M A COM MD59-0022RTR, MD59-0022SMB, MD59-0022TR Datasheet

(1)

PCS CDMA Upconverter / Driver

PCS CDMA Upconverter / Driver

PCS CDMA Upconverter / DriverPCS CDMA Upconverter / Driver
1710

1710————1910 MHz

17101710

1910 MHz

1910 MHz1910 MHz

MD59-0022

Features

• High Integrated Upconverter and Driver IC

• Operates over 2.7 V to 5V Supply Voltage

• +9 dBm Output Power at 51 dBc ACPR

• Low current mode for power saving at low output power

• Balanced IF Input 265 Ω

• Low LO Drive Level -10 dBm

• Operates in US and Korean PCS Bands

• Miniature TSSOP-16 Plastic Package

Description

M/A-COM’s MD59-0022 is a fully integrated upconverter / Driver
IC. It includes a balanced IF amplifier, upconverting mixer, two
stage driver amplifier and LO buffer amplifier in a miniature
TSSOP-16 plastic package. The backside of the lead frame is
exposed to facilitate excellent RF grounding and thermal transfer.

The MD59-0022 is ideally suited for CDMA handset applications
where high linearity and low power consumption are important
transmitter requirements. The MD59-0022 can also operate in a
low power mode to extend system battery life.

The MD59-0022 is fabricated using M/A-COM’s 0.5 micron low
noise E/D GaAs MESFET process. The process features full
passivation for increased performance and reliability.

Exposed
Pad

1

.118

.041/.031

1,05/,80

.177/.169

4,5/4,3

.118

3,0

3,0

TSSOP-16 Plastic Package

(.039)

Pin 16

.252

6,4

Pin 1

.201/.193

5,1/4,9

1. Dimensions are: in / mm

.0256

0,65

Ordering Information

Part Number Package

MD59-0022TR Forward Tape and Reel
MD59-0022RTR Reverse Tape and Reel
MD59-0022SMB Sample Board

1. If specific reel size is required, consult factory for part number assignment.

1
1

Electrical Specifications TA = 25°C, VDD = 3.0V

Parameter Test Conditions Units Min. Typ. Max.

Complete Upconverter1 / High Power Mode

Conversion Gain V
CDMA Linear Output Power
Noise Figure LO Frequency = 1580 - 1780 MHz dB 10
I

DD

VSWR (All Ports) IF = 130 MHz 1.5:1
IF Input Impedance Ohms 265
LO-to-RF Port Leakage dBm -18

Complete UPconverter1 / Low Power Mode

Conversion Gain V
CDMA Linear Output Power

Noise Figure LO Frequency = 1580 = 1780 MHz dB 10
I

DD

VSWR (All Ports) IF = 130 MHz 1.5:1
IF Input Impedance Ohms 265
LO-to-RF Port Leakage dBm -18

RF Driver Amplifier

Gain V
Gain V

1. Complete upconverter / driver measurements taken with a surface mount SAW filter between Mixer Ouput and Driver Input.

2. CDMA Linear power is defined as 51 dBc ACPR at a 1.228 MHz Offset from the carrier frequency.

2

2

= VDD dB 24 27.2

CTRL

RF Frequency = 1710 - 1910 MHz dBm 9

LO Power = -10 dBm mA 66

= (0V) dB 22

CTRL

RF Frequency = 1710 - 1910 MHz dBm 2

LO Power = -10 dBm mA 46

= VDD, RF Frequency = 1710 - 1910 MH z dB TBD

CTRL

= 0V, RF Frequency = 1710 - 1910 MHz dB TBD

CTRL

Specifications subject to change without notice.

V 2.0

 North America: Tel. [phone], Fax [phone]
 Asia/Pacific: Tel.[phone], Fax [phone]
 Europe: Tel. [phone], Fax[phone]

Visit www.macom.com for additional data sheets and product information.

PCS CDMA Upconverter / Driver 1710—1910 GHz

MD59-0022

Pin Configuration

PIN No. PIN Description

1 DRV VDD1 Driver Amplifier first stage supply voltage. Must be RF

2 DRV In
3 GND DC and RF Ground

4 GND DC and RF Ground
5 MIX OUT
6 GND DC and RF Ground

7 LO IN Local Oscillator Input (-10 to -5 dBm) (DC blocked)
8 LO VDD LO Amplifier Supply Voltage - Bypassing required
9 IF+ VDD IF+ supply voltage. Off chip inductor and IF bypassing

10 IF+ IN IF+ input port. Off chip matching elements required
11 IF- IN

IF- V

12 IF- VDD IF- supply voltage. Off chip induct or and IF bypassing

13 GND DC and RF Gr ound
14 DRV VDD2 Driver amplifier second stage supply voltage. Must be

15 DRV OUT
16 DRV SRC Source bias voltage of driver output stage. Required RF

bypassed
50 Ω Input to driver amplifier (DC blocking required)

50 Ω Output of Mixer (DC block ed )

required

IF- input port. Off chip matching elements required

DD

required

RF bypassed
50 Ω output of Driver Amplifi er (D C bl o ck ed inte rn ally)

bypassing and may be use d to control ouput stage
current

Block Diagrams

DRV VDD1

DRV IN

GND

GND

MIX OUT

GND

LO IN

LO V

DD

DRV SRC

DRV OUT

DRV V

DD

GND

IF- V

IF- IN

IF+ IN

IF+ V

2

DD

DD

Sample Board Schematic

DTC114 YE TL

if- in

if+ in

J1

1. Saw filter characterist ic s t o be determ i ned by cust omer, dependi ng on band of operat i on. Sample boards are supplied without saw filter in stalled.
Data supplied with sample board is measured over US PCS1900 Tx Bond using external K&L BPF (p/n SB121-1850/T450-0/OP) and 2 dB attenua­tion to emulate typical saw filter characteristics.

Specifications subject to change without notice.

 North America: Tel. [phone], Fax [phone]
 Asia/Pacific: Tel.[phone], Fax [phone]
 Europe: Tel. [phone], Fax[phone]

Visit www.macom.com for additional data sheets and product information.

V 2.0