4-1. Video outputVp-p0.81.01.2E-E Mode
4-2. Video S/NdB3942E-E Mode
4-3. Audio outputdB-10-6-2E-E Mode
4-4. Audio S/NdB4046E-E Mode
: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
Note
and some may drop s lightly bel ow these spec s. Limit sp ecs rep resent the a bsolute wo rst con dition that still migh t
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HC341SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related char acteristics which are often not evi dent from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have sp ecial safety characteristi cs are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Prod uct’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product s afety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain su ch com plian ce, it is equal ly imp ortant to implement the following precautions when a set
is being serviced
Precautions during Servicing
Parts identified by the ! symbol are critical for
A.
safety. Replace only with part number specified.
In addition to safety, other parts and assemblies
B.
are specified for conformance with regulations
applying to spur ious rad iation. T hese m ust also be
replaced only with specified re pla ce men ts .
Examples: RF converters, RF c ables, noise blocking capacitors, and noise blocking f ilters, etc.
Use specified internal wiring. Note especially:
C.
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
Use specified insulating materials for hazardous
D.
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
When replacing AC primary side components
E.
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
Observe that the wires do not contact hea t produc-
F.
ing parts (heatsinks, oxid e met al film res istors, fusible resistors, etc.).
Check that replaced wires do not contact sharp
G.
edges or pointed parts.
When a power cord h as been repl aced, ch eck that
H.
5 - 6 kg of force in any direction will not loosen it.
.
Also check areas surrounding repaired locations.
I.
Be careful that foreign objects (screws, solder
J.
droplets, etc.) do not remain inside the set.
Crimp type wire connector
K.
The power tr ansformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important:
2)Strip about 15 mm of t he insulation fr om the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp ful ly to the complete closure of the tool.
When connecting or disconnecting the internal con-
L.
nectors, first, disco nnect the AC plug from th e AC
outlet.
Do not re-use a connector. (Discard it.)
1-2-1H8740SFP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Obse rve that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearan ce distance (d) and (d’ ) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
This table is unofficial and for reference only.
Note:
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure acr oss the ter minals of l oad
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
230 V
This table is unofficial and for reference only. Be sure to confirm the precise values.
Note:
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2H8740SFP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Pin 1
c. The 1st pin of every male connector is indica ted as
shown.
Pin 1
Bottom View
5
10
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack-IC, fir st apply
soldering iron to c en ter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) R elease the fla t pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
.
Instructions for Connectors
1. When you connec t o r di s connec t the FF C ( Flex ible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. Do not supply hot air to the chip parts aroun d the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack -IC to protect other parts from
damage. (Fig. S-1-2)
2. The flat pack-IC on the CB A is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-3-1NOTE_1
Page 7
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. W hen you use solder flux
which is applied t o all pins of the f lat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(4) B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack-IC, fir st apply
soldering iron to c en ter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) R elease the fla t pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a solde ring iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it ge ntl y bec au se it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which sold er will
not adhere (iron wir e). When heating the pi ns, us e
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3)Botto m of the flat pack-IC is fixed with glue to the
CBA; when removing en tire flat pack -IC, first appl y
soldering iron to c ent er of the fla t pa ck - IC an d h eat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Relea se th e flat pac k-IC from the CB A us ing twee -
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. W hen you use solder flux
which is applied t o all pins of the f lat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up t he wir e as t he so lde r
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
1-3-2NOTE_1
Page 8
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pi n of the flat pack-IC on the CBA
so you can install a replacemen t flat pack-IC more
easily.
(2)The “ I ” mark on the flat pack -IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mar k matches the 1
on the PCB when positioni ng for installation. Then
presolder the four corn ers o f the fl at pac k -IC. (S ee
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a poten tial difference c aused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a gr oundin g band (1MΩ) that is properly grounded to re m ov e an y sta tic el ec tric it y that may
be charged on the body.
2. Ground for Workbench
Be sure to place a c onductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because t he static electric ity charge on c lothing will not escape through the body grounding band ,
be careful to avoid contacting semi-conductors with
your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Band
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-3-3NOTE_1
Page 9
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instruct ions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into th e Deck Mechanis m Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, TP507 (SENSOR INHIBITION) to GND. This will
stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs are connected
before plugging in the unit, th e functi on of th e sens ors
will stay valid.) See Fig. 1.
Because the Tape End Sensors are inactive, do
Note:
not run a tape a ll th e way t o the s tart or t he en d of the
tape to avoid tape damage.
About REC-Safety Switch
Caution:
The REC-Safety Switch is directly mounted on the
Main CBA. When the Dec k Mechanism Assembly is
removed from t he Main CBA for servic ing, this sw itch
does not work automatically.
What to do for preparation
In order to record, pr ess the Rec butt on whil e push ing
REC-SAFETY SW on the Main CBA. See Fig. 1.
Q503
SW506
Q504
TP507
S-INH
(REC-SAFETY SW)
Fig. 1
1-4-1HC2C0PFS
Page 10
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicate s the disas sembly step s to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Function CBA
[6] Deck Assembly
[7] Main CBA
2. Disassembly Method
REMOVAL
ID/
LOC.
No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1): Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L= Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5):Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Release Locking Tab (L-3) and remove Screw
(S-2), five Screws (S-3), three Screws (S-4) and
Screw (S-5). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Function CBA, Jack CBA and
Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. 5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as sho wn in
Fig. 6. Then, install the Deck Assemb ly whil e alig ning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hol e of LD-SW as
shown in Fig. 6.
[1]Top Case17(S-1)-
Front
[2]
Assembly
VCR
[3]
Chassis
Unit
[4]Jack CBA4Desolder, (S-6)-
Function
[5]
CBA
Deck
[6]
Assembly
[7]Main CBA5-----------
↓
(1)
↓
(2)
2*3(L-1),*4(L-2)-
*(L-3), 5(S-3), 3(S-4),
3
(S-5)
5Desolder-
5,62(S-7), Desolder2,3
↓
(3)
↓
(4)
1
↓
(5)
1-5-1HC2C0DC
Page 11
(S-1)
[1] T op Case
(S-1)
(S-1)
Fig. 1
(S-3)
[3]VCR
Chassis Unit
(S-4)
(S-3)
(S-5)
(S-4)
(S-3)
(L-2)
[2] Front
Assembly
(L-1)
(L-2)
(L-3)
Fig. 3
[4] Jack CBA
(S-6)
Desolder
Fig. 2
Fig. 4
1-5-2HC2C0DC
Page 12
FE Head
Cylinder Assembly
AC Head
Assembly
Pin
SW507
LD-SW
[6] Deck Assembly
(S-7)
[5] Function
CBA
Desolder from
bottom
From
FE Head
Lead with
red stripe
From
Cylinder
Assembly
Lead with
white stripe
From
AC Head
Assembly
[7] Main CBA
From
Capstan Motor
Assembly
Lead with
white stripe
(S-7)
[7] Main CBA
[6] Deck Assembly
Shaft
Hole
LD-SW
Cam Gear
Hole
Pin
[7] Main CBA
Fig. 6
TOP VIEW
Lead connections of Deck Assembly and Main CBA
Fig. 5
1-5-3HC2C0DC
Page 13
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjustments a re required after re placing
circuit component s and certain mechanical parts.
It is important to do these adjustments only afte r
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracki ng co ntrol is set in
the center position: P ress eith er "L5??" or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or ver tical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
TP751
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±60µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
V-Sync
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video output waveform is at the 6.5H(412.7µs) delayed position from the
rising edge of the CH2 head switching pulse waveform.
1.0H
Switching Pulse
6.5H
0.5H
1-6-1HC2C0EA
Page 14
M
M
LOADING
MOTOR
CYLINDER ASSEMBLYCAPSTAN MOTOR
DRUM
MOTOR
PG
SENSOR
CONTROL
HEAD
CL287
55CTL(+)
66CTL(-)
CL504
AC HEAD ASSEMBLY
MAIN CBA
KEY- 2
C-FG
C-CONT
D-FG
D-PG
ST-S
T-REEL
C-F/R
KEY- 1
REMOCON-IN
CTL(+)
RESET
REC-SAF-SW
PG-DELAY
CTL(-)
D-V SYNC
D-REC-H
RF-SW
H-A-SW
C-ROTA
END-S
14
90
89
94
95
76
87
10
4
80
34
78
2
13
15
18
65
16
31
8
7
RS501
REMOTE
SENSOR
LM-FWD/REV
81
D-CONT77
(DECK ASSEMBLY)
Servo/System Control Block Diagram
BLOCK DIAGRAMS
T-REEL
Q501
RESET
Q503
S-REEL79
SW-POINT
AL+5V
AL+5V
VR501
TIMER+5V
S-REEL
PS503
TP506
I2C-BUS SDA
I2C-BUS SDA
I2C-BUS SCL
A-MUTE-H
A-MUTE-H
H-A-COMP
17
V-ENV
6
P-ON-H
C-POW-SW
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86
P-DOWN-L
C-SYNC
58
SW506
REC-SAFETY
TO
VIDEO BLOCK
TO
AUDIO BLOCK
22KEY-2
44KEY-1
KEY SWITCH
KEY SWITCH
CL505CN651
FUNCTION CBA
1-7-11-7-2HC341BLS
SDA
SDA
SCL
SCL
TU701(TUNER UNIT)
IC503 (MEMORY)
72
83
I2C-BUS SCL
D-V SYNC
D-REC-H
RF-SW
H-A-SW
C-ROTA
I2C-BUS SDA
H-A-COMP
V-ENV
C-SYNC
I2C-BUS SCL
71
3
5
SDA
SCL
12
11
LD-SW9
AL+15V/+12V
AL+12V
AL+5V
AL+5V
SW507
P-ON+5V
LD-SW
AL+5V
D502
S-LED
END-S
TO
POWER
SUPPLY
BLOCK
KEY
SWITCH
TP507
S-INH
SW505
CH-UP
M
CAPSTAN
MOTOR
IC501
(SERVO/SYSTEM CONTROL)
AUDIO-SW-2
30
AUDIO-SW-1
AUDIO-SW-2
AUDIO-SW-1
29
5
6
CL502
12 C-F/R
11
AL+15V/+12V
10 AL+12V
9
P-ON+5V
8
GND
7
C-FG
6
C-CONT
5
GND
4
D-FG
3
LM-FWD/REV
2
D-CONT
1
D-PG
SENSOR CBA
SENSOR CBA
END-S
ST-S
Q504
Q505
CTL97
FF/REW-L84
Q502
TP501
CTL
Q562
Q563
Q564
Q565
CAS-LED
TIMER-LED
REC-LED 26
25
24
POWER-LED 23
D565 REC
D564 TIMER
D563 CAS
D562 POWER
D561 STAND-BY
SW508
RESET
Page 15
CYLINDER ASSEMBLY
V(R)-1
V-COM
V(L)-1
CL253
1
2
3
Video Block Diagram
1-7-31-7-4HC341BLV
(DECK ASSEMBLY)
VIDEO (R)-1
HEAD
SP
HEAD
AMP
EP
HEAD
AMP
REC FM
AGC
TO SERVO/SYSTEM
CONTROL BLOCK
C-SYNC
RF-SW
D-REC-H
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
LUMINANCE
SIGNAL
PROCESS
CHROMINANCE
SIGNAL
PROCESS
C-SYNC
V-ENV
H-A-COMP
H-A-SW
D-V-SYNC
RF-SW/C-ROTA
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
V(L)-2
V-COM
V(R)-2
4
5
6
TU701
IC301
(Y/C SIGNAL PROCESS)
IC501 (OSD)
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
SERIAL
DECORDER
V-OUT1
1
V-IN1133
V-OUT2
1
V-IN23
1
3
JACK CBA
48
50
52
56
24
6
50
52
19
20
JK101
V-OUT1
V-IN1
19
20
JK102
CL151
CL152
CL101
CL102
V-OUT2
V-IN2
61
63
96
95
93
94
90
89
88
87
CHARA.
INS.
CCD 1H DELAY
SP
BYPASS
MUTE
PB/EE
IN1
TUNER
IN1
TUNER
MUTE
PB/EE
IN2
IN2
AGC
PR
R
Y
C
P
R P R P
EP
Y. DELAY
Y/C
MIX
+
21
7978
AGCVXO
OSD
CHARACTER
MIX
FBC
1/2
5859
65
2928
69684643
67
84
83
71
62
70
D-REC-H
80
BUFFER
Q101
BUFFER
Q102
TP751
V-OUT
WF1
TU-VIDEO
VIDEO
MAIN CBA
TP502
RF-SW
WF2
Q351
BUFFER
TO SERVO/SYSTEM
CONTROL BLOCK
I2C BUS SDA
I2C BUS SCL
TP301
X301
4.43MHz
C-PB
WF5
Page 16
Audio Block Diagram
REC
AMP
100
3
AUTO
BIAS
2
1
+5V
+5V
Q401
Q406
BIAS
OSC
Q402
Q404
(PB=ON)
Q405
(PB=ON)
Q403
SWITCHING
D-REC-OFF
5
EQ
AMP
98
7
LINE
AMP
REC-ON
AUDIO HD-SW
CONTROL
MUTE
11
6
PB-ON
SP/LP-ON
P
R
ALC
DET
ALC
IC301 (AUDIO SIGNAL PROCESS)
4 A-PB/REC
CL504
3 A-COM
1 AE-H
2 AE-H/FE-H
A-PB/REC 4
A-COM3
AE-H1
AE-H/FE-H 2
CL287
AUDIO
HEAD
AUDIO
ERASE
HEAD
ACE HEAD ASSEMBLY
FE HEAD
2 FE-H
1 FE-H-GND
CL501
1-7-51-7-6HC341BLA
MAIN CBA
PB-AUDIO SIGNALREC-AUDIO SIGNAL Mode : SP/REC
71
A-MUTE-H
I2C BUS-SCL
I2C BUS-SDA
TO SERVO/SYSTEM
CONTROL BLOCK
FULL
ERASE
HEAD
68 69
SERIAL
DECODER
(DECK ASSEMBLY)
12
16
INV
ATT
TU701
SW
CTL
IC151 (SWITCHING)
PB/EE
PB/EE
PB/EE
PB/EE
TUNER
TU-AUDIO
IN2
IN1
IN1
AUDIO-SW-1
AUDIO-SW-2
TO SERVO/SYSTEM
CONTROL BLOCK
A-IN1
A-OUT1
8
6
JACK CBA
JK101
A-IN1(R)
A-IN1(L)
2
6
1
3
CL101
A-OUT1(R)
A-OUT1(L)
A-IN2
A-OUT2
8
6
8
6
8
6
JK102
A-IN2(R)
A-IN2(L)
2
6
1
3
CL102
CL151
CL152
A-OUT2(R)
A-OUT2(L)
21
1
5
2
4
12
14
15
11
10
9
3
13
TUNER
IN2
IN1
15
13
17
BUFFER
Q151
BUFFER
Q152
Page 17
2
4
16
6
7
Power Supply Block Diagram
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
The following symb ols wi ll ap pea r on t he i nd ic ato r panel to indicate the c ur rent mode or operatio n of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
RECFUNCTIONSTANDBYTAPE INTIMER
" H "= LED Light on, " L "= LED Light off
Led ModeIndicator Active
STANDBYPower on = " H "
Power off = " L "
FUNCTIONVCR mode = " H "
TV mode = " L "
TAPE IN
1. When reel and capstan mechanism is
not functioning correctly
2. When tape loading mechanism is not
functioning correctly
3. When cassette loading mechanism is
not functioning correctly
4. When the drum is not working properly
TIMERTimer stand by = " H "
RECREC mode = " H "
Cassette in = " H "
Cassette out = " L "
Cassette in
Cassette in
Cassette in
Cassette in
One touch recording = " H "
Timer recording = " H "
General mode = " L "
REC pause
General mode = " L "
Blinks at 0.8Hz interval
Blinks at 1.6Hz interval
Blinks at 3.2Hz interval
Blinks at 6.4Hz interval
Blinks at 0.8Hz interval
1-7-9HC341FIS
Page 19
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement p arts that ha ve these special safety
characteristics are identified in this manual and its
supplements; ele ctrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substit ute replaceme nt parts that
do not have the same s afety character istics as specified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part number shown on these dr awings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance va lue s ar e indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identi fied by four di gits. The fir st two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±
±
10%
15%
20°C-25~+85°C
20°C-25~+85°C
CBA Symbols
(Top View) (Bottom View)
+
Electrolytic Capacitor
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
(Top View)
Schematic Diagram Symbols
Digital Transistor
NPN Transistor
E C B
(Top View)
NPN Digital Transistor
E C B
PNP Transistor
E C B
(Top View)
PNP Digital
Transistor
E C B
1-8-1SCPA1
Page 20
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1.
CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2.
CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3.
Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain origi nal function and reliability of rep aired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Mode: SP/REC
6. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
7. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
8. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Page 21
1-8-31-8-41-8-5
HC341SCM1
Main 1/4 Schematic Diagram
Note:
When it is necessary to replace one or more of the following Diodes,
all five should be replaced: D561, D562, D563, D564, D565.
*
1
Page 22
1-8-61-8-71-8-8HC341SCM2
Main 2/4 Schematic Diagram
Page 23
1-8-9
1-8-10
1-8-11
HC341SCM3
Main 3/4 Schematic Diagram
Page 24
1-8-12
1-8-131-8-14
HC341SCM4
Main 4/4 Schematic Diagram
NOTE :
THE VOLTAGE FOR PARTS IN HOT CIRCUIT IS MEASURED USING
HOT GND AS A COMMON TERMINAL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Page 25
Jack Schematic Diagram
1-8-15
1-8-16
HC341SCJ
Page 26
1-8-17
1-8-18
Function Schematic Diagram
HC341SCF
Page 27
VR501
SW-P
WF2
TP502
RF-SW
TP501
CTL
TP507
S-INH
WF5
TP301
C-PB
TP506
END-S
WF1
TP751
V-OUT
1-8-19
BHC400F01018-A
Main CBA Top View
BHB300F01011-A
BHB300F01011-B
Sensor CBA Top View
1-8-201-8-21
CAUTION !
Fixed voltage power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
Page 28
1-8-22
1-8-23
1-8-24
BHC400F01018-A
Main CBA Bottom View
CAUTION !
Fixed voltage power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
Page 29
Jack CBA Top View
Jack CBA Bottom View
BHC400F01018-E
1-8-25
1-8-26
Page 30
Function CBA Top ViewFunction CBA Bottom View
1-8-27
1-8-28
BHC400F01018-B
Page 31
1-9-1U25WFPAL
WF1
V-OUT E-E
10usec 50mV x 10
WAVEFORMS
(TP751 of Main CBA)
WF1
UPPER
WF2
LOWER
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50usec
(TP751 of Main CBA)
(TP302 of Main CBA)
WF5
C-PB 10mV x 10
RF-SW 0.5V x 10
5msec
UPPER
LOWER
WF2
(TP302 of Main CBA)
(TP301 of Main CBA)
Page 32
WIRING DIAGRAM
HC341WI1-10-11-10-2
GND
1 V-OUT1
2
AL+12V(2)
3 V-IN1
4
NU5
A-OUT
6
JK1-8P-OUT
7
A-IN18
1
2
3
4
5
6
7
8
CL151
CL101
KEY2
GND
2
3
2
NU
11
3
KEY1
44
CN651CL505
GND
1 V-OUT2
2
NU
3 V-IN2
4
GND5
A-OUT
6
SC2-IN
7
A-IN28
1
2
3
4
5
6
7
8
CL152CL102
AC CORD
ANT-IN ANT-OUT
FUNCTION CBA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
JACK CBA
AC HEAD ASSEMBLY
AUDIO HEAD
AUDIO
ERASE HEAD
CONTROL HEAD
AE-H
AE-H/FE-H
A-COM
A-PB/REC
CTL(+)
CTL(-)
6
5
4
3
2
1
CL287
MLOADING
MOTOR
CYLINDER ASSEMBLY
AE-H
1
AE-H/FE-H2
A-COM3
A-PB/REC4
CTL(+)5
CTL(-)
6
V-COM5
V(R)-26
V(R)-11
V-COM2
V(L)-2
3 V(L)-1
4
AL+15V/+12V
12 C-F/R
11
P-ON+5V
10 AL+12V(1)
9
GND8
C-FG
7
C-CONT
6
GND5
D-FG4
LM-FWD/REV
3
D-CONT
2
D-PG1
FE-H2
FE-H GND1
CL501
CL502
CL504
CL253
CAPSTAN MOTOR
FULL
ERASE HEAD
FE HEAD
VIDEO
(R)1 HEAD
VIDEO
(L)1 HEAD
VIDEO
(L)2 HEAD
VIDEO
(R)2 HEAD
M
DRUM
MOTOR
PG
SENSOR
(DECK ASSEMBLY)
SENSOR CBA
(BHB300F01011)
SENSOR CBA
(BHB300F01011)
MAIN CBA
(BHC400F01018B)
(BHC400F01018E)
(BHC400F01018A)
JK101,102
Page 33
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1IN
2IN
3IN
4IN
5IN
6IN
7IN
8IN
9IN
10IN
11-
1213 OUT
14IN
15 OUT
16 OUT
17IN
18 OUT
19-
202122-
23 OUT
24 OUT CAS LED
Signal
Name
SC2-IN
PGDELAY
POWSAF
END-S
AFC
V-ENV
KEY-1
KEY-2
LD-SW
ST-S
N.U.Not Used
N.U.Not Used
D-V-
SYNC
REMOCO
N-IN
C-ROTA
H-A-SW
H-A-
COMP
RF-SW
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
POWER
LED
Function
Input Signal from
Pin 8 of SCART2
Video Head
Switching Puls e
Signal Adjusted
Voltage
P-ON Power
Detection Input
Signal
Tape End Position
Detect Signal
Automatic Frequency
Control Signal
Video Envelope
Comparator Signal
Key Scan Input
Signal 1
Key Scan Input
Signal 2
Deck Mode Position
Detector Signal
Tape Start Position
Detector Signal
Dummy V-sync
Output
Remote
Control Sensor
Color Phase Rotary
Changeover SIgnal
Video Head Amp
Switching Puls e
Head Amp
Comparator Signal
Video Head
Switching Puls e
“STANDBY” LED Signal Output
“TAPE IN” LED Signal Output
Active
Level
L/Hi-z
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
H/Hi-z
H/L
H/L
H/L
H/L
H/L
H/L
Pin
IN/
No.
OUT
25 OUT
26 OUT REC LED
2728-
29 OUT
30 OUT
31IN
3233-
34IN
35IN
36 OUT
3738IN
-
-
L
-
-
-
-
39 OUT
40414243IN
44IN
45 OUT
46-
4748IN
49-
50IN
51-
52 OUT
5354-
Signal
Name
TIMER
LED
N.U.Not Used
N.U.Not Used
AUDIOSW1
AUDIOSW2
REC-SAF
N.U.Not Used
N.U.Not Used
RESET
XC-INSub Clock
XC-OUTSub Clock
VccVcc
X-INMain Clock Input
X-OUTMain Clock Input
VssVss(GND)
N.U.Not Used
N.U.Not Used
CLKSELClock Select (GND)
IN
OSC
OUT
OSC
N.U.Not Used
N.U.Not Used
FSC-IN
[4.43MHz]
OSDVssOSDVss
VIDEO-IN Video Signal Input
N.U.Not Used
VIDEO-
OUT
OSDVccOSDVcc
HLF
Function
“TIMER” LED Signal
Output
“REC” LED Signal
Output
Audio Input/Output
Switching Control
Signal 1 (Mono)
Audio Input/Output
Switching Control
Signal 2 (Mono)
Recording Safety SW
Detect (With Record
tab="L"/With out
Record tab="H")
System Reset
Signal (Reset=”L”)
Clock Input
for letter size
Clock Output for letter
size
4.43MHz Clock Input
Video Signal Output
LPF Connected
Terminal (Slicer)
Active
Level
H/L
H/L
-
-
Z/L
Z/L
H
-
-
L
-
-
-
-
-
-
-
-
L
-
-
-
-
-
-
-
-
-
-
-
1-11-1HC341PIN
Page 34
Pin
IN/
No.
OUT
555657-
58IN
59 OUT
60-
61626364-
65 OUT
66 OUT
67IN
68-
6970-
71 OUT
IN/
72
OUT
737475-
76 OUT
77 OUT
78 OUT
79IN
80IN
81 OUT
8283 OUT
84 OUT
Signal
Name
Function
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-SYNC
8POUT-1
Composite
Synchronized Pulse
SCART 1 8Pin
Output Control Signal
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
D-REC-H
C-
POWERSW
P-ON-H
Delayed Record
Signal
Capstan Power
Switching Puls e
Power On Signal at
High
N.U.Not Used
N.U.Not Used
N.U.Not Used
IIC BUS-
SCL
IIC BUS-
SDA
IIC BUS Control
Clock
IIC BUS Control Data
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-CONT
D-CONT
Capstan Motor
Control Signal
Drum Motor Control
Signal
Capstan Motor FWD/
C-F/R
REV Control Signal
(FWD=”L”/REV=”H”)
S-REEL
T-REEL
LM-FWD/
REV
Supply Reel
Rotation Signal
Take Up Reel
Rotation Signal
Loading Motor
Control Signal
N.U.Not Used
A-MUTE-H Audio Mute Control
Signal (Mute = “H”)
FF/REW-
L
CTL Amp Gain
Switching Signal (FF/
REW=”L”)
Active
Level
-
-
-
PULSE
H/L
-
-
-
-
-
L
L/Hi-z
H
-
-
-
H/L
H/L
-
-
-
PWM
PWM
H/L
PULSE
PULSE
H/L/
Hi-z
-
H
L
Pin
No.
OUT
8586IN
IN/
Signal
Name
Function
N.U.Not Used
P-DOWN-LPower Voltage Down
Detector Signal
Capstan Motor
87IN
C-FG
Rotation Detection
Pulse
8889IN
90IN
91929394 OUT
95 OUT
96-
9798-
AMPVssAMPVss (GND)
D-FG
D-PG
Drum Motor Rotation
Detection Pulse
Drum Motor Pulse
Generator
N.U.Not Used
AMPVRE
F
IN
V-Ref for CTL AMP
CC Terminal
CTL (-)
CTL (+)
AMPC
CTLAMP
out
Playback/Record
Control Signal (-)
Playback/Record
Control Signal (+)
CTL AMP Connected
Terminal
To Monitor for CTL
AMP Output
AMPVccAMPVcc
A/D Converter Power
99-
AVcc
Input/ Standard
Voltage Input
100-
N.U.Not Used
Notes:
Abbreviation for Active Level:
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
*B73FE Head
B133
B410
B414M Brake S AssemblyII
B416
Loading Motor Assembly
Tension Lever Sub Assembly
AC Head Assembly
Capstan Motor
Cap Belt
Idler Assembly
Pinch Arm (A) Assembly
M Brake T Assembly
II
I
II
II
I
I
II
II
I
II
II
II
B525
Notes:
1.Clean all parts for the tape transp ort (Upper Drum with Video Head / Pi nch Roller / Audio Co ntrol Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording Model only
LDG Belt
II
2-1-1U25MEN
Page 38
Cleaning
Cleaning of Video Head
Clean the head with a head cleanin g stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isoprop yl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressi ng it a gai ns t th e he ad tip , tur n the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it i s very thin, avoid clea ning it
vertically.
2.Wait for the c leaned part to dry thorou ghly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% is opropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoro ughly before
operating the unit or damage may occur.
A/C Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2U25MEN
Page 39
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N8
J-2Guide Roller Adj.Screwdr i ve rAvailable
J-3MirrorAvailable
J-4Azimuth Adj.Screwdriver +Available
J-5X Value Adj.Screwdriver -Available
(1 speed only)
FL6NS8
(2 speed only)
Locally
Locally
Locally
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
Page 40
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignme nt for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
Method for Manual Tape Loading/Unloading
A.
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, ligh tly push the cassette
tape further in and se e if the ta pe comes bac k out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 f or a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the M oving guide prepar ations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 unti l the Moving guide preparations come to the Eject Position. Stop turning
when the preparations b egin clicki ng or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the approp riate directi on con tinuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
Method to place t he Cassette Holder in the tape-
B.
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Rel ea se the lo ck in g ta bs shown
in Fig. M1 and contin ue turning the LDG Belt un til
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1U25PALMA
Page 41
1.Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
1-A
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
1-B
1-C
1-C
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
1-D
1-D
OK
Not good
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
1-A
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2U25PALMA
Adjust the X value and envelope.
1-B, 1-C
Page 42
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Do not use an Alignment Tape for this proce-
Note:
dure. If the unit is not correctly alig ned, the tape ma y
be damaged.
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead s urface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the to p of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that th e tape run s witho ut cr ea si ng at
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizon tal Position of the Audio/Contr ol/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not proper ly a ligned , m ax imu m e nv el ope ca nnot be obtained at the Neutra l positio n of the Track ing
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6N8) and confirm that the PB FM signal is
present.
3. Set the Tracking C ontrol Circuit to the center p osition by pres si ng CH U P but to n the n “ PLA Y ” bu tt on
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Take-up Guide
Post
Tape
Fig. M5
2-3-3U25PALMA
Page 43
6. Press CH DOWN butto n on the unit until the CTL
waveform has s hifted from it s original position ( not
the position achie ved in step 5, b ut the position of
CTL waveform in step 4) by approximately -2msec.
Make sure that th e envelope is simply attenuated
(shrinks in height) once CTL waveform passes its
original position and is fur ther bro ught in the minu s
direction.
7. Set the Tracking Contr ol Circuit to th e center posi tion by pressing CH UP button and the n “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope out put is poor , noise will appear in the
picture. The tracki ng will then lose precision and the
playback picture w ill be distorted by any sligh t variation of the Tracking Control Circuit.
1. Connect the oscillos cope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6N8). Set the Tracking Control Circuit to the
center position by pressing CH UP b utton and then
“ PLAY ” button on the unit. Ad just the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscill oscope di splay so that the enve lope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Ro ll er [2] (Re fer to Fig. M3) s o that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Ro ll er [3] (Re fer to Fig. M3) s o that
the waveform looks like the one shown in Fig. M9.
5. When Guide Roller s [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushin g the CH UP or DOWN b uttons alternately, to check the symm etry of the env elope. Chec k
the number of pushe s to ensure cente r position. The
number of pushes CH UP button to ac hieve 1/2 level
of envelope should m atch the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alig nment tape (FL6N8) and confi rm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig . M6)
Dropping envelope level at the beginning of track.
Fig. M7
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
2-3-4U25PALMA
Page 44
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-5-1.)
All the following proc edures, including those for adjustment and replacement of par ts, should be done in Eject
mode; see the positions of [45] and [46] in Fig.DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
TDM1,DM17
[47][19]TG Post AssemblyTDM1,DM17 *(L-7)
[48][18],[28]
[49][48]
Rack AssemblyRDM18
F Door OpenerRDM18
[50][50]Cleaner Lever AssemblyTDM1,DM6
*(L-8)Type B
(+)Refer to Alignment
Sec.Pg.2-4-10
Type A
[51][50]CL PostTDM6*(L-9)Type A
↓
(1)
↓
(2)
↓
(3)
↓
(4)
↓
(5)
↓
(6)
ADJUSTMENT
CONDITION
↓
(7)
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3): Nam e of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5): Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
2-4-2U25PALDA
Page 46
T op View
[14]
[39]
[7][50][8]
[46][45][47][9]
[13]
[11]
[15]
[40]
[38]
Bottom View
[10]
[12]
[37]
[33][44][42] [31] [32] [41] [43]
Fig. DM1
[19]
[36]
[35]
[26]
[27]
[23]
[28]
[24]
[25]
[34][20][29][22]
Fig. DM2
2-4-3U25PALDA
Page 47
(S-1)
[1]
(S-1)
(S-2)
[3]
[6]
(S-3)
[4]
[5]
(P-1)
(S-4)
Fig. DM5
Pin C
Slots B
Pin D
[2]
Pin A
2
Pull up
Fig. DM3
A
1
Slide
Pin B
Slot A
[7]
Type A
(S-5)
[50]
[51]
(L-9)
Type B
[50]
(L-8)
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
Locking tab
Slot A
View for A
Fig. DM4
A
Desolder
from bottom
View for A
Lead with
Blue Stripe
Fig. DM6
2-4-4U25PALDA
Page 48
[9]
A
(S-7)
(S-6)
(L-2)
LDG
Belt
Adj. Screw
[8]
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-1)
[17]
(L-3)
[14]
(S-9)
(S-10)
[15]
Fig. DM9
After removing the Screw (S-11),
while pressing the Locking Tab
(L-3), remove [16].
Pin of [12]
Pin of [10]
[13]
[10]
A
Grooves of [28]
(P-3)
[12]
[16]
[18]
(P-2)
(S-11)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[28]
grooves of [28] as shown.
View for A
Fig. DM8
2-4-5U25PALDA
Page 49
Cap Belt
(C-1)
[20]
[19]
[21]
Fig. DM12
(S-12)
Fig. DM11
2-4-6U25PALDA
Page 50
[23]
(P-4)
(C-3)
(C-2)
(P-4)
[28]
[22]
[27]
[28]
[26]
(S-15)
[25]
(L-4)
(C-6)
[29]
[30]
[31]
(C-5)
(C-4)
[24]
Pin on
bottom
of [23]
T op Vie w
When installing [23], install
the spring (P-4) to [28] as
shown in the left figure, and
then install [23] while
pressing the spring (P-4) to
the direction of the arrow in
the left figure and confirming
that the position of the
spring (P-4) is placed as
shown in the left figure.
[23]
Position of pin on [22]
Pin on [22]
[28]
Fig. DM13
[32]
Pin of [37]
Bottom View
T op Vie w
Position of Mode Lever when installed
Pin of [34]
[28]
Align [25] and [28] as shown.
First groove on [28]
First tooth on [48]
[28]
When reassembling [28],
meet the first groove on
[28] to the first tooth on
[48] as shown.
Pin of [38]
[25]
Fig. DM14
2-4-7U25PALDA
Page 51
Refer to the Alignment Section, Page 2-4-9.
(P-5)
[45]
[46]
[47]
[34]
[38]
(P-7)
turn
[40]
[33]
(L-6)
turn
[44]
[42]
(L-5)
[39]
(C-8)
[36]
(C-7)
[41]
[35]
Fig. DM15
[43]
(P-6)
[37]
[49]
[48]
(L-7)
Fig. DM17
Slide
Fig. DM18
turn
Fig. DM16
2-4-8U25PALDA
Page 52
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape
loading/unloading mechanism. Since information
about the state of the mechanism is provided to the
System Control Circuit on ly through the Mode Switch,
it is essential that the correct relationship between
individual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequenc e given. Each
procedure assumes th at all pr evious pro cedures hav e
been completed.
IMPORTANT:
If any one of these alignments is not performed
properly, even if off by only one tooth, the unit will
unload or stop and it may result in damage to the
mechanical or electrical parts.
Alignment points in Eject Position
T op View
Alignment [a]
Alignment 3
Alignment 1
Loading Arm, S and T Assembly
Install Loading Arm S and T Assembly so that their
triangle marks point to each other as shown in Fig.
AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other ,
install the Loading Arm T Assembly so that the last
tooth of the gear meets the most inside teeth of the
Mode Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
T Assembly
Loading Arm
S Assembly
Last Tooth
Alignment 2
Most inside teeth
of Mode Gear
Mode Gear
Bottom View
Alignment [a] can be done independently of any
other alignment.
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment [a]
Tape Guide Assembly
Measurement of the screw must be as spe ci fied in
Fig. AL3.
Tape Guide
Assembly
Screw
3.25 – 0.1 mm
0.128 – 0.004 inch
This alignment can be
done independently of
any other alignment.
Fig. AL3
2-4-9U25NAPM
Page 53
Alignment 3
Cam Gear (A), Rack Assembly
Install the Rack Asse mbl y so tha t the first tooth on
Note: There are two different, but interchangeable
types of CLEANER LEVER(B359) in this model,
and have different combination with B361. Please
see Table 1 for details and combination. (Refer to
DECK PARTS LIST section.)
Table 1 (B359 and B361 Combination)
TypePart No.Part No.
A0VM411114
B
B483
B425
L1461
0VM304413
0VM305090
B360
(Blue grease)
B361B359 CLEANER LEVER
Not used
B529
Type B
B359
B562
B482
B563
L1341
B300
B529
Type A
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6U25PALDEX
Page 61
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, rea d carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
S1GIFT BOX CARTON HC341ED0VM305614
S2STYROFOAM HC460ED0VM203356
S3UNIT, BAG V4010PA0VM406453B
X1REMOTE CONTROL UNIT 364/CRC005 orN9472ED
X2DRY BATTERY R6P/2S orXB0M451T0001
X3RF CORD PAL 1.2MWPZ0122LG001
X4ACCESSORY BAG K8092BA0VM404632
X20A! OWNER'S MANUAL HC341ED0VMN03179
X20B! OWNER'S MANUAL(SWEDISH) HC341ED0VMN03181
(See Electrical Parts List)
(See Electrical Parts List)
LABEL, BAR CODE HC341ED0VM413839
(See Electrical Parts List)
(See Electrical Parts List)
PACKING
ACCESSORIES
REMOTE CONTROL UNIT 364/CRC006NA174ED
DRY BATTERY(SUNRISE) R6SSE/2SXB0M451MS002
200206133-2-1HC341CA
Page 62
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, rea d carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Parts that a re not assigned part numbe rs (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A)
FUNCTION CBA (MCV-B)
JACK CBA (MCV-E)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA(MCV-A)
Consists of the following:
CAPACITORS
C002! METALLIZED FI LM CAP. 0. 068µF/275V K orCT2E683HJE06
!METALLIZED FILM CAP. 0. 068µF/250V K orCT2E683DC011
!METALLIZED FILM CAP. 0. 068µF/250V MCT2E683MS037C003! SAFETY CAP. 2200pF/250V orCCN2EMP0E222
!SAFETY CAP. 2200pF/250VCA2E222MR049
ELECTROLYTIC CAP. 22µF/400V MCA2H220S6015
C005CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) X K 3300pF/16VCCA1CKT0X332
C008CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C010FILM CAP.(P) 0.022µF/50V J orCMA1JJS0 0223
FILM CAP.(P) 0.022µF/50V JCA1J223MS029
C011ELECTROLYTIC CAP. 10µF/1 6V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C012ELECTROLYTIC CAP. 10µF/50V M H7CE1JMAVSL100
C014ELECTROLYTIC CAP. 470µF/25V M orCE1EMASDL471
ELECTROLYTIC CAP. 470µF/25V MCE1EMASTL471
C017ELECTROLYTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
C018ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C020ELECTROLYTIC CAP. 1000µF/16 V MCE1CMZPTL102
C021ELECTROLYTIC CAP. 470µF/10V M orCE1AMASDL471
0VSA12955
---------
---------
--------0VSA12316
----------
Ref. No.DescriptionPart No.
ELECTROLYTIC CAP. 470µF/10V MCE1AMASTL471
C022ELECTROLYTIC CAP. 22µF/50V M H7CE1JMAVSL220
C025CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C026ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C053ELECTRIC DOUBLE LAYER CAP0.047F/5.5V Z or CA0J473NE003
ELECTRIC DOUBLE LAYER CAP. 0.047F/5.5V Z CA0J473MS014
C056CERAMIC CAP.(AX) F Z 0.047µF/16VCCA1CZTFZ473
C151CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C152CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C154CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C155ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C156ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C157ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C158CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C159CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C253ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C254CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C302CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C303ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C304ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C305CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
200206133-3-1HC341EL
Page 63
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C307CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C310CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C312CERAMIC CAP.(AX) Y M 8200pF/16VCCA1CMT0Y822
C313CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C314CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C316CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C317ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C318ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C319ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C320CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C323CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
C325CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C327CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C330CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C332CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C333ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C334ELECTROLYTIC CAP. 4.7µF/25V M NP H7CP1EMAVSB4R7
C335ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C337CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C338ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C339ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C340CHIP CERAMIC CAP. CH J 120pF/50V orCHD1JJBCH121
CHIP CERAMIC CAP. CG J 820pF/50VCHD1JJ3CG821
C412CERAMIC CAP.(AX) X K 1800pF/16VCCA1CKT0X182
C413ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C414CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C416CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C417CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C418CHIP CERAMIC CAP. CH J 33pF/50V orCHD1JJBCH330
CHIP CERAMIC CAP. CG J 33pF/50V orCHD1JJBCG330
CHIP CERAMIC CAP. CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP. CG J 33pF/50VCHD1JJ3CG330
C419CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C421ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C422ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C423CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C424ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C425CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C426CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C430ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C431CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C501ELECTROLYTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/6.3V MCE0KMASTL221
C502CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C506CERAMIC CAP.(AX) B K 100pF/50V orCCA1JKT0B101
CERAMIC CAP.(AX) B J 100pF/50VCCA1JJT0B101
C508ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C510ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C511ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C512CHIP CE RAM IC CA P. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C513CHIP CERAMIC CAP. CH J 22pF/50V orCHD1JJBCH220
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C522ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C523CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C524CHIP CERAMIC CAP. CH J 330pF/50V orCHD1JJBCH331
CHIP CERAMIC CAP. CG J 330pF/50V orCHD1JJBCG331
CHIP CERAMIC CAP. CH J 330pF/50V orCHD1JJ3CH331
CHIP CERAMIC CAP. CG J 330pF/50VCHD1JJ3CG331
C526CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C527ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C529CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C535CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C543CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C853CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
Ref. No.DescriptionPart No.
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZB0F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CE RAMI C CAP . F Z 0. 1µF/50V orCHD1JZ30F104
CHIP CE RAMI C CAP . F Z 0. 1µF/25V orCHD1EZ30F104
CHIP CE RAMI C CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C105CHIP CERAMIC CAP. F Z 0.1UF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1UF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1UF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1UF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1UF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1UF/50VCHD1JZ3FZ104
C107ELECTROLYTIC CAP. 1UF/50V M H7CE1JMAVSL1R0
C108CHIP CERAMIC CAP. B K 1000PF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000PF/50VCHD1JK30B102
C109CHIP CERAMIC CAP. B K 2200PF/50V orCHD1JKB0B222
CHIP CERAMIC CAP. B K 2200PF/50VCHD1JK30B222
C112CHIP CERAMIC CAP. CH J 470PF/50V orCHD1JJBCH471
CHIP CERAMIC CAP. CG J 470PF/50V orCHD1JJBCG471
CHIP CERAMIC CAP. CH J 470PF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470PF/50VCHD1JJ3CG471
C113CHIP CERAMIC CAP. B K 2200PF/50V orCHD1JKB0B222
CHIP CERAMIC CAP. B K 2200PF/50VCHD1JK30B222
C115ELECTROLYTIC CAP. 100UF/16V M H7CE1CMAVSL101
C116ELECTROLYTIC CAP. 470UF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470UF/6.3V MCE0KMASTL471
C117ELECTROLYTIC CAP. 470UF/6.3V M orCE0KMASDL471
1. There are two different, but interchangeable types of
CLEANER LEVER(B359) in this model, and have
different combination with B 361 . Pleas e se e T able 1
for details and combination.
Table 1 (B359 and B361 Combination)
B359 CLEANER LEVERB361
TypePart No.Part No.
A0VM3044130VM411114
B0VM305090Not used
2. There are two different types of RACK
ASSEMBLY(B555), and hav e different combination
with B514. Please see Table 2 for details and
combination.
Table 2 (B555 and B514 Combination)
Carved Seal on
Chassis
(see below)
TypePart No.Part No.
“1xx” or “2xx”A0VSA120710VM412597
“3xx” or “4xx”B0VSA128870VM411535
B555
RACK ASSEMBLY
B514
Carved Seal on Chassis
T op View
Ref. No.DescriptionPart No.
B2CYLINDER ASSEMBLY MK11 PAL 4HDN1547CYL
B3LOADING MOTOR ASSEMBLY MK110VSA12093
B8PULLEY ASSEMBLY MK110VSA12078
B9MOVING GUIDE S PREPARATION MK100VSA11002
B10MOVING GUIDE T PREPARATION MK100VSA11004
B11LOADING ARM T(B) ASSEMBLY MK110VSA12110
B12LOADING ARM S(B) ASSEMBLY MK110VSA12109
B27TENSION LEVER SUB ASSEMBLY MK110VSA12076A
B31AC HEAD ASSEMBLY MK110VSA12074
B35TAPE GUIDE ASSEMBLY MK110VSA12069
B37CAPSTAN MOTOR 288/VCCM011N9661CML
B52CAP BELT MK100VM411138
Ref. No.DescriptionPart No.
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) VTR-1X2ERS11-148DHVEC01TE004
B74PRISM MK100VM202870
B121WORM MK110VM412544
B126PULLEY MK110VM412543
B133IDLER ASSEMBLY(2) MK100VSA11531
B148TG CAP MK60VM407664C
B300C DRIVE LEVER R MK110VM305068
B303F DOOR OPENER MK110VM203299
B347GUIDE HOLDER A MK100VM304920
B354SLIDER R MK110VM101040
B355SLIDER L MK110VM203296
B359CLEANER LEVER MK10 or0VM304413
CLEANER LEVER MK110VM305090
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(Y) MK110VSA12807