an AMP company
RF MOSFET Power Transistor, lOOW, 28V
100 - 500 MHz UF281 OOM
Features
N-Channel Enhancement Mode Device
DMOS Structure
Lower Capacitances for Broadband Operation
High Saturated Output Power
Lower Noise Figure Than Competitive Devices
Absolute Maximum Ratings at 25°C
pi
Power Dissipation
JunctionTemperature
Storage Temperature T
Thermal Resistance El
PD
T,
STG
JO
-55 to +150
Electrical Characteristics at 25°C
I Parameter
Drain-Source Breakdown Voltage
Drain-Source LeakageCurrent
Gate-Source Leakage Current
Gate Threshold Voltage
ForwardTransconductance
input Capacitance
Output Capacitance
Reverse Capacitance
Power Gain
Drain Efficiency
Return Loss
Load Mismatch Tolerance
* Per Side
( Symbol 1 Min 1 Max 1 Units 1
BVDSS
‘OS5
‘GSS
V
GSCTHI
GM
C
ISS
C
OS.5
C
RSS
%
VSWR-T -
250 W
200
0.7 “Ciw
“C
“C
65 -
2.0
1.5 -
10 50 10 -
I4
&w t.74
II
505
P
V
V,,=O.O V, I,,=150 mA’
3.0 mA v,,=2a.o v. vo,=o.o v
3.0 pA v,,=20 v, v,,=o.o V’
6.0 V V,,=lO.O V, 1,,=300.0 mA‘
135 pF
90 pF
24 pF v,,=2a.ov, F=I .OMHZ*
3O:l -
I
S V,,=lO.O V, 1,,=3000.0 mA, ~v,,=l .O V, 80 ps Pulse’
v,=2a.o v, F=l .o MHz’
V,s=28.0 V, F=l .O MHz’
dB
V,,=28.0 V, 1,,=600.0 mA, P,,=lOO.O W. F=500 MHz
--
%
v,,=%.O V, 1,,=600.0 mA, P,,=lOO.O W, F=500 MHz
dB
V,,=28.0 V, 1,,=600.0 mA, PO,,=1 00.0 W, F=500 MHz
v,,=28.0 V. 1,,=600.0 mA, P,,,.=100.0 W, F=500 MHz
m a¶
a&b,
Test Conditions
.m4 1 ale
am 1 a?4
ooc 1 ace
1
I
Specifications Subject to Change Without Notice.
M/A-COM, inc.
RF MOSFET Power Transistor, IOOW, 28V
Typical Broadband Performance Curves
UF281OOM
v2.00
EFFICIENCY vs FREQUENCY
80.
P,=lO W I,,=600 mA (Push-Pull Device)
100 200 300 400 so0 14 16 20 24 28 32
FREQUENCY (MHz)
POWER OUTPUT vs SUPPLY VOLTAGE
P,,,=lO W I,,=600 mA F=500 MHz
loo
80
60
20
t
SUPPLY VOLTAGE (V)
POWER OUTPUT vs POWER INPUT
V,,=28 V I,,=600 mA (Push-Pull Device)
s 80
e
i3 60
fs 5 40
0
20
M/A-COM, Inc.
0
0 1 2 4 6 8 10 12
POWER INPUT(W)
Specifications Subject to Change Without Notice.