LSIS XEC-DR32H, XEC-DN64H, XEC-DP64H, XEC-DR32H/D1, XEC-DN32H User Manual

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User’s Manual

○○○○○○ Series

XGB Hardware (IEC)

Programmable Logic C ontroller

XGT Series

XEC-

DR32H

XEC-

DN32H

XEC-

DP32H

XEC-

DR64H

XEC-

DN64H

XEC-

DP64H

XEC-

DR32H/D1

XEC-

DR64H/D1

Safety Instruction

Before using the product …

For your safety and effective operation, please read the safety instructions thoroughly before using the product.

► Safety Instructions should always be observed in order to prevent accident

or risk with the safe and proper use the product.

► Instructions are separated into “Warning” and “Caution”, and the meaning of

the terms is as follows;

This symbol indicates the possibility of serious injury or death if some applicable instruction is violated

This symbol indicates the possibility of slight injury or damage to products if some applicable instruction is violated

► The marks displayed on the product and in the user’s manual have the

following meanings.

Be careful! Danger may be expected. Be careful! Electric shock may occur.

► The user’s manual even after read shall be kept available and accessible to

any user of the product.

Warning

Caution

Safety Instruction

Safety Instructions when designing

 Please, install protection circuit on the exterior of PLC to protect

the whole control system from any error in external power or PLC

module. Any abnormal output or operation may cause serious problem

in safety of the whole system.

- Install applicable protection unit on the exterior of PLC to protect the system from physical

damage such as emergent stop switch,

protection circuit, the upper/lowest limi

t switch, forward/reverse

operation interlock circuit, etc.

- If any system error (watch-dog timer error, module installation error,

etc.) is detected during CPU operation in PLC, the whole output is

designed to be turned off and stopped for system safety. However,

in case CPU error if caused on output device itself such as relay or

TR can not be

detected, the output may be kept on, which may

cause serious problems. Thus, you are recommended to install an addition circuit to monitor the output stat us .

 Never c onnect the overload than rated to the output module nor

allow the output circuit to have a short circuit, which may cause a fire.

 Never let the external power of the output circuit be designed to

be On earlier than PLC power, which may cause abnormal output or

operation.



In case of data exchange between computer or other external

equipment and PLC through communication or any operation of PLC (e.g. operation mode change), please install interlock in the sequence program to protect the system from any error. If not, it

may cause abnormal output or operation.

Warning

Safety Instruction

Safety Instructions when designing

 I/O signal or communication line shall be wired at least 100mm

away from a high-voltage cable or power line. If not, it may cause

abnormal output or operation.

Caution

 Use PLC only in the environment specified in PLC manual or

general standard of data sheet. If not, electric shock, fire, abnormal operation of the product or flames may be caused.

 Before installing the module, be sure PLC power is off. If not,

electric shock or damage on the product may be caused.

 Be sure that each module of PLC is correctly secured. If the

product is installed loosely or incorrectly, abnormal operation, error or dropping may be caused.

 Be sure that I/O or extension connecter is correctly secured. If

not, electric shock, fire or abnormal operation may be caused.

 If lots of vibration is expected in the installation environment,

don’t let PLC directly vibrated. Electric shock, fire or abnormal operation may be caused.

 Don’t let any metallic foreign materials inside the product, which

may cause electric shock, fire or abnormal operation..

Caution

Safety Instruction

Safety Instructions when wiring

 Prior to wiring, be sure that power of PLC and external power is

turned off. If not, electric shock or

damage on the product may be

caused.

 Before PLC system is powered on, be sure that all the covers of

the terminal are securely cl osed . If not, electric shock may be caused

Warning



Let the wiring installed correctly after checking the voltage rated

of each product and the arrangement of terminals. If not, fire,

electric shock or abnormal operat ion may be caused.

 Secure the screws of terminals tightly with specified torque when

wiring. If the screws of terminals get loose, short circuit, fire or abnormal

operation may be caused.

 Surely use the ground wire of C lass 3 for FG terminal s, which is

exclusively used for PLC. If the terminals not grounded correctly,

abnormal operation may be caused.

 Don’t let any foreign materials such as wiring waste inside the

module while wiring, which may cause fire, damage on the product

or abnormal operation.

Caution

Safety Instruction

Safety Instruct ions for test-operation or repair

Safety Instructions for waste disposal

 Don’t touch the terminal when powered. Electric shock or abnormal

operation may occur.

 Prior to cleaning or tightening the terminal screws, let all the

external power off including PLC power.

If not, electric shock or

abnormal operation may occur .

 Don’t let the battery recharged, disassembled, heated, short or

soldered. Heat, explosion or ignition may cause injuries or fire.

Warning

 Don’t remove PCB from the module case nor remodel the module.

Fire, electric shock or abnormal operation may occur.

 Prior to installing or disassembling the module, let all the external

power off including PLC power. If not, electric shock or abnormal

operation may occur.

 Keep any wireless installations or cell phone at least 30cm away

from PLC. If not, abnormal operatio n may be caused.

Caution

 Product or battery waste shall be processed as industrial waste.

The waste may discharge toxic materials or explode itself.

Caution

Revision History

ersion Date Remark Chapter

V 1.0 2009.2

1. First Edition -

V 1.1 2009.6

1. Add detailed description on High Speed Counter specification

Ch8.1.1

V 1.2 2009.10

1. Add DC power unit

Ch2.1, Ch2.2

Ch4.1, Ch4.3 Ch7.2.1, Ch7.2.2 Ch8.1.1, Ch8.1.2

Appendix2

V1.5 2010.10

1. Add new module

2. Error in consumption current calculation fixed

3. Error in Momentary power failure and watch dog fixed

4. Error in program execution fixed

5. Error in memory unit fixed

6. Error in remote function fixed

7. RTC flag, setting method modified

8. Input speciation of main unit fixed

9. Contents related with XGI deleted

10. Voltage reference fixed

11. Contents related with STOP LED deleted

12. APM_SSSB modified

13. XEC-DP32H/DP64H added

Ch2.1, Ch2.2,

Ch2.3.1, Ch4.1

Ch4.3, Ch4.4

Ch5.1.2, Ch5.1.4

Ch5.2.2 Ch5.4.1

Ch6.4

Ch6.12

Ch7.2.1, Ch7.2.2

Ch10.2 Ch10.3

Ch.11

Appendix4

Ch4.1, Ch4.3

Ch7.3.4, Ch7.3.6

Appendix2

V1.6 2014.2

1. Domain Of Homepage Changed

2. Add XEC-DN32H/DC

Front/Back

Cover

Ch2.1, Ch2.2 Ch4.1, Ch4.3

Ch7.2.1, Ch7.3.3

Ch8.1.1

Appendix2

V1.7 2015.7

1. Address & phone number changed

2. Add new module

3. Vibration Specification modified

Back Cover

Ch2.1, Ch2.2,

Ch2.3.3, Ch2.3.4

Ch3.1

The number of User’s manual is indicated the right side of the back cover.

About User’s Manual

Thank you for purchasing PLC of LSIS Co.,Ltd. Before use, make sure to carefully read and understand the User’s Manual about the functions, performances, installation and programming of the product you purchased in order for correct use and importantly, let the end user and maintenance administrator to be provided with the User’s Manual.

The Use’s Manual describes the product. If necessary, you m ay refer to the following description and order accordingly. In addition, you m ay connec t our website(http://eng.lsis.biz/

) and downlo ad the information as a

PDF file.

Relevant User’s Manual

Title Description

No. of User

Manual

XG5000 User’s Manual

(XGI/XGR/XEC)

It describes how to use XG5000 software especially about online functions such as programming, printing, monitoring

and debugging by using XGB (IEC language)

10310000512

XGI/XGR/XEC Series Instruction &

Programming

It describes how to use the instructions for programming using XGB (IEC language) series.

10310000510

XGB Hardware User’s Manual (IEC

language)

It describes how to use the specification of power/input /output/expansion m odules, system configuration and built-in

High-speed counter for XGB main unit.

10310000983

XGB Analog User’s Manual

It describes how to use the specification of analog input/analog output/temperature input module, system configuration and built-in PID control for XGB main unit.

10310000920

XGB Position

User’s Manual

It describes how to use bu ilt-in positioning function for XGB

main unit.

10310000927

XGB Cnet I/F

User’s Manual

It describes how to use built-in communication function for

XGB main unit and external Cnet I/F module.

10310000816

XGB Fast Ethernet I/F

User’s Manual

It describes how to use XGB FEnet I/F module.

10310000873

◎

Contents

◎

Chapter 1 Introduction ...................................................................... 1-1~1-5

1.1 Guide to Use This Manual ...................................................................................... 1-1

1.2 Features ................................................................................................................ 1-2

1.3 Terminology ........................................................................................................... 1-4

Chapter 2 System Configuration ........................................................... 2-1~2-11

2.1 XGB System Configuration .................................................................................. 2-1

2.2 Product List .......................................................................................................... 2-2

2.3 Classification and Type of Product Name ............................................................. 2-4

2.3.1 Classification and type of main unit .......................................................................... 2-4

2.3.2 Classification and type of expansion module ........................................................... 2-5

2.3.3 Classification and type of special module ................................................................. 2-6

2.3.4 Classification and type of communication module ..................................................... 2-7

2.3.5 Classification and Type of Option Module ................................................................ 2-7

2.4 System Configuration ........................................................................................... 2-8

2.4.1 Cnet I/F system .......................................................................................................... 2-8

2.4.2 Ethernet system ........................................................................................................ 2-11

Chapter 3 General Specifications ................................................................. 3-1

3.1 General Specifications ........................................................................................... 3-1

Chapter 4 CPU Specifications ................................................................. 4-1~4-9

4.1 Performance Specifications .................................................................................. 4-1

4.2 Names of Part and Function ................................................................................. 4-3

4.3 Power Supply Specifications ................................................................................ 4-4

4.4 Calculation Example of Consumption Current/Voltage ........................................... 4-6

4.5 Battery ................................................................................................................. 4-8

4.5.1 Battery specification ................................................................................................... 4-8

4.5.2 Notice in using ............................................................................................................ 4-8

4.5.3 Life of battery .............................................................................................................. 4-8

4.5.4

How to change the battery ......................................................................................... 4-9

Chapter 5 Program Configuration and Operation Method .................. 5-1~5-28

5.1 Program Instruction .............................................................................................. 5-1

5.1.1 Program execution methods .................................................................................... 5-1

5.1.2 Operation processing during momentary power failure ........................................... 5-2

5.1.3 Scan time .................................................................................................................. 5-3

5.1.4 Scan Watchdog timer ............................................................................................... 5-4

5.2 Program Execution ............................................................................................... 5-5

5.2.1 Configuration of program .......................................................................................... 5-5

5.2.2 Program execution methods ...................................................................................... 5-5

5.2.3 Interrupt . .................................................................................................................... 5-7

5.3 Operation Mode ................................................................................................. 5-19

5.3.1 RUN mode .............................................................................................................. 5-19

5.3.2 STOP mode ............................................................................................................ 5-20

5.3.3 DEBUG mode ......................................................................................................... 5-20

5.3.4 Change operation mode ......................................................................................... 5-24

5.4 Memory ................................................................................................................ 5-25

5.4.1 Program memory .................................................................................................... 5-25

5.4.2 Data memory ............................................................................................................ 5-26

5.4.3 Data retain area setting .......................................................................................... 5-26

5.4.4 Data Memory Map .................................................................................................... 5-28

Chapter 6 CPU Functions ...................................................................... 6-1~6-24

6.1 Type Setting ......................................................................................................... 6-1

6.2 Parameter Setting ................................................................................................ 6-2

6.2.1 Basic parameter setting ............................................................................................ 6-2

6.2.2 I/O parameter setting ................................................................................................ 6-3

6.3 Self-diagnosis Function ........................................................................................ 6-4

6.3.1 Saving of error log .................................................................................................... 6-4

6.3.2 Troubleshooting ........................................................................................................ 6-4

6.4 Remote Functions .................................................................................................. 6-6

6.5 Forced Input/Output On and Off Function .............................................................. 6-7

6.5.1 Force I/O setup ......................................................................................................... 6-7

6.5.2 Processing time and method of Forced Input/Output On and Off ............................ 6-8

6.6 Direct Input/Output Operation ................................................................................ 6-9

6.7 Diagnosis of External Device ...............................................................................

6-10

6.8 Allocation of Input/Output Number .......................................................................

6-11

6.9 Online Editing ......................................................................................................

6-13

6.10 Reading Input/Outpu t Information ...................................................................... 6-16

6.11 Monitoring ........................................................................................................ 6-17

6.12

RTC function ...................................................................................................... 6-22

6.12.1 How to use ............................................................................................................ 6-22

Chapter 7 Input/Output Specifications ............................................... 7-1~7-31

7.1 Introduction .......................................................................................................... 7-1

7.2 Digital Input Specifications of Main Unit ................................................................ 7-7

7.2.1 XEC-DR32H / XEC-DN32H input unit (Source/Sink type) ......................................... 7-7

7.2.2 XEC-DR64H / XEC-DN64H input unit (Source/Sink Type) ........................................ 7-8

7.3 Digital Output Specification of Main Unit ............................................................... 7-9

7.3.1 XEC-DR32H output unit ............................................................................................. 7-9

7.3.2 XEC-DR64H output unit ........................................................................................... 7-10

7.3.3 XEC-DN32H output unit (Sink type) ......................................................................... 7-11

7.3.4 XEC-DP32H output unit (Source type) .................................................................... 7-12

7.3.5 XEC-DN64H output unit (Sink type) ......................................................................... 7-13

7.3.6 XEC-DP64H output unit (Source type) .................................................................... 7-14

7.4 Digital Input Module Specification ....................................................................... 7-15

7.4.1 8 point DC24V input module (Source/Sink type) .................................................... 7-15

7.4.2 16 point DC24V input module (Sink/Source type) .................................................. 7-16

7.4.3 32 point DC24V input module (Source/Sink type) ................................................... 7-17

7.5 Digital Output Module Specifications .................................................................. 7-18

7.5.1 8 point relay output module ...................................................................................... 7-18

7.5.2 16 point relay output module .................................................................................... 7-19

7.5.3 8 point transistor output module (Sink type) ............................................................ 7-20

7.5.4 16 point transistor output module (Sink type) .......................................................... 7-21

7.5.5 32 point transistor output module (Sink type) .......................................................... 7-22

7.5.6 8 point transistor output module (Source type) ........................................................ 7-23

7.5.7 16 point transistor output module (Source type) ...................................................... 7-24

7.5.8 32 point transistor output module (Source type) ...................................................... 7-25

7.6 Combined Module Digital Input Specification ....................................................... 7-26

7.6.1 8 point DC24V input part (Source/Sink type) ........................................................... 7-26

7.7 Combined Module Digital Output Specification ..................................................... 7-27

7.7.1 8 point relay output part ........................................................................................... 7-27

7.8 IO Wiring by Using Smart Link Board ................................................................... 7-28

7.8.1 Smart link board ..................................................................................................... 7-28

Chapter 8 Built-in High-speed Counter Function .............................. 8-1~8-32

8.1 High-speed Counter Specifications ........................................................................ 8-1

8.1.1 Performance specifications ...................................................................................... 8-1

8.1.2 Designation of parts .................................................................................................. 8-2

8.1.3 Counter Function ........................................................................................................ 8-4

8.2 Installation and Wiring ........................................................................................ 8-21

8.2.1 Precaution for wiring ............................................................................................... 8-21

8.2.2 Example of wiring ................................................................................................... 8-21

8.3 Internal Memory ................................................................................................. 8-22

8.3.1 Special area for High-speed counter ...................................................................... 8-22

8.3.2 Error code ............................................................................................................... 8-27

8.4 Examples: Using High-speed Counter ................................................................ 8-28

Chapter 9 Installation and Wiring ........................................................ 9-1~9-18

9.1 Safety Instruction ................................................................................................. 9-1

9.1.1 Fail safe circuit .......................................................................................................... 9-3

9.1.2 PLC heat calculation .................................................................................................. 9-6

9.2 Attachment/Detachment of Modules ..................................................................... 9-8

9.2.1 Attachment/Detachment of modules ....................................................................... 9-8

9.2.2 Caution in handling .................................................................................................. 9-13

9.3 Wire ..................................................................................................................... 9-14

9.3.1 Power wiring ............................................................................................................. 9-14

9.3.2 I/O Device wiring ...................................................................................................... 9-17

9.3.3 Grounding wiring ...................................................................................................... 9-17

9.3.4 Specifications of wiring cable ................................................................................... 9-18

Chapter 10 Maintenance .................................................................... 10-1~10-2

10.1 Maintenance and Inspection ............................................................................. 10-1

10.2 Daily Inspection ................................................................................................ 10-1

10.3 Periodic Inspection ........................................................................................... 10-2

Chapter 11 Troubleshooting ............................................................ 11-1~11-12

11.1 Basic Procedure of Troubleshooting ................................................................. 11-1

11.2 Troubleshooting .................................................................................................. 11-1

11.2.1 Troubleshooting flowchart used with when the PWR(Power) LED turns Off. ........ 11-2

11.2.2 Troubleshooting flowchart used with when the ERR(Error) LED is flickering ....... 11-3

11.2.3 Troubleshooting flowchart used with when the RUN,STOP LED turns Off. ......... 11-4

11.2.4 Troubleshooting flowchart used with when the I/O part doesn’t operate norm all y..11-5

11.3 Troubleshooting Questionnaire ......................................................................... 11-7

11.4 Troubleshooting Examples ............................................................................... 11-8

11.4.1 Input circuit troubles and corrective actions ......................................................... 11-8

11.4.2 Output circuit and corrective actions ...................................................................... 11-9

11.5 Error Code List .................................................................................................. 11-11

Appendix 1 Flag List ............................................................. App. 1-1~App.1-8

Appendix 1.1 Special Relay (F) List ..................................................................... App. 1-1

Appendix 1.2 Communication Relay (L) List ........................................................ App. 1-5

Appendix 1.3 Network Register (N) List .............................................................. App. 1-8

Appendix 2 Dimension ............................................................. App.2-1~App.2-4

Appendix 3 Compatibility with GLOFA ................................... App.3-1~App.3-7

Appendix 4 Instruction List ................................................... App.4-1~App.4-13

Appendix 4.1 Basic Function ................................................................................. App.4-1

Appendix 4.2 MK(MASTER-K) Function ............................................................. App.4-10

Appendix 4.3 Array Operation Function ............................................................. App.4-10

Appendix 4.4

Basic Function Block................................................................... App.4-11

Chapter 1 Introduction

1.1 Guide to Use This Manual

This manual includes specifications, functions and handling instructions for the XGB series PLC. This manual is divi ded up into chapters as follows.

No. Title Contents

Chapter 1 Introduction

Describes configuration of this manual, unit’s features and

terminology.

Chapter 2 System Configurations

Describes available units and system configuration in the XGB series.

Chapter 3 General Speci ficati on s

Describes general specifications of units used in

the XGB

series.

Chapter 4 CPU Specifications

Describes performances, specifications and operations.

Chapter 5

Program

Configuration and

Operation Method

Chapter 6 CPU Module Functions

Chapter 7 Input/Output Specifications Describes operation of basic and input/output.

Chapter 8

Built-in High-speed Cou nter

Function

Describes built-in high-speed counter functions.

Chapter 9 Installation and Wiring

Describes installation, wiring and handling instructions for reliability of the PLC system.

Chapter 10

Maintenance

Describes the check items and method for long-

term normal

operation of the PLC system.

Chapter 11

Troubleshooting Describes various operation errors and corrective actions.

Appendix 1 Flag List Describes the types and contents of various flags.

Appendix 2 Dimension Shows dimensions of the main units and expansion modules.

Appendix 3

Compatibility with

GLOFA

Describes the compatibility with GLOFA.

Appendix 4 Instruction List Describes the special relay and instruction list.

1-1

Chapter 1 Introduction

1.2 Features

The features of XGB system are as follows.

(1) The system secures the following high performances.

(a) High Processing Speed (b) Max. 384 I/O control supporting small & mid-sized system implement ation

Item Specification Reference

Operation processing speed

83ns / Step -

Max IO contact point 384 points Program capacity 200KB -

Max. no. of expanded base

10 stages -

(2) Compact : the smallest size comparing to the same class model of competitors.

(a) Compact panel realiz ed thr ough the smallest size.

Item Type Size (W * H * D)

Reference

Main unit

XEC-Dx32H 114 * 90 * 64 XEC-Dx64H 180 * 90 * 64

Extension module XBE-,XBF-,XBL- 20 * 90 * 60 Basis of minimum size

(3) Easy attachable/extensible system for improved user convenience.

(a) Easy attachable to European terminal board and convenient-to-use MIL connector method improving

convenient wirin g. (“S” type main unit and expanded module)

(b) By adopting a removable terminal block connector (M3 X 6 screw), convenience of wiring may be

increased.

(4) Improved maintenance ability with kinds of regis ter, built-in RTC (“H” type), comment backup and etc

(a) Convenient programmin g envir onment by p rovidin g analogu e regi ster, array and structure.

(b) Improved maintenance ability by operating plural programs and task program through module program. (c) Built-in Flash ROM enabling permanent backup of program without any separate battery. (d) Improved mainte nance ability by ty pes o f comme nt ba ckup. (e) Built-in RTC function enabling convenient history and schedul e manage ment

1-2

Chapter 1 Introduction

(5) Optimized communication environment.

(a) With max. 2 channels o f built-in COM (excl. lo ade r) , up to 2 channel communication is available withou t

any expanded of module.

(b) Supporting various p rotocol s to improv e the conveni en ce (leaseddedicated, Modbus, user-defined

communication)

Cnet, Enet and etc). (d) Convenient network-diagnostic function through network & communication frame monitoring. (e) Convenient networking to upper systems through Enet or Cnet. (f) High speed p rogr am upload and download by USB P or t

(6) Applications expanded with a variety of I/O modules.

(a) 8, 16, 32 points modules provided (if relay output, 8/16 points module). (b) Single input, single output and combined I/O modules supported.

(7) Applications expanded through analogue-exclusive dedicated register de sign and ful l attachable

mechanism.

(a) All analogue modules can be attachable on extension base. (H type: up to 10 racks stages available) (b) W ith anal ogue exclusive dedicated re gister(U) and monitor ing exclusive dedicated function, convenient

use for I /O is maximize d (can design ate operations using eas y programming of U area and moni toring function)

(8) Integrated programming environment

(a) XG 5000: intensified progr am conveni en ce, diver se monito ring, dia gnosi s and editin g functi on (b) XG - PD: COM/network parameters setting, frame monitoring, protocol analysis function

(9) Built-in high speed counter function

(a) Providing high High-speed counter 1phase, 2phase and more additional func tions. (b) Providing parameter setting, diverse moni tori ng and diagno sis fun ction using XG500 0. (c) Moni torin g func tio n in X G500 0 ca n insp ect w ith out pro gram , ins pect ing ex ter nal w iring, data sett ing a nd

others.

(마침표)

(10) Built-in position control function

(a) Supporting max 100Kpps 2 axes. (b) Providing parameter setting, operation data collection, diverse monitoring and diagnosis by using

XG5000.

setting.

1-3

Chapter 1 Introduction

(11) Built-in PID

(a) Supporting max. 16 loops. (b) Setting parameters by using XG5000 and supporting loop status monitoring conveniently with trend

monitor. (c) Control constant setting through the improved automatic Auto-tuning function. (d) With many other additional functions including PWM output, ∆MV, ∆PV and SV Ramp, improving the

control preciseness. (e) Supporting types of cont rol m odes suc h as for ward/ back ward m ix ed o perat ion, 2-stage SV PID control,

cascade control and etc . (f) A variety of warning functions such as PV MAX and PV variation warning securing the safety.

1.3 Terminology

The following table gives defin ition o f terms u sed in this manu al.

Terms Definition Remark

Module

A standard element that has a specifie d function which configures the system . Devices suc h as I/O b oard, whic h inserted onto the mother board.

Example)

Expansion module, Special module, Communication

module

Unit

A single module or group of modules that perform an

independent operation as a part of PLC systems.

Example)

Main unit, Expansion unit

PLC System

A system which consists of the PLC and peripheral devices. A user program can control the system.

XG5000

A program and debugging tool for the MAS TER-K series. It executes program creation, edit, compile and debu gging. (PADT: Programming Added De bugging Tool)

XG - PD

Software to execute descrip tion, ed ition of basic par ameter, high

speed link, P2P parameter, and function of communication

diagnosis

I/O image area

Internal m emor y area of the CPU m odule wh ich used to hold I/O status.

Cnet Computer Network FEnet Fast Ethernet Network Pnet Profibus-DP Network Dnet DeviceNet Network -

RTC

Abbreviation of ‘Real Time Clock’. It is used to call general IC that contains clock function.

Watchdog Timer

Supervisors t he pre-set execut i on times of progr ams and warns if a program is not competed within the pre-set time.

1-4

Chapter 1 Introduction

Terms Definition Remark

Sink Input

Current flows from the switch to the PLC input terminal if a in put signal turns on.

Z: Input impedance

Source Input

Current flows from the PLC input terminal to the switch after a input signal turns on.

Sink Output

Current flows from the load to the output terminal and the PLC output turn on.

Source Output

Current flows from the output term inal to the load and the PLC output turn on.

−

Output

Contact

1-5

Chapter 2 System Configuration

The XGB series has suitable to configuration of the basic, computer link and network systems. This chapter describes the configuration and features of each system.

2.1 XGB System Configuration

XGB series System Conf iguration is as f ollows. Expanded I/O module an d special module are available to connect maximum 7 stages for “S” type and 10 stag es for “H” type. Expanded communication m odule is available to connect maximum 2 stages.

Item Description

Total I/O points

• XEC-DxxxH : 32~384 points

Maximum number of expansion modules

Digital I/O module

•

Max. 10

Special module

•

Max. 10

Comm. I/F module

•

Maximum 2

Items

Main unit

• refer to 2.2 Product List

Expansion module

Digital I/O module

Special module

Communication I/F

module

Option

module

Memory module

* XG5000 V3.0 or above is required for XEC

Main Unit

I/O Module

Special Module

Communication Module

2-1

Chapter 2 System Configuration

2.2 Product List

XGB series’ product list is as follows.

Types Model Description Remark

Main Unit

XEC-DR32H AC 100V~220V power, DC24V input 16 points, relay output 16 points

XEC-DN32H AC 100V~220V power, DC24V input 16 points, TR output 16 points

XEC-DN32H/DC DC 24V power, DC24V input 16 points, TR output 16 points

XEC-DR64H AC 100V~220V power, DC24V input 32 points, relay output 32 points

XEC-DN64H AC 100V~220V power, DC24V input 32 points, TR output 32 points

XEC-DR32H/D1 DC 12/24V power, DC12V input 16 points, relay output 16 points XEC-DR64H/D1 DC 12/24V power, DC12V input 32 points, relay output 32 points

Digital I/O module

XBE-DC08A DC24V Input 8 point

XBE-DC16A DC24V Input 16 point

XBE-DC32A DC24V Input 32 point

XBE-RY08A Relay output 8 point

XBE-RY08B Relay output 8 point (independent point) XBE-RY16A Relay output 16 point

XBE-TN08A Transistor output 8 point

XBE-TN16A Transistor output 16 point

XBE-TN32A Transistor output 32 point

XBE-TN64A Transistor output 64 point (sink type)

XBE-TP16A Transistor output 16 point (source type)

XBE-TP32A Transistor output 32 point (source type)

XBE-DR16A DC24V Input 8 point, Relay output 8 point

Special Module

XBF-AD04A Current/Voltage input 4 channel

Analog

ln/Out

XBF-AD04C Current/Voltage input 4 channel, High resolution XBF-AD08A Current/Voltage input 8 channel

XBF-DC04A Current output 4 channel

XBF-DC04C Current output 4 channel, High resolution

XBF-DV04A Voltage output 4 channel XBF-DV04C Voltage output 4 channel, High resolution

XBF-AH04A Current/Voltage input 2 channel, Current/Voltage output 2 channel, XBF-RD04A RTD (Resistance Temperature Detector) input 4 channel

Temperat

ure

XBF-RD01A RTD (Resistance Temperature Detector) input 1 channel XBF-TC04S TC (Thermocouple) input 4 channel XBF-PD02A Position 2Axis, Line Drive type Position XBF-HD02A High Speed Counter 2 channel, Line Drive Type

Counter

XBF-HO02A High Speed Counter 2 channel, Open Collector Type

XBF-TC04RT

Temperature controller module (RTD input, 4 roof)

Temperat

ure

XBF-TC04TT

Temperature controller module (TC input, 4 roof)

2-2

Chapter 2 System Configuration

Types Model Description Remark

Communication

Module

XBL-C21A Cnet (RS-232C/Modem) I/F XBL-C41A Cnet (RS-422/485) I/F -

XBL-EMTA Enet I/F -

XBL-EIMT RAPIEnet I/F 2 UTP cable

XBL-EIPT EtherNet I/P Module

XBL-CMEA CANopen MasterI/F -

XBL-CSEA CANopen Slave I/F -

XBL-PMEC Pnet I/F -

Option module

XBO-M1024A Memory module -

Download

Cable

PMC-310S

Connection cable (PC to PLC), 9pin(PC)-6pin(PLC) -

USB-301A Connection cable (PC to PLC), USB -

Download Cable (PMC-310S) Diagram

Note

2-3

Chapter 2 System Configuration

2.3 Classification and T ype of Product Name

2.3.1 Classification and type of main unit

Name of main unit is classified as follows.

Classification Name DC input Relay output Transistor output Power

Module type Main unit

XBM-DR16S 8 point 8 point None

DC24V

XBM-DN16S 8 point None 8 point XBM-DN32S 16 point None 16 point

Compact type Main unit (MK language)

XBC-DR32H 16 point 16 point None

AC110V~220V

XBC-DN32H 16 point None 16 point XBC-DR64H 32 point 32 point None XBC-DN64H 32 point None 32 point XBC-DR32H/DC 16 point 16 point None

DC24V

XBC-DN32H/DC 16 point None 16 point XBC-DR64H/DC 32 point 32 point None XBC-DN64H/DC 32 point None 32 point

Compact type main unit (IEC language)

XEC-DR32H

16 point 16 point None

AC110V~220V

XEC-DN32H

16 point None 16 point

XEC-DR64H

32 point 32 point None

XEC-DN64H

32 point None 32 point

XEC-DP32H

16 point None 16 point

XEC-DP64H

32 point None 32 point

XEC-DR32H/D1

16 point 16 point None

DC 12/24V

XEC-DR64H/D1

32 point 32 point None

X B M

D R X X S

Relay output (R) Sink type transistor output (N) Source type transistor output (P)

No. of IO point

XGB PLC standard (S) XGB PLC High-end type (H)

XGB PLC

Module type main unit (M) Compact type main unit(C)

DC input

MK language supported (B) IEC language supported (E)

2-4

Chapter 2 System Configuration

2.3.2 Classification and type of expansion module

Name of expansion module is classified as follows.

Name DC input Relay output Transistor output Reference

XBE-DC08A

8 point None None

XBE-RY08A/B

None 8 point None

XBE-TN08A

None None 8 point (Sink type)

XBE-TP08A

None None 8 point (Source type)

XBE-DC16A/B

16 point None None

XBE-RY16A

None 16 point None

XBE-TN16A

None None 16 point (Sink type)

XBE-TP16A

None None 16 point (Source type)

XBE-DR16A

8 point 8 point None

XBE-DC32A

32 point None None

XBE-TN32A

None None 32 point (Sink type)

XBE-TP32A

None None 32 point (Source type)

X B E

DC X X A

Relay output(RY) Transistor output (TN/TP) Digital input (DC) Digital input+ sink type transistor output (DN) Digital input+ source type transistor output (DP) Digital input + relay output (DR)

No. of IO point

XGB series

I/O expansion module

2-5

Chapter 2 System Configuration

2.3.3 Classification and type of special module

Special module is classified as follows.

Classification Name

No. of

input ch.

Input type

No. of

output ch.

Output type

Analog input

XBF-AD04A 4 Voltage/Current None XBF-AD08A 8 Voltage/Current None

Analog output

XBF-DC04A None - 4 Current XBF-DC04B None - 4 Current XBF-DV04A None - 4 Voltage XBF-AH04A 2 Voltage/Current 2 Voltage/Current

RTD input

XBF-RD04A 4 PT100/JPT100 None XBF-RD01A 1 PT100/JPT100 None -

TC input

XBF-TC04S 4 K, J, T, R None -

XBF-TC04RT 4 PT100/JPT100 4 Transister

XBF-TC04TT 4 K, J, T, R 4 Transister

Positioning

module

XBF-PD02A - Line Driver 2 Voltage

High Speed

Counter

XBF-HD02A 2 Line Driver XBF-HO02A 2 Open Collector

X B F

AD X X A

Analog input (AD) Analog voltage output (DC) Analog current output (DV) Analog combined module (AH) RTD input (RD) Thermocouple input (TC) Line driver positioning module (PD)

No. of IO point

XGB series

Expansion special module

Non-insulation type (A)

Insulation type (S)

2-6

Chapter 2 System Configuration

2.3.4 Classification and type of communication module

Name of communication module is classified as follows.

Classification Name Type

Cnet Comm. Module

XBL-C21A RS-232C, 1 channel XBL-C41A RS-422/485, 1 channel

FEnet Comm. Module XBL-EMTA Electricity, open type Ethernet

RAPIEnet Comm. Module

XBLEIMT/EIMF/EIMH

Comm. Module between PLCs, electric media, 100 Mbps industrial Ethernet supported

EtherNet Comm. Module XBL-EIPT Open EtherNet I/P

CANopen Comm. Module

XBL-CMEA CANopen Master XBL-CSEA CANopen Slave

Pnet Comm. Module XBL-PMEC Profibus-DP

2.3.5 Classification and Type of Option Module

Name of option module is classified as follows.

Classification Name Type

Memory module XBO-M1024A Memory module : 1,024 KB

X B L - C21A

Cnet 1 channel (RS-232C): C21A Cnet 1 channel (RS-422/485): C41A FEnet 1 channel: EMTA RAPIEnet 1 channel: EIMT

XGB series

Expansion communication module

X B O - M1024A

Memory module : 1,024 KB

XGB series

Option module

2-7

Chapter 2 System Configuration

2.4 System Configuration

2.4.1 Cnet I/F system

Cnet I/F System is used for communication between the main unit and external devices using RS-

232C/RS-422 (485) Int erface. The XGB ser ies has a built-in RS-232C port, R S-485 port and has also XBL-C21A for RS-232C , XBL-C4 1A for R S-422/485. I t is pos sible to c onstruct c omm unication s ystems on demand.

(1) 1:1 communication system

(a) 1:1 communication of an external device (computer) with main unit using a built-in port

(RS-232C/RS-485)

(b) 1:1 communication wit h main unit using a built-in RS-485 port

(In case of built-in RS-232C,it is for connecting to HMI device.)

Built-in RS-232C Connection

PADT connection

Built-in RS-485 Connection RS-232C / RS-485

XEC-DR32H

XP30-TTA

2-8

Chapter 2 System Configuration

(d) 1:1 communication of an external device (monito ring unit) with main unit using a built-in RS-

232C/485 port.

Modem

XBL-C21A XEC-DR32H

Modem

XBL-C21A XEC-DR32H

Built-in RS-232C/485 connection

XP30-TTA

XEC-DR32H

2-9

Chapter 2 System Configuration

(2) 1:n Communication system

(a) Using RS-485 built-in function can connect between one computer and multiple main units for up to 32 stations.

(b) Using RS-485 built-in function/expansion Cnet I/F module can be connect for up to 32 stations.

1) Refer to ‘XGB Cnet I/F user manual’ for details

Note

Max. 32 stations available

PADT connection

Built-in RS-232C connection

XEC-DN32H

Max. 32 stations available

XEC-DN32H

PADT connection

Built-in RS-232C connection

XBL-C41A XEC-DN32H

Max. 32 stations available

2-10

Chapter 2 System Configuration

Hub

Router or

Gateway

Router or

Gateway

Public line

2.4.2 Ethernet system

Ethernet made b y cooperation of Xerox, Intel, DEC is standard LAN c onnection method (IEEE802.3) , which is network connection system using 1.5KB packet with 100Mbps transmission ability. Since Ethernet can combine a variety of computer by network , it is called as standard specification of LAN and diverse products. By adopting CSMA/CD m ethod, it is easy to configure the network and collect large capacity data.

1) Refer to ‘XGB FEnet I/F user manual’ for details

Note

100Base-TX

HMI

2-11

Chapter 3 General Specifications

3.1 General Specifications

The General specification of XGB series is as below.

No. Items Specifications Related standards

Ambient

temperature

0 ~ 55 °C

Storage

temperature

−25 ~ +70 °C

Ambient humidity

5 ~ 95%RH (Non-condensing)

Storage

humidity

5 ~ 95%RH (Non-condensing)

Vibration

resistance

Occasional vibration

Frequency

Acceleration

Amplitude

times

IEC61131-2

5 ≤ f < 8.4Hz

−

3.5mm

10 times each

directions

(X, Y and Z)

8.4 ≤ f ≤ 150Hz

9.8m/s2 (1G)

−

Continuous vibration

Frequency

Acceleration

Pulse width

5 ≤ f < 8.4Hz

−

1.75mm

8.4 ≤ f ≤ 150Hz

4.9m/s2 (0.5G)

−

Shock

resistance

• Peak acceleration: 147 m/s

(15G)

• Duration: 11ms

•

Half-sine, 3 times each direction per each axis

Noise

resistance

Square wave

Impulse noise

AC: ±1,500 V DC: ±900 V

LSIS standard

Electrostatic

discharge

4kV (Contact discharge)

IEC61131-2

IEC61000-4-2

Radiated

electromagnetic

field noise

80 ~ 1,000 MHz, 10V/m

IEC61131-2,

IEC61000-4-3

Fast

transient/bust

noise

Segment

Power supply

module

Digital/analog input/output

communication interface

IEC61131-2

IEC61000-4-4

Voltage

2kV

1kV

Environment

Free from corrosive gasses and excessive dust

Altitude

Up to 2,000 ms

Pollution

degree

2 or less

Cooling

Air-cooling

1) IEC (International Electrotechnical Commission) :

An international civil community that promotes international cooperation for standardization of electric/ electro technology, publishes international standard and operates suitability assessment system related to the above.

2) Pollution Degree :

An index to indicate the pollution degree of used environment that determines the insulation performance of the device. For example, pollution de gree 2 means the state to occur the pollution of non-electric conducti vity generally, but the state to occ ur temporary electric conductio n according to the formation of dew.

Notes

3-1

Chapter 4 CPU Specifications

4.1 Performance Specifications

The following table shows the general specifications of the XGB main module type

Items

Specifications

Remark

XECDR32H(/D1)

XECDR64H(/D1)

XECDN32H(/DC)

XECDN64H

XECDP32H

XECDP64H

Numb

er of

instruc tions

Operator 18 Basic function 136 + Real number operation function Basic function block 43

Dedicated function block

Special function dedicated function

Processing speed

Basic instruction : 0.083 ㎲/step Program memory capacity 200KB (XEC 200KB corresponds to XGI 110KB) Max. I/O points 352 384 352 384 352 384

Data memory

Automatic variable (A)

32KB (Max. 16KB retain set ting avai lable )

Input variable (I) 2 KB (%IX15.15.63) Output variable (Q) 2 KB (%QX15.15.63)

Direct variable

M 16KB (Max. 8KB retain setting available) R 20KB (1block) W 20KB Same area with R

Flag variable

F 2KB System flag K 8KB Built-in special flag L 4KB High speed link flag N 10KB P2P flag

U 1KB Analog flag Flash area 20KB, 2 block R device used Timer No limit to the number of point (time range: 0.001s ~ 4,294,967,295s)

20 byte automatic

variable area

occupied per r point

Counter No limit to the number of point (count range: 64 bit expression range) Operation mode RUN, STOP, DEBUG

Restart mode Cold, Warm

Total number of program block

128

Task

Initialization 1 Fixed period 8 External input 8 (%IX0.0.0 ~ %IX0.0.7) Internal devi ce 8

Self diagnosis Detecting operation delay , memory error, I/O error

Data reserved in case of power cut

Setting retain area at basic parameter

Number of max. extension stage

10 stage

Internal consumption current

660mA 1,040mA 260mA 330mA 300mA 380mA

Weight 600g 900g 500g 800g 500g 800g

4- 1

Chapter 4 CPU Specifications

Items Specifications Remark

Built-in function

PID control function

Controlled by instructions, Auto-

tuning, PWM output, Manual output,

Adjustable operation scan time, Anti Windup, Delta MV function, SV-

Ramp function

Cnet I/F function

Dedicated protocol support

MODBUS protocol support RS-232C 1 port User defined protocol support RS-485 1 port

High-speed counter

Capacity

AC type

1 phase: 100 kHz 4 channel, 20kHz 4 channel 2 phase: 50 kHz 2 channel, 10kHz 2 channel

D1 type

1 phase : 100 kHz 4 channel, 10 kHz 4 channel

2 phase : 50 kHz 2 channel, 5 kHz 2 channel

Counter

mode

4 different counter modes according to input pulse and

addition/subtraction method

• 1 phase pulse input: addition/subtraction counter

• 1 phase pulse input: a

ddition/subtraction counter by B

phase

• 2 phase pulse input: addition/subtraction counter

• 2 phase pulse input: addition/subtraction by

phase differences

Additional

function

• Internal/External preset function

• Latch counter function

• Comparison output function

• Revolution number per unit time function

Positioning function

Basic function

No. of control axis: 2 axes Control method: position/speed control Control unit: pulse Positioning data: 80 data/axis

(operation step No. 1~80) Operation mode: End/Keep/Continuous Operation method: Single, Repeated operation

TR output type

support

Positioning

function

Positioning method: Absolute / Incremental Address range: -2,147,483,648 ~ 2,147,483,647 Speed: Max. 100Kpps(setting range 1 ~ 100,000pps) Acceleration / Deceleration method : trapezoidal method

Return to Origin

Origin detection when approximate origin turns off Origin detection when approximate origin turns on

Origin detection by approximate origin.

JOG operation

Setting range: 1~100,00 0 ( Hi gh / Low spee d )

Additional

function

Inching operation, Speed synchronizing operation, Position

synchronizing operation, linear interpolation operation etc.

Pulse catch

10㎲ 4 points (%IX 0.0.0~%IX0.0.3), 50㎲ 4points ( %IX0.0.4 ~ %IX0.0.7)

External interrupt

10㎲ 4points (%IX 0.0.0~%IX0.0.3), 5 0㎲ 4 points (%I X0.0.4

~ %IX0.0.7)

Input filter Select among 1,3,5,10,20,70,100 ㎳ (Adjustable)

4- 2

Chapter 4 CPU Specifications

4.2 Names of Part and Function

XGB Compact type main unit (IEC language)

No. Name Description

①

Input indicator LED

▪ Input indicator LED

②

PADT connecting connector

▪

PADT connecting USB (USB 1.1 supported) 1 channel,

RS-232C 1 channel connector

③

Input connector and terminal block

▪ Input connector and terminal block

④

Output connector and terminal block

▪ Output connector and terminal block

⑤

Key switch

▪

RUN / STOP Key switch In case of STOP mode, Remote mode changeable.

⑥

Output indicator LED ▪ Output indicator LED

⑦

Status indicator LED

It indicates CPU module’s status.

▪ PWR(Red): Power status ▪ RUN(Green): RUN status

STOP mode: Off/ RUN mode : On

▪

Error(Red): In case of error, it is flickering.

⑧

8-1

Built-in RS-232C

/ RS-485 Connecting

connector

 Built-in RS-485 connecting connector

“+” , “-“ terminal connecting connector in RS-485 communication ▪ Built-in RS-232C connecting connector

“TxD” , “RxD“ , “GND” connecting connector in RS-232C

8-2

Power supply connector

▪ AC100~240V power supply connector

⑨

Battery holder

▪ Battery (3V) holder

⑩

Mode switch

▪ Program mode and O/S download mode select switch

①

②

④

⑤

⑥

③

⑦

8-1

8-2

⑨

⑩

4- 3

Chapter 4 CPU Specifications

4.3 Power Supply Specificat ions

Describes power specification of main unit

Items

Specification

XEC-DR32H XEC-DN32H

XEC-DP32H

XEC-DR64H XEC-DN64H

XEC-DP64H

XEC-

DN32H/DC

XEC-

DR32H/D1

XEC-

DR64H/D1

Input

Rated voltage

(UL warranty voltage)

AC 100 ~ 240 V DC24V DC 12/24V

Input voltage range

AC85~264V(-15%, +10%)

DC19.2~28.8V (-20%,+20%)

DC 9.5~30V

Inrush current 50APeak or less

50APeak or less

Input current

AC 220V : 0.5A or less, AC 110V : 1A or less

0.7A or less

DC 12V :

1.4 A or less DC 24V :

0.7 A or

less

DC 12V :

2.1 A or less DC 24V :

1.0 A or

less

Efficiency

65% or more

60% or more

Permitted momentary

power failure

Less than 10 ㎳

DC 12V : less than 2

㎳ DC 24V : less than 10

㎳

Output

Rated

output

DC5V

DC24V

0.4A

0.6A - -

Output voltage ripple

DC5V (±2%) DC4.9~5.15V

Power supply status indication

LED On when power supply is normal

Cable specification

0.75 ~ 2 mm2

* Use the power supply which has 4 A or more fuse for protecting power supply.

4- 4

Chapter 4 CPU Specifications

(1) Consumption current (DC 5V)

Type Model

Consumption current (Unit : ㎃)

Main unit

XEC-DR32H

660

XEC-DR64H

1,040

XEC-DN32H 260

XEC-DN64H

330

XEC-DP32H

300

XEC-DP64H

380

XEC-DR32H/D1 660 XEC-DR64H/D1 1,040

Expansion I/O module

XBE-DC32A 50

XBE-DC16A/B 40

XBE-DC08A 30 XBE-RY16A 440

XBE-RY08A/B 240

XBE-TN32A 80 XBE-TN16A 60

XBE-TN08A 50

XBE-TP32A 80 XBE-TP16A 60 XBE-TP08A 50

XBE-DR16A 250

Expansion special module

XBF-AD04A 120 XBF-DV04A 110 XBF-DC04A 110

XBF-DC04B 110 XBF-RD04A 100

XBF-RD01A 100

XBF-TC04S 100 XBF-PD02A 500 XBF-AH04A 120 XBF-AD08A 105

Expansion communication module

XBL-C21A 120

XBL-C41A

120

XBL-EMTA 300

XBL-EIMT 290

XBL-EIPT 290

Memory module XBO-M1024A 40

4- 5

Chapter 4 CPU Specifications

4.4 Calculation Example of Consumption Current/Voltage

Calculate the consumption current and configure the system not to exceed the output current capacity of

main unit.

(1) XGB PLC configuration example 1 Consumption of current/voltage is calculated as follows.

Type Model Unit No.

Internal 5V

consumption

current

(Unit : ㎃)

Remark

Main unit XEC-DN32H 1 260

In case contact points are On.

(Maximum consumption current)

Expansion module

XBE-DC32A 2 50 XBE-TN32A 2 80 XBF-AD04A 1 120

All channel is used.

(Maximum consumption current)

XBF-DC04A 1 110

XBL-C21A 1 120

Consumption current

870 ㎃

Consumption voltage

4.35 W

0.87A ⅹ 5V = 4.35W

In case system is configured as above, since 5V consumption current is total 870 mA and 5V output of XGB 32 points main unit is maximum 2A, normal system configuration is available.

(2) XGB PLC configuration example 2

Type Model Unit No.

Internal 5V

consumption

current

(Unit : ㎃)

Remark

Main unit XEC-DR32H 1 660

In case all contact points are On.

(Maximum consumption current)

Expansion module

XBE-DR16A 5 250 XBE-TN32A 2 80 XBF-AD04A 1 120

All channel is used.

(Maximum consumption current)

XBL-C21A 1 120

Consumption current

2,310mA -

Consumption voltage

11.55W 2.31 * 5V = 11.55W

If system is configured as above, total 5V current consumption is exceeded 2,310mA and it exceeds the 5V output of XGB 32 points main unit. Normal system configuration is not available. Although we assume the above example that all contact points are on, please use 64 points main unit which 5V output capacity is higher than standard type main unit.

4- 6

Chapter 4 CPU Specifications

(3) XGB PLC configuration example 3

Type Model Unit No.

Internal 5V

consumption

current

(Unit : ㎃)

Remark

Main unit XEC-DR64H 1 1,040

In case of all contact points are

On.

(Maximum consumption current)

Expansion module

XBE-DR16A 5 250 XBE-TN32A 2 80 XBF-AD04A 1 120

All channel is used.

(Maximum consumption current)

XBL-C21A 1 120

Consumption current

2,690mA -

Consumption voltage

13.45W

2.69A ⅹ 5V = 13.45W

The above system is an example using XEC-DR64H, 64 points main unit, about system (2). Unlike (2) example, 5V output capacity of XEC-DR64H is maximum 3A, normal configuration is available.

Remark

Calculating of consum ption current is based on m aximum consum ption current. In app lication system ,

the consumption current is consumed less than above calc ulat ion.

4- 7

Chapter 4 CPU Specifications

4.5 Battery

Battery is inserted in XGB PLC compact main unit (XEC-DR32/64H, XEC-DN32/64H, XEC-DP32/64H)

4.5.1 Battery specification

Item

Specification

Voltage/Current

DC 3V / 220 mAh

Warranty period

3 years (ambient temp.)

Purpose

Program and data backup, RTC operation in case of power failure

Specification

Manganese Dioxide lithium battery

Dimension (mm)

φ 20 X 3.2 mm

4.5.2 Notice in using

(1) Do not heat the battery or solder the polarity. ( It may cause the reduction of life.) (2) Do not measure the voltage or short with tester. (It may cause the fire.) (3) Do not disassemble the battery.

4.5.3 Life of battery

Life of battery depends on the power failure time and ambient temperature etc.. If battery is getting low, main unit cause the warning, ‘battery voltage low warn ing ’. The user can check it by error LED, flag and error message of XG5000. Since battery works properly for long time, after battery voltage low warning, so the user can take the action after batter y voltage lo w warning occurred.

4- 8

Chapter 4 CPU Specifications

4.5.4 How to change the battery

The user should change the battery used to save the program and backup the data in case of power failure periodically. Though the user eliminate the battery, it works for 30 minute by super capacitor. Change the battery as fast as possible.

Sequence changing battery is as follows.

Start of battery change

Open battery cover

Pick up using battery from holder and

disassemble the connector

Insert new battery and connect to

connector with proper direction

Check the LED whether ERR LED is off

ERR LED off?

Battery malfunction

Yes

Complete

4- 9

Chapter 5 Program Configuration and Operation Method

5.1 Program Instruction

5.1.1 Program execution methods

(1) Cyclic operation method (Scan)

This is a basic program pro ceeding met hod of PLC that perfo rms the oper ation repe atedly for the pr epared program from the beginning to the last step, which is called ‘program scan’. The series of processing like this is called ‘cyclic operation method’. The processing is divided per stage as below.

Stage Processing description

 A s tage to start the scan processing which is executed once

when power is applied or Reset is executed, as below.

Self-diagnosis execution Data clear Address allocation of I/O module and type register

 If initializing task is designated, Initializing program is executed.

 Reads the state of input module and saves it in input image

area before starting the operation of program.

 Perform s the operation in order fr om the program start to las t

step.

 Performs the operation in order from the program start to last step.



A processing stage to return to the first step after CPU module

completes 1 scan processing an d the processing p erformed is as below.

Update the current value of t imer and co unter et c. User event, data trace service Self-diagnosis High speed link, P2P e-Service Check the state of key switch for mode setting

Start

Initialization processing

Input image area refresh

Program operation processing

Program start

Program last step

Output image area refresh

END

5 - 1

Chapter 5 Program Configuration and Operation Method

(2) Interrupt operation (Cycle time, Internal device)

This is the method that stops the program operation in proceeding temporarily and carries out the operation processing which corresponds to interrupt program immediately in case that there occurs the status to process emergently during PLC program execution. The signal to inform this kind of urgent status to CPU module is called ‘interrupt signal’. There is a Cycle time signal that operates program every appointed time and external interrupt signal that operates program by external contact point (%IX0.0.0~%IX0.0.7). Besides, there is an internal devi ce start prog ram that starts according to the state change of device assigned in si de .

(3) Constant Scan (Fixed Period)

This is the operation method that performs the scan program every appointed time. This stands by for a while after performing all the scan program, and starts again the program scan when it reaches to the appointed time. The di ffe r ence fro m con stan t p r og ram i s t he up dat e o f inp ut /ou tput and t he thi ng to perform with synchroniz ati on. At constant operation, the scan time indicates the net program processing time where the standby time is deducted. In case that scan time is bigger than ‘constant’, %FX92 (_CONSTANT_ER) flag shall be ‘ON’.

5.1.2 Operation processing during momentary power failure

CPU module detects the momen ta ry power fail ure when input power vol tage supp lied to power modu le is lower than the standard. If CPU module detects the momentary power failure , it carries out the operation processing as follows.

If momentary power failure within 10 ms is occurred, main unit (CPU) keeps the operation. But, if momentary power failure a bove 10 ㎳, the operation is stop and t he output is Off. Restart pr ocessing like at power input shall be performed.

(1) Momentary power failure within 10 ms

(2) Momentary power failure exceeding 10 ms

Remark

1) Momentary power failure?

This means the state that the voltage of supply power at power condition designated by PLC is

lowered as it exceeds the allowable variable range and the short time (some ms ~ some dozens ms) interruption is called ‘momentary power failure’ ).

 Restart processing like at power input shall

be performed.

Input power

Momentary power failure exceeding 10 ms

Momentary power failure within 10 ms

(1) When momentar y po wer failure occurs, PLC holds

its output status and stop operation.

(2) If momentary power failure is canceled, operation

continues.

(3) Output voltage of power module keeps value is

specification.

(4) Though momentary power failure occurs and

operation stops, timer measurement and timer measurement for interrupt is conducted normally.

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Chapter 5 Program Configuration and Operation Method

5.1.3 Scan time

The processing time from program step 0 to the next step 0 is called ‘Scan Time’.

(1) Scan time calculation expression Scan time is the sum of the processing time of scan program and interrupt program prepared by the user

and PLC internal time, and i s disting uished by the follow ing fo rmula.

(a) Scan time = Scan program processing time ＋ Interrupt program processing time ＋ PLC internal

processing time

 Scan program processing time = processing time of user program not saved as interrupt program  Interrupt program processing time = Sum of interrupt program proceeding time processed during 1 scan  PLC internal processing time = Self-diagnosis time ＋ I/O refresh time ＋ Internal data processing time

＋ Communication service processing time

(b) Scan time depends on whether to execute interrupt program and communication processing.

(2) Scan time monitor

(a) Scan time can be monitored 『Online』-『PLC Information』-『Performance』.

(b) Scan time is save in special relay (F) area as follows.

 %FW50: max. value of scan time (unit: 0.1 ms)  %FW51: min. value of scan time (unit: 0.1 ms)  %FW52: current value of scan time (unit: 0.1 ms)

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Chapter 5 Program Configuration and Operation Method

5.1.4 Scan Watchdog timer

WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of

PLC CPU module.

(1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT is

set in Basic parameter of XG5000.

(2) If WDT detects the excess of detection setting time while watching the elapsed time of scan during operation, it stops th e oper ation of PLC im m ediately an d k eeps or cle ars t he outp ut ac cordi ng to parameter setting

(3) If the excess of Scan Watchdog Time is expected in the program processing of specific part while performing the user program (FOR ~ NEXT instruction, CALL instruction), clear the timer by using ‘WDT_RST’ Function

‘WDT_RST’ Function initializes the elapsed time of Scan Watchdog Timer and starts the time measurement from 0 again.

(For further information of WDT_RST Function, please refer to Instruction.)

(4) To clear the erro r state o f watchdog , we can use the fol lowing method : powe r re-supply, PLC reset, mode conversion to STOP mode.

Remark

1) The setting range of Watchdog Timer is 10 ~ 1000ms (Unit: 1ms).

WDT_RST instruction execution

0 1 2 3 ….. …8 9

SCAN END

WDT Reset

0 1 2 …

WDT

count(ms)

0 1 2 … …6 7

SCAN END

0 1 2 …

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Chapter 5 Program Configuration and Operation Method

5.2 Program Execution

5.2.1 Configuration of program

All functional elements need to execute a certain control process are called as a ‘program’. Program is stored in the built-i n RAM mounte d on a CPU module or flash memory of a exter nal memory module. The following tabl e shows the classification of the program.

Program type Description

Initializing program

• It will be executed till the specific Flag ‘INIT_DONE’ is On. And while the

initialization task is executed, several of initializing program is programmed. (If INIT_DONE instruction is executed, scan program is

executed.)

Scan program

• The scan program is executed regularly in every scan.

Cycle time interrupt program

• The pr ogram is perf ormed ac cordi ng to t he fixe d tim e interv al in c ase th at the required processing time condition is as below.

 In case that the faster processing than 1 scan average processing time is

required

 In c ase that t he longer t ime interv al than 1 sc an averag e process ing time is

required

 In case that program is processed with the appointed time interval

External interrupt program

• The exter nal interrupt program is perform ed process on external interrupt signal.

Subroutine program

•

Only when some condition is satisfied.(in case that input condition of CALL

instruction is On)

5.2.2 Program execution methods

Here describes the program proceeding method that is executed when the power is applied o r key swi t ch i s ‘ RUN’.

The program performs the operation processing according to the configuration as below.

Start processing

Scan program

END processing

Subroutine program

External interrupt program

Cycle time program

Only when some

condition is satisfied.

Initializing program

It executes up to execution of INIT_DONE instruction when initializing program is designated.

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Chapter 5 Program Configuration and Operation Method

(1) Scan program

(a) Function

• This program performs the operation repeatedly from 0 step to last step in order prepared by the program to process the signal tha t is repeated ly regularly every scan.

• In case that the execution condition of interrupt by task interrupt or external input while executing program is established, stop the current program in execution and perform the related interrupt program.

(2) Interrupt program

(a) Function

• This program stops the operation of scan program and then processes the related function in prior to process the internal/external signal occurred periodically/non-periodically.

(b) Type

• Task p rogr a m is di v ide d a s bel ow .

- Cycle time task program: available to use up to 8.

- Internal device ta sk program: available to u se up t o 8.

- I/O (External contact task program): available to use up to 8. (%IX0.0.0~%IX0.0.7)

• Cycle time task program

- Performs the program according to the fixed time internal.

• Internal devi ce task prog ram

- Performs the corresponding program when the start condition of internal device occurs.

- The start cond ition de tection of device shall be performed after processing of scan program.

• I/O (External contact task program)

- Performs the program according to the input external signal (%IX0.0.0~%IX0.0.7).

Remark

(1) Write the interrupt program as s hortl y as poss i ble . I n c as e same interrupt occurs repeatedly before completion of interrupt, program is not executed and O/S watch dog error may occur. (2) Though interrupt whic h has lower priority occurs man y times during execution of interrupt

which has higher priority, interrupt which has lower priority occurs only one time.

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Chapter 5 Program Configuration and Operation Method

5.2.3 Interrupt

For your understanding of Interrupt function, here describes program setting method of XG5000 which is an XGB

programming S/W. Example of interrupt setting is as shown bellows.

• Interrup t setting Interrupt source Interrupt name priority Task No. Program

Initializing Interrupt 0_ - - Cycle time 1 Interrupt 1_cycle time 2 0 Cycle time 1 External Interrupt 2_external 2 8 External Internal devi ce Interrupt 3_internal 3 16 Internal Cycle time 2 Interrupt 4_cycle time 3 1 Cycle time 2

Remark

• In case that several tasks to be executed are waiting, execute from the highest Task Program in

priority. When the same priority tasks are waiting, execute from the order occurred.

• While interrup t executing, if the h ig h est i nt er rupt is occurre d, th e h ig h est interrupt is exec u ted earliest of all.

• When power On, All interrupts are in the state ‘Enable’.

• Internal device interrupt i s e xe cut ed after END instruction.

Initializing

(Before INIT_DONE instruction)

Cycle time 1 execution

Interrupt 1_Cycle time

occur

Cycle time 1/

external occur

simultaneously

Cycle time 1 execution

External I/O execution

Internal device Interrupt occur

Internal device interrupt

execution

Cycle time 1

execution

Timed-driven 1

execution

Cycle time 2

occur

Cycle time 2 execution

END

Scan program

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Chapter 5 Program Configuration and Operation Method

(1) How to prepare interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each

task. For further information, please refer to XG5000 user’s manual.

(It can be additi onal when XG5000 is not connec ted with PLC .)

(a) Click right button of mouse on project name and click 『Add item』-『Task』.

(b) The screen of Task setti ng is show n. Cli ck 『Initialization』 in Execution condition and make a Task name.

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Chapter 5 Program Configuration and Operation Method

(d) Make initia lizing program. In initializing program , INIT_DONE instruction must be m ade. If not, Scan

program is not executed.

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Chapter 5 Program Configuration and Operation Method

(2) How to prepare Cycle interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each

task. For further information, please refer to XG5000 user’s manual.

(It can be additional whe n XG5000 is not connected with PLC)

(a) Click right button of mouse at registered task and select『Add Item』-『Task』.

• It shows setting screen of Task.

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Chapter 5 Program Configuration and Operation Method

(b) Task type

Classification Description Remark

Task name Make Task name.

Character, number available

Priority Set the priority of task. (2~7)

“2” is the highest priority number.

Task number

Set the Task number.

• Cycle time task (0 ~ 7): 8

• External I/O task (8 ~ 15): 8

• Internal device task (16 ~ 23): 8

Execution condition

Initialization Set the initial program when running the project.

Till the execution of

INIT_DONE

instruction

Cycle time Set the cyclic interrupt.

0~4294967295㎳ available

I/O Set the external I/O.

%IX0.0.0~%IX0.0.7 available

Internal device

Set the internal device to interrupt execution.

• Bit: Among Rising, Falling, Transition, On, Off

• Word: Among >,>=,<,<=

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Chapter 5 Program Configuration and Operation Method

(d) Register the Program name and Program description.

(e) It is displayed the p rog ram window to write ta sk program.

(f) It is displayed the setting in proj ec t windo w.

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Chapter 5 Program Configuration and Operation Method

(3) Task type

Task type and function i s as follows.

Type Spec.

Cycle time task

(Interval task)

I/O task

(Interrupt task)

Internal device task

(Single task)

Max. Task number

8 8

Start condition

Cyclic

(setting up to max. 4,294,967.295 sec. by

1ms unit)

Rising or falling edge of main unit’s contact

(%IX0.0.0~%IX0.0.7)

Internal device execution condition

Detection and execution

Cyclic execution per setting time

Immediate execution at

the edge of main unit’s contact

(%IX0.0.0~%IX0.0.7)

Retrieve the condition and execute after completing Scan Program

Detection delay time

Max. 1 ms delay Max. 0.05 ms delay

Delay as much as max. scan time

Execution priority

2~7 level setting (2 level is highest in priority)

Task no.

Within 0~7 range

without user

duplication

With 8~15 range without user duplication

Within 16~23 range without user duplication

(4) Processing methods of task program

Here describes common processing method and notices for Task program. (a) Feature of task program

1) Task Program is executed only when execution condition occurs without every scan repeat processing. When preparing Task Program, please consider this point.

2) For example, if a timer and counter were used in cyclic task program of 10 second cycle, this timer occurs the tolerance of max. 10 seconds and the counter and the timer and as the counter checks the input status of counter per 10 seconds, the input changed within 10 se conds is not counted up.

(b) Execution priority

1) In case that several tasks to be executed are waiting, execute from the highest Task Program in priority. When the same priority tasks are waiting, execute from the order occurred.

2) In case Cycle time task and external I/O task is occurred concurrently, execute from the highest task program. (In sequence of XG5000 setting)

3) The task program priority should be set considering the program features, importance and the emergency when the execution requested.

There are some causes for Task Program processing delay as below. Please consider this when task

setting or program preparation.

1) Task detection delay (Refer to detailed description of each task.)

2) Program proceeding delay caused by Priority Task Program proceeding

(d) Relationship of initialize, Scan Program and Task Program

1) ser identification task does not start while performing Initialization Task Program.

2) As Scan Program is set as lowest priority, if task occurs, stop Scan Program and process Task Program in advance. Accordingly, if task occurs frequently during 1 scan or concentrates intermittently, scan time may extend abnormally. Cares should be taken in case of task condition set ting.

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Chapter 5 Program Configuration and Operation Method

(e) Protection of Program in execution from Task Program

1) In case that the continuity of program execution is interrupted by high priority Task Program during program execution, it is available to prohibit the execution of Task Program partially for the part in problem. In this case, it is available to perform the program protection by ‘ DI (Task Program Sta rt Disabled) and ‘EI (Task Program Start Enabled)’ Function

2) Insert ‘DI’ Function in the sta rt po si ti on of t he pa rt re quiri ng the prote ction and inse rt ‘EI’ Function in the position to release. Initialization Task is not influenced by ‘DI’, ‘EI’ Function.

3) If interrupt i s occurred while ‘CALLP’ instruction executing, interrupt program is executed after ‘CALLP’ instruction execution.

(5) Cyclic task program processing method

Here describes the processing method in case that task (start condition) of Task program is set as Cycle time.

(a) Items to be set in Task

Set the execution cycle and priority which are the start condition o f Task prog ram to exe cution. Check th e

task no. to manage the task.

(b) Cyclic task processing

Performance the corresponding cyclic task program per setting time interval (execution cycle).

1) When cyclic task program is in execution currently or waiting for execution, if the demand to execute the same task program occurs, the new occurred task shall be disregarded.

2) Timer that makes a demand to execute cyclic task program only while operation mode is Run mode, shall be added. The shutdow n time shal l be all di srega rded.

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Chapter 5 Program Configuration and Operation Method

3) When setting the execution cycle of cyclic task program, consider the possibility that the demand to execute several cyclic task program at the same time occurs.

If 4 cyclic task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of

execution per 20 seconds shall be occurred at the same time and scan time may extend instantaneously.

(6) I/O task program processing

It described the I/O task program processing. (%IX0.0.0~%IX0.0.7)

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Chapter 5 Program Configuration and Operation Method

(a) Items to be set in Task

 Set the execution condition and priority to the task being executed. Check the task no. to manage the

task.

(b) I/O task processing

 If inte rrupt signa l from external signal (I/O) is occurred on main unit (%IX0.0.0~%IX0.0.7), ta sk program is

executed by external (I/O) signal.

1) If task program which is executed by inte rr upt sig nal is on execution o r standby status , new tas k program which is requested by identical I/O is ignored.

2) Only operation mode is Run mode, execution request of task program is recognized. Namely, execution request of task program is ignored when operation mode is Stop mode.

(7) Internal device task program processing

Here describes the processing method of international device task program which extended the tas k (star t condition) of task program from contact point to device as execution range.

(a) Items to be set in Task

Set the execution condition and priority to the task being executed. Check the task no. for task

management.

(b) Internal device task processing

After completing the scan program execution in CPU module, if the condition that becomes the start

condition of internal device task program is met, according to the priority, it shall be executed.

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Chapter 5 Program Configuration and Operation Method

1) Accordingly, even if the executi on cond ition o f internal device task program occurs in Scan Program

or Task Program (Cycle time, I/O), it shall not be e xecuted i mmedi at ely but executed at the time of completion of Scan Program.

2) If the demand to execute Internal Device Task Program occurs, the execution condition shall be examined at the time of completion of Scan Program. Accordingly, if the execution condition of Internal Device Task occurs by Scan Program or Task Program (Cycle time) during ‘1 scan’ and disappears, the task shall not be executed as it is not possible to detect the execution at the time of examination of execution condition.

(8) Verification of task program

(a) Is the task setting proper?

If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time

may lengthen or be irregular. In case not possible to change the task setting, verify max. scan time.

(b) Is the priority of task arranged well?

The low priority task program shall be delayed by the high priority task program, which results in disabling

the processing within the correct time and even task collision may occur as next task occurs in the state that the execution of previous task is delayed. Consider the emergency of task and execution time etc when setting the priority.

If the execution time of Task Program is longer, scan time may lengthen or be irregular. Even it may cause

the collision of task program. Write the execution time as short as possible. (Especially, when writing the cyclic task program, write the execution time so that the task program can be executed within 10% cycle of the shortest task among several tasks.)

(d) Is program protection for the high priority task needed during program execution?

If other task is inserted during task program execution, complete the task in execution and operate the

standby tasks in th e o rder o f hi gh p riori ty . I n ca se th at it i s n ot al l ow ed to i nse rt ot he r task i n S can Program, prevent the insert partially by using ‘DI’ and ‘EI’ application instruction. The problem may occur while processing the global variables used commonly with other program or special or communication module.

(9) Program configuration and processing example

If task and program are registered as below.

Interrupt type Interrupt name Priority Task No. Program Cycle time 10 ㎳_cycle time 3 0 Program 1 Internal devi ce Internal d evi ce_%MX0 5 16 Program 2

I/O I/O_%IX0.0.0 2 8 Program 3

1) Scan program name: “ Scan Program”

2) Execution time respective program: Scan program = 17 ㎳, Program 1 = 2 ㎳, Program 2= 7 ㎳,

Program 3 = 2 ㎳

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Chapter 5 Program Configuration and Operation Method

Process per time

Time (㎳)

Process

0 Scan started and scan program started to execute.

0~6 Scan program is executed.

6~8

Scan program is stop because execut ion external I/O (P000) is reques ted. And progr am

3 is executed. Request of execution at 7[m s] is ignored because program 3 has been

executing.

8~10 Program 3 is finished and Scan program is continued.

10~12

Scan program is stop b y reques t of ‘10㎳_Cycl e ti me ’ interrupt signal a nd execut e program

12~20 Program 1 is finished and Scan program is continued.

Request of ‘Cycle time’ interrupt signal and ‘External I/O (P000)’ signal is occurred

concurrently but priorit y of ‘External I/O’ signal is higher than ‘C ycle tim e’ interrupt signal

so program 3 is executed and program 1 is standby.

20~22 Program 3 is finished and Scan program is continued. 22~24 After program 3 is completed, program 1 (the program of ‘10ms_Cycle time’ is executed. 24~25 P1 execution completed and the stopped scan program execution finished

At the finished point of scan program, check the request of Internal device ‘M000’ execution and execute program 2.

25~30 Program P2 is executed. 30~32

When ‘10㎳_Cycle time’ interrupt signal is occurred, the priority of that is high er t ha n Int ernal device ‘M000’ though program 2 is stopped and program 1 is executed.

32~34 P1 executed completed and the stopped P2 execution finished

34 New scan starts (Start scan program execution)

PO executed

P1 executed

10ms_Cycle time

Program 2

Internal device_%MX0

Program 3

External I/O_%IX0.0.0

Time

0 6 7 8 10

Scan started

(Initial operation started)

Scan program stopped

New scan started

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Chapter 5 Program Configuration and Operation Method

5.3 Operation Mode

For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode.. Here describes the operation processing of each operation mode.

5.3.1 RUN mode

This is the mode to executed program operation normally.

(1) Processing at mode change

At the beginning, execute initialization of data area and examine the effectiveness of program and judge the

possibility of execution.

(2) Operation processing contents

Execute I/O refresh and program operation.

(a) Detects the start condition of Interrupt Program and executes Interrupt Program. (b) Examines the normal operation or missing of built-in module. (c) Communication service and other internal processing.

RUN mode first scan start

Initialize data area

Examine Program effectiveness and judge the

possibility of execution

Execute input refresh

Program execute, Interrupt Program ex ecute

Communication service and internal processing

Execute output refresh

Operation

mode change

RUN mode keep

Change to other mode

Operation by changed operation

mode

Examine the normal operation or missing of

built-in module

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Chapter 5 Program Configuration and Operation Method

5.3.2 STOP mode

This is the mode in stop state without Program operation. It is available to transmit the program through XG5000

only in Remote STOP mode.

(1) Processing at Mode Change

Clear the output image area and execute output refresh.

(2) Operation Processing Contents

(a) Executes I/O refresh. (b) Examines the normal operation or missing of built-in module.

5.3.3 DEBUG mode

This is the mode to detect Program error or trace the operation process and the conversion to this mode is available only in STOP mode. This is the mode to check the program execution state and the contents of each data and verify the program.

(1) Processing at mode change

(a) Initializes the data area at the beginning o f mode change. (b) Clears the output i mage a rea and e xe cute i npu t r e fresh.

(2) Operation processing contents

(a) Executes I/O refresh. (b) Debug ope ration acc ording to s ettin g state. (c) Afte r fini shi ng D ebu g opera tio n by the end of Program, execute output refresh. (d) Examine the normal operation or missing of built-in module. (e) Executes communication service or other service.

(3) Debug operati on

 It describes debug mode.

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Chapter 5 Program Configuration and Operation Method

Item Description Remark Start/Stop Debugging Change the debug ↔ stop mode Go It starts debug operati on. Step Over It operates by 1 step. Step Into It starts the subroutine program.

Other

operation is identical to

Step Over.

Step Out It finished the subroutine program. Go to Cursor It operates to current cursor position.

Set/Remove

Breakpoints

Set/Removes current cursor position to break points.

Breakpoints Lis t It displays list of breakpoints.

Breakpoint

Conditions

It specifies device value and number of scan.

(a) Set/Remove Breakpoints ▪ Sets breakpoint at current cursor position. After breakpoint setting, (breakpoint setting indicator) is

displayed.

(b) Go ▪ Run the program to breakpoint. At break-pointer (stop indicator) is displayed.

error 1

error 2

error1

error2

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Chapter 5 Program Configuration and Operation Method

(d) Breakpoint List

▪ It displ ay s c u rrent B re a kpoint Li s t. I t supp o rt s Sele c t A ll , Re set A ll, Goto, R e move, R e move All.

error 1

error 2

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Chapter 5 Program Configuration and Operation Method

(e) B reak condit ion ▪ It sets D ev i ce B rea k an d S can B r ea k.

Remark

1) Refer to XG5000 Us e rs Manual ‘Chapter 12 Debuggi ng’ for detailed in formati on.

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Chapter 5 Program Configuration and Operation Method

5.3.4 Change operation mode

(1) Operation Mode Change Method

The method to change operation mode are as follows. (a) By mode key of CPU module

(b) By connecting the programming tool (XG5000) to communication port of CPU (c) By changing the operation mode of other CPU module connected to network by XG5000 connected to

communication port of CPU.

(d) By using XG5000, HMI, computer link module connected to network (e) By ‘STOP‘ instruction during program execution

(2) Type of operation mode

The operation mode setting is as follows.

Operation mode switch XG5000 command Operation mode

RUN - Run

STOP

RUN Remote Run

STOP Remote Stop

Debug Debug Run

Mode change P revi ous ope ration mode

RUN -> STOP - Stop

(a) Remote mode co nver sion is avail abl e only in the s tate of ‘Remote Enabled: On’, ‘Mode switch: Stop’. In case of changing the Remote ‘RUN’ mode to ‘STOP’ by switch, ope rate the switch as foll ows.

(STOP)  RUN  STOP .

Warning

In case of changing Remote RUN mode to RUN mode by switch, PLC operation continues the

operation withou t i nt err up tion.

It is available to modify during RUN in RUN mod e by switc h but th e mode cha nge oper ation b y

XG5000 is limited. This should be set only in case that remote mode change is not allowed.

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Chapter 5 Program Configuration and Operation Method

5.4 Memory

There are two types of memory in CPU module that the user can use. One is Program Memory that saves the

user program written by the user to build the system, and the other is Data Memory that provides the device area

to save the data during operation.

5.4.1 Program memory

Contents and size of program memory are as follows.

Item

Size

Program memory entire area

1.76 MB

System area:  System program area

 Backup area

512 KB

Parameter area:  Basic parameter area  I/O parameter area  High speed link parameter area  P2P parameter area  Interrupt setting inf ormation area

 Reserved area

48 KB

Execution program area:  Scan program area

 Task program area

200 KB

Program reserved area  Scan program backup area  Task program area  Upload area  User defined function/function block area  Variable initialization information area  Reserved variable assignment information area

 Reserved area

1 MB

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Chapter 5 Program Configuration and Operation Method

5.4.2 Data memory

Contents and size of data memory are as follows.

Item

Size

Data memory entire area

256 KB

System area :  I/O information table  Forced I/O table

 Reserved area

143 KB

Flag area

System flag (F)

2 KB

Analog image flag (U)

1 KB

Internal special flag (K)

8 KB

High speed link (L)

4 KB

P2P flag (N)

10 KB

Input image area (%I)

2 KB

Output image area (%Q)

2 KB

R area (%R)

20 KB

Direct variable area (%M)

16 KB

Symbolic variable area (maximum)

32 KB

Stack area

16 KB

5.4.3 Data retain area setting

In case you want to k e ep th e da ta necessary for operation and the data m ad e dur in g op eration when PL C stops and rest arts, Default( automatic) Vari able Retain is us ed and some are a of M area can be s et as Retain area through parameter setting

The following is chara cteri stic table about the devi ce availa ble fo r Retain setting

Device

Retain

setting

Characteristic

Default

As for automatic variable area, Retain setting is available

As for internal c on tact p oin t ar ea, Ret ai n set tin g i s av ai labl e at pa ra mete r

In case of power failure, contact point is kept

System flag area

Analog data register (Ret ain i s no t avai l able )

L X

High speed link/P2P service sta tus contact point of c ommunication modul e (Retain is available )

P2P service address area o f communi cation module (Retai n is av ailable )

Flash memory dedicated area (Retain is available)

Remark

1) K, L, N, R devices are retained basically.

2) K, L, N devices can be deleted through “Clear PLC” of XG5000 online menu.

3) For more detail, refer to “Online” of XG5000 user manual.

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Chapter 5 Program Configuration and Operation Method

1) Initialization of data according to restart mode

There are three variable related with restart mode (Default, initialization and retain variable). Initialization method about each variable in case of executing restart mode is as follows.

2) Operation of data retain area

Method on delet ing t he Retain da ta i s as foll ow s.

- RESET through XG5000 (Overall Reset)

- Execute “Clear PLC” through XG5000 at STOP mode

- Writing by program (Initialization program recommended)

- Writing ‘0’ FILL etc at XG5000 monitor mode For holding of retain area data or reset (clear) operation according to PLC operation, refer to the following

table.

Classification Retain M area Retain R area

Reset

Hold previous value Hold previous value Hold previous value

Overall reset

Initialized as ‘0’ Initialized as ‘0’ Hold previous value

STOP→RUN

Hold previous value

Remark

1) Terms on three types of variable are as follows. (1) Default variable : variable not set as INIT or Retain variable (2) INIT variable : initial value is set (3) Retain variable : Holds previous value

3) Initialization of data

If PLC becom es ‘Cleat Mem ory’ status, mem ory of all dev ices are delete d as ‘0’. W hen you want to specif y initial value , use initialization task . At CPU module, there are two t ypes of built-in memory. One is pr ogram memory to save program made by user, for user to s tructure sys tem, Another is dat a memory provid i ng de v ic e area saving data during operation.

Mode

Variable assignment

COLD WARM

Default Initialized as ‘0’ Initialized as ‘0’ Retain Initialized as ‘0’ Hold p rev iou s v al ue

Initialization

Initialized as user de fined val ue

Retain & Initialization I nitial ized a s user define d valu e Hold previous val ue

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Chapter 5 Program Configuration and Operation Method

5.4.4 Data Memory Map

User program area

Parameter area

User program area

(200 KB)

Data area

Automatic variable (32 KB)

Z127

Z000

Input variable (2 KB)

“I”

%IX0.0.0

%IX15.15.63

Output variable (2 KB)

“Q”

%QX0.0.0

%QX15.15.63

Direct variable M area

(16 KB)

“M”

%MW8188

%MW0

Direct variable R area

(20 KB)

“R”

%RW10236

%RW0

Direct variable W area

(20 KB)

“W”

%WW10236

%WW0

Direct variable F area

(2 KB)

“F”

%FW1020

%FW0

Direct variable K area

(8 KB)

“K”

%KW4092

%KW0

Direct variable L area

(4 KB)

“L”

%LW2044

%LW0

Direct variable N area

(10 KB)

“N”

%NW5116

%NW0

Direct variable U area

(1 KB)

“U”

%UW0.15.31

%UW0.0.0

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Chapter 6 CPU Functions

6.1 Type Setting

It describes settin g of XGB PLC type.

PLC

Series

CPU type Language Description Reference

XGB

XGB-DR16C3

MK language

Dedicated product Module type

XGB-XBMS

MK language

“S” type : XBM-DN16/32S , XBMDR16S

Module type

XGB-XBCH

MK language

“H” type : XBC-DR32/64H , XBCDN32/64H

Compact type

XGB-XECH

IEC language

“H” type : XEC-DR32/64H , XECDN32/64H, XEC-DP32/64H

Compact type

Remark

▪ In case ty pe is differ ent, con nection is not avail able .

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Chapter 6 CPU Functions

6.2 Parameter Setting

This paragraph describes how to set parameters.

6.2.1 Basic parameter setting

Clicking Basic Parameter in the project window shows the following window.

There are three main options ; “Basic Operation Setup” , “Device Area Setup” and “Error Operation Setup”.

Category Item Description Note

Basic

operations

Fixed period operation

Set the time of fixed period operation.

1~999 ㎳

Watchdog timer Set the time of scan watchdog.

10~1000 ㎳

Standard input filter Set the time of standard input filter.

1,3,5,10,20,70,100 ㎳

Restart mode Set restart mode Allowance/Prohibition

Output during debugging

Set whether to allow output actually during debugging operation.

Allowance/Prohibition

Keep output when an error occurs

Set whether to preserve output holding function set in I/O parameter in case of error.

Allowance/Prohibition

Memory

area

setting

Select latch area Set Retain range about M area

Pause/Resume

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Chapter 6 CPU Functions

6.2.2 I/O parameter setting

This setting is to set and reserve each I/O information. Clicking 『I/O Parameter』 in the project window shows the following setting window.

Clicking 『Module』 in 『Slot Position』 indicates a list of modules, in which you may set I/O corresponding to the ac tual sy stem. Then, the follow ing window is display ed.

Clicking 『Details』 in 『Slot Position』 s hows the f ollo wing window to set filter and emergency output.

Remark

(1) If sett ings are d iff er ent wi th I /O m od ule ac tua ll y acc es sed , “ Inc ons ist ent m od ul e type error” occ urs ,

displaying error.

(2) Without settings, CPU reads each I/O module information and operates.

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Chapter 6 CPU Functions

6.3 Self-diagnosis Function

6.3.1 Saving of error log

CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking

『Error/Warning』 of 『Online』 shows the current error and previous error log.

Item Description Remarks

Error/Warning Display the current error/warning. -

Error Log Display a log of error/warning occurred. Saving up to 100

Remark

(1) Saved data are not delete d until sel ecting a menu of XG5000 and clicking “Delete”. (2) “H” type display s D at a a nd Time.

6.3.2 Troubleshooting

(1) Trouble types

Trouble occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble is divided into trouble mode stopping operation for the safety and warning mode generating alert to user with a mode in trouble.

The causes troubling PLC system are as follows.

(a)

PLC hardware trouble

(b) System configuration error (c) Operation error while operating user program (d) Error detected ow ing to ext e rna l d evi ce i n tro ubl e

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Chapter 6 CPU Functions

(2) Operation mode if trouble occurs

PLC system logs any trouble occurred in flag and determines whether to stop or resume operation depending on trouble mode .

(a) PLC hardware trouble

In case an error occurs so that PLC such as CPU module and power module may not work nor mally, the system is h alt ed, b ut any warning may not interfere with the operation.

(b)

Operation error while operating user program

Representing an error occurred during operation of user program, in case of numeric operation error, it displays the error in error flag but the system resumes operating. However, if the operation time exceeds by the ope rati on mo nit o ring t i me limit and I/O module does not control it normally, the system is halted.

(c)

Error detected owing to external device in trouble

Representing the detection of external device to be controlled by users program of PLC, if an error is detected, the system is halted, but any warning may not interfere with the operation.

Remark

(1) If any trouble occurs, the trouble content is saved in a special relay %FD1. (2) For details of flag , refer to the app endi x 1 Flag List.

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Chapter 6 CPU Functions

6.4 Remote Functions

CPU module may change operati on by communi cati on as well as by key swit ches mounte d on the modu le. To operate it remotely, it is necessary to set ‘RUN/STOP’ switch to ‘STOP’.

(1) Remote operations are as follows.

(a) Operable by accessing to XG5000 through RS-232C port mounted on CPU modu le. (b) Can operate other PLC connected to PLC network with CPU module connected to XG5000.

(2) Remote RUN/STOP

(a) Remote RUN/STOP is the externally controlled RUN/STOP function. (b) It is convenient w hen C PU modul e i s lo cat ed at a po sit ion ha rd to cont rol o r wh en C PU modul e

within control panel is to control RUN/S TOP functio n remo tely.

(3) Remote DEBUG

(a) it manages debugging remot ely when remote mode is STOP. Namely, DEBUG operation is to execute

program operation depending on designated operation condi tions .

(b) Remote DEBUG is a convenient function when confirming program operation status or data during

system debugging.

(4) Remote Reset

(a) Remote reset is to reset CPU module remotely if an error occurs at a place hard to directly control

CPU module.

(b) Like operation by switches, it supports ‘Reset’ and ‘Overall Reset’.

Remark

For details regarding remote functions, refer to ‘Online’ of XG5000 Users Manual.

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Chapter 6 CPU Functions

6.5 Forced Input/Output On and O f f Function

Force I/O function is used to force to turn I/O areas on or off, regardless of program results.

6.5.1 Force I/O setup

Click『 Online 』-『 Force I/O 』.

Item Description Move address Select base and slot Application Set whether to allow or not Force I/O

Single

Flag Set whether to allow or not Force I/O by bits. Data Set Force I/O data on or off by bits.

Select All Set to allow Force I/O with all I/O area on

Delete All

Delete to allow Force I/O with all I/O area off.

Setting device Display I/O area set as a bit.

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Chapter 6 CPU Functions

6.5.2 Processing time and processing method of Force Input/Output On and Off

(1) Forced Input

Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among data read from input module with the data as Force and updates input image area. Therefore, user program execute s ope ra tio ns w i th a ctual inp ut da ta w hile For ce i npu t a rea is operated with da ta s et a s Force.

(2) Forced Output

Regarding output , at the ti me o f o utput refresh upon the execution user program operation, it replaces the data of contact set as Force On/Off among data of output image area containing operation results with data set as Force and outputs the data in output module. Unlike (Force) input, the output image area is not changed by Force On/Off setti ng.

(3) Cautions when using Force I/O function

(a) It operates from the time when I/O is individually set as ‘Allow’ after setting Force data. (b) It is possible to set Force input although I/O module is not actually mounted. (c) Despite of the power changed Off -> On, operation mode c han ge s o r any op er ati on by p res sing r ese t

key, the data of which On/Off is set before is kept in CPU module. (d) Even in STOP mode, Force I/O data is not removed. (e) To set new dat a fro m t he b egin nin g, it i s ne cess ary to d e selec t all settin g s o f I /O by u sing ‘ Del ete Al l ’

option.

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Chapter 6 CPU Functions

6.6 Direct Input/Output Operation

Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after ‘END’ instruction on program.

In order to refresh I/O data during program execution, use ‘DIREC_IN, DIREC_OUT’ function to read in put contact point immediately and use it for operation, or output ope rati on resul t immediately .

Program outputti ng data 2# 01 11_ 011 1_0 111 _01 11 to 32 point transistor o utput model eq ui pped at extension module slot 4 during scan.

(1) Input base number 0 and slot number 4 where output module is e quip ped (2) Since data to outpu t i s 1 6 bit d uring sca n, enabl e low er 16 bi t among value of MASK_L

(16#FFFF0000)

(3) If execution condition (%IX0.0.0) is On, DIREC_O (Immediate refresh of output module) is executed

and data of output module is set as 2#0111_0 111 _01 11_0 111.

Remark

1) For detail of DIREC_IN,DIREC_OUT function, refer to XGI/XGR/XEC instruction manual

2) In case of us ing DIR EC_IN,DI REC_OUT function , the valu e is applie d immedi ately. T hey have h igher priority than forced I/O.

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Chapter 6 CPU Functions

6.7 Diagnosis of External Device

This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of the system. Use o f thi s fl ag di splay s fa ult s o f e xte rnal device without a ny complicated program p repared and monitors fault location without any specific device (XG5000 and etc) or source program.

1) Detection and classi fication of fault s in exte rnal devi ce (1) The trouble (fault) of external device may be detected by user program and largely divided, depending

on the type, into error and warning; the former requires halt of PLC operation and the latter simply displays the sta tu s w hil e P LC ke eps w or king .

(2) ‘Heavy t rouble ’ uses ‘ _ANC_ERR’ flag and ‘Light troubl e’ uses ‘_ANC_WB’ flag.

2) Heavy trouble of external device

(1) In case of detecting heavy trouble of external device at user program, write error code defined by user at

system flag ‘ANC_ERR’ and turn on _CHK_ANC_ERR flag. If _CHK_ANC_ERR flag is on, at the end of scan, ‘_ANNUN_ER’ bit of ‘_CNF_ER’, system error rep rese ntati ve fl ag, is on an d PLC turns off all output of output modu le (it c an b e differ ent ac cordi ng to the sett ing of bas ic param eter) and b ecom es error status (Error LED flickers with 1s cycle)

(2)

In case of heavy trouble, y ou can kn ow the rea son by che cking ‘_ANC_ERR' flag.

(3) To turn off the ERR LED caused by flag detecting heavy trouble of external device, reset or restart PLC  Example)

3) Light trouble o f e xte rnal devi ce

(1) In case of detecting heavy trouble of external device at user program, write error code defined by user at

system flag ‘ANC_WAR’ and turn on _CHK_ANC_WAR flag. If _CHK_ANC_WAR flag is on, at the end of scan, ‘_ANNUN_WAR’ bit of ‘_CNF_WAR’, system warning representative flag, is on. When light

trouble occurs, LED flickers with 2s cycle. (2) In case of heavy trouble, you can know the reason by checking ‘_ANC_WAR' flag. (3) If _CHK_ANC_WAR is off, light trouble status is canceled and Error LED is off.

 Example)

Error

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Chapter 6 CPU Functions

6.8 Allocation of Input/Output Number

Allocation of I/O number is to allocate an address to every I/O of each module to read data from input module and output data to output module when it executes operations. XGB series adopts each I/O 64 points occupation to every module .

(1) Allocation of I/O number

64 points are allocated to every module (incl. special, communi cation ).

System Configuration

Number of Connection stage

Type I/O allocation Remarks

XECDN32H

Input : %IX0.0.0 ~ %IX0.0. 63 Output: %QX0.0.0 ~ %QX0.0.63

Real input : %IX0.0.0 ~ %IX0.0.15 Real output: % QX0.0. 0 ~ %Q X0 .0.15

XBEDC32A

Input : %IX0.1.0 ~ %IX0.1. 63 Output: %QX0.1.0 ~ %QX0.1.63

Real input : %IX0.1.0 ~ %IX0.1.31

XBETN32A

Input : %IX0.2.0 ~ %IX0.2. 63 Output: %QX0.2.0 ~ %QX0.2.63

Real output: %QX0.2.0 ~ %QX 0.2 .31

3 XBL-C41A

Input : %IX0.3.0 ~ %IX0.3. 63 Output: %QX0.3.0 ~ %QX0.3.63

XBFAD04A

Input : %IX0.4.0 ~ %IX0.4. 63 Output: %QX0.4.0 ~ %QX0.4.63

XBFDV04A

Input : %IX0.5.0 ~ %IX0.5. 63 Output: %QX0.5.0 ~ %QX0.5.63

XBEDC32A

Input : %IX0.6.0 ~ %IX0.6. 63 Output: %QX0.6.0 ~ %QX0.6.63

Real input : %IX0.6.0 ~ %IX0.6.31

XBETN32A

Input : %IX0.7.0 ~ %IX0.7. 63 Output: %QX0.7.0 ~ %QX0.7.63

Real output: % QX0.7. 0 ~ %Q X0 .7.31

Empty I/O point is available for internal relay.

6- 11

Chapter 6 CPU Functions

In case of using monitor function of XG5000, I/O allocation information is displayed.

I/O contact point allocation information

Description of each module

6- 12

Chapter 6 CPU Functions

6.9 Online Editing

It is possible to modify program and communication parameter during operation of PLC without control operation stopped. The following describes basic modification. For details of modifying program, refer to XG5000 Users Manu al.

Items to be modified duri ng operatio n are as follow s.

• Program

• Communication parameter

(1) It displays programs that are currently running.

(2) Click 『Online』-『Start Online Edi tin g』.

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Chapter 6 CPU Functions

(3) If you modify prog ram, backgro und co lor chan ges to indic ates sta rt of onli ne editin g.

(4) Upon the modification of program, click 『Online』-『Write Modified Program』.

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Chapter 6 CPU Functions

(5) Upon the writing of program, click 『Online』-『End Onli ne Editing』.

(6) The program background returns and the program modification during run is completed.

Remark

▪ For par ameter modification during run, change each parameter on XG-PD and click『Online』-『Write

Modified Program 』.

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Chapter 6 CPU Functions

6.10 Reading Input/Output Information

It monitors information of individual modules consisted of XGB series system. (1) Click『Online』-『I/O Info』. Then, information of each module connected to the system is monitored.

(2) If clicking Details after selecting a module, it displays detail information of a selected module.

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Chapter 6 CPU Functions

6.11 Monitoring

It monitors system information of XGB series system. (1) Clicking『Monitor』 displays the following sub-menus.

(2) Items and descriptions

Item Description Remarks

Start/Stop Monitoring Designate the start and stop of monitor. Click for reverse turn.

Pause Pause monitoring. -

Resume Resume paused monitor. -

Pausing Conditions

Pause monitoring if a preset value of device corresponds to condition.

Monitor resumes; clicking for resume.

Change Current Value

Change the present value of currently selected device.

System Monitoring Monitor general system information. -

Device Monitoring Monitor by devi ce (type ). -

Trend Monitoring Monitor trend of device set in the system.

For details, refer to XG5000 Users Manu al.

Custom Events

Monitor the value of device set when an event set by a user occurs.

Data Traces Trace the value of device.

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Chapter 6 CPU Functions

(a) Change current value

It changes the current value of each device selected in the current program window.

(b) Device monitoring

It monitors by device (ty pe).

6- 18

Chapter 6 CPU Functions

It stops monitoring in case a device value set in the program corresponds.

(d) Trend monitoring

It displays device value s graphi cally .

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Chapter 6 CPU Functions

(e) Custom events

1) It monitors detail information when an event set by a user occurs. Additional u ser eve nt may be registered.

2) It sets basic setting and relative device.

If rising edge of %MX0 device occurs, it records the message of an alarm, “Out of order Water Tank 1”

and the device values of DATA (%MW0), %MW100, tog_4s device are recorded.

3) Set the relative devi ce(s).

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Chapter 6 CPU Functions

4) Monitor event history of custom event.

5) Double-cli ckin g a n u mbe r p rodu ced moni to r s t he rela tiv e val ue s o f dev ice and the detail message as follows.

Remark

▪For details of monitor, refer to XG5000 Users Manual.

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Chapter 6 CPU Functions

6.12 RTC function

XGB PLC supports the RTC (clock) function and user can use this function for time management of system or error log. RTC function is executed steadily when power is off or instantaneous power cut status. Current time of RTC is renewed every scan by system operation status information flag.

6.12.1 How to use

(1) Reading/setting clock data

(a) Reading or setting from XG5000

1) Click『Online』의『PLC Information』.

2) Click PLC RTC tap of PLC Information』.

3) In case the user wants to send the clock of PC to PLC, press ‘Synchronize PLC with PC clock’.

4) In case the user wants t o send the c lock the user wants, c hange the se tting val ue of T ime box and press ‘Send to PLC’.

(b) Reading by flag

The user can monitor as follows by flag

Flag for RTC Data Contents

_MON_YEAR h0599 99 year 5 month

_TIME_DAY h1512 12 date 15 hour

_SEC_MIN h4142 42 minute 41 second

_HUND_WK h2001 20xx year, Monday

Time data of _TIME_DAY is indicated as 24 hour type.

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Chapter 6 CPU Functions

You can set clock data by program. It is used when you make system to set clock manually by external Digit switch or modify clock periodically throug h netwo rk.

‘RTC-SET’ function block is used to write the c lock data to a clock. I f you input the clock da ta and execute the function block, it writes the clock data to a clock at the scan end. For further information, refer to an instruction manual.

There is another method not using a function block. Input the clock data at the following area and turn ON ‘_RTC_WR’.

Flag for writing clock Content Setting range

_MON_YEAR_DT

Month/Year

1984 ~ 2163 year, 1 ~12 month

_TIME_DAY_DT

Hour/day

1 ~ 31 day, 0 ~ 23 hour

_SEC_MIN_DT

Second/Minute

0 ~ 59 minute, 0 ~59 second

_HUND_WK_DT

Hundred year/date

0 ~ 6

You can write clock data with out using function block. Write cloc k data at the abov e area and turn on ‘_RTC_WR’.

• When form of clock data is wrong, the value is not written. (But when dat e i s w r ong , e r ror i s no t d et e cted and wri tt en it sel f. )

• After writing clock data, monitor clock-related device for check

(d) How to express the date

Number 0 1 2 3 4 5 6 Date

Sunday

Monday

Tuesday

Wednesday

Thursday

Friday

Saturday

(2) Deviation of clock data

±2.2s / 1 d

(1) Initially , R TC may not h ave any clo ck d ata . (2) When using the CPU module, first make sure to set the accurate clock data. (3) If any dat a out o f the clo ck da ta rang e is written into RTC, i t doe s n ot wor k p ro perly .

i.e.) 14M 32D 25H

(4) RTC may stop or have an error due to abnormal battery and other causes. The error is released if a

new clock data is written.

Remark

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Chapter 6 CPU Functions

6.13 External Memor y Module

You can save user pr ogram safel y or download user pr ogram to PLC w ithout special handl ing when user program is damaged by using external memory module in XGB PLC

6.13.1 Structure

6.13.2 How to use

With the following handling, you can run PLC with program saved in memory module.

(1) Save user program at external memory module

(a) Set switch of memory module as 0 (b) Install memory module at the RS-232C port of main unit

- After installation, program and parameter is saved into memory module and READ LED is on

- If Saving program and parameter is complete, READ LED is off

(2) Save user program of external memory module at main unit

(a) Set operation mode of main unit as STOP

- In RUN mode, you can’t save program (b) Set switch of memory module as 1. (c) Install memory module

- Install it at the RS-232C port of main unit.

- If PLC program and parameter is written, WRITE LED is on.

- If saving program and parameter is complete, WRITE LED is off.

(d) If you change op erati on mode of PLC into RU N, P LC o per at es with pr ogram and parameter s av ed

in memory module.

(3) In case LED flickers

(a) When you execute writing of memory module in case operation mode of PLC is RUN.

(WRITE LED flickers)

(b) When the PLC type of program of memory module doesn’t correspond with actual PLC type.

(WRITE LED flickers) (c) When mode switch of memory module is not “0”, “1” (RUN LED flickers) (d) When interface with main unit is not normal (READ LED flickers)

-. Program and parameter of XG5000, parameter and information about link enabled are all saved.

-. Don’t run PLC while external memory module is installed.

-. When READ/WRITE LED is on, don’t remove memory module.

Remark

RS-232C connector

RUN LED

WRITE LED

READ LED

0 : READ mode 1 : WRITE mode

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Chapter 7 Input/Output Specifications

7.1 Introduction

Here describes the notices when selecting digital I/O module used for XGB series.

(1)

For the type of digital in put, ther e are t wo t ypes such as c urrent s ink inp ut and c urrent s ource

input.

(2) The number of max. Simultaneous in put contact point is different ac cording to module type. It

depends on the input voltage, ambient temperature. Use input module after checking the specification.

(3) When response to h igh speed input is necessary, us e interrupt input cont act point. Up to 8

interrupt points are supported.

(4) In case that open/close frequenc y is high or it is used f or conductive load open/close, use

Transistor output module o r triac output m odule as the durabilit y of Relay Output Modu le shall be reduced.

(5) For o utput modul e to run the c onductive (L) l oad, m ax. open/close f requency shou ld be use d

by 1second On, 1 second Off.

(6) For outp ut module, in case that counter tim er using DC/DC Converter as a load was us ed,

Inrush current ma y flow in a certain cycle when it is O N or during operation. In this case, if average current is selected, it may cause the failure. Accordingly, if the previous load was used, it is recommended to connect resistor or inductor to the load in s erial in ord er to reduce the impact of Inrush current or use the large module having a max. load current value.

Output

module

Resistor

Load

Inductor

Load

7-1

Chapter 7 Input/Output Specifications

(7) Relay life of Relay output module is shown as below.

Max. life of Relay used in Relay output module is shown as below.

Open/Close times (

10000)

100

10 5 3 2 1

0.5

Open/Close current (A)

AC 250V Resistive load

DC 30V Resistive load

AC 125V Resistive load

7-2

Chapter 7 Input/Output Specifications

(8) A clamped terminal w ith sleeve can not be used for the XGB terminal strip. The c lamped terminals

suitable for terminal strip are as follows (JOR 1.25-3:Daedong Electr icity in Korea).

(9) The cable size con nected to a terminal strip s hould be 0.3~0.75㎟ stranded c able and 2.8 ㎜ thick.

The cable may have different current allowance depending on the insulation thickness.

(10) The coupling torque available for fixation screw and terminal strip screw should follow the table below.

Coupling position

Coupling torque range

IO module terminal strip screw (M3 screw)

42 ~ 58 N·㎝

IO module terminal strip fixation screw (M3 screw)

66 ~ 89 N·㎝

(11) Relay life graph is not writt en based on real use. (This is not a guaranteed value). So cons i der margin.

Relay life is specified under following condition.

(a) Rated voltage, load: 3 million times: 100 million times

(b) 200V AC 1.5A, 240V AC 1A (COS¢ =0.7): 1 million times

(d) 200V AC 1A, 240V AC 0.5A (COS¢ =0.35): 1 million times

(e) 200V AC 0.3A, 240V AC 0.15A (COS¢ =0.35): 3 million times

(f) 24V DC 1A, 100V DC 0.1A (L/R=7ms): 1million times (g) 24V DC 0.3A, 100V DC 0.03A (L/R=7ms): 3million times

(12) Noise can be insert ed into in put module. To prevent this noise, the user can set filter for in put d el a y in

parameter. Consider the environment and set the input filter time.

Input filter time (ms)

Noise signal pulse size (ms)

Reference

0.3

3 1.8

Initial value

5 3

10 6

100

6.0mm or less

7-3

Chapter 7 Input/Output Specifications

(a) Setting input filter

1) Click I/O Parameter』in the project window of XG5000

2) Click『Module』 at the slot location.

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Chapter 7 Input/Output Specifications

3) Set I/O module really equipped.

4) After setting I/O module, click Input Filter.

5) Set filter value.

7-5

Chapter 7 Input/Output Specifications

(b) Setting output status in case of error

1) Click Emergency Out in the I/O parameter setting window.

2) Click Emergency Output.

If it is selected as Clear, the output will be Off and if Hold is selected, the output will be kept.

7-6

Chapter 7 Input/Output Specifications

7.2 Digital Input Specifications of Main Unit

7.2.1 XEC-DR32H / XEC-DN32H input unit (Source/Sink type)

Model

Specification

Main unit

XEC-DN32H(/DC)

XEC-DP32H

XEC-DR32H XEC-DR32H/D1

Input point 16 point Insulation method Photo coupler insulation Rated input voltage DC24V DC12/24V Rated input current

About 4 ㎃ (point 0~7: About 10 ㎃)

About 5/10mA (point 0~7: about 7/15mA)

Operation voltage range DC20.4~28.8V (ripple rate < 5%)

DC9.5~30V (ripple rate < 5%)

On Voltage/Current

DC19V or higher / 3 ㎃ or higher DC9V or higher / 3 ㎃ or higher

Off Voltage/Current

DC6V or less / 1㎃ or less

DC 5V or less / 1㎃ or less

Input resistance About 5.6 ㏀ (%IX0.0.0~%IX0.0.7: About 2.7㏀)

About 2.7㏀ (%IX0.0.0 ~%IX0.0.7: About 1.8㏀)

Response time

Off → On

1/3/5/10/20/70/100㎳ (set by CPU parameter) Default: 3 ㎳

On → Off

Insulation pressure

AC560Vrms / 3Cycle (altitude 2000m)

Insulation resistance

10 ㏁ or more by Mega ohmmeter Common method 16 point / COM Proper cable size 0.3 ㎟ Current consumption

200 ㎃ (when all point On) Operation indicator Input On, LED On External connection method 24 points connecting connector (M3 X 6 screw) Weight 500g 600g

Circuit configuration

No. Contact No.

Conta

Type

TB1 RX

TB2 485+

TB3 TX

TB4 485-

TB5 SG

TB6 00

TB7 01

TB8 02

TB9 03

TB10 04

TB11 05

TB12 06

TB13 07

TB14 08

TB15 09

TB16 10

TB17 11

TB18 12

TB19 13

TB20 14

TB21 15

TB22 COM

TB23

24G

DC24V

Internal circuit

0 B10

COM

Photocoupler

Terminal block no.

A03

B02

7-7

Chapter 7 Input/Output Specifications

TB24 24V

7.2.2 XEC-DR64H / XEC-DN64H input unit (Source/Sink Type)

Model

Specification

Main unit

XEC-DN64H XEC-DR64H XEC-DR64H/D1

Input point

32 point

Insulation method

Photo coupler insulation

Rated input voltage

DC24V

DC 12/24V

Rated input current

About 4 ㎃ (point 0~7: About 10 ㎃)

About 5/10㎃ (point 0~7: About 7/15㎃)

Operation voltage range DC20.4~28.8V (ripple rate < 5%)

DC 9.5~30V (ripple rate < 5%)

On Voltage/Current

DC19V or higher / 3 ㎃ or higher

DC9V or higher / 3 ㎃ or higher

Off Voltage/Current

DC6V or less / 1㎃ or less

DC5V or less / 1㎃ or less

Input resistance

About 5.6 ㏀ (%IX0.0.0~%IX0.0.7: About 2.7 ㏀)

About 2.7㏀ (%IX0.0.0 ~%IX0.0.7: About 1.8㏀)

Response time

Off → On

1/3/5/10/20/70/100㎳ (set by CPU parameter) Default: 3 ㎳

On → Off

Insulation pressure

AC560Vrms / 3Cycle (altitude 2000m)

Insulation resistance

10㏁ or more by Mega ohmmeter

Common method

16 point / COM

Proper cable size

0.3㎟

Current consumption

200㎃ (when all point On)

Operation indicator

Input On, LED On

External connection method

42 point connecting connector (M3 X 6 screw)

Weight

800g

900g

Circuit configuration

No. contact No.

con tact

type

TB1 RX

TB2 485+

TB3 TX

TB4 485-

TB5 SG

TB6 00

TB7 01

TB8 02

TB9 03

TB10 04

TB11 05

TB12 06

TB13 07

TB14 08

TB15 09

TB16 10

TB17 11

TB18 12

TB19 13

TB20 14

TB21 15

TB22 COM

TB23 NC

TB24 16

TB25 17

TB26 18

TB27 19

TB28 20

TB29 21

TB30 22

TB31 23

TB32 24

TB33 25

TB34 26

TB35 27

TB36 28

TB37 29

TB38 30

TB39 31

TB40 COM

TB41

DC24V

Internal

circuit

00 TB6

COM0

Photo coupler

TB21

TB22 R DC24V

10 TB24

COM1

Photo coupler

Terminal block no.

TB39

TB40

7-8

LSIS XEC-DR32H, XEC-DN64H, XEC-DP64H, XEC-DR32H/D1, XEC-DN32H User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual