1 Seconds Solder temperature : 260 ± 5℃ Flux: Rosin Dip time: 10 ± 1 seconds

Impedance shall be within ± 20% of the initial

printed circuit board having an amplitude of 1.52mm

repeated should directions (X,Y,Z) for 2 hours each.

100cm height three times in x, y, z directions. The terminals shall be protected.

Vibration

Drop shock

value. There shall be no mechanical damage.

No apparent damage

• CLIMATIC TEST

ITEM SPECIFICATION TEST CONDITION

Thermal Shock (Temperature Cycle)

Humidity Resistance

High Temperature Resistance

Low Temperature Resistance

1. Operating Temperature Range: -55 ℃ TO +125℃

2. Storage Condition: The temperature should be within -40℃~85℃ 75% RH. The product should be used within 6 months from the time of delivery.

Impedance shall be within ± 20% of the initial value.

Temperature: -55℃~125℃ for 30 minutes each, 100 cycles. Temperature : 60℃ Humidity: 95% RH Time: 1000 ± 12 Hours Temperature : 85℃±2℃ Time: 1000 ± 12 Hours Temperature : -40℃±2℃ Time: 1000 ± 12 Hours

MAG.LAYERS

GMLB-060303-P Series

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Ramp-up

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max

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Temperature

min

t=25

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Preheat

℃℃℃℃

to Peak

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Critical Zone

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TL to T

Ramp-down

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Profile Feature Sn-Pb Pb-Free

ts 60~120 seconds 60~180 seconds

Preheat

Average ramp-up rate (T

Time main above

Peak temperature (TP) Time within 5℃ of actual peak

temperature (tP) Ramp-down rate

Time 25℃ to peak temperature

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T T

Temperature (TL) Time (tL) 60~150 seconds 60~150 seconds

smin

smax

to TP)

100℃ 150℃ 150℃ 200℃

3℃/second max. 3℃/second max.

183℃ 217℃

230℃ 250~260℃

10 seconds 10 seconds

6℃/sec max. 6℃/sec max.

6 minutes max. 8 minutes max.

The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.

MAG.LAYERS

GMLB-060303-P Series