LSIS XGT, XGR, XGR-CPUH/F, XGR-DBST, XGR-DBSF User Manual

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Programmable Lo gic C ontroller

XGR CPU Modul e

User’s Manual



Read this manual carefully before

wiring, operating, servicing or



Keep this manual within easy reach for

CPU

Expansion drive

XGT Series

XGR-CPUH/F XGR-CPUH/T XGR-CPUH/S XGR-DBST XGR-DBSF(S) XGR-DBSH(S) XGR-DBDT XGR-DBDF XGR-DBDH

installing, inspecting this equipment.

quick reference.

http://www.lsis.com

Safety Instructions

Warning

Caution

Before using the product …

For your safety and effective operation, please read the safety instructions thoroughly before using the product.

► Safety Instructions should always be observed in order to prevent accident

or risk with the safe and proper use the product.

► Instructions are separated into “Warning” and “Caution”, and the meaning of

the terms is as follows;

WARNING indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury

CAUTION indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury.

It may also be used to alert against unsafe practices

► The marks displayed on the product and in the user’s manual have the

following meanings.

Be careful! Danger may be expected. Be careful! Electric shock may occur.

► The user’s manual even after read shall be kept available and accessible to

any user of the product.

Safety Instructions

damage such as emergent stop switch,

protection circuit, the upper/lowest limit switch, forward/reverse

etc.) is detected during CPU operation in PLC, the whole output is designed to be turned off and stopped for system safety. However, in case CPU error if caused on output device itself such as relay or

detected, the output may be kept on, which may

In case of data exchange between computer or other external

Warning

Safety Instructions when designing

 Please, install protection circuit on the exterior of PLC to protect

the whole control system from any error in external power or PLC

module. Any abnormal output or operation may cause serious problem

in safety of the whole system.

- Install applicable protection unit on the exterior of PLC to protect the system from physical

operation interlock circuit, etc.

- If any system error (watch-dog timer error, module installation error,

TR can not be cause serious problems. Thus, you are recommended to install an addition circuit to monitor the output stat us.

 Never connect the overload than rated to the output module nor

a llow the output circuit to have a short circuit, which may cause a fire.

 Never let the external power of the output circuit be designed to

be On earlier than PLC power, which may cause abnormal output or

operation.



equipment and PLC through communication or any operation of PLC (e.g. operation mode change), please install interlock in the sequence program to protect the system from any error. If not, it

may cause abnormal output or operation.

Safety Instructions

Caution

product is installed loosely or incorrectly, abnormal operation, error or

Caution

Safety Instructions when designing

 I/O signal or communication line shall be wired at least 100mm

away from a high-voltage cable or power line. If not, it may cause

abnormal output or operati o n.

Safety Instructions when designing

 Use PLC only in the environment specified in PLC manual or

general standard of data sheet. If not, electric shock, fire, abnormal operation of the product or flames may be caused.

 Before installing the module, be sure PLC power is off. If not,

electric shock or damage on the product may be caused.

 Be sure that each module of PLC is correctly secured. If the

dropping may be caused.

 Be sure that I/O or extension connecter is correctly secured. If

not, electric shock, fire or abnormal operation may be caused.

 If lots of vibration is expected in the installation environment,

don’t let PLC directly vibrated. Electric shock, fire or abnormal operation may be caused.

 Don’t let any metallic foreign materials inside the product, which

may cause electric shock, fire or abnormal operation..

Safety Instructions

damage on the product may be

Before PLC system is powered on, be sure that all the covers of

Warning

Let the wiring installed correctly after checking the voltage rated

Caution

Safety Instructions when wir ing

 Prior to wiring, be sure that power of PLC and external power is

turned off. If not, electric shock or

caused.



the terminal are securely closed. If not, electric shock may be c aused



of each product and the arrangement of terminals. If not, fire, electric shock or abnormal operati on may be c ause d.

 Secure the screws of terminals tightly with specified torque when

wiring. If the screws of terminals get loose, short circuit, fire or abnormal

operation may be caused.

 Surely use the ground wire of Class 3 for PE terminals, which is

exclusively used for PLC. If the terminals not grounded correctly,

abnormal operation may be caused.

 Don’t let any foreign materials such as wiring waste inside the

module while wiring, which may cause fire, damage on the product

or abnormal operation.

Safety Instructions

If not, electric shock or

Warning

Caution

Product or battery waste shall be processed as industrial waste.

Caution

Safety Instruct ions for test-operation or repair

 Don’t touch the terminal when powered. Electric shock or abnormal

operation may occur.

 Prior to cleaning or tightening the terminal screws, let all the

external power off including PLC power. abnormal operation may occur.

 Don’t let the battery recharged, disassembled, heated, short or

soldered. Heat, explosion or ignition may cause injuries or fire.

 Don’t remove PCB from the module case nor remodel the module.

Fire, electric shock or abnormal operation may occur.

 Prior to installing or disassembling the module, let all the external

power off including PLC power. If not, electric shock or abnormal

operation may occur.

 Keep any wireless installations or cell phone at least 30cm away

from PLC. If not, abnormal operation may be caused.

Safety Instructions for waste disposal



The waste may discharge toxic materials or explode itself.

(3) Flag

A-6, A-11

2-4

Revision History

Version Data Main contents Revised location

V 1.0 ’08. 6 First Edition -

V 1.1 ’08.7

1. Modifying contents (2) How to configure redundancy system (3) Performance specification (4) S can Time (5) Program memory (6) I/O mod ule skip fu nction (7) Module changing wizard during RUN

(8) Performance specification (9) E xample of calculating consumption current/power (10) Caution in handling (11) Grounding

2. Adding contents (1) XGR redundancy system configuration

(2) Remote I/O system

(3) Scan Time (4) I/O module skip

3. Deleting contents

2-5 4-1,4-2 5-6,5-8

5-28

6-19,6-20

6-21

7-1,7-3

8-5

11-5

11-13

1-3

2-13

5-8

6-20

V 1.2 ’09.9

V 1.3 ’09.9

(1) Max install-able module number in specification

1. Modifying contents (1) Performance specification (2) redundancy parameter setting window

1. Adding contents (1) Contents on redundancy system communication

operation setting (ONE IP Solution)

2. modifying contents (1) Product list (add new products)

- XGR-DC32, XGR-DMMA

- XGF-SOEA

- XGL-EIPT

7-1

4-2

5-2, CH6

6-18~20

2-1

2-3

(5) Modifying contents on basic parameter

Ch6.7.1

(4) Base and expansion cable

Ch101.1

Revision History

Version Data Main contents Revised location

V 1.4 ’09.12

V 1.5 ’10.03

V 1.6 ’10.10

1. Adding contents (1) adding contents related to DC power

1. Adding contents

(1) Contents on reset/D.Clear (2) Contents on Cnet/FEnet module equipment (3) Contents on redundancy parameter (4) Warning flag (5) Smart Link wiring diagr am and Event input m odule

specifications

2. Modifying contents

(1) Contents on parameter setting window (2) Contents on Fault mask setting (3) Module replacement

1. Modifying contents

(1) Modifying contents (2) Adding contents

Ch8.1, Ch8.2, Ch8.3

4-6 2-7

5-8~9

App-8

9-24~25

5-4, 6-1, 6-14~15

6-20

6-23~24

Ch3.1

Ch5.1.2

V 1.7 ’10.10

V 1.8 ’10.10

(3) Adding modules (4) Modifying contents on redundancy parameter

1. Modifying contents

(1) Overview (2) System configuration (3) Power module

1. Adding contents

(1) Adding contents on redundancy parameter (2) Adding contents on redundancy parameter (3) Adding contents on redundancy parameter

Ch5.1.4 Ch5.1.4

Ch1.1 Ch2.1

Ch8.4.1

Ch5.1.4 Ch6.8.1

Ch6.9

(4) Adding optical single module

1-1, 2-1, 2-6, 4-1, 4-2, 7-1

(1) Removing Appendix 1.11

App-21

(1) Vibration resistance S pecifications

3-1

(6) List of Configuration Products updated

Revision History

Version Data Main contents Revised location

V 1.9 ’11.06

V 2.0 ’13.01

V 2.1 ’14.06

1. Adding contents

(1) Adding module on Extension redundancy

(2) Adding contents on Extension redundancy

(3) Adding contents on Flag

1. Adding contents

(1) Adding Redundancy Expansion Base

(2) Built-in PID Function

2.Modifying contents

(1) Modifying EtherNet/IP (2) Modifying U, K Device memory

3. Re moving conten ts

1. Adding contents

(1) Adding _REFRESH_NG_BASE

1-1, 2-1, 7-2

1-3, 1-4, 2-8, 6-25,

8-3, 10-2, 14-28

App-3/7/11/13

2-1, 10-1

Ch 14

1-6, 2-7, 2-13

4-1, 5-32

App-13

V 2.2 ’15.07

V 2.3 ‘15.09

V 2.4 ‘16.03

※ The number of User’s manual is indicated right part of the back cover.

1.Modifying content s

1.Modifying content s (1) Rated input voltage modified (2) Circuit configuration modified (3) Smart Link Model name modified (4) Terminology modified (FG  PE) (5) CPU Processing Speed Unit changed (us  ns)

1.Modifying contents

(1) Smart Link manual supplemented

8-1

9-2, 9-3, 9-4, 9-5

9-6

8-2, 10-1, 10-2, 11-2, 13-1

4.1

2.1

9-6

Manual

online functions such as programming, printing,

About User’s Manual

Thank you for purchasing PLC of LSIS Co., Ltd. Before use, mak e sure to caref ully read an d understan d the Us er’s Manu al about the functions, performances, insta llation and programming of th e product you purchased in or der for correct use and importantly, let the end user and maintenance administrator to be provided with the User’s Manual.

The User’s Manual describes the product. If necessary, you may refer to the following description and order accordingly. In ad dition, you may con nect our website( and download the information as a PDF file.

Relevant User’s Manuals

Title Description

It describes how to use XG5000 software, which it is XG5000 User’s Manual (for XGI/XGR)

XGI / XGR Series Instructions & Programming

applied to the IEC standar d language, especially about

monitoring and debugging by using XGI/XGR series

products.

It is the user’s manual for programming to explain ho w

to use commands that are used PLC system with XGI

CPU and XGR CPU.

http://eng.lsis.biz/)

No. of User’s

10310000834

10310000833

XGI-CPU User’s Manual

It describes CPU specif ications and technical terms for

the XGT PLC system using a series of XGI-CPU.

10310000832

◎

TABLE OF CONTENTS

Chapter 1 Overview ......................................................................................................................... 1-1~1-8

1.1 About this User Manual ................................................................................................................... 1-1

1.2 Configuration o f the XGR Redundant System .................................................................................. 1-3

1.3 Features of the XGR Redundancy system ....................................................................................... 1-4

1.4 Glossary ........................................................................................................................................... 1-6

Chapter 2 System Configuration.................................................................................................... 2-1~2-17

2.1 Product List ........................................................................................................................................ 2-1

2.2 Redundancy System ....................................................................................................................... 2-7

2.2.1 Redundant System Configuration ............................................................................................. 2-7

2.2.2 Redundancy of CPU sy stem .................................................................................................. 2-9

2.2.3 Power Module Redundancy ..................................................................................................2-11

2.2.4 Extension Drive Redundancy ............................................................................................... 2-12

2.2.5 Extension Base Communication Path Redundancy ............................................................. 2-12

2.2.6 Example of Redundant System Configuration .................................................................... 2-12

2.3 Network System .............................................................................................................................. 2-17

2.3.1 Networking among Systems ................................................................................................. 2-17

2.3.2 Remote I/O Sy stem ................................................................................................................ 2-17

Chapter 3 General Specifications ............................................................................................................ 3-1

3.1 General S pecifications ....................................................................................................................... 3-1

Chapter 4 CPU Module ................................................................................................................... 4-1~4-8

4.1 Performance S pecifications ............................................................................................................... 4-1

4.2 Names and Functions of Parts .......................................................................................................... 4-3

4.3 Battery ............................................................................................................................................... 4-7

4.3.1 Battery specifications ................................................................................................................ 4-7

4.3.2 Cautions for usage .................................................................................................................... 4-7

4.3.3 Battery life ................................................................................................................................. 4-7

4.3.4 Replacement ............................................................................................................................. 4-8

Chapter 5 Program Constitution and Operation Method ............................................................... 5-1~5-33

5.1 Program Basics ............................................................................................................................... 5-1

5.1.1 Program S tructure and Execution ........................................................................................... 5-1

5.1.2 Software Program Execution Methodology ............................................................................ 5-2

5.1.3 Operation of instantaneous interrupt ......................................................................................... 5-5

5.1.4 Scan Time ................................................................................................................................. 5-6

5.2 Program Execution .........................................................................................................................5-11

TABLE OF CONTENTS

5.2.1 Program T ype ..........................................................................................................................5-11

5.2.2 Program Execution ..................................................................................................................5-11

5.2.3 Restart Mode ......................................................................................................................... 5-12

5.2.4 Tas k Progra m ........................................................................................................................ 5-14

5.3 Operation Mode............................................................................................................................... 5-23

5.3.1 Operation Mode .................................................................................................................... 5-23

5.3.2 RUN mode .............................................................................................................................. 5-23

5.3.3 S top M ode ............................................................................................................................... 5-24

5.3.4 Debug Mode ........................................................................................................................... 5-25

5.3.5 Switching Operation Mode .................................................................................................... 5-25

5.4 Redundancy System Operation .................................................................................................... 5-27

5.4.1 Redundancy System Operation ............................................................................................. 5-27

5.4.2 Start-up of Redundant System ................................................................................................ 5-29

5.5 Memory ........................................................................................................................................... 5-31

5.5.1 Program memory .................................................................................................................... 5-31

5.5.2 Data memory .......................................................................................................................... 5-32

5.5.3 Data retain area setting ........................................................................................................... 5-32

Chapter 6 CPU Module Functions ................................................................................................. 6-1~6-24

6.1 Self-dia gnosis Function ..................................................................................................................... 6-1

6.1.1 Scan watchdog timer ................................................................................................................ 6-1

6.1.2 I/O Module Check Function ...................................................................................................... 6-3

6.1.3 Battery level check .................................................................................................................... 6-3

6.1.4 Saving error log ......................................................................................................................... 6-3

6.1.5 Troubleshooting ........................................................................................................................ 6-3

6.2 Clock Function ................................................................................................................................... 6-4

6.3 Remote Functions ............................................................................................................................. 6-7

6.4 Forced On/Off Function of I/O ......................................................................................................... 6-10

6.4.1 Force I/O Setting ..................................................................................................................... 6-10

6.4.2 The point of time of method o f forced On/Off process .............................................................6-11

6.5 Operation history saving function .................................................................................................... 6-12

6.5.1 Error history ............................................................................................................................. 6-12

6.5.2 Mode change history .............................................................................................................. 6-12

6.5.3 Shut down history ................................................................................................................... 6-12

6.5.4 System history......................................................................................................................... 6-12

6.6 External device failure diagnosis function ........................................................................................ 6-13

6.7 Redundancy system operation mode ............................................................................................. 6-14

6.7.1 Operation mode setting ........................................................................................................... 6-14

6.7.2 Data synchronization area setting ........................................................................................... 6-16

6.8 Setting operation of communication .............................................................................................. 6-17

6.8.1 Automatic master conversion ................................................................................................ 6-17

6.8.2 Global status variable .............................................................................................................. 6-18

6.8.3 ONE IP Solution ...................................................................................................................... 6-18

6.9 Fault Mask Function ...................................................................................................................... 6-20

6.9.1 Applications and operations .................................................................................................... 6-20

6.9.2 Fault mask setting ................................................................................................................... 6-20

6.9.3 Releasing fault mask ............................................................................................................... 6-20

6.10 I/O M odule Skip Function .............................................................................................................. 6-21

6.10.1 Applications and operations .................................................................................................. 6-21

6.10.2 Setting and processing I/O data ............................................................................................ 6-21

6.10.3 Releasing skip function ......................................................................................................... 6-21

6.11 I/O Base Skip Function .................................................................................................................. 6-22

TABLE OF CONTENTS

6.11.1 Purpose and outline of the operation .................................................................................... 6-22

6.11.2 Setting method ...................................................................................................................... 6-22

6.11.3 Releasing skip function ......................................................................................................... 6-22

6.12 Module Replacement Function during Operation ......................................................................... 6-23

6.12.1 Module replacement in redundant system............................................................................ 6-23

6.12.2 Replacing I/O module in redundant system .......................................................................... 6-23

6.12.3 Replacing base module in redundant system ...................................................................... 6-24

Chapter 7 Extension Drive Module .................................................................................................. 7-1~7-3

7.1 Performance specifications ............................................................................................................... 7-1

7.2 Identification and Function ................................................................................................................. 7-2

Chapter 8 Power Module ................................................................................................................. 8-1~8-5

8.1 T y pe and S pecification ....................................................................................................................... 8-1

8.2 Parts’ Names ..................................................................................................................................... 8-2

8.3 Selection ............................................................................................................................................ 8-3

8.4 Examples of Current Consumption/Power Calculations ................................................................... 8-4

Chapter 9 IO Module ..................................................................................................................... 9-1~9-40

9.1 Cautions for Selecting Modules ......................................................................................................... 9-1

9.2 Digital Input Module S pecifications .................................................................................................... 9-3

9.2.1 8 point DC24V input module(source/sink type) ........................................................................ 9-3

9.2.2 16 point DC24V input module(source/sink type) ...................................................................... 9-4

9.2.3 16 point DC24V input module(source type) .............................................................................. 9-5

9.2.4 32 point DC24V input module(source/sink type) ...................................................................... 9-6

9.2.5 32 point DC24V input module(source type) .............................................................................. 9-7

9.2.6 64 point DC24V input module(source/sink type) ...................................................................... 9-8

9.2.7 64 point DC24V input module(source type) .............................................................................. 9-9

9.2.8 16 point AC110V input module ............................................................................................... 9-10

9.2.9 8 point AC220V input module ..................................................................................................9-11

9.2.10 8 point AC220V isolated input module .................................................................................. 9-12

9.3 Digital Output Module S pecifications ............................................................................................... 9-13

9.3.1 8 point relay output module ..................................................................................................... 9-13

9.3.2 16 point relay output module ................................................................................................... 9-14

9.3.3 16 point relay output module(Surge Killer built-in type) ........................................................... 9-15

9.3.4 16 point Triac output module ................................................................................................... 9-16

9.3.5 16 point transistor output module(sink type) ........................................................................... 9-17

9.3.6 32 point transistor output module(sink type) ........................................................................... 9-18

9.3.7 64 point transistor output module(sink type) ........................................................................... 9-19

9.3.8 16 point transistor output module(source type) ....................................................................... 9-20

9.3.9 32 point transistor output module(source type) ....................................................................... 9-21

9.3.10 64 point transistor output module(source type) ..................................................................... 9-22

9.3.11 8 point transistor isolated output module(sink type) .............................................................. 9-23

9.4 Digital I/O Combined Module S pecifications. .................................................................................. 9-24

9.4.1 32 point(DC input transistor output) I/O combined module ..................................................... 9-24

9.5 Event Input Module ......................................................................................................................... 9-25

9.5.1 Event input module ................................................................................................................. 9-25

TABLE OF CONTENTS

9.6 Applications of Smart Link ............................................................................................................... 9-26

9.6.1 Modules accessible to Smart Link .......................................................................................... 9-26

9.6.2 Smart Link Components ......................................................................................................... 9-26

9.6.3 Smart Link Mapping T able ...................................................................................................... 9-27

9.6.4 Smart Link Connection............................................................................................................ 9-27

9.6.5 Smart Link Connection Diagram ............................................................................................. 9-28

9.6.6 Smart Link Specifications & Dimensions ................................................................................ 9-38

Chapter 10 Base and Extension Cable ....................................................................................... 10-1~10-5

10.1 Specifications ................................................................................................................................. 10-1

10.1.1 Basic base ............................................................................................................................ 10-1

10.1.2 Extension base ..................................................................................................................... 10-1

10.1.3 Sync. Cable ........................................................................................................................... 10-2

10.1.4 Extension cable ..................................................................................................................... 10-2

10.1.5 Connector for extension cable (electrical) ............................................................................. 10-3

10.2 Parts and Names ........................................................................................................................... 10-4

10.2.1 Basic base ............................................................................................................................ 10-4

10.2.2 Extension base ..................................................................................................................... 10-5

Chapter 11 Installation and Wiring .............................................................................................. 11-1~11-13

11.1 Installation .......................................................................................................................................11-1

11.1.1 Inst allation environment ..........................................................................................................11-1

11.1.2 Cautions for handling .............................................................................................................11-3

11.1.3 Attachment/Detachment of modules ......................................................................................11-8

11.2 Wiring ........................................................................................................................................... 11-10

11.2.1 Power wiring ........................................................................................................................ 11-10

11.2.2 I/O Device wiring .................................................................................................................. 11-11

11.2.3 G rounding wiring ................................................................................................................. 11-12

11.2.4 S pecifications of wiring cable ............................................................................................... 11-13

Chapter 12 Maintenance ............................................................................................................. 12-1~12-2

12.1 Repairs and Maintenance ............................................................................................................. 12-1

12.2 Routine Inspection ......................................................................................................................... 12-1

12.3 Periodic Inspection ........................................................................................................................ 12-2

Chapter 13 EMC Compliance. ..................................................................................................... 13-1~13-4

13.1 Requirements Complying with EMC Specifications .................................................................... 13-1

13.1.1 EMC specifications ............................................................................................................... 13-1

13.1.2 Panel ..................................................................................................................................... 13-2

13.1.3 Cable ..................................................................................................................................... 13-3

13.2 Requirements Complying with Low Voltage Direction .................................................................. 13-4

13.2.1 Specifications applicable to XGT series ................................................................................ 13-4

13.2.2 Selection of XGT series PLC ................................................................................................ 13-4

TABLE OF CONTENTS

Chapter 14 Built-in PID Function ............................................................................................... 14-1~14-37

14.1 Features ........................................................................................................................................ 14-1

14.2 PID Control .................................................................................................................................... 14-1

14.3 PID Control Operation ................................................................................................................... 14-2

14.3.1 Terms used ........................................................................................................................... 14-2

14.3.2 PID equation ......................................................................................................................... 14-2

14.3.3 P control ................................................................................................................................ 14-3

14.3.4 PI control ............................................................................................................................... 14-4

14.3.5 PID control ............................................................................................................................ 14-5

14.4 PID Instructi on ............................................................................................................................... 14-6

14.4.1 PID loop state ........................................................................................................................ 14-6

14.4.2 PID instruction group ............................................................................................................. 14-7

14.5 PID Configuration .......................................................................................................................... 14-9

14.5.1 Common bit area ................................................................................................................ 14-12

14.5.2 Individual data operation ..................................................................................................... 14-15

14.6 Convenient Functions of PID Instruction ..................................................................................... 14-22

14.6.1 Various control method including PID ................................................................................. 14-22

14.6.2 Operation and function of Anti Wind-UP ............................................................................. 14-22

14.6.3 Operation and function of Auto-tuning ................................................................................ 14-22

14.6.4 Operation and function of cascade ..................................................................................... 14-23

14.7 Directions of PID Instructions ...................................................................................................... 14-24

14.7.1 Hardware configuration ....................................................................................................... 14-24

14.7.2 Program example 1 ............................................................................................................ 14-27

14.7.3 PID control .......................................................................................................................... 14-28

14.7.4 AT(Auto-tuning) operation ................................................................................................... 14-35

14.7.5 Program example 2 ............................................................................................................ 14-36

14.7.6 Cascade operation .............................................................................................................. 14-37

Chapter 15 Troubleshooting ...................................................................................................... 15-1~15-27

15.1 Basic Troubleshooting Procedure ................................................................................................. 15-1

15.2 Troubleshooting ............................................................................................................................. 15-2

15.2.1 Action when POWER LED is off ........................................................................................... 15-3

15.2.2 A ction when WA R. (Warning) LED is on ............................................................................... 15-4

15.2.3 A ction when ERR. LED is on. ............................................................................................... 15-8

15.2.4 A ction when RUN/STOP LED is off ...................................................................................... 15-9

15.2.5 A cton when I/O module does not work properly ................................................................. 15-10

15.2.6 Action when writing program is not possible ....................................................................... 15-12

15.2.7 Action when Sync. cable is not installed properly ............................................................... 15-13

15.2.8

When undesirable master switching occurs ....................................................................... 15-14

15.2.9 When newly added CPU does not join redundant operation ............................................. 15-15

15.2.10 When failing to switch master ........................................................................................... 15-16

15.2.11 When extension cable is disconnected ........................................................................... 15-17

15.2.12

When extension driver gets er ror ............................................................................... 15-19

15.3 Troubleshooting Questionnaires ................................................................................................. 15-21

15.4 Cases .......................................................................................................................................... 15-22

15.4.1 Trouble types and measures of input circuit ....................................................................... 15-22

15.4.2 Trouble types and measures of output circuit ..................................................................... 15-23

15.5 Error Codes List ........................................................................................................................... 15-25

15.5.1 Error codes during CPU operation ...................................................................................... 15-25

TABLE OF CONTENTS

Appendix 1 Flags List ............................................................................................................ App-1~App-18

Appendix 1.1 User Flag ....................................................................................................................... App-1

Appendix 1.2 System Error Representative Flag ................................................................................ App-2

Appendix 1.3 System Error Detail Flag ............................................................................................... App-6

Appendix 1.4 System Warning Representative Flag .......................................................................... App-8

Appendix 1.5 System Warning Detail Flag ........................................................................................ App-10

Appendix 1.6 System Operation Status Information Flag ................................................................. App-11

Appendix 1.7 Redundant Operation Mode Information Flag ............................................................ App-16

Appendix 1.8 Operation Result Information Flag .............................................................................. App-17

Appendix 1.9 Operation mode Key S tatus Flag ................................................................................ App-18

Appendix 1.10 Link Flag (L) List ........................................................................................................ App-19

Appendix 1.11 Reserved Word ......................................................................................................... App-21

1-1

XGR−AC12, XGR-AC22, XGR-AC13, XGR-AC23, XGR-DC42

XGR-DBDT, XGR-DBDF, XGR-DBDH

Chapter 1. Overview

1.1 About this User Manual

This User Manual describes the performance speci fications and operation procedures of the redundancy system including the XGR-CPU, in addition to the configuration of communication system and the use of special module in relation to the redundancy system.

This User Manual provides the basic specificati ons of the CPU module, power module, I/O modul e, main/expansion base of redundancy and expansion drive module, which are applied to the ba sic system of redundancy (XGR).

Classification Model Name Redundancy CPU Modul e Expansion D rive Module Redundancy Pow er Module I/O Module Redundancy Ba sic Ba se Redundancy Expansion Base Redundancy Expansion Drive Modul e

For programming, see following manuals in addi tion to this User Manual;

 XG5000 User Manual (for XGI/XGR)  XGI/XGR Instruction User Manual

For further information o n the special and co mmunication modules, see the manuals and techni cal data pertinent to each special module and communication modules.

 User Manuals of the special modules  User Manuals of the communication modules

XGR−CPUH/F, XGR−CPUH/T, XGR-CPUH/S XGR−DBST, XGR−DBSF(S), XGR−DBSH(S)

XGI−□□□□, XGQ−□□□□ XGR-M02P , XGR-M06P

XGR-E12P, XGR-E12H

1-2

Describes the product ty pes and system configurations available for the XGR series.

CPU Module Specifications

Configuration of program and operation method

Chap. 6

Chap. 7

Chap.8

Chap. 9

Chap. 10

Provides the items and methodology of maintenance for PLC system to prevent failure throughout the service life.

Provides the system construction and configuration in response to the EMC specification.

Describes various errors an d faults which may occur in the sy stem and countermeasures..

Append. 1

Flag List

Describes the types and conte nts of various flags.

Append. 2

Dimensions

Provides the external size of the CPU, I/O module and base.

Append. 3

GLOFA Compatibility

Append. 4

Warranty

Note

1) This User Manual doe s not describe the special a nd communication modules and programming.

Chapter 1. Overview

This User Manual contains following information.

Chapter Subject Description

Chap. 1 Overview Describes the configuratio n, product features, and glossaries. Chap. 2 System Configuration Chap. 3 General Specifications Provides the common speci fications of the modules used in the XGR se ries. Chap. 4

Chap. 5

Chap. 11

Chap. 12 Chap. 13 Chap. 14

CPU Module Functions Expansion driver module Power Module IO Module Base Expansion Cable

Installation and Wiring

Maintenance EMC Compliance Troubleshooting

Describes the performance, specification, and ope ration of the XGR-CPUH.

Describes the specification s and use of the I/ O module and power module , except the CPU module.

Provides the guidelines for installation, wiring and precaution of t he PLC system to secure system reliability.

Refer related manuals for the information.

2) XGR CPU is a kind of XGT PLC system whose CPU type can be clas sified as follows; ① XGK Series: the XGT PLC systems having the CPU using Master-K language(LS langua ge) ② XGI Series: the XGT PLC systems having single CPU using IEC language ③ XGR Series: the XGT PLC systems having redundan t CPUs using IEC language

1-3

Chapter 1. Overview

1.2 Configuration of the XGR Redundant System

XGR Redundancy System provides reliable solution for va rious types of redundan cy systems required in diversified applications. The XGR Redundancy System is economical and user-convenient because the system makes use of the most resources of the XGI system, added with the components for redundancy.

Redundancy

 CPU module redundancy  Power module redundancy  Ethernet communication module redundancy

Modules for redundancy

 2 redundant CPUs [optical, electrical]  5 types of power module [standard, la rge output] – AC110V, AC220V, DC24V individual  Redundant bases [2, 6 slots : 2, 6 communication modules can be installed]  3 types of expansion drive modules [per media class: optical, electrical, mixed]  Expansion base [12 slots: according to consumption current]  3 types of redundancy expansion drive modules [per media: Optical, electrical, mixed]  Redundancy expansion base [1 2 slots: according to consumption current]

CPU Module

 IEC 61131-3 language supported, lad der process rate o f 42ns/command, 3MB (Approx. 128kstep) program capacity, 131,072

of I/O points

 1Gbps optical communicati on for CPU synchronization  Built-in I/O communication master  Provides 2 types of CPU module according to the I/O communication media [optical , electrical]

Redundant system Network

•

 Expansion d rive module  Topology: ring [bus ty pe operation activated i n case of one error]  Provides optical, electrical, and combined media  Applied with 100Mbps class industrial Eth ernet technology  Max. available I/O point s: 23,808 (31 station s x 12 slots x 64 poi nts)

Programming Tool

 Integrated control of all the all XGT ty pes with XG5000 – XGK, XGI, XG B, XGR  Convenient programming, various motoring function, diagnosis function, edit funtion  Supports various IEC ty pe languages: LD, ST, SFC, IL[Only view function]  Supports communication parameter setting, frame monitoring function through XG-PD  Supported with software packages per functionalities for motion, APM, temperature controller, etc.

1-4

Chapter 1. Overview

1.3 Features of the XGR Redundancy system

XGR Redundancy System provides optimized solutions in vario us applications with its supe rb performance and convenience features.

High performance

 CPU process rate: 42ns / command  High speed backplane  Large capacity control poin ts: max. 131,072 points  Sufficient program capacity (max. 128ksteps)  Sufficient data memory: 25MB  Long data type (64bit) and high speed real number operation (single, doubl e) provided  Switching operation with minimum delay : if the master CPU fails, operation is switched to t he backup CPU wi thin 50ms

Minimum size implemented

 Compact panel can be implemented with the minimum size among the class  CPU module: Width(55 mm) * Height(98 mm) * Depth(90 mm)  Power module

1) XGR-AC12/AC22: Width (55 mm) * Hei ght (98 mm) * Depth (90 mm)

2) XGR-AC13/AC23: Width (55 mm) * Hei ght (98 mm) * Depth ( 110 mm)

Easy expansion using network

 Easy installation of expansion bases using networ k cable  Up to 31 remote ba ses can be added  Software program c an be uploaded/download ed via online acces s from expansion base  Communication master module on expansion base enables the installatio n of smart I/O at anywhere

Improved maintenance maintain ace by system history, network ring configuration, etc.

 Provides system analysis dat a including the ope ration, error, and sy stem histories  Network ring configuration enables normal system operation even w hen a network cable fails  Provides network monitoring and protocol monito ring functions  If communication fails (smart I/O, etc.), the failed channel can be monitored (by monitoring the flag via HMI).  Graphic display of sy stem configuration  Module Changing Wizard enables safe replacement of module during operation  Base Changing Wizard enables safe replacement of base during operation

IEC 61131-3 (standard language) specification compliance

 Provide s IEC standard LD, ST, SFC, IL(only view function)  Provides IEC standard program structure and data type

1-5

Chapter 1. Overview

Supports various communication functions

 Open network enables conveni ent interface with o ther products (Ethern et, Profibus, DeviceNet , RS-232C, RS-422/485, etc. )  Supports various protocols for improved convenience  Up to 24 communication master modules (12 high speed links, 8 P2Ps) c an be mounted on one redundant system.  Simple and east network dia gnosis using network a nd communication fra me monitoring function  RAPIEnet module can be ins erted on basic base

Diverse I/O modules are provided for easy system configuration

 8, 16, 32, and 64 point modules are provided (8/16 point modules fo r relay output)  Single input, single outp ut, mixed I/O module p rovided

Extended applications with enhanced analog function

 Analog modules can be connected to the slots of all the expansion bases (max. 250 output modules , 139 input modules)  Supports various application s with insulated ty pe analog and temperatu re module  Convenient use by special parameter settings and flags  Strengthened debugging fun ction by monitoring flags and data and changing t he setting value through special monitor display

window

Provides integrated programming & engineering environments

 Integrated control of all the all XGT ty pes with XG5000 – XGK, XGI, X GB, XGR  Convenient p rogramming, vario us motoring function, dia gnosis function, edit funtion  Supports various IEC ty pe languages: LD, ST, SFC, IL[Only view function]  Supports communication parameter setting, frame monitoring function through XG-PD  Supported with software packages per functionalitie s for motion, APM, temperature controller, etc.

Provides diversified additional function

 Battery backup and flash memory backup for software programs  Various restart mode(warm, cold)  Task program process  Forced ON/OFF of I/O  Clock  Module changing wizard available during operation  Fault mask function  Module skip function  Extensive operation history supported (sy stem hi story )  Detail error report supported (e rror histo ry)  LED indication of operation status  Dot matrix indicator: display operation information an d abnormal matters in texts.

PID Function

 Max. 256 loops supported  Parameter setting using XG5000, convenient monitoring on loop status through Trend monitor  Easy control parameter setting using i mproved auto-tuning function  Provides various control modes including normal/ reverse combination operation, 2 step SV PID control, cascade control, etc.  Safety secured by diversi fied alarm function s including PV MAX, PV change, etc.

1-6

CPU module,

etc.

This base can accommodate the CPU module and Ethernet

operating as backup mode.

Expansion ba se where power module, I/O module, and

RAPIEnet).

A programming tool for developing software program, editing and debugging

Replaceable

HSC,RTD

Chapter 1. Overview

1.4 Glossary

This section provides the major terms and their definitions, u sed in this Manual.

Terms Definition Remark

Module

Master CPU Module

Standby CPU Module

Redundant Basic Base

Redundant Expansion Base

Expansion Drive Module

Synchronous cable

A standardized component havi ng a specific function to constitute a system. E.g., I/O board designed to be inserted i nto base.

The CPU module running the p resent software prog ram. Automatically switched to backup CPU module when the operation is stopped and transfers the control

The control function of the master CPU module is transferred to this standby CPU module in case of failure, and this standby CPU module becomes the master CPU module.

communication module. ▪Master CPU system: the redundant ba sic system whose CPU module is operating as the master. ▪Standby CPU system: the redundant ba sic base whose CPU module is

special/communication module can be installed . (The communication module can be any module except the EtherNet/IP , FEnet and

The module for communication between base s. It also enable s setting the base numbers (1~31) with a rotary switch

1Gbps optical cable for connection between the CP U modules of a redundant system

power module, I/O module,

As a part of redundant sy stem, the system is constructed to ena ble

CPU redundancy

Power redundancy

Unit

PLC System

XG5000

Module Changing Wizard

continuous operation when the master CPU module fail s using a backup CPU module

A system constructed with redundant power modules to enable continuo us system operation when a modul e of the base fail s

A module or a set of module w hich is the mini mum unit of a PLC sy stem oper ation. A PLC sy stem comprises units and/or s ets of units

A system consists of PLC and peripheral devices and can be controlled with user software program

A software used for the r eplacement of CPU module during PLC operation. Power module, I/O module, some of the special modules, and base module can be replaced with this software

Basic unit.

Expansion unit

special modules: A/D,D/A,

1-7

%IX0.0.2

etc.

The variables used with na mes and type declared by user.

and %MD1234.

Chapter 1. Overview

Terms Definition Remark

Cold Restart

Warm Restart

Starting a PLC system and user program after initializing al l data (variable s and programs such as I/O i mage area, internal register, timer, counte r, etc.) automatically or manually

Along with the function that notifies user-program about power OFF incidents, the user programs are restarted with holding previous data according to setting, after a power OFF.

I/O Image Area

Cnet Computer Network FEnet Fast Ethernet Network Pnet Profibus-DP Network Dnet DeviceNet Network Rnet Remote Network RTC Real Time Clock. The generic IC with a built-in clock function

Watchdog Timer

Function

Function Block

The internal memory area o f the CPU module in stalled to maintain I/ O status

The timer which monitors the preset running time of a user program, and triggers alarm if the process fails to be completed within preset ti me

The operation units which do not store the ope ration result in the instructions, such as the 4 arithmetical and comparison operations, and output the results of the inputs immediately

The operation units which store the operation re sults in the instru ction, such as timer and counter, and use the results over multiple scans

Direct Variable

Automatic Symbolic Variable

Task

The variables used without de claring name and ty pe. For example, I, Q, and M areas are direct va riables.

- if declared as‘INPUT_0’=%IX0.0.2, ‘RES ULT’=%MD1234, ‘INPU T_0’ and ‘RESULT’ names can be used in the program instead of %IX0.0.2

The condition for a program start-up, such as fixed cycle task, internal contact point task, and ini tialization task

%QW1.2.1 %MD1234,

1-8

The method wherein the cur rent enters PLC input terminal from swi tch when

Sink Output

The method wherein the current enters output terminal fro m load when the

The method wherein the cur rent enters from outpu t terminal when the PLC

−

S/W

Common

Current

−

S/W

Common

−

Current

Output

Contact

Common

−

Current

Output

Common

Chapter 1. Overview

Terms Definition Remark

the input signal is turned ON

Sink Input

Source Input

The method wherein the current enters switch from PLC input terminal when the input signal is turned ON

PLC

Z: input impedance

PLC output is ON

PLC

Contact

Load

output is ON

PLC

Source Output

Load

2-１

• Max. I/O points

• For opti cal communi cati on (multi mode, max. distance: 2km)

• Max. I/O points

• For opti cal communi cati on (s ingle mode, max. distan ce: 15km)

• Max. I/O points

• For electrical communication

• For mounti ng redu ndan cy CPU module, pow er redun dan cy

• Availabl e for 2 communication modules

• For mounti ng redu ndan cy CPU module, pow er redundancy

• Available for 6 communication modules

• Fo r mounting I/ O module , power redundancy

• Availabl e for 12 I/O modules

• Fo r mounting I/ O module , power redundancy

• Availabl e for 8 I/O modules

• Fo r mounting I/ O module , power redundancy

• Availabl e for 12 I/O modules

• Communication module for XGR expansion base operation.

Electrical media

• Communication module for XGR expansion base operation. Optical media (multi mode, max. distance: 2km)

• Communication module for XGR expansion base operation. Electrical/optical media mixing (multi mode, max. di stance: 2km)

• Communication module for XGR expansion base operation. Optical media (single mode, max. distance: 15km)

• Communication module for XGR expansion base operation. Electrical/optical media mixing (single mode, max. distance: 15km)

• Communication module for XGR expansion drive redundancy base operation. Electrical media

operation. Optical media (multi mode, max. distance: 2km)

• Communication module for XGR expansion drive redundancy base (multi mode, max. distance: 2km)

Chapter 2. System Configuration

The XGR Series offer various products for basic systems, computer communication and network systems. This Chapter describes the configuration method and features of each system.

2.1 Product List

The product line of the XGR Series is as follows.

(1) Products exclusive for redundancy

Product Model Description

: 23,808, program capacity: 3MByte (including UPLOAD)

Redundancy CPU Module

Redundancy Basic Base

Redundancy Expansion Base

Redundancy Expan sion Driver Base

XGR-CPUH/F

XGR-CPUH/S

XGR-CPUH/T

XGR-M02P

XGR-M06P

XGR-E12P

XGR-E08P

XGR-E12H

• Exten sion drive module redundancy

Expansion Drive Module

Expansion Drive Redundancy Modul e

Power Module

XGR-DBST XGR-DBSF XGR-DBSH XGR-DBSFS XGR-DBSHS XGR-DBDT XGR-DBDF

XGR-DBDH

XGR-AC12 XGR-AC22 XGR-AC13 XGR-AC23 XGR-DC42

• Communication module for XGR expansion drive redundancy base

operation. Electrical/optical media mixing

• DC5V: 5.5A , AC110V input

• DC5V: 5.5A , AC220V input

• DC5V : 8.5A, AC1 10V input

• DC5V: 8.5A , AC220V input

• DC5V: 7.5A , DC24V in put

2-２

XGC-F201

• LC type optical cable (multi core), length: 2 m

• LC type optical cable (multi core), length: 5 m

Chapter 2. System Configuration

Product Model Description

Sync. Cable

Dustproof module XGR-DMMA

XGC-F301 XGC-F501

• LC type optical cable (multi core), length: 3 m

• dustproof module for not used power module slot

2-３

Digital I/O Mi xed

Module

• DC 24V input , 16 point s(curren t sour ce / sink inpu t)

• Transistor output, 16 points (0.1A, sink output)

Chapter 2. System Configuration

(2) Common Products for XGT Series

(a) Digital I/O Module

Product Model Description

Digital Input M odu le

XGI-D21A XGI-D21D XGI-D22A XGI-D24A

XGI-D28A XGI-D22B XGI-D24B XGI-D28B XGI-A12A XGI-A21A XGI-A21C XGQ-RY1A

XGQ-RY1D XGQ-RY2A XGQ-RY2B XGQ-TR2A

• DC 24V input , 8 point s (current source / sink input)

• DC 24V Diagnostic Input, 8 point (Current sink in put)

• DC 24V input , 16 point s (current source / si nk input )

• DC 24V input , 32 point s (current source / si nk input )

• DC 24V input , 64 point s (current source / si nk input )

• DC 24V input , 16 point s (current source inpu t)

• DC 24V input , 32 point s (current source inpu t)

• DC 24V input , 64 point s (current source inpu t)

• AC 110V inp ut, 16 points

• AC 220V input, 8 points

• AC 220V i sola te d i npu t, 8 points

• Relay output, 8 points (2A, single COM.)

• Diagnostic Relay output, 8 point (for 2A, single COM.)

• Relay outpu t, 16 points (2A)

• Relay output, 16 points (2A), Varistor incorporated.

• Transistor output, 16 points (0.5A, sink output)

XGQ-TR4A

Digital Output M odul e

Anti-vibration Module XGT-DMMA

XGQ-TR8A XGQ-TR2B XGQ-TR4B

XGQ-TR8B XGQ-SS2A XGQ-TR1C

XGH-DT4A

• Transistor output, 32 points (0.1A, sink output)

• Transistor output, 64 points (0.1A, sink output)

• Transistor output 16 points (0.5A, source output)

• Transistor output 32 points (0.1A, source output)

• Transistor output 64 points (0.1A, source output)

• Triac output, 16 points (1A)

• Transistor isolated output, 8 points (2A)

• Anti-vibration module for unused slots

2-４

• Volta ge Input: 8 channel

• DC 1 ~ 5V / 0 ~ 5V / 0 ~ 1 0V / −10 ~ +10V

• Current Input: 8 channel

• DC 4 ~ 20mA / 0 ~ 20mA

• Volta ge/Cu r rent I npu t: 4 cha nnel s

• Insula tion betwe en chan nels

• 2-wire transmitter driver power supported

• Volta ge Output : 4 channel s

DC 1 ~ 5V / 0 ~ 5V / 0 ~ 1 0V / −10 ~ +10V

• Curren t Output: : 4 channels

• DC 4 ~ 20mA / 0 ~ 20mA

• Curren t Output: : 4 channels

• Insula tion betwe en chan nels

• Curren t Output: : 4 channels

Insulation betwe en chan nels

• Volta ge Output : 8 channel s

• DC 1 ~ 5V / 0 ~ 5V / 0 ~ 1 0V / −10 ~ +10V

• Curren t Output: : 8 channels

• DC 4 ~ 20mA / 0 ~ 20mA

Analog I/O

Module

• Vol ta ge/Cu r rent in put 4 channel s Voltage/Cur rent ou tp ut 2 ch ann el s

HART I/F

Module

HART I/F

Module

Thermocouple

Input Module

• Temperature (T/C) Input, 4 channel s,

• Insula tion betwe en chan nels

XGF-RD4A

• Temperature (RTD) Input, 4 channe l s

• Insula tion betwe en chan nels

XGF-RD8A

• Temperature (RTD) Input, 8 channels

Output(8 channels, TR/current)

• Control loop: 4 loops input (4 channel s, RTD), Outpu t (8 chan nels, TR )

• Volta ge In put ty pe ( Open C olle cto r ty pe )

• 200kHz, 2 channel

• 500kHz, 2 channel

• Volta ge In put ty pe ( Open C olle cto r type)

• 200kHz, 8 channel

(b) P roce ss an d Mot ion C ontrol Mo dules

Product Model Description Remarks

Chapter 2. System Configuration

Analog input

Module

Analog output

Module

XGF-AV8A

XGF-AC8A

XGF-AD08A

XGF-AD4S

XGF-AD16A

XGF-AW4S

XGF-DV4A

XGF-DC4A

XGF-DV4S

XGF-DC4S

XGF-DV8A

XGF-DC8A

• Volta ge/Cu r rent I npu t: 8 channels

• Volta ge/Cu r rent I npu t: 16 channels

• 2-wire voltage/ curre nt in put: 4 –channel, insulation

between channels

•

Analog Input

Analog Output

RTD Input

Module

Temp. control

Module

High speed

Counter

Module

XGF-AH6A

XGF-AC4H

XGF-DC4H

XGF-TC4S

XGF-RD4S

XGF-TC4UD

XGF-TC4RT

XGF-HO2A

XGF-HD2A

XGF-HO8A

•

• Current Input : 4 channel

• HART I/F, DC 4 ~ 20mA

• Current Output : 4 channel

• HART I/F, DC 4 ~ 20mA

• Control loop : 4 loop s

• Input (4 channel s, TC/R TD/volta ge/cu rrent ),

•

• Differ entia l Input type (Line Drive r type )

2-５

Event Input

Module

Data Log

Module

• 32 poin t s (Inp ut : 2 2 poi n ts , Outp ut : 10 p oi n ts )

Note

Recommendations of selecting USB Cable (To avoid disconnection with XG5000)

Chapter 2. System Configuration

Product Model Description Remarks

Positioning

Module

XGF-PO3A XGF-PO2A XGF-PO1A XGF-PD3A XGF-PD2A XGF-PD1A XGF-PO4H XGF-PO3H XGF-PO2H XGF-PO1H XGF-PD4H XGF-PD3H XGF-PD2H XGF-PD1H

• Pulse out put (Open Collector type), 3 axes

• Pulse out put (Open Collector type), 2 axes

• Pulse out put (Open Collector type), 1 axis

• Pulse out put (Line Drive type), 3 axes

• Pulse out put (Line Drive type), 2 axes

• Pulse out put (Line Drive type), 1 axis

• Pulse out put (Open Collector type), 4 axes

• Pulse out put (Open Collector type), 3 axes

• Pulse out put (Open Collector type), 2 axes

• Pulse out put (Open Collector type), 1 axes

• Pulse out put (Line Drive type), 4 axes

• Pulse out put (Line Drive type), 3 axes

• Pulse out put (Line Drive type), 2 axes

• Pulse out put (Line Drive type), 1 axes

XGF-PN8A XGF-PN8B

Motion Control

Module

1. Recommend that the company’s USB Cable(USB-301A) which is shielded and shorter th an 3m.

2. Recommend using USB Hub when connecting up to the PC poor at Noise.

XGF-M16M XGF-M32E

XGF-SOEA XGF-DL16A

• Network type(EtherCat), 8 axes, LS dedicated type

• Network type(EtherCat), 8 axes, Standard type

• Motion dedi cat ed net (M-II) ty pe, 16 axes

• Motion dedi cat ed net (EtherCAT) type, 32 axes

• DC 24V input , 32 point , Sequence of Ev ent modu le

• USB 2.0 , CF200 1, Ma x 16G B

2-６

• 100/10 Mbp s suppo rt

• Fast Ethernet(electrical), Master

• 100/10 Mbp s suppo rt

XGL-ESHF

• Fast Ethernet Switch module(optical)

XGL-EH5T

• Fast Ethernet Switch module(electrical)

• Communi catio n Module betwe en PLCs (elect rical )

• 100 Mbps Indust rial Ethe rnet suppo rted

• Communication Module between PLCs (optical)

• 100 Mbps Indust rial Ethe rnet suppo rted

• Communi catio n Module betwe en PLCs (elect rical / opt ical)

• 100 Mbps Indust rial Ethe rnet suppo rted

• Communi catio n Module betwe en PLCs (electrical)

• RAPIEnet Sw itch

• Serial communication

• RS-232C, 2 channel

• Serial communication

• RS-422(485), 2 channel

• Serial communication

• RS-232C 1 channel / RS-422(485) 1 channel

• Dedica ted Ethernet(optical ), M a ster

• 100/10 Mbp s suppo rt

• 100/10 Mbps support

• for Rnet Master I/F (Smart I/O communication available)

• for twisted cable

Profibus-DP

Module

XGL-PMEA XGL-PMEC

Pnet Slave I/F

module

DeviceNet

Module

Ethernet/IP

Module

Note

Product Model Description Remarks

Chapter 2. System Configuration

FEnet Module (Optical/Elec.)

RAPIEnet

Cnet Module

FDEnet

Module(Master)

XGL-EFMF

XGL-EFMT

XGL-EIMT

XGL-EIMF

XGL-EIMH

XGL-ES4T

XGL-C22A

XGL-CH2A

XGL-EDMF

XGL-EDMT

• Fast Ethernet(optical), Master

• 100 Mbps Indust rial Ethe rnet suppo rted

• Deterministic communication support

• Dedica ted Ethe rnet(el ect rical) , Maste r

• Deterministic communication support

- XGL-C42A

• Fa st respon se speed supp ort(again st the e xisting Fnet

Rnet Module XGL-RMEA

XGL-PSEA XGL-DMEA XGL-EIPT

BACnet/IP I/F Module

Fnet I/F module XGL-FMEA  Field Bus master module -

For the active coupler, optical converter, repeater and block type remote module, see the network related

technical documents.

XGL-BIPT

module)

• 1 Mbps base band

• Profibus-DP Master module

• Profibus-DP Slave module

• DeviceNet Master module

 Ethe rNe t/IP(e lectric)

 100/10 Mbps support

 BAC Ne t/IP (e le c tr ic )  100/10 Mbps support

2-７

Basic base

configuration

Extension base

configuration

Max. extendabl e

stacks

• 16-point modules: 5,952 points

• 64-point modules: 23,808 points

• B etween bases

- Electrical: 3.1km (when installing 31 expansion modules)

Chapter 2. System Configuration

2.2 Redundancy System

2.2.1 Redundant System Configuration

The configuration of the basic system incorporating the redundant basic base and expansion bases connected with cables are shown below.

Classification Description

• C onstructed with 2 basic bases of the same structure.

• C onstructed with 2 extension drive module of the same station number

• Expansion bases can be installed up to 31 stacks.

Max. I/O modules • Up to 372 I/O modules can be installed in expansion bases.

Max. I/O points

Max. expansion

distance

• 32-point modules: 11,904 points

- Optical multi mode: 2 km

- Opt ical single mode: 15km

- Electrical: 100 m

• Tot al max length

- Optical multi mode: 62km (when installing 31 expansion modules)

- Optical single mode: 465km (when installing 31 expansion modules)

2-８

Note

(1)The redundant basic base ha s a fixed ba se No. of 0. Expansion bases are provided with switches for

to start.

I/O number

allocation for expansion bases

Classification Description

• The beginning value of the I/O numbers of each base is determined by the base number setup in the expansion drive module.

• In the base, the I/O numbers are allocated by 64 (fixed) points per slot.

Each slot is a llocated w ith 64 point s regardle ss of t he instal lation an d ty pe of modu le.

• D ifferent from the digital I/O modules, special modules do not use I/O number for control.

They use U device and exclusive function block.

• A n exemplary allocation of I/O numbers of a 12 slot base is shown b elow.

Chapter 2. System Configuration

• S ince communication module only can be installed on the basic base, I/O numbering is meaningless.

I/O number of basic

base

• Though the basic base does not use the I/O number, the same numbers (768 points) as that of a 12 lot expansion base are allocated.

• The basic base has the base No. of “0” located at the first digit of the I/O No.

setting up base No. (2) The base modul e s i n stalle d w it h redundant CPU are available for the basic base only. (3) The redundant CPU is a CPU module which occupies 2 slots.

(4) The type of module setup with I/O parameter must agree with that of the actual module to enable operation

2-９

Refresh

Size

Refresh

Size

XGI-A12A

XGQ-RY1A

XGI-A21A

XGQ-RY2A

XGI-A21C

XGQ-RY2B

XGI-D21A

XGQ-SS2A

XGI-D22A/B

XGQ-TR1C

XGI-D24A/B

XGQ-TR2A/B

XGI-D28A/B

XGQ-TR4A/B

Digital I/O module

XGH-DT4A

XGQ-TR8A/B

XGF-AC8A

XGF-RD4A

XGF-AV8A

XGF-RD4S

XGF-AD8A

XGF-TC4S

XGF-AD16A

XGF-RD8A

XGF-AD4S

XGF-TC4RT

XGF-AW4S

XGF-TC4UD

XGF-AC4H

XGF-HO2A

XGF-DC8A

XGF-HD2A

XGF-DV8A

XGF-HO8A

XGF-DC4A

XGF-DV4A

Data log module

XGF-DL16A

XGF-DC4S

XGL-EFMT

XGF-DV4S

XGL-EFMF

XGF-DC4H

XGL-ESHF

Analog I/O module

XGF-AH6A

XGL-DMEA

XGF-PO1A

XGL-PSEA

Chapter 2. System Configuration

2.2.2 Module selection when configuring basic system

When configuring basic system, you must consider about size of each module’s Data Refresh area. Data Refresh area is used for data transmission between CPU and modules in XGR CPU system. Data Refresh area is allocated to CPU memory, irrespective of module’s operation. You must consider about maximum size of Data Refresh area. If it exceeds 5120 words(Input Data), 3072 words(Output Data), system doesn’t operate properly.

(1) Size of each module’s Data Refresh area

(Unit : WORD)

Item Type

Digital input modul e

Analog input module

Analog output

module

Item Type

Digital output module

Temperature detector

input module

Temperature control

module

High speed counter

module

SOE module

XGF-SOEA

APM module

( Advanced Position

module )

XGF-PO2A XGF-PO3A XGF-PD1A XGF-PD2A XGF-PD3A XGF-PO1H XGF-PO2H

Communication module

XGL-PMEA 16 XGL-PMEC XGL-EDMT XGL-EDMF

XGL-EDST XGL-EDSF

XGL-RMEA

2-１０

Refresh

Size

Refresh

Size

Note

Chapter 2. System Configuration

Item Type

XGF-PO3H XGF-PO4H XGF-PD1H XGF-PD2H

APM module

( Advanced Position

module )

XGF-PD3H XGF-PD4H XGF-PN8A 3 XGL-EIMF XGF-PN8B 3 XGL-ES4T

XGF-M16M 1 XGL-BBM

XGF-M32E 4 XGL-EIPT

(2) Calculation of Data Refresh area’s size

1) Limit of Data Refresh area’s size

Item Type

XGL-FMEA

XGL-C22A XGL-C42A

XGL-CH2A

XGL-EIMT

Communication module

XGL-EIMH

Sum of Data Refresh area’s size installed in system (Input module) ≤ 5,120 WORD Sum of Data Refresh area’s size installed in system (Output module) ≤ 3,072 WORD

2) Example

In a system, below modules are installed. (Input module) XGI-D28A(20 EA), XGF-DC8A(40EA), XGF-AC8A(20EA), XGF-RD4A(10EA)

→ Input module data refresh : (4 * 20) + (22 * 20) + (30 * 10) = 820 WORD ≤ 5,120 WORD → Output module data refresh : (11 * 40) = 440 WORD ≤ 3,072 WORD

1) Sum of Input module Data Refresh area’s size must not exceed 5,120 WORD. Sum of Output module Data Refresh area’s size must not exceed 3,072 WORD.

2) If size of Data Refresh area exceeds the range, XGK/I system doesn’t operate prope rly.

2-１１

Modules

Type/Model

Main base

CPU Module

XGR-CPUH/T, XGR-CPUH/F

Power Module

XGR-AC12, XGR-AC22, XGR-AC13, XGR-AC23

Communication Module

EtherNet/IP I/F module, FEnet I/F module, RAPIEnet I/F module, Cnet I/F module

Base

XGR-M02P

*2)

, XGR-M06P

Expansion

Digital I/O

All types of digital I/O

Analog I/O

All types of analog I/O

Communication Module

Pnet/Rnet/Dnet/Cnet I/F module

*1) XGR CPU module V1.8 or above is needed. *1) XGR-M02P base is supported at XG5000 V3.6 or above

Note

(1) Redundant CPU cannot be installed on an expansion base module.

module, the same modul e must be instal led on th e CPU-B: 0 slot.

Chapter 2. System Configuration

2.2.3 Redundancy of CPU system

A redundant system has the redundancy of power supply modules, CPU modules, basic base modules, and communication modules. On the basic base module of a redundant system, two identical power, CPU, and communication modules are installed. The two CPU modules are connected with a sink cable.

One of the two CPU systems functions as the master which is in charge of the operation and the other is the backup system which takes over the operation when the master system fails.

After correcting the failure, the previous master system can participate in the redundant operation as a backup system. Master and backup systems can be selected using software tool and key switch during redundant operation.

Use the switch on the CPU module to setup CPU-A and CPU-B. If the setting is duplicated with A or B, normal redundant operation cannot be achieved.

Slot 0

Slot 1

Slot 2

Power

CPU

CPU-A

Module

Slot 0

Slot 1

Slot 2

Power

CPU

CPU-B

Module

[Fig. 2.3.2] Slot configuration of duplicated basic base

The modules which can be installed on the basic base are as follows.

Slot 3

Slot 4

Slot 5

Slot 3

Slot 4

Slot 5

base

(2) The O/S version of the two CPUs must be the same.

(3) As shown in [Fig. 2.3.2], the modules on CPU-A: 0, 1, 2, 3, 4, 5 slots and CPU-B: 0, 1, 2, 3, 4, 5

slots must be of the same product type. If th e CPU-A: 0 slot is installed with an XGL-EFMF(FEnet)

*1)

2-１２

Chapter 2. System Configuration

2.2.4 Power Module Redundancy

The power modules of the basic and expansion base systems can have a redundancy. The redundant power module enables continuous system operation without interruption when one of the two power modules fails to supply power. Power system or power module failure can be repaired or the module can be replaced during operation without interruption.

2.2.5 Extension Drive Redundancy

Extension redundancy system consists of power module, extension drive module, redundancy extension base, redundancy cable. All modules except extension base modules are backed up by redundancy. One extension driver operates as master system and another operation as standby which gets the right when error occurs at master system. Master extension driver recovered from error gets stand-by and doesn’t participate in an operation. When changing extension drive module during RUN mode, use “Base Skip”.

Extension redundancy drive modules in the same extension base should have same station number. Extension redundancy

drive module has to be mounted on the designated position of extension base

Master-standby status of extension driver is determined by operating status of CPU.

2.2.6 Expansion Base Communication Path Redundancy

Since the cable connectio n of the expansion bases are ring-structur ed, the s ystem can be operate d without interr upti on

even when a cable fails, by using the other cable.

In normal ring oper ati on mode, operation is perf ormed using the path which is n earer to the master. When a cable fails,

the system operation is maintained by line operation mode.

The failed cable can be replaced without interrupting the operation.

2-１３

Note

(1) Extension base syste m can be configur ed by dual ring method.

(7) All exten sion drive rs in the sy stem need not be same.

Chapter 2. System Configuration

(1) Ring Operation Mode

Dual ring method

(2) Diverse configuration is avail abl e but t he re i s some l imit . Re fer t o appl i cation no te. (3) O/S version of both extension drivers should be same. (4) Switching of extension driver is same as that of CPU.

(5) If there is error in extension base modules (digital/analog I/O, communication module in

extension base), those are not backed up by redundancy.

(6) You can use only one extension driver. But at this time, extension driver is not backed up by

redundancy.

2-１４

2.2.7 Example of Redundant System Configuration

(1) Example of using electrical modules

Chapter 2. System Configuration

(a) CPU-A module, CPU-B module: XGR-CPUH/T (b) Ext. drive modules of base 1,2,3: XGR-DBDT

(2) Example of using optical modules

(a) CPU-A module, CPU-B module: XGR-CPUH/F (b) Ext. drive modules of base 1,2,3: XGR-DBDF

2-１５

Chapter 2. System Configuration

(3) Example using mixed modules

In a system that electrical modules are already established where distance among the stations is too far or electrical no ise is severe, the section c an be replaced with optical modules to build an optical/el ectrical mixed module network without an additional converter.

(a) CPU-A module, CPU-B module: XGR-CPUH/T (b) Ext. drive modules of base 1,2,3: XGR-DBDT (c) Ext. drive modules of base 1,2,3: XGR-DBDH

2-１６

RAPIEnet (Ring)

GMR

PC Card /HMI

Master

Backup

Ethernet

XGK

Smart I/O

Software HMI (Info-U)

Hub

Modbus

Pnet

Dnet

Rnet

Hub

XGI

GM4C

Chapter 2. System Configuration

(4) Example of using dedicated Ethernet for upper level HMI connection and between PLCs (Single ring)

The communication netw or k between upper level systems, ex isting P LCs and th e c ontroll er s f r om other supp liers can be constructed using an Ethernet communication module (FEnet). With XGT PLCs, a high speed and reliable system can be built using an industrial Ethernet module (RAPIEnet).

2-１７

Functionality

Maximum No. of Modules

Max. No. of modules for high speed link configuration

Max. No. of P2P1) service modules

Max. No. of dedicated service (slave) modules

Network Type

Block-type Remote

Ext.-type Remote

DeviceNet O O

Rnet O O

Cnet(MODBUS)

Chapter 2. System Configuration

2.3 Network System

XGR Series support diversified network systems for flexible system configuration methodology. For the communication between PLCs and upper level systems or between PLCs, Ethernet (EthNet/IP, FEnet, RAPIEnet) and

Cnet are provided. For lower control networ k syste m, Profibus-DP, DeviceNet, and Rnet are provided.

2.3.1 Networking among Systems

Only EthNet/IP , FEnet and RAPIEnet communication modules are availa ble for the redundant basic base. All communication module s e x cept E the rnet communi c atio n mod ule can be in stal l ed in t he expansion base. Maximum 24 communication modules can be installed in the redundant basic base and expansion bases. Maximum number of modules limited by functionality are as follows;

*Note1) : P2Pservice: 1 to 1 communication

2.3.2 Remote I/O System

For the control network systems of the I/O modules distributed across remote locations, Profibus-DP, DeviceNet, Rn et, Cnet, etc., are provided.

(1) I/O System Application by Network Type

Remote I/O modules are classified into base boa rd ty pe and block ty pe (Smart I/O, etc.). Base board type may not be supported in certain network types.

No.

1 Profibus-DP O O

* The above specifications can be changed for functional improvement. Please refer to the technical material of the network system for detail information.

(Master)

I/O (Smart IO)

I/O

2-１８

Note

Pwr/ Mod.

Ext. Drive.

Pnet/Dnet/Rnet/Cnet

(Master Module)

XGL

****

(2) Block-type Remote I/O System

(a) System Configura tion

Constructed with Profibus-DP, DeviceNet, Rnet and Cnet. Block-type remote I/O can be used regardless of the PLC series in the system. Profibus-DP and DeviceNet are developed in compliance with the international standard, therefore, they can be connected with other suppliers’ products as well as our own.

(b) I/O Allocation and I/O Numbering Scheme

1) available to allocate variable to remote IO by High Speed Link parameter

2) I, Q, M area of master can be designated as READ/WRITE area for the remote I/O area.

3) For smooth use of forced I/O setting function, it is recommended to use ‘I’ and ‘Q’ areas.

4) For the setting method of the high speed link parameters of module, see the technical documents of the network system.

Chapter 2. System Configuration

−

Smart-I/O Smart-I/O Smart-I/O

(1) Remote station numbers and areas must be set-up with out ov e rlap pin g.

(2) Input and output services, such as forced On/Off, are provided only when the inputs

and outputs are allocated with I/O variables (%IW,%QW).

(3) For SMART IO connected to master module, in case you set Read area(Q) and Save

area(I) through XG-PD, forced I/O setting is available.

3-1

Ambient humidity

Frequency

Acceleration

Amplitude

times

5 ≤ f < 8.4 Hz

3.5mm

8.4 ≤ f ≤ 150 Hz

9.8m/s2(1G)

Continuous vibration

5 ≤ f < 8.4 Hz

1.75mm

8.4 ≤ f ≤ 150 Hz

4.9m/s2(0.5G)

Half-sine, 3 times each direction per each axis

Square wave

Radiated

field noise

degree

N0ote

1) IEC (International Electrotechnical Com mission):

occurs. However, this state contains temporary conduction due to dew

produced.

Chapter 3 General Specifications

3.1 General Specifications

Table 3.1 shows the general specifications of XGT series.

[Table 3.1] General specifications

No. Items Specifications Related standard s

3 4 Storage humidity 5 ~ 95%RH (Non-condensing)

Ambient

temperature

Storage

temperature

Vibration

resistance

Shock

resistance

0 ~ 55 °C

−25 ~ +70 °C

5 ~ 95%RH (Non-condensing)

Occasional vibration -

−

Frequency Acceleration Amplitude

−

• Peak acceleration: 147 m/s2(15G)

• Duration: 11ms

•

Impulse noise

Electrostatic

discharge

±1,500 V

4kV

−

10 times each

directions

(X, Y and Z)

IEC61131-2

LSIS stan dard

IEC61131-2

IEC61000-1-2

7 Noise resistance

electromagnetic

Fast transient/bust

noise

8 Environment Free from corrosive gasses and excessive dust

9 Altitude Up to 2,000 ms 10 11 Cooling Air-cooling

Pollution

An international nongovernmental organization which promotes internationally cooperated standardization in

electric/electronic field, publishe s international stand ards and manages appli cable estimation system re lated with.

2) Pollution degree: An index indicating pollution degree of the operating environment which decides insulation performance of the devices. For instance, Pollution degree 2 indicates the state generally that only non-conductive pollution

80 ~ 1,000 MHz, 10V/m

Segme

Voltage 2kV 1kV

Power supply

module

2 or less

Digital/analog input/output

communication interface

IEC61131-2,

IEC61000-1-3

IEC61131-2

IEC61000-1-4

4-1

Specifications

XGR-CPUH/F

XGR-CPUH/S

XGR-CPUH/T

Task program: Initialization, Cycle, Internal device

not supported.

LD (Ladder Diagram), ST (Structured Text)

IL (Instruction List, view function only)

112 ns / command

÷ : 1,134 ns(S), 2,660 ns(D)

Input variable(I)

16KB

%IW0.0.0 ~ %IW127.15.3

area(A)

System flag

PID flag

Chapter 4 CPU Module

4.1 Performance Specifications

The performance specifications of the redundant CPU module are as follows.

Item

Program operation method

I/O Control system Scan synchronous batch processing system (refresh system).

Program language

Operator 18 Basic fun ction

No. of

Instructions

Operation processing

speed (basic

instruction)

Basic fun ction block

Dedicated function block

Basic 42 ns / command MOVE

Real number operation

Scan program: Reiterative operation, Fixed cy cle scan

SFC (Sequential Function Chart)

130 types ＋ real number operati on function

FB dedicated for special module, FB for process control

±: 602 ns(S), 1,078 ns(D) x: 1,106 ns(S), 2 ,394 ns(D)

Remarks

Direct method by command

S: Single real number D: Double real number

Program memory capacity 3MB Including upload program

I/O points(installable) 23,808 points (31bases * 12slots * 64poi nts)

Max. I/O memory contact point I: 131,072, Q: 131,072

Output variable(Q) 16KB %QW0.0.0 ~ %QW127.15.3 Automatic variable

Direct variable

Data memory

Flag variable

512KB (max. 256KB re tain settable)

M 256KB (max. 128KB retain settable) R 64KB * 2 blocks W 128KB

F 4KB K 16KB (PID 256 l oops) L 22KB

N 42KB U 32KB (31 base, 16 slo t, 32channel)

64KB per block Same area with R

High speed link flag P2P flag

Analogue refresh flag

4-2

Specifications

XGR-CPUH/F

XGR-CPUH/S

XGR-CPUH/T

Occupying 20 bytes

variable area

per point

Occupying 8 bytes

variable area

per point

END

Data protection in case of

power failure

Setting retain area in the Basic Parameter Retain setting of auto variable

peration monitoring

Data backup

between CPU

Data Sync. Method

between CPU

Proportional to data which master transmits to backup

user designated amount (2kword) * 0.250ms/2kword

Master switching

time

Ope ration delay in

case of standby start

Chapter 4 CPU Module

Item

Timer

Counter

Total no. of programs 256 Initialization task 1(_int)

Program structure

Self diagnosis function

Max. expansion base 31 stages One ba se per stage

Max. length between expansion base Optical (2km) Optical (15km) Electrical (100m)

Fixed cycle task 32 (range: 0~31 ) Internal device task 32 (range: 64~95)

Operation mode RUN, STOP, DEBU G

Restart mode Cold, Warm

between CPU

 No point limit  Time range: 0.001~ 4,294,967.295 second (1,193 hours)

 No point limit  Coefficient range : 64 bit expression range ( -32 ,768 ~ +32,767)

Operation delay monitoring, memory fault, I/O faul t, battery fault, power fau and etc

Redunda nt monitoring by Sync. Line and ring type I/O networ k

Remarks

of automatic

Processed at scan

1 G bps optical line, max. length 200 m (recommended)

Set in the Redundancy Parameter

Redundancy performance

Internal consumption current (mA) 1,310 ㎃ 980㎃

Delay in case of

redundancy

operation

Weight (g) 276 g 257 g

- Max. 15ms

- optimization ava ilable by user setting Basic 15ms +

22ms Refer to 5.1.4

About 10% more than single o peration scan time Refer to 5.1.4

Refer to 5.1.4

4-3

to RUN, STOP

writing program and changing

nitoring and

changing the data are available)

4.2 Names and Functions of Parts

Chapter 4 CPU Module

No. Name Description

Sets the operation mode of CPU module via key switch.

 RUN mode: runs program  STOP mode: stops program

Operation mode

①

② - a

switch

RUN/REM/STOP

RUN/STOP LED

 REM mode: mode selectable by programming tool ▶ RUN -> REM, STOP -> REM: keep s previous mode. ▶ RUN -> RUN, REM -> STOP: changes the mode

respectively

▶ In case operation mode is not REM,

operation mode are not available by programming tool. (Mo

Shows the operation sta tus of the CPU module.  Green light: ‘RUN’ mode

▶ ‘RUN’ operatio n by mode switch (local run) ▶ ‘RUN’ operation by programming tool with mode switch set as ‘REM’

(Remote run)

 Red light: ‘STOP’ mode ▶ ‘STOP’ operation by mode switch

▶ ‘STOP’ operation by programming tool with mode switch set as ‘REM’

(Remote stop)

4-4

Off: No warning

Chapter 4 CPU Module

No. Name Description

② - b

WAR. LED

 On(yellow): displaying an warning

▶ Force I/ O setting ▶ Skip I/O/Faul t mask setting

▶ Run when Fuse error ▶ Run when I/O module error ▶ Run when special module error ▶ Run when communication module error ▶ War ning abnormal R TC data ▶ Warning existence of base which doesn’t participate in the operation ▶ Abnormal operation stop warning ▶ Task collision warning ▶ Abnormal battery warning ▶ Warning detection of light error of external device ▶ High speed link setting wa rning ▶ P2P setting warning ▶ Fixed cy cle error warning ▶ Abnormal base power module warning ▶ Abnormal base skip cancellation warning ▶ Abnormal base number setting warning ▶Warning redundant configurat ion ▶Warning OS version inconsistency ▶Warning Ring topology configuration



 On(red): di splays error makes the op eration unavailable

▶ CPU configuration er ror ▶ Module ty pe mismatch error ▶ Module detac hed error ▶ Fuse disconnection error

② - c ERR. LED

▶ Detection of h eavy trouble of external device ▶ Basic parameter error ▶ I/O para meter error ▶ Special module p arameter erro r ▶ User program error ▶ Program code error ▶ CPU abnormal end or malfuncti on ▶ Base power e rror ▶ Scan watchdog error ▶ Base information error ▶ S tandby CPU run error ▶ Expansion base detached error ▶ Redundant parameter error ▶ Module inser tion location error ▶ Expansion base no. overlapped error ▶ Redundant Sy nc. Error ▶ A/B side overlapped setting error ▶Base abnormal configuration error

 Off:

▶ No error

4-5

Di splays operation st atus with 4 characters

Error (Refer to XGR error code)

Two types, optical/optical, el ectrical/electri cal

Used to download OS at first time

(1) BOOT/ NORMAL switch always should be set to right side.

for OS downloading

Caution

No. Name Description



② - d

② - e

② - f

Displaying operation

status

Displaying

redundancy status

Displaying expansion

network status

▶ Normal operation

▶ Warning

▶

 Displays operation/installation st atus of CPU system.

▶ RED: On when redundant operation, Of f when single o peration ▶ MASTER: on; CPU operating as master , off; st andby CPU ▶ CPU-A: on when CPU position designation switch (⑤-b) set as A ▶ CPU-B: on when CPU position designation switch (⑤-b) set as B

Displays communication status w ith expansion base

 ACT On (yellow): relevant channel is operating  LINK On (Green): link of relevant channel is connected

▶ 1 indicates upper channel (④-a), 2 indi cates lower channel (④-b).

 RING On (Green): Expansion network is configured a s Ring.  Ring Off: Expansion network is not established or configured as Line because part

of Ring fails

Chapter 4 CPU Module

③ Sync. connector Data sharing and monitoring bet ween two CPUS.

④-a ④-b

⑤-a

A/B side switch

⑤-b

(CPU position

Connector for

expansion connector

BOOT/NORMAL

switch

designation switch)

Connector used for connecting with expansion base

 For easy Ring configuration, tw o connector supported



 BOOT/NORMAL (right side): used for normal ope ration  BOOT/NORMAL (left side): used to download OS (OS download mode).

(2) In case of setting to le ft side, sy stem doesn’t operate properly and

It i s not allowed for th e user to use

(3) BOOT/NORMAL switch is not allowed to set to left side

Designates the logical po sition of CPU

 Left side means CPU position i s set as A  Right side means CPU position is set as B  Two CPU s hould have a dif ferent position.

(available to check in the progra mming tool)  In case two PLC are set as same po sition, the lately started one cau se “E101” error

4-6

Operation

Result

move to left  return to center

Reset

move to left  keep 3 seconds or above  return to center

Overall reset Operation

Result

move to right  return to center:

General data area and retain area (M, Automatic variable) will be cleared.

move to left  keep 3 seconds or

General data area, retain area (M, cleared.

(1) Data clear function is only executed in sto p mode.

Caution

Chapter 4 CPU Module

No. Name Description

⑤-c Reset/D. Clear switch

Y ou can enable/disable Re set/D.Clear switch i n “XG5000  Basic Parameter  Basic Operation Setup”

1. When Reset switch is enabled

2. When D.Clear switch is enabl ed

above  return to center:

⑥ USB connector Conne ctor for connecting with peripheral (XG5000 etc. ) (supports USB 1.1)

⑦ RS-232C connector Connector for conne cting with peripheral (XG5000 etc.)

⑧

Backup battery cover Backup battery cover

Automa tic variable) a nd R area will be

4-7

Item

Specifications

Nominal Voltage / Current

DC 3.0 V / 1,800 mAh

Warranty period

5 years(at ambient temperature)

Applications

Program/data backup, RTC operation in case of power failure

Type

LiMnO2 Lithium Battery

Dimensions (mm)

φ 17 .0 X 33.5 mm

In general, it gener ates the war ning after 7 years from the purch ase, b ut if th e cur rent is exces sivel y disch arged du e to

Caution

Chapter 4 CPU Module

4.3 Battery

4.3.1 Battery specifications

4.3.2 Cautions for usage

(1) Do not h eat it up nor weld t he electrode(it may reduce the life) (2) Do not measure the voltage wi th a tester nor shor t-circuit it(it may cause a fire). (3) Do not di sassemble it without pe rmission.

4.3.3 Battery life

The XGR-CPUH is designed to use it for 7 years and longer at any environment. However, the battery life varies depending on the duration of power failure, operati on temperature range an d etc. If the battery voltage level is low, the CPU module generates a warnin g of ‘Low Battery Level’. It can be che cked by the LED of th e CPU module, flag and error message in XG5000. If it is occurred to a low battery level warning, please shortly change the battery .

defective battery or leakage current, it may warn it earlier. If it warns shortly after replacing a battery, the CPU module may need A/S service.

4-8

‘BAT’ LED Off?

Chapter 4 CPU Module

4.3.4 Replacement

A battery used as a backup power for program and data in case of power failure needs replacing regul arly. The program and data is kept by the super capacity for about 30 minutes even a fter removing the ba ttery, but it needs u rgently replacing it as soon as pos sible.

Replace a battery in ac cordance with the follow ing steps.

Star ting replacing a battery

Open the battery cover .

Pull out the current battery and remove the connector.

Insert a new battery into the holder along the right direction and connect to the connector

Check whether ‘E502’ indication of the CPU module indicator disappear

Defective battery

Yes

End

5-1

Begin Operation

Input image area refresh

Begin scan program

End of scan program

Output image area refresh

END

1 Scan

Input module contact point status

Output module contact status

Execute task

program

:System self diagnosis, comm. data

processing, operation mode changing, etc.

Chapter 5 Program Configuration and Operation Method

Chapter 5 Program Constitution and Operation Method

5.1 Program Basics

5.1.1 Program Structure and Execution

The program for the XGR PLC is made out with XG5000, compiled into an executable program, and transmitted to PLC for execution.

(1) The programs can be classified into scan programs and task programs. The scan programs are executed at every scanning, and the task programs are executed by a task.

- Scan program: the program executed every scan repeatedly

- Task program: the program executed by task (2) A scan program runs from the fi rst to the last step re giste red in the project in the regi stered o rder, and termin ates the

scanning (END). The entire process is referred to as “1 scan.’ (3) This process meth odology which run s a progra m from the begi nning to the end and then runs the entire pro cess aga in,

is called ‘cyclic oper ation method.’ (4) Before starti ng the operati on of a scan prog ram, the statu s of the input module i s read an d saved i n the i n put image area,

and the status of the output image area is outputted to the output module when the operation of the scan program is completed. This process is called ‘I/O Refresh.’

(5) XGR PLC series is based on the cyclic operation method. In the operation process, input or output status is not entered directly, but the op e rati on i s exe cuted by I/O refreshing by s can uni t ba sis . To this end, the statuses of the i nput and out put contact points are stored in the memory area of the PLC. This area is called image area.

5-2

Note

 Step to start scan: it ru ns onc e as fol lo ws if i t is tu rn ed on o r i f you reset

Program starts

Chapter 5 Program Configuration and Operation Method

5.1.2 Program Execution Methodology

(1) Cyclic Operation Method (Scan)

A program scan is an operation cycle of a program from the first step to the end step. In a cyclic operation, the first step is restarted after the end step of the previous scan has been completed. The table below s how s this process by ste p.

Step Process Description

Operation

 With the program downloaded into the PLC, the instruction from the

user is received.

Initialization processing

it.

I/O module reset  self-diagnostic execution

Data clear  Address allocation and type registration of I/O module

Refresh input ima ge area

Program operation processing

Program ends

 Before starting an operation of program, it reads the status of Input

module and saves it to the input image area  When ON t ime of input d ata is shorte r than CPU sc an time, it is not

reflected to ladder program

 Execute operations from the first to the last step of a program.

Refre sh output image ar ea

 Once a program ’s operation ends, it outputs the content saved in the

output image area to the output module.

END

 As a step that the CPU modul e ends 1 sc an proces s and ret urns to t he

first step, it processes the follows.

Updating the current values of Timer, Counter and others Executing user event and data trace service Execute self-diagnostic Execute high speed link and P2P service Check the status of mode setting key switch

The synchronization between the data of the master CPU and standby CPU begi ns after the star t-up of the

standby CPU. See 5.3 Operation Mode for the details of redundant operation.

5-3

Chapter 5 Program Configuration and Operation Method

(2) Interrupt Operation Method (Fixed Cycle Task Program)

In the interrupt operation method, if it is required to execute a task program with priority during scan program operation, the current scan program operation is interrupted and the task program is executed. When the task program operation is completed, the system returns to the previous scan program operation. An interrupt signal instructs the CPU to execute a task program with priority. A typical interrupt ope rati on is the fi xed cycle inter rupt operati on. In thi s metho d, the int errupt si gnal s are generat ed at the times preset by the user to execute task programs. After the completion of a task program, the system returns to the scan program.

Scan program

Interrupt 1 occurs

Interrupt 2 occurs

Interrupt 3 occurs

Interrupt 4 occurs

Interrupt 1

(Program 1)

Interrupt 2

(Program 2)

Interrupt 3

(Program 3)

(프로그램 3)

Interrupt 2

(Program 2)

Interrupt 4

(Program 4)

END

5-4

Note

ndicated with the scan times setup with the fixed cycle operation

waiting time.

Chapter 5 Program Configuration and Operation Method

(3) Constant Scan

Constant scan is an operation method which repeats the execution of a basic scan program at fixed cycle time. In case that the fixed cycle time is longer than the time required for executing the scan program, the system waits for the remaining time, and restarts the scan program at the beginning of the next cycle time. Therefore, different from the fixed cycle task program, the program can be executed matching the I/O refreshing and synchronization. In such case, the scan time is indicated excluding the waiting time. On the contrary, if the fi xed cy cle time is setup s horte r than the ti me elapsed for the scan prog ram exe cution , the ‘_CONSTANT_ER’ flag is turned ‘ON’ and the operation is executed with the time during which the operation can be executed.

The constant scan can be setup with the basic parameters of the XG5000.

When configured for a constant scan operation, the scan time is indicated as follows. The maximum and current scan times are i parameters, and the minimum scan time indicates the actual time elapsed for the program execution deducted with the

5-5

Note

pecified in the PLC is out of the allowable variance

range and falls, and especially, a short term interruption(several ms ~ dozens of ms) is called

Input power

Instantaneous interruption within 20ms

of power module is

power failure, timer measurement and interrupt timer measurements still work normally.

Input power

Instantaneous interruption over 20ms

Chapter 5 Program Configuration and Operation Method

5.1.3 Operation of instantaneous interrupt

The CPU module detects instantaneous interruption when the voltage of input power supplied to the power module is lower than the nominal value. If the CPU module detect s instan taneous interru ption, it proce sses operati on as foll ows.

(1) In case of instantaneous interruption within 20ms occurs

(2) In case of instantaneous interruption over 20ms occurs

(3) If the syste m has a redund ant power , the operation will be one of followings;

(a) In sta nta neo u s pow e r int er rup tio n i n one of two pow er mod ul e s which have been in ope ration;

- the other power module keeps operation, without interrupting PLC operation. (b) In stanta neou s power inter rupti on in bot h power modu les by shorter th an 20ms;

- the modules operate as described in Clause 1) above. (c) In stan tan eou s p ow er i n terrup tio n in both power modu l es by lon ge r than 20 ms;

- the modul e s ope rate a s des cr ib ed in Cl au se 2 ) above.

(a) It stops an operation with the output at the

moment of instantaneous interruption maintained.

(b) It resumes the operat ion onc e the interruption is

removed

maintained within the specified value.

(d) Even though an operation stops due to

instantaneous

(a) It executes i nitialization pr ocess such as when it is turned on (b) In a redundant CPU operation, the system triggers CPU switch-over.

(1) What is instantaneous interruption? It means the status that the power supply voltage s

instantaneous interruption. (2) CPU switching In a redundant CPU operation, if a power interruption longer than 20ms occurs in all the power modules of the master CPU, the operation is switched over to the standby CPU. For the details of redundant operation, see 5.3 Operation Mode.

5-6

Process time of scan program

42ns per 4 byte of execution program

Communication module: within 200 ㎲ per one

Digital I/O: w i th in 10㎲ per one

Communication module: within 150 ㎲

Different according to setting In case of normal operation,

within 4ms

Chapter 5 Program Configuration and Operation Method

5.1.4 Scan Time

The time required to complete all steps from the first step (0 step) to last step, that is, a time taken for one control operation is called ‘scan time.’ It is directly related to the control performance of the system.

(1) Operation and performance of XGR

The major factors which influence scan time are program operation time, I/O data process time, communication service time, and the data syn chroniz ation betw een the mas ter and stan dby CPUs. By utilizing the hardwa re relay method for the data exchange between expansion drive modules, the data communication performance of the XGR is greatly improved. In addition, the scan time is greatly reduced by MPU’s ladder program execution and the paralleled execution of the I/O data scanning by bus cont rolle r.

In a single CPU operation, the scan process times of CPU are as follows.

Item Content to be processed time

Scan program+ Task program

Process time of basic base

Process time of Expansion base

Process time of system

Module process Communication service

Every expansion base Within 300 ㎲ per one base

Module process

Communication service Within 1000 ㎲ per service

PUT/GET instruction process

Basic O/S pr ocess routin e, module err or check, Fault mask, I/O skip etc.

Within 500 ㎲ per one service

Special module: within 30㎲

Different according to data ~ 0.5 kbyte : 800㎲ or less ~ 1 kbyte : 2.5㎳ or less ~ 4 kbyte : 8 ㎳ or less ~ 8 kbyte : 15㎳ or less

environment

5-7

CPU scan

Basic base

process

Extension

base

process

① scan program

② main base

process

③ extension base

process

②

③

④

System

process

1 scan1 scan

②-2

③-

②-1

③-1

Chapter 5 Program Configuration and Operation Method

(2) Calculation of scan time (Single CPU operation)

The CPU module executes controls along the following steps. A user can estimate the control performance of a system that the user is to structure from the following calculation.

Scan time = ① scan program process ＋ ② basic base process＋ ③ expansion base process + ④ system process

① Scan program process = program size/4 x 0.042 (usec) (For correct scan time calculation, add the execution speed of the applied instructions.)

② Basic base process ②-1. module process: processes refresh data of module in basic base

- Commmunication module: 200 ㎲ or less per one ②-2. communication service process: executes HS, P2P service

- 500㎲ or less per one service ③ Expansion base process ③-1. module process: processes refresh data of module in basic base

- Process time per expansion base: 300 ㎲ or less per expansion base

- Digital I/O: 10 ㎲ or less per one

- Special module: 30 ㎲ per one

③-2. Communication service proc ess and PUT /G ET ins truc tio n pr oc ess : ex ec ut es HS , P 2P s er vic e a nd PUT /GET

- Communication module: 150 ㎲ or less per one

instruction set by user

- Communication service process: 1000 ㎲ or less per service

- PUT/GET instruction process ~ 0.5 kbyte : 800㎲ or less ~ 1 kbyte : 2.5 ㎳ or less ~ 4 kbyte : 8 ㎳ or less

~ 8 kbyte : 15㎳ or less

5-8

Example

CPU(program 32KB) + 6 32-point I/O modules + 6 analog modules (total PUT/GET size 1000byte) + 4 communication

= 11.4

Chapter 5 Program Configuration and Operation Method

④ Sy stem process: executes system internal process includig basic O/S process routin, battery check, module error check, I/O skip, forced I/O, loader service etc.

- different according to the environment In case of normal 4ms or less

modules (two in basic base, other two in expansion base, one communication service setting for each module) What is the scan time of above system (the number of expansion base is 2) Scan time(㎲) = l adde r process ti me + basic base process time + expansion base process time + system process time = (32768/4 x 0.042) + (200 x 2(two communication modules) + 500 x 2) + (300 x 2(expansion base) + (10 x 6)+(30 x 6)+(150 x 2) + 1000 x 2 + 2500(PUT/GET)) + (4000) = 11384 ㎲

㎳

(3) Scan time monitor

In an actual XGR CPU operation, the actual scan time can be obtai ned by monitori ng follow ing dat a. (1) Scan time is saved into the following flag(F) areas.

_SCAN_MAX : max. value of scan time(unit of 0.1ms) _SCAN_MIN : min. value of scan time(unit of 0.1ms) _SCAN_CUR : current value of scan time (unit of 0.1ms)

_SCAN_MAX, _SCAN_MIN value can be initialized using _SCAN_WR flag. If the _SCAN_MAX is larger than WDT (Watch Dog Timer) v alue, a system error occurs. The WDT time can be setup with the basic parameters.

(4) S can Ti me in R edu nda nt Ope rati on

In redundant operati ons, compar ed with single CPU operatio n, the scan ti me sub stantially incr eases due to the syste m data sharing between the CPUs. The scan time also varies according to the data volume setup by the user in the redundancy parameter setting area. The increase in the scan time by data volume is as follows.

5-9

Redundancy

parameter

Though base error occurs in normal RUN mode, is restored, it operates normally.

Though module is dis abled, module detachment operates normally.

sion base

When two powe r modules of expa nsion base are off, system goes to WAIT mode (Ebxx)

When two power modules of expansion base are off, CPU error appears

Disable warning for single power operation

Disables warning mes sa ge when one betw e en two power modules i n e xpan si on ba se i s o ff

Disables warning message when becoming line topology

Disables warning message when becoming Single CPU Mode

Disable warning message for fault mask removal

Disables warning message when fault mask is removed.

When the cable is disconnected, it is instantly switched. (within 1s)

Master automatic switchover (redundancy

Standby becomes Master.

Example

CPU(program 32KB) + 6 32-point I/O modules + 6 analog modules (total PUT/GET size 1000byte)

base, one communication service for

= 16.45

Chapter 5 Program Configuration and Operation Method

Contents Operation

Base Hot swapping option

Module

Expan power failure setup

Warning option

Communication operation setting

(a) Redundant CPU system data: share basic data, e.g., syste m flag, commun icati on flag , etc. (2.8ms) (b) Redundancy parameter setting data: synchronization time in each area is as follows;

I/Q base: 1ms/32 bases M area: approx. 250 ㎲ per 2 kwords. Approx. 16 ms for synchronizing 128kword R area: approx. 1.5ms per 2 kword. Approx. 12ms for max. 16 kword synchronization. (When 2 kword in R area is transmitted, 2 kword in W area are also transmitted; total 4 kword are transmitted) PID Area: 016.7 ㎲ required for each PID setting one loop. When max. 8 blocks are synchronized, approx. 4ms is required. Automatic variable area: 32KB  2.5ms required

Restart and wait

Base power failure error

Disable warning for li ne Topol ogy

Disable warning for Single CPU Mode

Disconnection of the cable

Disconnection of the server connection

system except that base operates. And if that base

error doesn’t appear. If that module is enabled, it

operation)  When Master/Standby is acting as FEnet server, if th e cable o f the M ast e r is di sconn e cted,

+ 4 communication modules(two in basic base, other two in expansion

each one module) what is the scan time of above system? (Two expansion bases, synchronizes M area 2kword

and PID 2 blocks) Redundancy Run scan ti me = single Run scan ti me + time for synch ronizi ng redund an cy da ta = Single Run scan time + redund ancy system dat a+ I/O base + sy nchroniz ing M area and PID area = 11.4ms + 2.8ms + 1ms + 0.25ms + 0.5 x 2

5-10

(1) When the st andb y CPU is a ctivate d to cha nge the s ystem from single ope ration t o redund ant oper atio n,

It should be note d t ha t, du ring sing le mode op e ration , in c lu ding w hen the st and by CPU i s not in ope rati on,

Caution

Chapter 5 Program Configuration and Operation Method

(5) Delay Time at Entering Redundancy Operation

When a redunda nt CP U i s added t o si ngle C PU operati on, the scan ti me of the curren t scan cycle i s increa sed temporarily, for the standby CPU to be initiated to enter redundancy operation mode. Since the data synchronization is carried out by 10% equival ent to the scan ti me of single ope ratio n, the scan ti me durin g the data synchroniz ati on increases by about 10% compared with single operation.

the scan time increases for a short time to synch ronize the program and data from the master CPU to the standby CPU.

(2)

data is not synchronized between the master CPU and standby CPU. Therefore, the data may differ from each other CPU.

5-11

Chapter 5 Program Configuration and Operation Method

5.2 Program Execution

5.2.1 Program Type

The programs for the XGR PLC can be classified as presented in the chart below, according to their condition s of execution. Total 256 programs can be used.

Total 256 PLC

programs

Task Program Initialization Task Program (0 ~ 1)

Fixed Cycle Task Program (0 ~ 32)

Internal contact point Task Program (0 ~ 32)

Scan Program (256 deducted with the No. of task programs)

5.2.2 Program Execution

(1) Task Program

(a) In itiali zatio n Task Prog ram The initialization task programs are used for system initialization when starting PLC operation in cold or warm restart mode. During the execution of an initialization task program, the system operation status information flag _INIT_RUN is turned to ON. The initialization task program executes cycle operation including I/O refresh until the _INIT_DONE flag is ON.

(b) Fi xed Cycl e Task Prog ram Fixed cycle task programs are executed in repetition at the cycle setup in the task.

(c) Internal Contact Point Task Program The internal contact point task programs are executed when such events as rise, fall, transition, on, or off of the internal contact points occur. The point of time of execution is determined by the condition of event occurrence after the completion of scan program.

(2) Scan Program

In order to process the si gnals whi ch are repe ated regu larly in each scan, the oper ation is execute d from the fi rst (0) step to the last step in the sequential order. In case that a condition of interrupt execution is met by the fixed cycle task or interrupt module during the execution of scan program, the current program is suspended, and the respective task (interrupt) program is executed. The occurrence of an event of internal contact point program is checked when the scan program has been completed.

5-12

• Of the init ializ ation ta sks, the first scan On/Off i s executed for the fir st scan only , and not executed fr om the

and standby CPU will operates as master

Caution

next scan until the completion of _INIT_DONE.

• The above mode appli es when the master CPU is started from stop state. Since the st and by ope r ate s according to the status of the master, restart mode does not apply.

• For manual reset switch activation in redundant operation, please take care of followings; Activating the reset switch of the master CPU will restart the entire system, but activating the reset switch of the standby CPU w ill re sta rt t he standby CPU only.

• When activating the Run/Stop switch during redundant operation, please take care of following; If you activate Stop switch of CPU operating as master, CPU operating as master will become Stop mode

5.2.3 Restart Mode

Chapter 5 Program Configuration and Operation Method

The restart mode sets up the method of initializing variables and the system at the start-up of PLC operation. Restart mode has two types; cold and warm restart, which can be set up in the basic parameters of the XG5000.

When the standby CPU starts up, it executes the initialization according to the restart mode and receives the program and data backup from the master. When set up in flash operation mode, it receives the flash data backup from the master too.

When the standby CPU is switched to master CPU during operation, it is not a restart, therefore, no further action is taken.

The conditions of the execution of the restart modes are as follows.

5-13

Variable

Retain & Initialization

Chapter 5 Program Configuration and Operation Method

(1) Cold restart

(a) All data is reset (deleted) to “0.” Here, the ‘all data ’ m eans the M ar ea, R ar ea, and au tomaton variables. The

flag area, such as PID, which does not belong to this category is not deleted. (b) Only the variables whose initial values are set up are reset to the initial values. (c) Even though the parameter is set u p t o war m restart mode, at the f irs t r u nn ing af ter c ha ng ing th e pr ogr a m to

be executed, the following program will be executed with cold restart mode. (d) Pressing the manual r est switch for 3 seconds (s ame as the overall reset of the XG5000), the system will

start in cold restart mode regardless of the set up restart mode.

(2) Warm restart

(a) T he data which was set up to maintain previous va lue will m aintain the previous val ue. The data which h as

user defined initial value will be reset to the initial value. Other data will be deleted to “0.” (b) When s et up in warm restart m ode, too, the f irst run, af ter an interru ption b y program download or error , will

be started in cold restart mode. (c) When set up in war m restart m ode, if the dat a is abnor m al (data w as not maintained during a po wer fai lure),

the system will be started in cold restart mode. (d) Press ing the m anual reset s witch for l ess than 5 seconds duri ng power -on, sam e as the reset instruction i n

the XG5000, if the setting is warm restart mode, the operation will begin in warm restart mode.

Data initializatio n ac cording to the restar t modes are a s follow s. The variables relat ed with res tart mode are defau lt, re tain, and initiali zati on varia bles . The method o f initial izing the variables in the execution of restart mode is as follows.

Mode

Default Initialize to ‘0’ Initialize to ‘0’

Retain Initialize to ‘0’ Maintain the previous value

Initialization Initialize to user defined val ue Initialize to user defined value

Cold Warm

Initialize to user defined val ue Maintain the previous value

5-14

Note

Chapter 5 Program Configuration and Operation Method

5.2.4 Task Program

This section describes the programming and configuration of the task programs with XG5000 which is the programming software of the XGR.

(1) Programming Task Programs

(a) In the project window of the XG5000, select the PLC to which the task is added. Click the right button of mouse, and select [Add Item]-[Task].

(b) In the Tas k dialog box , set up the ta sk to be added, and click Con firm butto n.

External contact point ta sk is not suppor ted in the XGR PLC Se rie s, a nd wi ll b e develo ped in t he nea r fut ur e.

5-15

Type

Spec.

When entering RUN unit of 1ms)

Execute until the flag

Chapter 5 Program Configuration and Operation Method

(c) Th e configu red ta sk will be display ed a s shown in the window below. For detai l configu rati on, see the Us er Manual o f the XG5000.

(2) Task Types

The below table summarizes the types and functions of tasks.

Initialization

Number Start-up

condition

Detection/exec

ution

Detection delay

time

Execution

priority

Task number

mode, prior to starting scan program

_INIT_DONE is ON

Cycle time (settable up to 4,294,967.295 seconds at the

Cyclically execute at the predefined interval.

Delayed as long as 0.2ms to the max.

Setting 2 ~ 7 levels (level 2 is the highest priority)

Assigning it between 0~31 so that it is not duplicate

Cycle time Internal address

32 32

Conditions of internal device designation

Checks and Executes after completing scan program

Delayed as long as the max. scan time.

Setting 2 ~ 7 levels (level 2 is the highest priority)

Assigning it between 64~95 so that it is not duplicated

5-16

Chapter 5 Program Configuration and Operation Method

(3) Processing method of task program

It describes the common processing method and cautions of task program (a) Features of task program

 Task program does not reiteratively be processed like a scan program and instead, it is executed only when the execution conditions occur. Make sure to remember this when creating a task program.

 For instance, if a task program with 10 seconds of fixed cycle is used with a timer and counter, the timer may have an error of 10 seconds maximum while the counter checks every 10 seconds, any counter input changed within 10 seconds is not counted.

(b) Execution priority

 If several t asks to execute are waiting, it processes from the highest priority task program. If there are several tasks of same priority, they are processed by the order which is occurred.

 The task priority is applied to only each task.

 Please set the priority of task program considering program features, importance level and urgency demanding execution.

The delay of task program processing occurs due to the following factors. Make sure to consider them when setting a task or creating a program.

 Task detection delay(please refer to the details of each task)  Program execution delay due to the execution of preceding task program

(d) Correlation between scan program and task program in the initialization

Fixed Cycle task and internal contact point task does not operate while initialization task program is working. Since scan program has a low priority, if a task occurs, it stops a scan program and executes a task program. Therefore, if tasks frequently occur during one scan, a scan time may increase unreasonably. A special attention should be paid when setting the conditions of task.

5-17

Note

Chapter 5 Program Configuration and Operation Method

(e) Protection from task program of a currently running program

 If program execution continuity is lost by executing a higher priority program, you can partially protect the task program from being executed, for a problematic part. At the moment, a program can be protected by application function commands of ‘DI (task program operation disabled)’ or ‘EI(task program operation enabled)’

 Insert the application function command, ‘DI’ into the beginning position of a section to be protected and the application function command, ‘EI’ to the position to cancel it. Initialization task is not affected by the application function commands of ‘DI’ and ‘EI’.

(1) If task program priority is duplicate set, a program works according to the creation order.

5-18

(4) Cycle Time Task Program

(a) Se tting up cycle task

The window below shows the setting up of a fixed cycle task. In order to set up a fixed cycle task, enter task name, priority, and task number for task control, and select Fixed Cycle radio button in the Condition of Execution, and enter the cycle time of execution.

Chapter 5 Program Configuration and Operation Method

(b) Fixed cycle task processing

 Execute a fixed cycle task program at a pre-defined interval.

If a same task program is to be executed when a fixed cycle task program is in operation or waiting for execution, a new task is ignored.  Only for a moment when the operation mode is RUN, a timer requiring executing a fixed cycle program is counted. Any interruption time is ignored.  Remember that several fixed cycle task programs are to be executed simultaneously when setting the execution cycle of a fixed cycle task program. If using 4 fixed cycle task programs of which cycle is 2, 4, 10 and 20 seconds respectively, it may have simultaneous execution of 4 programs every 20 seconds, probably causing a longer scan time.

5-19

Caution

(1) Note that if the total time length during which cycle time task are executed simultaneously is longer than the

(2) The only cycle time task of which cycle is longer than scan cycle can be guaran teed fo r the fixed cycle.

Caution

Internal address task program is executed at the moment when a scan program is completely executed.

program, it is not immediately executed and instead, it is executed at the moment when a scan program is

m, a task is not executed because it is not detected at the moment when the execution conditions

Chapter 5 Program Configuration and Operation Method

specified tim e l eng th when s ever al cycle time task s occ ur sim ult ane ous l y, a s hor t cycle time task may not be successfully executed.

(5) Internal device task

Bit and Word device can be set as execution condition for task. (a) Task setting

In order to set up an internal device task, set task name, priority, and task number, Internal Device, the type of device and the condition of start up (Rising, falling, transition, on and off)

(b) In ternal Devi ce Task Handling

After the completion of scan program by CPU module, the internal device task program will be executed if starting condition is met according to the priority.

Therefore, although a scan program or task program generates the execution conditions of internal ad dres s task executed completely. Therefore, if the execu t io n c o nd i t io ns of in ternal address task occur and disappear within a

scan progra are surveyed.

5-20

Chapter 5 Program Configuration and Operation Method

(6) Task processing in instantaneous interruption

When resuming operation due to a long instantaneous interruption, ignore any waiting task and tasks that occur during the interruption and process the only tasks from the moment of starting operation. If an inte rrupti on is wit hin 20ms, a ta sk that was waitin g i s e x e cuted o n ce th e i nte rr upt ion i s r e moved. Any fixed cy cl e i nt er rupt ta sk t hat is duplicated during the interruption is ignored.

Verification of task program

(7)

After creating a tas k program, v eri fy it in accor dance with the follow ings. (a) Is the ta sk set p rope rly ?

If a task occurs excessively or several tasks occur simultaneously in a scan, it may cause longer scan time or irregularity If a task setting can not be changed, check the max. scan time.

(b) Is the task priority well arranged?

A low priority task program may not be processed in a specified time due to a delay from a higher priority task program. The case may be, since the next task occurs with a preceding task delayed, it may cause task collision. The priority should be set in consideration of urgency of task, execution time and etc.

A longer execution time of task program may cause a longer scan time or irregularity. In addition, it may cause task program collision. Make sure to set the execution time as short as possible(especially, create a fixed cycle task program so that it could be executed within 10% of the shortest task cycle among several tasks. )

(d) Doesn’t the program need to be protected against the highest priority task during the execution of program?

If a different task breaks into a task program execution, it completes a current task and then, operates from a task with the highest priority among waiting tasks. In case it is prohibited that a different task breaks into a scan program, it can be protected by using ‘DI’/’EI’ application functional commands. It may cause a trouble while processing a global parameter process commonly used with other program or a special or communication module.

(8) Program configuration and example of processing

First of all, register task and program as follows.

• Registering a task : T_SLOW (fixed cycle : = 10ms, Priority := 3 ) PROC_1 (internal contact : = M0, Priority := 5 )

5-21

P0 Execution

P1 Execution

P2 Execution

T_SLOW Detection

PROC_1 Detection

Time :

6 7 8

(ms)

S (1’st operation start)

1 program end

1 (2’nd scan start)

: Execution without program interruption

: Delay of program execution

: Instant stopping during program execution

Chapter 5 Program Configuration and Operation Method

• Registering a program : Program --> P0 (scan program) Program --> P1 (operating by task T_SLOW) Program --> P2 (operating by task PROC_1)

Then, if the program execution time and the occurrence time of external interrupt signal are same,

• Execution time of each program: P0 = 21ms, P1 = 2ms and P2 = 7ms, respectively

• PROC_1 occurrence: During a scan program, the program is executed as follows.

can start

’st Scan

’st scan end

5-22

Scan starts and the scan program P0 starts operation

0~10

Program P0 is executed

10~12

P0 stops due to the execution request for P1 and P1 is executed

Execution request for P2

12~20

P1 execution i s c o mplet e a nd the s u spende d P 0 res u mes

20~24

P0 stops due to the execution request for P1 and P1 is executed

24~25

As P1 execution is complete, the suspended P0 is completely executed.

complete and execute P2.

25~30

Execute program P2

30~32

P2 stops due to the execution request for P1 and P1 is executed

32~34

As P1 execution is complete, the suspended P2 is completely executed.

Start a new scan(P2 execution starts)

Chapter 5 Program Configuration and Operation Method

 Processing by time period

Time(ms) Processing

Check the execution request for P2 at the moment when scan program(P0) is

5-23

Start the first scan at RUN

mode

Initialize data area

verifying the effectiveness of program

Execute input refresh

Execute scan program and interrupt

program

detachment of modules installed

Process communication service and

others

Execute output refresh

Change Operation Mode

Operate at the changed

Chapter 5 Program Configuration and Operation Method

5.3 Operation Mode

5.3.1 Operation Mode

(1) Program Execution Mode

Program execution mode is the status of program execution by the CPU module. There are three modes; Run, Stop, and Debug. The operational status of each mode may vary by the status of the redundant operation.

It describes the operation process at each operation mode.

5.3.2 RUN mode

It executes a program operation normally.

Maintaining RUN mode

Determine whether to process by

Inspect the operation and

Changing to other mo de

operation mode

5-24

Chapter 5 Program Configuration and Operation Method

(1) Process of switching to Run mode

(a) When the PLC module is switched to the Run mode, th e d at a a rea i s i nit iali z ed.

 According to the set up restart mode (cold, warm)

(b) Ch eck the pr ogram val idity to judge the po ssibil ity of executi on.

(2) Operation process

Execute I/O refresh and program operation.

(a) Execute the interrupt program by detecting the operation conditions of interrupt program. (b) Inspect the operation and detachment of modules installed. (c) Process communication service and other internal operations.

(d) Sy nch ronize the data betw een the mas ter and stand by CP U s.

5.3.3 Stop Mode

It stops with no program operation. Program can be transmitted through XG5000 only at remote STOP mode. (1) Process in mode switching

When switched to the Stop mode, the output images are processed in two ways according to the basic parameter setting, as shown below.

(a) When set up to maintain output in Run  Stop switching

When the mode is switched from Run to Stop operation, the output image area maintains the results of the last operation, and carries out output refreshing.

(b) When the output i s released fro m maintena nce at switching from Run to S top

When the mode is switched from Run to Stop operation, the output image area is deleted and output refreshing is carried out.

(2) Operation process

(a) Execute I/O refresh. (b) Inspect the operation and detachment of modules installed. (c) Process communication service and other internal operations.

5-25

Operation condition

Description

Stepwise execution of operation(step over)

Execution according to the designation of break point

Once a break point is designated in a program, it stops at the designated point

If designating the contact area to monitor and the status(read, write, contact.

Execution according to the designated scan frequency

Once designating the s can freque ncy to operation , i t stops a fter operati ng as many as the scan frequency designated.

Caution

1. Debug mode is only avail able in si ngle sys tem.

Chapter 5 Program Configuration and Operation Method

5.3.4 Debug Mode

As a mode to find any error from a program or trace an operation procedure, the mode can be changed only from STOP mode. In the mode, a user can verify a program while checking the program execution and data.

(1) Processing when a mode is changed

(a) At t he beg inni ng w hen the mode i s chan ged , i ni ti aliz e t he da ta a rea. (b) Clear the output image area and execute input refresh.

(2) Operation process

(a) Execute I/O refresh. (b) Debug gin g o pera tion depe nding on th e setting s. (c) After completing debugging operation to the end of the program, it executes output refresh. (d) Inspect the operation and detachment of modules installed. (e) Process communication service and other internal operations.

(3) Conditions of debug operation

There are four types of debug operation conditions and if reaching the break point, it is possible to set a different type of break point.

Upon an operation command, it executes a unit of operation and stops

Execution according to the status of contact

value), it stops when the designated operation occurs at the pre-defined

(1) To use debug mode, tu rn off the pow er of standby CPU and so that th e syste m runs in singl e. (2) Convert to remote stop mode by mode key switch.

2. During debug mode, the us er can’t change mode by mode swit ch.

(4) Operation method

(a) Set the debug operation conditions at XG5000 and execute the operation. (b) The interrupt program can be set by enabled/disabled at the unit of each interrupt.

(For the details of operation, please refer to Chapter 12 Debugging in the user’s manual of XG5000)

5.3.5 Switching Operation Mode

(1) How to change an operation mode

An operation mode can be changed as follows. (a) Mode change by the mode key of the CPU module

(b) Change by accessin g the progr amming to ol(XG50 00) to a communication port of CPU (c) Change of a di ffere nt CPU modul e networked by XG5000 accessed to a communication port of CPU (d) Change by using XG5000 , HMI and computer link module, which are networked.

(e) Change by ‘STOP’ comma nd whil e a progra m is opera ting.

5-26

Caution

(2) Type of Operati on Mode

(a) Changing program execution mode with mode key

the method of changing ope ratio n mode using mode key is as follows.

Mode Key Position Operation Mode RUN Local RUN STOP Local STOP

STOP → REM Remote STOP REM → RUN Local RUN RUN → REM Remote RUN REM → STOP Local STOP

(b) Changing remote operation mode

Changing remote mode s can be done with the operati on mode swit ch at ‘Remote Allowed: REM.’

Mode Key

Position

Mode change Mode change by XG5000

Chapter 5 Program Configuration and Operation Method

Change by comput er

communication, etc. Remote STOP → Remote RUN ＯＯ(review) Remote STOP → DEBUG

REM

Remote RUN → Remote STOP Remote RUN → DEBUG DEBUG → Remote STOP

DEBUG → Remote RUN ＸＸ

ＯＸＯＯＸＸＯＯ

If changing the remote ‘RUN’ mode to ‘RUN’ mode by switch, the PLC is continuously operating without

suspension. Editing during RUN is po ssible in the ‘RUN’ mode by switch , but the mode change by XG5000 is restricted. Make sure to change it only when the mode chan ge is not re motely allowed .

5-27

Cable between

CPUs

status

B is operating in redundant

Redundant

In redundant operation mode, CPU-A and CPU-B are set up as master and standby to perform redundant operation.

CPU-A and CPU-B are set up as master and standby to perform redundant operation, but the operation is stopped.

Caution

When a stan dby CPU is added to a s ystem oper ating wit h a single C PU (master) for redun dant operat ion, the additional (stan dby) CPU must be installed in accordance w it h follow in g p ro ced ure s for u nin te rrupte d o pe ra tio n o f

Chapter 5 Program Configuration and Operation Method

5.4 Redundancy System Operation

5.4.1 Redundancy System Operation

(1) Redundant ope ration mode

A redundant system has data synchronization (SYNC) cable between CPUs. Each CPU module has a key switch for operation mode setting. The key switches look as shown below;

The operation statues of redundancy system can be classified as flows according to the installation, power supply, whether dada communication cable is connected between the CPUs, and the operation mode of each CPU.

Data sync.

Connected

Not connected

Current

operation

Single

operation

Operation

stopped

Single

operation

Operation

mode of

CPU-A(B)

RUN STOP

RUN RUN

STOP STOP

RUN/STOP -

Operation

mode of

CPU-B(A)

Description

Only CPU-A or CPUoperation mode. Same single CPU operation.

The operation is same as a single CPU operation.

the PLC. (1) With the power of the standby-side base OFF, construct a same module as the master-side base.

(2) Install the standby CPU in the CPU mounting slot. And set the A/B side switch in Standby CPU differently from Master CPU. (3) Connect the CPUs with th e data sy nchroni zation cable (Sy nc cable) and expansion cable. (4) Confirm that the cable s are cor rectly connecte d, turn the pow er of the sta ndby bas e ON. (5) Turn the operation mode switc h to Local Run mode, so tha t the stand by CPU is in corpora ted in the redundant operation. (6) The standby CPU must be incorporated in the redundancy system operation to be able to run the same programs as those of the master CPU. (Take care that, if the standby CPU has not been participating in the redundant operation, its program may differ from that of the master CPU.)

5-28

Mode Change

Description

Standby Operation

Changing the standby to Run mode, the operation is changed to redundant operation.

If the master is changed to STOP, the standby becomes master in single operation status.

If the standby is changed to STOP, the master operates in single operation mode.

The one, A or B, that e nter s RU N mode first gets the operation control and

status.

Chapter 5 Program Configuration and Operation Method

(2) Changing red undan t operatio n mode

(a) According to the change of the CPU operation mode with mode key or by XG5000, the operation mode of the

redundant system is changed as follows.

Current Status

Master Operation

RUN → STOP

Single Operation

(RUN/STOP)

Redundant

Operation

(RUN/RUN)

Operation Stop

(STOP/STOP)

(3) Changing master in redundant operation

(a) Conditions for automatic master switching

1) Master CPU power supply failure

2) Master CPU stopped due to failure in program execution

3) Module removal/replacement error in the master CPU‘s basic base

4) Master CPU failure (CPU excluded)

5) Module on an expansion base is removed (isolated)

6) A system error in the master CPU (abnormal termination of CPU, scan watchdog error)

(a) Conditions for manual master switching

1) Master CPU’s mode key switch is set to Stop

2) Switched to Stop mode by the XG5000 connected with the master CPU

3) Execution of master switching instr uc ti on via XG5000 online access

4) Master/standby switching instruction (MST_CHG) is executed

5) Master/standby switching flag (_MASTER_CHG) is executed.

1) One of two power supply fails

2) Master fails when the standby has been failed a) If the same failure is identified, the operation is stopped. b) When en error is detected in the module in which error mask has been set up, the master is not switched.

3) When the standby CPU is not in Run operation state

(No change: RUN) → RUN

→ STOP

(No change: RUN) → STOP

→ RUN

STOP status is

maintained

(No change: RUN)

When the m aster is changed to STOP state, the operati on is stopped

becomes t he m aster in sin gle o pera tion

5-29

Chapter 5 Program Configuration and Operation Method

5.4.2 Start-up of Redundant System

(1) Programming

(a) Conduct programm ing with XG5000.

(For details, see ‘XG5000 User Manual’.)

(b) Transmit the program

Transmit the program with XG5000.

(2) Starting met hods

Following methods are available for starting-up PLC;

(a) Starting with local key:

Download the program in remote mode (REM), set the front key to ‘RUN’

(b) Starting with XG5000:

Set the front key on the CPU module to ‘REM,’ select RUN on the XG5000’s online menu.

When the power is turned O N with the front key set to RUN or if the s ystem was in Remote RUN m ode before power OFF, the system can be started by power ON.

(d) Restarting with reset key:

Restarting with reset key has two methods; Reset and Overall Reset

1) Reset: activated by pressing th e reset button on th e front of the CPU module les s than 3 seconds. ‘RST’ will appear on the indicator panel of the CPU. This is the same as power ON/OFF.

2) Overall Reset: activated by pressing the reset button on the CPU module for more than 3 seconds. ‘RSTC’ will appear on the indicator panel of the CPU. When the button is released, th e system will be restarted in c old restart.

(3) Beginning the first operation

The procedures of system setting-up and starting-up for the first time operation of a redundant system are as follows.

(a) Prepare the program bocks suitable for the purpose, in as independent forms as possible (b) In the redundancy parameters, set up the data synchronization area. (c) When the programming is completed, compile it and carry out debugging. (d) U sing the XG5000 program tool, access CPU communication port and download the program (e) Switch CPU-A or B to RUN mode using the mode switch key or XG5000. (f) Switch the CPU which is not the master to RUN mode to set it to the standby CPU (g) St op the CPU-A to check normal operation of the standby CPU-B.

(4) Participa ting in ope ration

When the standby CPU participates in the operation while the master CPU is in operation, the standby CPU is synchronized with the master CPU in following procedures.

(a) CPU initialization (b) Checking the redundant components (c) Transfer non-variable data to the master (d) Transfer variable data from the master (e) Check synchronization with the master CPU (f) Participate in the operation at the same time as the master CPU

5-30

Chapter 5 Program Configuration and Operation Method

Note

(1) For the redundant operation mode setting and para meter setting, see ‘6.7 Redundant System Operation Mode’ (2) (a), (b), and (c) are processed separately with delay time less than approximately 50ms at every scan of the master. (3) (d), (e), and (f) must be processed within one scan of the master, with the delay time not exc eedi ng 50ms. (If the volume of the variables used exceeds the standard variable value, the delay time may exceed 50ms. For further

information, see ‘5.1.4 Scan Time’)

(5) Procedures of participating in standby operation

Detail procedures of participating in standby operation are as follows.

(a) Power ON

1) Check that the master is in operation

2) Standby entering mode

3) CPU self diagnosis

4) Transfer program from the master (store in RAM and memory module) (b) Checking redundant system components

1) Check switching I/O access

2) Receive and check switching I/O module information from the master

3) Scan the redundant I/O module information installed in the standby-side

4) Compare with the I/O parameters (c)Transfer non-variable data from the master

1) Receive the flag from the master (executed by being divided into multiple scans as necessary)

2) After confirming that the flag status has not been changed, proceed to (4) (d) Receive the variable data from the maser

1) User data area and a part of system buffer (e) Check synchronicity with the master

1) All the operation data in the CPU is synchronized (f) Participate in the operation at the same time as the master

1) Conduct redundant operation from the input refreshing

(6) Operation according to starting status

(a) Normal start-up

The master CPU module chec ks system configuration at power ON. In case of late power on of the expansion base, the base being check appears on the front indicator panel and wait for power on. In ‘STOP’ mode, wait for 10 seconds and switched to Stop mode.

1) The first operation after program modification begins in cold restart.

2) When the system had been shut-down normally, the restarting will be performed according to the set-up parameters, including mode key, XG5000, power OFF and reset.

3) To cold-restart a system set up in warm restart mode, use reset key or the Overall Reset function of the XG5000.

4) If the system was s topped due to an error in operation, the restart ing method will be determined by the type

and release method of the error (see ‘Chapter 13. Program Troubleshooting’).

(b) When I/O skip has been set up

1) Since the I/O module set up with sk ip is excluded from the operation in the r estarting, failure check , etc., are not conducted, and i ncluded in the opera tion normally when the s kip is released during operation. For d etail information, see ‘9.2 I/O Skip’ and ‘9.3 Module Replacement during Operation.’

5-31

area

Chapter 5 Program Configuration and Operation Method

1) Sinc e the modules set u p with failure mask are included in the operation i n the restarting, f ailure check, etc., are conducted. Ho wever, even if module t ype disagreement error occurs in the initial p hase of the restart, the operation is continued. For further information, see ‘9.1 Failure Mask.’

2) When the e ntire bases are set up with m ask, if the power of the r espective base is off, the CPU waits for power on in waiting mode.

5.5 Memory

The CPU module contains two types of memory that can be used by a user. One is the program memory to save a user program created to con stru ct a system and th e other one is the data memory to provide a device a rea to save the data during operation.

5.5.1 Program memory

The storage capacity and data area type of the program memory are as follows.

Item(area) Capacity Remark

Whole memory area 25MB Whole memory capacity

Program Memory 3MB Include Upload

System Memory 4MB

Data Memory 2MB

Flash Memory 16MB For flash operation mode

System data and parameter

Device memory, Flag, System

5-32

Item(area)

Capacity

Whole data memory area

2MB

Reserved area

System flag

4KB

Analogue image flag

32KB

PID flag

16KB

High speed link flag

22KB

P2P flag

42KB

Input image area(%I)

16KB

Output image area(%Q)

16KB

R area(%R)

128KB

Direct parameter area(%M)

256KB

Symbolic parameter area(max.)

512KB

Stack area

256KB

Auto variable

User-defined

Retain settable if adding a parameter to the auto parameter area

User-defined

Retain settable into internal contact area by parameter

K(PID)

Contact that is kept a s contact st atus in cas e of interrupt

System flag area

Not retained

Analogue data registe r (ret ain not set table )

Not retained

(V1.1 or above)

High speed link/P2P service status contact of communication module(retained)

P2P service address ar ea of communication module(retained)

Exclusive flash memory area(retained)

Note

(1) K, L, N and R devices are basically retained.

(3) For details of directions, please refer to the ‘Online’ in the user’s manual of XG5000.

Chapter 5 Program Configuration and Operation Method

5.5.2 Data memory

The storage capacity and data area type of the data memory are as follows.

System area :

 I/O data table

 Forcible I/O table



Flag area

770KB

5.5.3 Data retain area setting

If the data nec essar y for o pera tion or the dat a tha t occu r duri ng oper ation are to be k ept for us e even when th e PLC stops and r esumes operat ion, the defau lt(auto.) parameter retain is to be used. Alternati vely, a part of the M area device may be used as the retain area by parameter setting.

The following table su mmariz es the fe ature s of retain settable device.

Device Retain setting Feature

(2) K, L and N devices can be deleted in the memory deletion window of PLC deletion, an online menu of

XG5000.

5-33

Maintaining the previous

value

Maintaining the previous

value

Maintaining the previous

value

Maintaining the previous

value

Maintaining the previous

value

DCLR (3sec)

Initializing as ‘0’

Maintaining the previous

value

Maintaining the previous

value

Maintaining the previous

value

Note

Parameter

Initializing as a user-defined value

Chapter 5 Program Configuration and Operation Method

(1) Data initialization by restart mode

There are 3 restart mode related parameters; default, initialization and retain parameter and the initialization methods of each parameter are as follows in the restart mode.

Default Initializing as ‘0’ Initializing as ‘0’ Retain Initializing as ‘0’ Maintaining the previous value

Initialization Retain & initi aliz ati on

(2) Operation in the data retain area

Retain data can be d ele ted as fol low s.

- D.CLR switch of the CPU module

- RESET swi tch of the CPU module (3 seconds and longer: Over all Reset )

- RESET by XG5000 (Overall Reset)

- Deleting memory at STOP mode by XG5000

- Writing by a program (recommen di ng the i ni tialization program)

- Writin g ‘0’ FILL and etc at XG5000 monitor mode D.CLR clear d oes not work at RUN mode. To do it, after make sure to c hange t o STO P mode. I n additi on, the defaul t

area can be al so i ni ti aliz ed w h en cl eari ng by D. CL R swi tch . When insta ntaneously op erating D.CLR , the only ret ain area is de leted. If main taining D.CLR for 3 seconds , 6 LEDs blink and at the moment, if the switch returns, even R area data are also deleted.

For the maintenance or reset(clear) of the retain area data according to the PLC operation, refer to the following table.

Item Retain M area retain R area

Mode

Cold Warm

Initializing as a user-defined val ue Maintaining the previous value

Reset

Over all reset

DCLR

Initializing as ‘0’ Initializing as ‘0’ Initializing as ‘0’ Initializing as ‘0’

STOP→RUN

When STOP->RUN, in case it is set as Cold Re star t, R etai n A ut o va ri abl e i s ini tia lized In case it is set as Warm Restart, Retain Auto variable is maintained.

The terms and definitions for 3 types of variables are as follows. (1) Default variable: a variable not set to maintain the initial/previous value (2) Initialization(INIT) variable: a variable set to maintain the initial value (3) Retain variable: a variable set to maintain the previous value

(3) Data initialization

Every device memory is cleared up as ‘0’ at the status of memory deletion. The data value may be assigned initially depending on a system and at the moment, the initial iz ation task should be used.

6-1

Executing WDT

WDT

Chapter 6 CPU Module Functions

6.1 Self-diagnosis Function

(1) The self-diagnostic is the function that the CPU module diagnoses any trouble of the PLC system. (2) It detects any t roubl e w he n tu rni ng on the PLC sy stem or any troubl e is found du ring the operatio n, avoi d the sy stem

from malfunctioning and taking preventive measures.

6.1.1 Scan watchdog timer

WDT(Watchdog Timer) is the function to detect any program runaway resulting from abnormal hardware/software of PLC CPU module.

(1) WDT is a timer used to detect an operation delay from abnormal user program. It can be set in the basic

parameter of XG5000.

(2) WDT monitors any scan overtime during operation and if it detects any overtime delay, it immediat ely su spe nds

the PLC operation and turns off every output.

(3) If it is expected that programming a specific part(using FOR ~ NEXT command, CALL command and etc) may

have an overtime delay of scan watchdog timer while executing a user program, you can clear the timer by using ‘WDT’ command. The ‘WDT’ command restarts from 0 by initializing the overtime delay of scan watchdog time(for the details of WDT command, please refer to the chapter about commands in the manual).

(4) To release a watchdog error, turn it on again, operate manual reset switch or change the mode to STOP mode.

0 1 2 3 ….. …8 9

Count (ms)

WDT Reset

0 1 2 …

Scan END

0 1 2 … …6 7

Scan END

0 1 2 …

6-2

Caution

Chapter 6 CPU Module Functions

(1) The setting ra nge o f the w at chdo g ti mer i s 1 ~ 99 9 ms(1 ms s tep ) , a nd the initial value i s 20 0 ms. (2) If the cycle is set too short, scan watchdog time error may occur if the scan time is elongated by communication traffic overload, etc. It is recommended to set the cycle sufficiently longer that _SCAN_MAX

6-3

Note

Chapter 6 CPU Module Functions

6.1.2 I/O Module Check Function

This function checks the I/O module when entering Run mode or during PLC operation

(1) When entering Run mode, check if a module disagrees with the parameter setting or in failure (E030) (2) Check if the I/O module is isolated or failed during operation (E031)

If an abnormality is detected, the error indicator lamp (ERR LED) turns on, error number is indicated on the status indicator, and the CPU stops operation.

6.1.3 Battery level check

The function monitors battery level and detects, if any, low battery level, warning a user of it. At the moment, the warning lamp (BAT) on the front of the CPU module is On. For the details of measures, please refer to “4.3.3 Battery Life”.

6.1.4 Saving error log

The CPU module logs, if any, errors so that a user can easily analyze the error and take corrective measures. It saves each error code to the flag area.

The results of self-diagnostic check are logged in the flag ar ea. For the d etails of self -diagnostic and troubleshooting against errors, pleas e refer to 14.5 Error C odes List during CPU Operation of Chapter 13. Troubleshooting.

6.1.5 Troubleshooting

(1) Types of trouble

A trouble occurs mainly by the breakage of PLC, system configuration error and abnormal operation results. ‘Trouble’ can be catego riz ed by ‘heavy fault mode’ at which the system stops for the purpose of the system safety and ‘light fault mode’ at which the system warns a user of a trouble and resumes operation.

The PLC system may have a troubl e by the follow ing cau ses.

Trouble in t he P LC ha rdw ar e



 System configuration error  Operation error while a user program is operating  Error detection resulting from a fault external device

(2) Operation mode when a trouble is found

If a trouble is detected, the PLC system logs the trouble message and stops or resumes operatio n dependi ng on a trouble mode.

(a) Trouble in the PLC hardware

If heavy fault tha t the PLC may not prope rly work, such as CPU modul e, powe r module and other s occurs, the system stops. However, the system resumes operation in case of light fault such as abno rmal batt ery.

System configuration error

(b)

It occurs when the hardware structure of PLC is not same as defined in the software. At the moment, the system stops. This occurs at module type disagreement error, module isolated error, or when the I/ O mounted on the PLC differs from the I/O se t up in the XG5000 .

6-4

Note

Chapter 6 CPU Module Functions

Operation error while a user program is operating

(c)

In case of numerical operation error as a trouble occurring while a user program is operating, error flag(_ERR) and error latch flag(_LER) are displayed and the system resumes operation. If an operation time exceeds the overtime delay limit or the built-in I/ O mod ul e is not controll ed, the system stops.

Error latch flag is maintained as long during a scan program if an error occurs i n scan program. Every time a c om mand is executed , er r or f la g is c l eared and set just af ter a c ommand generati ng an error is executed.

Error detectio n resul ting from a faul t exter nal devi ce

(d)

It detects a fault of ext ernal devi ce; in case of heavy fault, the system stop s while i t just displ ays a faul t of the devi ce and keeps operating in case of light fault.

(1) If a fault occurs, the fault number is saved into the flag(_ANNUM_ER). (2) If light faul t is dete cted, the fault number is saved into the flag(_ANNUM_WAR). (3) For further information about the flags, please refer to Appendix 1. Flags List.

(5) Error detecti on in redunda nt ope ration

Nonconformit y of redundanc y parameter is detected by the r edundancy par ameter error flag (_DUPL_PRM_ER), and data comm unic ati on er ror duri ng re dun dan t oper at io n is detec t ed b y the redu nda nc y s ynchr oniza ti on er ror fla g (_DUPL_SYNC_ERR). If an error occurs, the system stops. In addition, the status information on the current redundancy system configuration is provided with the redundancy Configuration warning error flag (_REDUN_WAR). If this err or is det ected, the system di splay s the statu s but contin ues operati on.

6.2 Clock Function

The CPU module contains a clock element (RTC), which operates by the backup battery even in case of power-off or instantaneous interruption. By using the clock data of RTC, the time control for the operation or trouble logs of the system is available. The present time of RTC is updated to the clock-related F device pe r scan.

(1) Read from XG5000/Setting

Click ‘PLC RTC’ in the online mode, ‘PLC Information.’

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Chapter 6 CPU Module Functions

It displays the time from the PLC RTC. If it displays the present time incorrectly, a user can fix it up by transferring the right time after manually setting the time or performing “Synchronize PLC with PC clock” method to transmit the time of PC clock connected to the PLC.

(2) Clock reading by Flag

It can be monitored by flags as follows.

Flags Examples Size F area Description

_RTC_TIME[0] _RTC_TIME[1] 16#02 BYTE %FB13 Current time [Month] _RTC_TIME[2] 16#23 BYTE %FB14 Current time [Date] _RTC_TIME[3] 16#14 BYTE %FB15 Current time [Hour] _RTC_TIME[4] 16#16 BYTE %FB16 Current time [Minute] _RTC_TIME[5] 16#17 BYTE %FB17 Current time [Second] _RTC_TIME[6] 16#06 BYTE %FB18 Current time[day] _RTC_TIME[7] 16#20 BYTE %FB19 Current time [hundred year]

(3) Clock data modified by program

A user also can set the value of clock by using a program. It is used when setting the time manually by external digital switches or creating a system to calibrate a clock periodically on network.

Input a value i nto t he bel ow flag a rea an d use the ‘_RTC_TIME_US ER’ function block. The time data is up da ted in scan END.

Flags Examples Size F area Description

_RTC_TIME_USER[0]

16#08

BYTE %FB12 Current time [year, last two digits]

BYTE %FB3860 Current time [year, last two digits] _RTC_TIME_USER [1] 16#02 BYTE %FB3861 Current time [Month] _RTC_TIME_USER [2] 16#23 BYTE %FB3862 Current time [Date] _RTC_TIME_USER [3] 16#14 BYTE %FB3863 Current time [Hour] _RTC_TIME_USER [4] 16#16 BYTE %FB3864 Current time [Minute] _RTC_TIME_USER [5] 16#17 BYTE %FB3865 Current time [Second] _RTC_TIME_USER [6] 16#06 BYTE %FB3866 Current time[day] _RTC_TIME_USER [7] 16#20 BYTE %FB3867 Current time [hundred year]

Alternatively , in stea d o f u sing fun cti on blocks, it is al so po s sible t o e nt e r cl o ck dat a i nto t he abov e a rea an d tu rn on ‘_RTC_WR’ in order to input the time.

(a) No input is allowed unl ess ti me data is entered in a ri ght fo rmat

(However, eve n i f th e d ay o f t he wee k dat a i s n ot corre ct, i t i s se t wi thou t e rro r dete ct ed)

(b) After writing the clock data, check whether it is rightly set by monitoring Reading Clock device.

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Operating temp.

Max. error (sec/date)

Ordinary (sec/date)

0 °C

- 4.67 ~ 1.38

-1.46

25 °C

- 1.64 ~ 2.42

0.43

55 °C

- 5.79 ~ 0.78

-2.29

Caution

(1) In iti ally, RTC may not h ave any clo ck d ata .

cur between the master and

Chapter 6 CPU Module Functions

(4) How to express the day of the week

Number 0 1 2 3 4 5 6

Day Sunday Monday Tuesday Wednesday Thursday Friday Saturday

(5) Time error

The error of RTC varies depending on the operating temperature. The following table shows the time error for a day.

(2) When using the CPU module, first make sure to set the accurate clock data. (3) If any dat a out o f the clock d a ta r ang e i s w ri tten i n to RTC, i t doe s not w ork p rope rly.

i.e.) 14M 32D 25H

(4) RTC may sto p or have an err or due to abnorm al battery an d other causes . The error is releas ed if a new

clock data is written. (5) For further information of how to modify the clock data, please refer to the description of XGI commands (6) In the sybchron ization of the mas ter and backu CP Us, time differenc e may oc

backup.

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Note

For the furt her information about rem ote funct ions, ple ase ref er to th e ‘Online’ part in the user’s manual of XG5000.

Chapter 6 CPU Module Functions

6.3 Remote Function

The operation mode of the CPU can be changed by communicatio n, in addit ion to the key switch on th e module. For remote operation, set the key switch of the CPU module to REM (remote) position>

(1) Types of remote operation

(a) Operation by connectin g to XG5000 vi a USB or RS-232C port installe d o n the CPU modul e (b) Operate by connecting XG5000 via the USB port on the expansion drive module (c) Other PLC networked on the PLC can be controlled with the CPU module connected to XG5000. (d) The PLC operation is controlled by HMI software and other applications through the dedicated communication.

(2) Remote RUN/STOP

(a) Re mot e RUN/S TOP is the function to execute RUN/STOP remotely with the dip switch of the CPU module set to

REMOTE and the RUN/STOP switch set to S TOP.

(b) It is a very convenient function when the CPU module is located in a place hard to control or in case the CPU

module is to run/stop from the outside.

(3) DEBUG

(a) DEB U G is the fu n cti on to c on trol DEB U G wit h the di p sw it ch o f the C PU module set to REMO TE an d RU N/S TOP

switch set to STOP.

It is a very convenient functi on when che cking pro gram exe cution status or da ta in the debu gging ope ration of the

(b)

system.

(4) Remote Reset

(a) Remote reset is the function to reset the CPU module remotely in case an error occurs in a pla ce not t o di rectly

control the CPU module.

(b) Like the switch control, it supports ‘Reset’ and ‘Overall Re set.’

(5) Flash memory operation mode

(a) What is the flash operation mod e? It mean s that the syst em operat es by the backup program in flash in case the

program in ram is damaged. If selecting “Flash Memory Operation Mode”, it starts operation after program in flash moves to the program memory of the CPU module when the operation mode is changed from other mode to RUN mode or when restarting.

6-8

Caution

(1) The default is ‘Flash Memory Operation Mode deselected’.

set, the changed program may be applied only

writing, “Flash memory operation mode” is released.

Chapter 6 CPU Module Functions

(b) Flash Memory Operation Mode Setting Check the operation mode setting by using ‘Online  Set Flash Memory …  ‘Enable flash memory run mode’

and click ‘OK. ’ Once pressing i t, it show s a dialogue box stati ng “Saving flash memory program …” and copies the program from user program area to flash.

(2) Flash memory operation mode is maintained as ‘On’ as long as it is not ‘Off’ by XG5000. (3) Flash memory operation mode can be changed, irrespective of RUN/STOP mode.

(4) Flash mem ory operation mode can be s et by the onli ne menu of XG 5000 when exec uting flash ‘operation

mode setting’ after program debugging is complete with the flash memory operation mode off. (5) If modifying during RUN with ‘flash memory o perat ion m ode ’

when it restar ts as lo ng as the pr ogram is success full y writte n in flash memor y. Note tha t if the PL C restar ts before a pr ogram is save d into flash m emory, a pr ogram that is s aved in adva nce, instead of the chang ed program, works.

(6) If flash memory operation mode is changed from ‘disabled’ to ‘enable’, flash memory operation mode is

applied as long as the flash memory writing is com pl et e . In cas e the PL C r estarts before completing program

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setting

CPU understands that flash memory does not have any

Chapter 6 CPU Module Functions

If restarting the PLC system or changing its operation mode to RUN , it works as follows depending o n the flash operation mode setting.

Flash memory operation mode

Description

If program memory dat a are dam aged beca use flash mem ory and program memor y are different or battery voltage is low, it downloads the program saved in flash memory to program memory.

Off

program and operates by the program saved in RAM.

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Caution

Chapter 6 CPU Module Functions

6.4 Forced On/Off Function of I/O

The forcible I/O function is used to forcibly turn on or off I/O area, irrespective of program execution results.

6.4.1 Force I/O Setting

(1) Click [Online]-[Force I/O] on XG5000.

(a) To set forcible I/ O, select the flag of a conta ct to set and the data checkbox (b) To set “1”, select the flag and data of a bit and then, select a flag. (c) To set “0”, select a flag only , not the data corres pondin g to the bit . (d) If selecting ‘forcibl e i npu t o r outp ut en able d’, the setting i s app lied a nd it works accordingly.

For further directions, please refer to the us e r’s manual of XG5000.

(1) Forcible I/ O s etti ng is available only in local I/O module . (2) It can not be set in remote I/O module(smart I/O module). (3) If for cible I/ O is set, “CHK LED” is On. (4) The forcible I/ O set by a user is maint aine d even t houg h a n ew p ro gra m i s downloa ded .

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Caution

Cautions for using forcible I/O

Chapter 6 CPU Module Functions

6.4.2 The point of time of method of forced On/Off process

(1) Forcible i npu t

‘Input’ replaces the data of a contact set by Forcible On/Off from the data read from input module at the time of input refresh with the forcibly set data and updates input image area. Therefore, a user program can execute operation with actual input data and forcibly set data.

(2) Forcible o ut put

‘Output’ replaces the data of a contact set by Forcible On /Off from th e outpu t image area dat a cont aining ope rati on result at the time of output refresh with the forcibly set data and outputs to an output module after completing user program operation. Unlike input, the data in output i mage a rea i s not c han ged by forcible On/Off set ting .

(1) It works from t he ti me w he n i npu t/out pu t a r e s et to ‘enable/disable’ respectively after setting forcible data. (2) Forcible input can be set even thoug h a c tual I/O modul e i s n ot in s tall ed. (3) The previously set On/Off setting data are kept in the CPU module, despite of power off  on, operation

mode change, program download or manipulation by reset key. Howeve r, it i s del ete d i f ov er all re set is

executed. (4) Forcible I/O da ta a re no t d ele ted eve n i n STOP mode. (5) To set new data from the first, release every setting of I/O by using ‘overall reset’.

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Note

Chapter 6 CPU Module Functions

6.5 Operation history saving function

There are four types of operation logs; Error log, Mode change log, shut down log and System log. It saves the time, frequency and operation of each event into memory and a user can conveniently monitor them through XG5000. Operation log is saved within the P LC un le s s it is del ete d by XG5000.

6.5.1 Error history

It saves error log that occurs during operation.

(1) Saving error code , date, time and erro r detail s. (2) Saving logs up to 2,048 (3) Automatically released if memory backup is failed due to low battery level and etc

6.5.2 Mode change history

It saves the change mode information and time if an operation mode is changed.

(1) Saving the date, time and mode chan ge in formatio n. (2) Saving up to 1 ,024.

6.5.3 Shut down history

Saving power On/ O ff da ta w ith i t’s time data.

(1) Saving On/Off data, date and time. (2) Saving up to 1 ,024. (3) History of master and standby power is indicated respectively.

6.5.4 System history

It saves the ope rati on log o f system that occur s du ring ope r ati on.

(1) Saving the date, time and operation changes (2) XG5000 operation data, key swit ch change in formati on (3) Instantaneous interruption data and network ope ration (4) Saving up to 2 ,048

(1) The saved d at a a r e n ot deleted before it i s del et ed by sel ecti ng a menu in XG5 000. (2) If executing Read All in case logs are more than 100, the previous logs are displayed.

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Chapter 6 CPU Module Functions

6.6 External device failure diagnosis function

It is the flag that a user detects a fault o f external devi ce so that the su spension/w arni ng of a system coul d be easily re alized. If using the flag, it can display a fault of external device, instead of creating a complex program and monitor a fault position without XG5000 and source program.

(1) Detection/classification of external device fault

(a) The fault of external device is detected by a user progra m and it can be div ided into heavy fault(er ror) tha t require s

stopping the P LC o pe ra tion a nd l igh t fa ult (wa rning ) th at only di spl ay s faul t stat u s while it keeps operating.

(b) Heavy fault uses ‘_ANC_ERR' flag and light fault uses ‘_ANC_WB' flag.

(2) If a heavy fault of external device is detected

(a) If a heavy fault of external device is detected in a user program, it writes the val u e ac cording to error type defined in a

system fla g, ‘_ANC_ERR’ by a user. Then, with _CHK_ANC_ERR flag On, it check s at the complet ion of a scan program. At the moment, if a fault is displayed, it is displayed in ‘_ANNUN_ER’ of ‘_CNF_ER’, which is the represent ative error flag. Then, the PLC turns off every output module(depending on the output control setting of basic param eter) and it has the same er ror status with PLC fa ult de tect ion. At th e m om ent , P.S LED and CHK LED are On, besides ERR LED.

In case of a fault, a user can check the cause by using XG5000 and alternatively, check it by monitoring ‘_ANC_ERR’

(b)

flag.

(c) To turn off ERR LED, P.S LED and CHK LED, which are On by heavy fault error flag o f e xte rnal dev i ce, it i s nece ssa ry

to reset the PLC o r t urn i t o ff a nd on ag ai n .

 Example

(3) If a li ght faul t o f e xte rna l devi c e i s d ete cte d

(a) If a lig h t fa u lt of ex t ernal device is det ected in a user program, it writes the val u e according to warning type defined in

‘_ANC_WAR’ by a us er. Then, with _CHK_ANC_WAR On, it c hecks at th e completio n of a scan program. At the moment, if a warning is displayed, ‘_ANNUN_WAR’ of ‘_CNF_WAR’, which is the representative error flag of system is On. At the moment, P.S LED and CHK LED are On.

(b) If a war ning occurs, a user can ch eck the ca uses b y using XG 5000. Alternatively, a user can check the causes by

directly monitoring ‘_ANC_WAR’ flag.

reset.

 Example

‘_ANNUN_WAR’ of ‘_CNF_WAR’ is

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Chapter 6 CPU Module Functions

6.7 Redundancy system operation setting

For redundant syste m operat ion, redu ndan cy paramete rs have to be s et up. Redundanct paramete r config urat ionis cla ssi fied into the operati on mode se tting and data sync hroniz ation area setting. The default setting has no data synchronization area. Be careful that, if the data synchroniz atio n area is not se t up, the data of the master CPU is not synchronized to the standby CPU.

Different from other parameters, the dredundancy parameters can be written during running. However, the redundan cy para met e rs canno t be au tomati cal ly dpw nloa ded d u ring running w ri tin g.

From the XG5000 online writin g, sele ct the r edu nda n cy par a meter s only and download t he m.

6.7.1 Operation mode setting

(1) Single CPU operation mode

If the system is operati on with master CPU only , withou t standby , redundancy system configuration warning occurs. To configure XGR system with a single CPU, select the ‘Di sabl e the wa rni ng messa ge fo r Si ngle C PU Mode’ check box

to prevent the warning display.

6-15

Caution

Chapter 6 CPU Module Functions

It is recommended to configure the XGR system in redundant CPU system. If the redundant system is configured with single CPU , the s ystem stops if the CPU m odu le fai ls. To preve nt s ystem interr upti on, s et up the s ystem in redundant CPU configuration

(2) Error handling in power cut-off of expansion base

In a redundant XGR system configured wuth multiple extensin bases for enhanced system reliability and diver sity, in case of detach (powr off) of expansion base(s), the user can select whether to consider it as error or CPU restarts the system and watis until exension base in problem paricipate in operation again.

a) If the check box “Restart and wait” is selected;

As the default setting , in case of a problem in an expansion base, the system is restarted and the CPU module waits until the bas e i n fail u re is normalized. The base in failure is indicated wi th “Ebx x” in the CPU indi cator panel .

When the failed base is restarted normally and returns to the system, the CPU module restarts in the same manner as the initial start-up and carry out normal operation.

b) If the check box “Extended Base Detach Error ” is selected;

In case of failure of an expansion base, other modules operate in accordance with the error process setting in the basic parameter settings. If the basic parameter was set to maintain output under error occurrence, other modules maintain the last output.

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Caution

Chapter 6 CPU Module Functions

6.7.2 Data synchronization area setting

(1) M area setting

Setting can be made by 1 kbyte step within 1 ~ 256 kByte range. Initial value: %MW0~%MW2000 Change in Start End method

(2) I/Q : setting by base unit

Setting can be made in base unit. Initial value i s 31 bases (error message if the setting value is less than the number of installed bases)

(3) PID : setting by block (max. 8 blocks)

For the synchronization area of the PID area, 32 PID areas are allocated for each block

- Initial value: 0 block

(4) R(W) : set R only, and automatic setting for W

Synchronization area for R(W) area

- Initial value : %RW0~%RW2000(%WW0~%WW2000, %WW32768~%WW34768)

(1) The M area retain can be set up in the “Basic Parameter Setting.” For details, see “5.5.3 Data Retain Area

Setting.”

(2) When the master/standby CPUs are performing redundant operati on, follow ing s are automati cally

synchronized. (a) L (high speed link fla g), N(P2P paramete r settin g) devi ce area (b) F (system flag area) device area (howev er, indiv idual flag are as are not sy nchroniz ed) . (c) U (special module refresh area) device area (however, only installed modules are synchronized). (3) If a variable value has been changed during monitoring by XG5000, it applies to the respective areas of the

master and standby CPUs, rega rdles s of the data sync hroniz ation area setting.

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