M A COM MA4SPS502 Datasheet

Surface Mount Monolithic
PIN Diode Chip

MA4SPS502

Features

n Surface Mount Device
n No Wirebonds Required
n Rugged Silicon-Glass Construction
n Silicon Nitride Passivation
n Polymer Scratch Protection
n Low Parasitic Capacitance and Inductance
n High Power Handling (Efficient Heatsinking)

Description

This device is a silicon-glass PIN diode chip fabricated with
M/A-COM’s patented HMIC process. This device features
two silicon pedestals embedded in a low loss glass. The diode
is formed on the top of one pedestal and connections to the
backside of the device are facilitated by making the pedestal
sidewalls conductive. Selective backside metalization is
applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer
layer for scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge during
handling and assembly.

Applications

These packageless devices are suitable for usage in moderate
incident power (10 W C.W.) or higher incident peak power
(500 W) series, shunt, or series-shunt switches. Small parasitic
inductance, 0.35 nH, and excellent RC time constant, 0.22 pS,
make the devices ideal for wireless TR switch and accessory
switch circuits, where higher P

These diodes can also be used in π, T, tapered resistance, and
switched-pad attenuator control circuits for 50Ω or 75Ω
systems.

Absolute Maximum Ratings

@ TA = +25°C (unless otherwise specified)

Parameter Absolute Maximum

Reverse Voltage

and IP3 values are required.

1dB

1

-300 V

Case Style ODS-1270

1. Backside metal: 0.1 micron thk. gold.

2. Hatched areas indicate bond pads.

Dim Inches

Min. Max. Min. Max.

A 0.056 0.058 1.435 1.485
B 0.022 0.024 0.555 0.605
C 0.004 0.008 0.102 0.203
D 0.020 0.022 0.505 0.555
E 0.013 0.015 0.325 0.375

1,2

Millimeters

600 mA

2 W

Forward Current

Operating Temperature

Storage Temperature

Dissipated Power (RF & DC)

Mounting Temperature

1. Exceeding these limits may cause permanent damage.

-65 °C to +150 °C

-65 °C to +150 °C

+235 °C for 10 seconds

Surface Mount Monolithic PIN Diode Chip

Electrical Specifications: @ 25 °C

Symbol Test Conditions Units Min. Typ. Max.

CT -40 Volts, 1 MHz pF 0.140 0.200
CT -40 Volts, 1 GHz pF 0.090

MA4SPS502 SurMount TM Series

RS 100 mA, 100 MHz
RS 20 mA, 100 MHz
VF 100 mA V 1.24 1.50
VF 10 mA V 0.87 1.00
VR

IR -300 V
IR -40 V nA 8

R

JL

θ

TL +10 mA / -6 mA measured at 90% voltage µs 2.8

10 µA

Steady state °C/W 75

Handling Procedures

All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.

Ω
Ω

V -300 -330

µA

Functional Schematic1

Rp

1.4

2.4

10

Ls

Cp

Bonding Techniques

Attachment to a circuit board is made simple through the use of
surface mount technology. Mounting pads are conveniently
located on the bottom surface of these diodes and are removed
from the active junction locations. These devices are well suited
for solder attachment onto hard and soft substrates. The use of
80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an
equal temperature profile across the contacts. Conductive epoxy
paste for attachment may also be used.

When soldering these devices to a hard substrate, hot gas die
bonding is preferred. We recommend utilizing a vacuum tip and
a force of 60 to 100 grams applied normal to the top surface of
the device. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by heating
the circuit trace near the mounting pad while applying 60 to 100
grams of force perpendicular to the top surface of the die.

Since the HMIC™ glass is transparent, the edges of the mounting
pads closest to each other can be visually inspected through the
die after attach is completed.

Rvia

-

1. Rs = 2 * Rvia + Rp

Rvia

+

Specifications subject to change without notice.

n North America: Tel. [phone]
n Asia/Pacific: Tel.[phone], Fax [phone]
n Europe: Tel. [phone], Fax[phone]

Visit www.macom.com for additional data sheets and product information.

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