M A COM MD57-0001, MD57-0001TR Datasheet

Low Cost MMIC Mixer with Local Oscillator Amplifier, 0.8-1.0 GHz MD57-0001

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MD57-0001

Low Cost MMIC Mixer with Local Oscillator
Amplifier, 0.8 GHz - 1.0 GHz

Features

• -5 to +5 dBm LO Drive Level

• High Isolation, 28 dB LO to RF

• Inexpensive SOT-26 Package

Description

The MD57-0001 is a floating FET mixer with an on-chip LO
amplifier. The LO drive for the MD57-0001 can range from -5 to
+5 dBm without severly impacting the mixer’s performance. The
MD57-0001 is ideally suited for cellular band communications
handsets’ that can provide only minimal amounts of LO drive.
Typical applications include frequency up/down conversion and
IQ modulation and demodulation in digital receivers and
transmitters.

The MD57-0001 utilizes a patented “floating-FET” architecture.
The on-chip LO amplifier allows the MD57-0001 to operate with
as little as -5 dBm of LO drive making it an ideal choice for low
power portable designs.

The MD57-0001 is fabricated using M/A-COM’s 0.5 micron low
noise GaAs MESFET process. This process features full
passivation for increased performance and reliability. The
MD57-0001 is 100% RF tested to ensure superior performance
specification compliance.

SOT-26

114±.008

.

2,9±0,2

.075±.008

1,90 ±0,2

+.008

.063

.031

0,79

.006
0,15

+.004

-.007
+0.10

-0.18

+.004

-.002
+0.10

-0.05

1,60

-.004
+0.20

-0.10

PIN # 1

16XY

+.004

.016

-.002
+0.10

0,40

-0.05

008 MIN

.

0,20 MIN

.110

±.008

2,80±0,2

.002±.002
0,05±0,05

+.008

043

.

-.004
+0.20

1,10

-0.10

Ordering Information

Part Number Package

MD57-0001 SOT-26, 6-Lead Plastic Packa
MD57-0001TR Forward Tape and Reel*
MD57-0001SMB Desi

ner’s Kit

e

*If a specific reel size is required, consult factory for part number.

Electrical Specifications

TA = +25°C, RF = 900MHz (-15 dBm), LO = 730MHz (-5 dBm), IF = 170MHz, V

1

= 2.7V, Typical I

DD

= 5mA

DD

Parameters Abbv. Test Conditions Units Min. Typ. Max.

Conversion Loss L

c

—dB—9.311

Isolation ISO LO to RF dB 20 28 —

LO to IF dB 10 12 —
RF to IF dB — 20 —

VSWR VSWR RF Port — — 2.0:1 —

LO Port — — 2.0:1 —

IF Port — — 2.0:1 —
Input 1 dB Compression P
Two Tone IM Ratio

1. IMR vs. RF drive can be calculated by the for m ula: IMR = [44 - 1.5(PIN)]

M/A-COM Division of AMP Incorporated ■ North America: Tel. [phone], Fax [phone] ■ Asia/Pacific: Tel.[phone], Fax [phone]

■

Europe: Tel. [phone], Fax+ 44 (1344) 300 020

www.macom.com

1

AMP and Connecting at a Higher Level are trademark s.

Specifications subject to change wit hout notice.

1dB

dBc Two tones at -10 dBm each;

RF Freq. = 900 MHz, LO = -5 dBm dBm — 14 —

dBc — 59 —

Tone spacin

= 1 MHz, IF = 170 MHz

V2.00

Low Cost MMIC Mixer with Local Oscillator Amplifier, 0.8-1.0 GHz MD57-0001

g

g

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g

g

Absolute Maximum Ratings

Parameter Ratings

Input RF/IF Power
Input LO Power
Operatin
Operatin
Stora

1. Exceeding these limits may cause permanent damage.

2. Ambient Temperature (T

3. Typical Thermal Resis tance (

Voltages
Temperature -30°C to +80°C

e Temperature -65°C to +150°C

condition.

2

2

2

) = + 25°C.

A

θ

) = 108°C/W at nomial bias

jc

1,3

+27 dBm
+17 dBm

VDD = +6 volts

Pin Configuration

Pin No. Pin Name Description

1 RF Port RF Input/Output
2 Bias LO Amplifier Bias Resistor
3 LO Port LO Input
4V

DD

5 GND Ground
6 IF Port IF Input/Output

LO Amplifier V

DD

Functional Block Diagram

R1

RF

C2

1

C3

2

3

L2

LO

6

C1

5

L1

4

External Circuitry Parts List

Part Name Description Value

R1 LO Amplifier Bias Resistor
L1 LO Amplifier Bias Input 22 nH
L2 LO Port Matchin
C1 IF Port Matchin
C2 IF Bypass Capacitor 10 nF
C3 RF Bypass Capacitor 22 pF
C4 V

Bypass 47 pF

DD

IF

C4

200

10 nH

10 nF

V

DD

Ω

Recommended PCB Configuration

Layout View

Cross Section View

RF Traces & Components

RF Ground

DC Routing

Customer Defined

The PCB dielectric between RF traces and RF ground layers
should be chosen to reduce RF discontinuities between 50
lines and package pins. M/A-COM recommends an FR-4
dielectric thickness of 0.008” (0.2 mm) yielding a 50 Ω line
width of 0.015” (0.38 mm). The recommended metalization
thickness is 1 oz. Copper.

Ω

M/A-COM Division of AMP Incorporated ■ North America: Tel. [phone], Fax [phone] ■ Asia/Pacific: Tel.[phone], Fax [phone]

■

Europe: Tel. [phone], Fax+ 44 (1344) 300 020

www.macom.com

AMP and Connecting at a Higher Level are trademark s.

Specifications subject to change wit hout notice.

V2.00