LSIS XBC-DP20SU, XGT Series, XBC-DR30SU, XBC-DN20SU, XBC-DN20S User Manual

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BEHA OTOMASYON

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PLC XGB-XBC SERİLERİ

KULLANIM KILAVUZU

Right choice for ultimate yield

LSIS strives to maximize customers' profit in gratitude of choosing us for your partner.

Programmable Logic Controller

XBC Standard/Economic Type Main Unit

User’s Manual



Read this manual carefully before installing, wiring, operating, servicing or inspecting this equipment.

 Keep this manual within easy reach

for quick reference.

XBC-DR10E XBC-DN10E XBC-DP10E XBC-DR14E XBC-DN14E XBC-DP14E XBC-DR20E XBC-DN20E XBC-DP20E XBC-DR30E XBC-DN30E XBC-DP30E

XGT Series

http://eng.lsis.biz

Main unit

XBC-DR20SU XBC-DN20S(U) XBC-DP20SU XBC-DR30SU XBC-DN30S(U) XBC-DP30SU XBC-DR40SU XBC-DN40SU XBC-DP40SU XBC-DR60SU XBC-DN60SU XBC-DP60SU

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Safety Instruction

Warning

Caution

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Before using the product …

For your safety and effective operation, please read the safety instructions thoroughly before using the product.

► Safety Instructions should always be observed in order to prevent accident

or risk with the safe and proper use the product.

► Instructions are separated into “Warning” and “Caution”, and the meaning of

the terms is as follows;

This symbol indicates the possibility of serious injury or death if some applicable instruction is violated

This symbol indicates the possibility of slight injury or damage to products if some applicable instruction is violated

► The marks displayed on the product and in the user’s manual have the

following meanings.

Be careful! Danger may be expected. Be careful! Electric shock may occur.

► The user’s manual even after read shall be kept available and accessible to

any user of the product.

Safety Instruction

 Please, install protection circuit on the exterior of PLC to protect

the whole control system from any error in external power or PLC

module. Any abnormal output or operation may cause serious problem

in safety of the whole system.

- Install applicable protection unit on the exterior of PLC to protect the system from physical damage such as emergent stop switch, protection circuit, the upper/lowest limit switch, forward/reverse operation interlock circuit, etc.

- If any system error (watch-dog timer error, module installation error, etc.) is detected during CPU operation in PLC, the whole output is designed to be turned off and stopped for system safety. However, in case CPU error if caused on output device itself such as relay or TR can not be detected, the output may be kept on, which may cause serious problems. Thus, you are recommended to install an addition circuit to monitor the output status.

 Never connect the overload than rated to the output module nor

allow the output circuit to have a short circuit, which may cause a fire.

 Never let the external power of the output circuit be designed to

be On earlier than PLC power, which may cause abnormal output or

operation.

 In case of data exchange between computer or other external

equipment and PLC through communication or any operation of PLC (e.g. operation mode change), please install interlock in the sequence program to protect the system from any error. If not, it

may cause abnormal output or operation.

Warning

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Safety Instructions when designing

Safety Instruction

 I/O signal or communication line shall be wired at least 100mm

away from a high-voltage cable or power line. If not, it may cause

abnormal output or operation.

Caution

 Use PLC only in the environment specified in PLC manual or

general standard of data sheet. If not, electric shock, fire, abnormal operation of the product or flames may be caused.

 Before installing the module, be sure PLC power is off. If not,

electric shock or damage on the product may be caused.

 Be sure that each module of PLC is correctly secured. If the

product is installed loosely or incorrectly, abnormal operation, error or dropping may be caused.

 Be sure that I/O or extension connecter is correctly secured. If

not, electric shock, fire or abnormal operation may be caused.

 If lots of vibration is expected in the installation environment,

don’t let PLC directly vibrated. Electric shock, fire or abnormal operation may be caused.

 Don’t let any metallic foreign materials inside the product, which

may cause electric shock, fire or abnormal operation..

Caution

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Safety Instructions when designing

Safety Instruction

 Prior to wiring, be sure that power of PLC and external power is

turned off. If not, electric shock or damage on the product may be

caused.

 Before PLC system is powered on, be sure that all the covers of

the terminal are securely closed. If not, electric shock may be caused

Warning

 Let the wiring installed correctly after checking the voltage rated

of each product and the arrangement of terminals. If not, fire, electric shock or abnormal operation may be caused.

 Secure the screws of terminals tightly with specified torque when

wiring. If the screws of terminals get loose, short circuit, fire or abnormal

operation may be caused.

 Surely use the ground wire of Class 3 for FG terminals, which is

exclusively used for PLC. If the terminals not grounded correctly,

abnormal operation may be caused.

 Don’t let any foreign materials such as wiring waste inside the

module while wiring, which may cause fire, damage on the product

or abnormal operation.

Caution

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Safety Instructions when wiring

Safety Instruction

 Don’t touch the terminal when powered. Electric shock or abnormal

operation may occur.

 Prior to cleaning or tightening the terminal screws, let all the

external power off including PLC power. If not, electric shock or abnormal operation may occur.

 Don’t let the battery recharged, disassembled, heated, short or

soldered. Heat, explosion or ignition may cause injuries or fire.

Warning

 Don’t remove PCB from the module case nor remodel the module.

Fire, electric shock or abnormal operation may occur.

 Prior to installing or disassembling the module, let all the external

power off including PLC power. If not, electric shock or abnormal

operation may occur.

 Keep any wireless installations or cell phone at least 30cm away

from PLC. If not, abnormal operation may be caused.

Caution

 Product or battery waste shall be processed as industrial waste.

The waste may discharge toxic materials or explode itself.

Caution

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Safety Instructions for test-operation or repair

Safety Instructions for waste disposal

Revision History

1. XGB output module added

3. Sequence diagram on troubleshooting fixed

1. XGB SU type added

2. RTC option board added (XBO-RTCA)

Chapter 9

1. XGB SU type added

(XBO-DC04A, XBC-TN04A, XBO-M2MB)

Ch12

1. XGB E type added XBC-DP10E, XBC-DP14E, XBC-DP20E, XBC-DP30E)

1. XGB SU type added

2. Data Backup time modified

4-14

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ersion Date Remark Page

V 1.0 2010.3

V 1.1 2010.12

V 1.2 2010.12

V 1.3 2011.06

V1.4 2012.01

V1.5 2013.01

1. First Edition -

(XBC-RY08B, XBE-DC16B)

2. Error fixed

(XBC-DN20SU, XBC-DN30SU)

(XBC-DN40SU, XBC-DN60SU, XBC-DR40SU, XBC-DR60SU)

2. XGB option module added

(XBC-DN10E, XBC-DN14E, XBC-DN20E, XBC-DN30E,

(XBC-DP20SU, XBC-DP30SU, XBC-DP40SU, XBC-DP60SU)

Ch10, Ch11,

※ The number of User’s manual is indicated the right side of the back cover.

About User’s Manual

Title

Description

No. of User

Manual

XG5000 User’s Manual

It describes how to use XG5000 software especially about online functions such as programming, printing, monitoring and debugging by using XGT series products.

10310000512

XGK/XGB Series Instruction & Programming

It describes how to use the instructions for programming using XGK/XGB series.

10310000510

XGB Analog User’s Manual

It describes how to use the specification of analog input/analog output/temperature input module, system configuration and built-in PID control for XGB main unit.

10310000920

XGB Cnet I/F User’s Manual

It describes how to use built-in communication function for XGB main unit and external Cnet I/F module.

10310000816

XGB Fast Ethernet I/F User’s Manual

It describes how to use XGB FEnet I/F module.

10310000873

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About User’s Manual

Congratulations on purchasing PLC of LSIS Co.,Ltd. Before use, make sure to carefully read and understand the User’s Manual about the functions, performances, installation and programming of the product you purchased in order for correct use and importantly, let the end user and maintenance administrator to be provided with the User’s Manual.

The Use’s Manual describes the product. If necessary, you may refer to the following description and order accordingly. In addition, you may connect our website(http://eng.lsis.biz/) and download the information as a PDF file.

Relevant User’s Manual

◎ Contents ◎

Chapter 1 Introduction ............................................................................................. 1-1~1-5

Chapter 2 System Configuration ............................................................................... 2-1~2-14

Chapter 3 General Specifications ...................................................................................... 3-1

Chapter 4 CPU Specifications ................................................................................... 4-1~4-14

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1.1 Guide to Use This Manual ............................................................................................. 1-1

1.2 Features ........................................................................................................................ 1-2

1.3 Terminology ................................................................................................................... 1-4

2.1 XGB System Configuration ......................................................................................... 2-1

2.2 Product List .................................................................................................................. 2-3

2.3 Classification and Type of Product Name ................................................................... 2-5

2.3.1 Classification and type of basic unit ......................................................................... 2-5

2.3.2 Classification and type of expansion module ........................................................... 2-7

2.3.3 Classification and type of special module ................................................................ 2-8

2.3.4 Classification and type of communication module ..................................................... 2-9

2.4 System Configuration ................................................................................................ 2-11

2.4.1 Cnet I/F system ........................................................................................................ 2-11

2.4.2 Ethernet system ....................................................................................................... 2-14

3.1 General Specifications .................................................................................................. 3-1

4.1 Performance Specifications ......................................................................................... 4-1

4.2 Names of Part and Function ........................................................................................ 4-7

4.3 Power Supply Specifications ..................................................................................... 4-10

4.4 Calculating Example of Consumption Current/Voltage ............................................. 4-13

4.5 Data Backup Time ..................................................................................................... 4-14

Chapter 5 Program Configuration and Operation Method ........................................ 5-1~5-37

Chapter 6 CPU Functions ......................................................................................... 6-1~6-25

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5.1 Program Instruction ..................................................................................................... 5-1

5.1.1 Program execution methods .................................................................................... 5-1

5.1.2 Operation processing during momentary power failure ........................................... 5-2

5.1.3 Scan time .................................................................................................................. 5-3

5.1.4 Scan Watchdog timer ............................................................................................... 5-5

5.1.5 Timer processing ...................................................................................................... 5-6

5.1.6 Counter processing .................................................................................................. 5-9

5.2 Program Execution .................................................................................................... 5-11

5.2.1 Configuration of program ........................................................................................ 5-11

5.2.2 Program execution methods .................................................................................... 5-11

5.2.3 Interrupt . .................................................................................................................. 5-13

5.3 Operation Mode ......................................................................................................... 5-25

5.3.1 RUN mode .............................................................................................................. 5-25

5.3.2 STOP mode ............................................................................................................ 5-26

5.3.3 DEBUG mode ......................................................................................................... 5-26

5.3.4 Change operation mode ......................................................................................... 5-30

5.4 Memory ....................................................................................................................... 5-31

5.4.1 Data memory .......................................................................................................... 5-31

5.5 Configuration Diagram of Data Memory .................................................................... 5-33

5.5.1 “S” type ..................................................................................................................... 5-33

5.5.2 “H” type ..................................................................................................................... 5-34

5.5.3 Data latch area setting ............................................................................................. 5-35

6.1 Type Setting ................................................................................................................. 6-1

6.2 Parameter Setting ........................................................................................................ 6-2

6.2.1 Basic parameter setting ............................................................................................ 6-2

6.2.2 I/O parameter setting ................................................................................................ 6-3

6.3 Self-diagnosis Function ............................................................................................... 6-4

6.3.1 Saving of error log .................................................................................................... 6-4

6.3.2 Troubleshooting ........................................................................................................ 6-4

6.4 Remote Functions ......................................................................................................... 6-6

Chapter 7 Input/Output Specifications ..................................................................... 7-1~7-74

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6.5 Forced Input/Output On and Off Function ..................................................................... 6-7

6.5.1 Force I/O setup ......................................................................................................... 6-7

6.5.2 Processing time and method of Forced Input/Output On and Off ............................ 6-8

6.6 Direct Input/Output Operation ..................................................................................... 6-9

6.7 Diagnosis of External Device .................................................................................... 6-10

6.8 Allocation of Input/Output Number ............................................................................ 6-11

6.9 Online Editing ............................................................................................................ 6-13

6.10 Reading Input/Output Information ............................................................................. 6-16

6.11 Monitoring ................................................................................................................ 6-17

6.12 Program Upload Prohibit ......................................................................................... 6-22

6.13 Clear All PLC ........................................................................................................... 6-23

6.14 Password Setting per Program Block ..................................................................... 6-24

7.1 Introduction .................................................................................................................. 7-1

7.2 Main Unit Digital Input Specifications .......................................................................... 7-7

7.2.1 XBC-DR10E 6 point DC24V input (Source/Sink type) ............................................... 7-7

7.2.2 XBC-DR14E 8 point DC24V input (Source/Sink type) ............................................... 7-8

7.2.3 XBC-DR20E 12 point DC24V input (Source/Sink type) ............................................. 7-9

7.2.4 XBC-DR30E 18 point DC24V input (Source/Sink type) ........................................... 7-10

7.2.5 XBC-DN10E 6 point DC24V input (Source/Sink type) ............................................. 7-11

7.2.6 XBC-DN14E 8 point DC24V input (Source/Sink type) ............................................. 7-12

7.2.7 XBC-DN20E 12 point DC24V input (Source/Sink type) ........................................... 7-13

7.2.8 XBC-DN30E 18 point DC24V input (Source/Sink type) ........................................... 7-14

7.2.9 XBC-DP10E 6 point DC24V input (Source/Sink type) ............................................. 7-15

7.2.10 XBC-DP14E 8 point DC24V input (Source/Sink type) ........................................... 7-16

7.2.11 XBC-DP20E 12 point DC24V input (Source/Sink type) ......................................... 7-17

7.2.12 XBC-DP30E 18 point DC24V input (Source/Sink type) ......................................... 7-18

7.2.13 XBC-DN20S 18 point DC24V input (Source/Sink type) ......................................... 7-19

7.2.14 XBC-DN30S 18 point DC24V input (Source/Sink type) ......................................... 7-20

7.2.15 XBC-DR20SU 12 point DC24V input (Source/Sink type) ...................................... 7-21

7.2.16 XBC-DR30SU 18 point DC24V input (Source/Sink type) ...................................... 7-22

7.2.17 XBC-DR40SU 24 point DC24V input (Source/Sink Type) ..................................... 7-23

7.2.18 XBC-DR60SU 36 point DC24V input (Source/Sink Type) ..................................... 7-24

7.2.19 XBC-DN20SU 12 point DC24V input (Source/Sink type) ...................................... 7-25

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7.2.20 XBC-DN30SU 18 point DC24V input (Source/Sink type) ...................................... 7-26

7.2.21 XBC-DN40SU 24 point DC24V input (Source/Sink Type) ..................................... 7-27

7.2.22 XBC-DN60SU 36 point DC24V input (Source/Sink Type) ..................................... 7-28

7.2.23 XBC-DP20SU 12 point DC24V input (Source/Sink type) ...................................... 7-29

7.2.24 XBC-DP30SU 18 point DC24V input (Source/Sink type) ...................................... 7-30

7.2.25 XBC-DP40SU 24 point DC24V input (Source/Sink Type)...................................... 7-31

7.2.26 XBC-DP60SU 36 point DC24V input (Source/Sink Type)...................................... 7-32

7.3 Main Unit Digital Output Specifications ..................................................................... 7-33

7.3.1 XBC-DR10E 4 point relay output ............................................................................. 7-33

7.3.2 XBC-DR14E 6 point relay output ............................................................................. 7-34

7.3.3 XBC-DR20E 8 point relay output ............................................................................. 7-35

7.3.4 XBC-DR30E 12 point relay output ........................................................................... 7-36

7.3.5 XBC-DN10E 4 point transistor output (Sink type) .................................................... 7-37

7.3.6 XBC-DN14E 6 point transistor output (Sink type) .................................................... 7-38

7.3.7 XBC-DN20E 8 point transistor output (Sink type) .................................................... 7-39

7.3.8 XBC-DN30E 12 point transistor output (Sink type) .................................................. 7-40

7.3.9 XBC-DP10E 4 point transistor output (Source type) ................................................ 7-41

7.3.10 XBC-DP14E 6 point transistor output (Source type).............................................. 7-42

7.3.11 XBC-DP20E 8 point transistor output (Source type) .............................................. 7-43

7.3.12 XBC-DP30E 12 point transistor output (Source type)............................................ 7-44

7.3.13 XBC-DR20SU 8 point relay output ......................................................................... 7-45

7.3.14 XBC-DR30SU 12 point relay output ....................................................................... 7-46

7.3.15 XBC-DR40SU 16 point relay output ....................................................................... 7-47

7.3.16 XBC-DR60SU 24 point relay output ....................................................................... 7-48

7.3.17 XBC-DN20S(U) 8 point transistor output (Sink type) ............................................. 7-49

7.3.18 XBC-DN30S(U) 12 point transistor output (Sink type) ........................................... 7-50

7.3.19 XBC-DN40SU 16 point TR output (Sink type) ....................................................... 7-51

7.3.20 XBC-DN60SU 24 point TR output (Sink type) ....................................................... 7-52

7.3.21 XBC-DP20SU 8 point transistor output (Source type) ........................................... 7-53

7.3.22 XBC-DP30SU 12 point transistor output (Source type) ......................................... 7-54

7.3.23 XBC-DP40SU 16 point TR output (Source type) ................................................... 7-55

7.3.24 XBC-DP60SU 24 point TR output (Source type) ................................................... 7-56

7.4 Digital Input Module Specifications ............................................................................ 7-57

7.4.1 8 point DC24V input module (Source/Sink type) .................................................... 7-57

7.4.2 16 point DC24V input module (Source/Sink type) .................................................. 7-58

7.4.3 32 point DC24V input module (Source/Sink type) ................................................... 7-59

Chapter 8 Built-in High-speed Counter Function .................................................... 8-1~8-54

Chapter 9 RTC Option Board ...................................................................................... 9-1~9-5

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7.5 Digital Output Module Specifications ......................................................................... 7-60

7.5.1 8 point relay output module ...................................................................................... 7-60

7.5.2 8 point relay output module (independent point) ...................................................... 7-61

7.5.3 16 point relay output module .................................................................................... 7-62

7.5.4 8 point transistor output module (Sink type) ............................................................ 7-63

7.5.5 16 point transistor output module (Sink type) .......................................................... 7-64

7.5.6 32 point transistor output module (Sink type) .......................................................... 7-65

7.5.7 8 point transistor output module (Source type) ........................................................ 7-66

7.5.8 16 point transistor output module (Source type) ...................................................... 7-67

7.5.9 32 point transistor output module (Source type) ...................................................... 7-68

7.6 Combined Digital I/O module Input Specification ....................................................... 7-69

7.6.1 8 point DC24V input (Source/Sink type) .................................................................. 7-69

7.7 Combined Digital I/O module Output Specification .................................................... 7-70

7.7.1 8 point relay output ................................................................................................... 7-70

7.8 IO Wiring by Using Smart Link Board ....................................................................... 7-71

7.8.1 Smart link board ....................................................................................................... 7-71

8.1 High-speed Counter Specifications ............................................................................... 8-1

8.1.1 Performance specifications ...................................................................................... 8-1

8.1.2 Designation of parts .................................................................................................. 8-3

8.1.3 “E” type Functions .................................................................................................. 8-6

8.1.4 “S(U)” type Functions ........................................................................................... 8-23

8.2 Installation and Wiring ............................................................................................... 8-40

8.2.1 Precaution for wiring ............................................................................................... 8-40

8.2.2 Example of wiring ................................................................................................... 8-40

8.3 Internal Memory ......................................................................................................... 8-41

8.3.1 Special area for High-speed counter ...................................................................... 8-41

8.3.2 Error code ............................................................................................................... 8-49

8.4 Examples: Using High-speed Counter ...................................................................... 8-50

9.1 Battery ........................................................................................................................... 9-1

Chapter 10 DC Input Option Function ................................................................... 10-1~10-15

Chapter 11 TR Output Option Board ...................................................................... 11-1~11-16

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9.1.1 Battery specification ................................................................................................. 9-1

9.1.2 Notice in using ............................................................................................................ 9-1

9.1.3 Life of battery .............................................................................................................. 9-1

9.1.4 How to change battery ............................................................................................... 9-2

9.2 RTC Function ................................................................................................................ 9-3

9.2.1 How to use ................................................................................................................. 9-3

9.3 Name and Function of Each Part .................................................................................. 9-5

10.1 DC input Option Board Specification ....................................................................... 10-1

10.1.1 DC input Option Board Specification ..................................................................... 10-1

10.2 High Speed Counter Specification ........................................................................... 10-2

10.2.1 Performance Specification .................................................................................... 10-2

10.2.2 Name of Each Part ............................................................................................... 10-3

10.2.3 Function .................................................................................................................. 10-5

10.3 Installation and Wiring ............................................................................................... 10-9

10.3.1 Power wiring ........................................................................................................... 10-9

10.3.2 Example of wiring ................................................................................................... 10-9

10.4 Internal Memory ...................................................................................................... 10-11

10.4.1 Special area for High-speed counter .................................................................... 10-11

10.5 Example using high-speed counter ......................................................................... 10-15

11.1 TR Output Option Board Operation Sequence of Positioning ................................. 11-1

11.1.1 Operation Sequence of Positioning ....................................................................... 11-1

11.2 XBO-TN04A Specification ........................................................................................ 11-2

11.2.1 Output option board specification ......................................................................... 11-2

11.3 Positioning Specification ............................................................................................ 11-3

11.3.1 Performance Specification ...................................................................................... 11-3

11.3.2 Name of each part .................................................................................................. 11-3

11.3.3 Before Positioning .................................................................................................. 11-5

11.3.4 Positioning Stop Factor .......................................................................................... 11-7

11.3.5 Manual operation .................................................................................................... 11-8

Chapter 12 Memory Module .................................................................................... 12-1~12-9

Chapter 13 Installation and Wiring ...................................................................... 13-1~13-18

Chapter 14 Maintenance ....................................................................................... 14-1~14-2

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11.3.6 Home return ............................................................................................................ 11-9

11.3.7 Positioning Basic Parameter Setup ...................................................................... 11-10

11.4 Positioning Instruction List ....................................................................................... 11-14

11.5 Positioning Example ................................................................................................ 11-15

12.1 Memory Module Specification ................................................................................... 12-1

12.1.1 Memory module specification ................................................................................ 12-1

12.1.2 Memory module structure ...................................................................................... 12-1

12.1.3 How to use memory module .................................................................................. 12-2

12.1.4 How to use when password is set ......................................................................... 12-7

13.1 Safety Instruction ..................................................................................................... 13-1

13.1.1 Fail safe circuit....................................................................................................... 13-3

13.1.2 PLC heat calculation .............................................................................................. 13-6

13.2 Attachment/Detachment of Modules ....................................................................... 13-8

13.2.1 Attachment/Detachment of modules ................................................................... 13-8

13.2.2 Caution in handling .............................................................................................. 13-13

13.3 Wire ......................................................................................................................... 13-14

13.3.1 Power wiring ......................................................................................................... 13-14

13.3.2 I/O Device wiring .................................................................................................. 13-17

13.3.3 Grounding wiring .................................................................................................. 13-17

13.3.4 Specifications of wiring cable ............................................................................... 13-18

14.1 Maintenance and Inspection ................................................................................... 14-1

14.2 Daily Inspection ....................................................................................................... 14-1

14.3 Periodic Inspection .................................................................................................. 14-2

Chapter 15 Troubleshooting ................................................................................ 15-1~15-12

Appendix 1 Flag List ................................................................................ App. 1-1~App.1-13

Appendix 2 Dimension ................................................................................. App.2-1~App.2-4

Appendix 3 Compatibility with MASTER-K ................................................... App.3-1~App.3-6

Appendix 4 Instruction List ......................................................................... App.4-1~App.4-40

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15.1 Basic Procedure of Troubleshooting ....................................................................... 15-1

15.2 Troubleshooting ......................................................................................................... 15-1

15.2.1 Troubleshooting flowchart used with when the PWR(Power) LED turns Off. ........ 15-2

15.2.2 Troubleshooting flowchart used with when the ERR(Error) LED is flickering ...... 15-3

15.2.3 Troubleshooting flowchart used with when the RUN,STOP LED turns Off. ......... 15-4

15.2.4 Troubleshooting flowchart used with when the I/O part doesn’t operate normally..15-5

15.3 Troubleshooting Questionnaire ............................................................................... 15-7

15.4 Troubleshooting Examples ...................................................................................... 15-8

15.4.1 Input circuit troubles and corrective actions ......................................................... 15-8

15.4.2 Output circuit and corrective actions ...................................................................... 15-9

15.5 Error Code List ........................................................................................................ 15-11

Appendix 1.1 Special Relay (F) List ........................................................................... App. 1-1

Appendix 1.2 Communication Relay (L) List .............................................................. App. 1-6

Appendix 4.1 Classification of Instructions ................................................................. App.4-1

Appendix 4.2 Basic Instructions ................................................................................ App.4-2

Appendix 4.3 Application Instruction ......................................................................... App.4-5

Appendix 4.4 Special/Communication Instruction ................................................... App.4-37

Chapter 1 Introduction

1.1 Guide to Use This Manual

No.

Title

Contents

Chapter 1

Introduction

Describes configuration of this manual, unit‟s features and terminology.

Chapter 2

System Configurations

Describes available units and system configuration in the XGB series.

Chapter 3

General Specifications

Describes general specifications of units used in the XGB series.

Chapter 4

CPU Specifications

Describes performances, specifications and operations.

Chapter 5

Program Configuration and Operation Method

Chapter 6

CPU Module Functions

Chapter 7

Input/Output Specifications

Describes operation of basic and input/output.

Chapter 8

Built-in High-speed Counter Function

Describes built-in high-speed counter functions.

Chapter 9

Installation and Wiring

Describes installation, wiring and handling instructions for reliability of the PLC system.

Chapter 10

Maintenance

Describes the check items and method for long-term normal operation of the PLC system.

Chapter 11

Troubleshooting

Describes various operation errors and corrective actions.

Appendix 1

Flag List

Describes the types and contents of various flags.

Appendix 2

Dimension

Shows dimensions of the main units and expansion modules.

Appendix 3

Compatibility with MASTER-K

Describes the compatibility with MASTER-K.

Appendix 4

Instruction List

Describes the special relay and instruction list.

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Chapter 1 Introduction

This manual includes specifications, functions and handling instructions for the XGB series PLC. This manual is divided up into chapters as follows.

1-1

Chapter 1 Introduction

1.2 Features

Item

Type

Reference

XBC-DRxxE

XBC-DxxxS(U)

Operation processing speed

0.24 ㎲ / Step

94ns / Step

Max IO contact point

38 points

284 points

In case of using option module 4 points (Coming soon)

Program capacity

4kstep

15kstep

Max. no. of expanded stage

Option module 2 stages

7 stages (including option module 2 stages)

Item

Type

Size (W * H * D)

Reference

Basic unit

XBC-Dx20S

135*90*64 “S” type

XBC-Dx30S

XBC-Dx20SU

“SU” type

XBC-Dx30SU

XBC-Dx40SU

161 * 90 * 64

XBC-Dx60SU

210 * 90 * 64

XBC-Dx10E

100*90*64

“E” type

XBC-Dx14E

XBC-Dx20E

135*90*64 XBC-Dx30E

Extension module

XBE-,XBF-,XBL-

20 * 90 * 60

Basis of minimum size

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The features of XGB system are as follows.

(1) The system secures the following high performances.

(a) High Processing Speed (b) Max. 284 I/O control supporting small & mid-sized system implementation

(d) Expanded applications with the support of floating point. (e) XBC-DRxxE is expressed as “E” type and XBC-DxxxS(U) is expressed as “S(U)” type. (2) Compact : the smallest size comparing to the same class model of competitors.

(a) Compact panel realized through the smallest size. (Unit: mm)

(3) Easy attachable/extensible system for improved user convenience.

(a) By adopting a removable terminal block connector (M3 X 6 screw), convenience of wiring may be

increased. (“S(U)” type main unit)

(b) By adopting connector coupling method, modules may be easily connected and separated.

(4) Improved maintenance ability with kinds of register, RTC option, comment backup and etc

(a) Convenient programming environment by providing analogue register and index register.

(b) Improved maintenance ability by operating plural programs and task program through module program.

1-2

Chapter 1 Introduction

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(d) Improved maintenance ability by types of comment backup. (e) Built-in RTC function enabling convenient history and schedule management

(5) Optimized communication environment.

(a) With max. 2 channels of built-in COM (1 channel for “E” type (except load port)), communication is

available without any expanded of module.

(b) Supporting various protocols to improve the convenience (dedicated, Modbus, user-defined

communication)

Enet and etc). (“S(U)” type main unit) (d) Convenient network-diagnostic function through network & communication frame monitoring. (e) Convenient networking to upper systems through Enet or Cnet. (“S(U)” type main unit)

(6) Applications expanded with a variety of I/O modules.

(a) 8, 16, 32 points modules provided (if relay output, 8/16 points module). (b) Single input, single output and combined I/O modules supported.

(7) Applications expanded through analog-dedicated register design and full attachable mechanism.

(a) All analogue modules can be attachable on extension base. (“S(U)” type: up to 7 stages available)

(b) With analog dedicated register(U) and monitoring dedicated function, convenient use for I/O is

maximized (can designate operations using easy programming of U area and monitoring function)

(8) Integrated programming environment

(a) XG 5000: intensified program convenience, diverse monitoring, diagnosis and editing function (b) XG - PD: COM/network parameters setting, frame monitoring, protocol analysis function

(9) Built-in high speed counter function

(a) Providing High-speed counter 1phase, 2phase and more additional functions.

(b) Providing parameter setting, diverse monitoring and diagnosis function using XG5000.

others.

(10) Built-in position control function (“S(U)” type TR output main unit)

(a) Supporting max 100Kpps 2 axes.

(b) Providing parameter setting, operation data collection, diverse monitoring and diagnosis by using

XG5000.

setting.

1-3

Chapter 1 Introduction

1.3 Terminology

Terms

Definition

Remark

Module

A standard element that has a specified function which configures the system. Devices such as I/O board, which inserted onto the mother board.

Example) Expansion module, Special module, Communication module

Unit

A single module or group of modules that perform an independent operation as a part of PLC systems.

Example) Main unit, Expansion unit

PLC System

A system which consists of the PLC and peripheral devices. A user program can control the system.

XG5000

A program and debugging tool for the MASTER-K series. It executes program creation, edit, compile and debugging. (PADT: Programming Added Debugging Tool)

XG - PD

Software to execute description, edition of basic parameter, high speed link, P2P parameter, and function of communication diagnosis

I/O image area

Internal memory area of the CPU module which used to hold I/O status.

Cnet

Computer Network

FEnet

Fast Ethernet Network

Pnet

Profibus-DP Network

Dnet

DeviceNet Network

RTC

Abbreviation of „Real Time Clock‟. It is used to call general IC that contains clock function.

Watchdog Timer

Supervisors the pre-set execution times of programs and warns if a program is not competed within the pre-set time.

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(11) Built-in PID (“S(U)” type main unit)

(a) Supporting max. 16 loops.

(b) Setting parameters by using XG5000 and supporting loop status monitoring conveniently with trend

monitor.

(d) With many other additional functions including PWM output, ∆MV, ∆PV and SV Ramp, improving the

control preciseness.

(e) Supporting types of control modes such as forward/backward mixed operation, 2-stage SV PID control,

cascade control and etc.

(f) A variety of warning functions such as PV MAX and PV variation warning securing the safety.

The following table gives definition of terms used in this manual.

1-4

Chapter 1 Introduction

Terms

Definition

Remark

Sink Input

Current flows from the switch to the PLC input terminal if a input signal turns on.

Z: Input impedance

Source Input

Current flows from the PLC input terminal to the switch after a input signal turns on.

Sink Output

Current flows from the load to the output terminal and the PLC output turn on.

Source Output

Current flows from the output terminal to the load and the PLC output turn on.



Output Contact

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1-5

Chapter 2 System Configuration

2.1 XGB System Configuration

Item

Description

Total I/O points

 XBC-DxxxS (“S(U)” type): 20~284 points

 XBC-DxxxE (“E” type): 10~38 points

Maximum number of expansion modules

Digital I/O module

 “S(U)” type: Max. 7

Special module

 “S(U)” type: Max. 7

Communication I/F module

 “S(U)” type: Max. 2

Option module

 “S(U)” type: Max. 2

 “E” type: Max. 2

(In case of 10/14 points, only one is available)

Items

Main unit “S” type

 XBC-DR20/30/40/60SU  XBC-DN20/30S  XBC-DN20/30/40/60SU  XBC-DP20/30/40/60SU

“E” type

 XBC-DR10/14/20/30E  XBC-DN10/14/20/30E  XBC-DP10/14/20/30E

Main Unit

I/O Module

Special Module

Communication Module

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Chapter 2 System Configuration

The XGB series has suitable to configuration of the basic, computer link and network systems. This chapter describes the configuration and features of each system.

XGB series System Configuration is as follows. For “E” type, only option module can be attached For “S” type, up to 7 stages connection is available. But in case of attaching 2 option modules, up to 5

stages connection is available. (For communication module, up to 2 connection is available.)

2-1

Chapter 2 System Configuration

Item

Description

Items

Expansion module

Digital I/O module

 XBE-DC08/16A/B/32A  XBE-RY08A/B/16A

 XBE-TN08/16/32A

 XBE-DR16A

 XBE-TP08/16/32A

A/D·D/A module

 XBF-AD04A  XBF-AH04A  XBF-RD04A  XBF-HO02A  XBF-DC04C

 XBF-DV04A  XBF-TC04S  XBF-AD08A  XBF-AD04C

 XBF-DC04A  XBF-PD02A  XBF-HD02A  XBF-DV04C

Communication I/F module

 XBL-C41A  XBL-EMTA  XBL-CSEA

 XBL-C21A  XBL-EIMT

 XBL-EIPT  XBL-CMEA

Option module

Digital I/O module

 XBO-DC04A  XBO-TN04A

Special module

 XBO-AD02A  XBO-RD01A

 XBO-DA02A  XBO-TC02A

 XBO-AH02A

RTC module

 XBO-RTCA

Memory module

 XBO-M2MB

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2-2

Chapter 2 System Configuration

2.2 Product List

Types

Model

Description

Remark

Main Unit

XBC-DR32H

AC100~220V power supply, DC24V input 16 point, Relay output 16 point

XBC-DN32H

AC100~220V power supply, DC24V input 16 point, Transistor output 16 point

XBC-DR64H

AC100~220V power supply, DC24V input 32 point, Relay output 32 point

XBC-DN64H

AC100~220V power supply, DC24V input 32 point, Transistor output 32 point

XBC-DR20SU

AC100~220V power supply, DC 24V input 12 point, relay output 8 point

XBC-DN20S(U)

AC100~220V power supply, DC24V input 12 point, transistor 8 point

XBC-DP20SU

AC100~220V power supply, DC24V input 12 point, transistor 8 point

XBC-DR30SU

AC100~220V power supply, DC 24V input 18 point, relay output 12 point

XBC-DN30S(U)

AC100~220V power supply, DC 24V input 18 point, transistor output 12 point

XBC-DP30SU

AC100~220V power supply, DC 24V input 18 point, transistor output 12 point

XBC-DR40SU

AC100~220V power supply, DC 24V input 24 point, relay output 16 point

XBC-DN40SU

AC100~220V power supply, DC 24V input 24 point, transistor output 16 point

XBC-DP40SU

AC100~220V power supply, DC 24V input 24 point, transistor output 16 point

XBC-DR60SU

AC100~220V power supply, DC 24V input 36 point, relay output 24 point

XBC-DN60SU

AC100~220V power supply, DC 24V input 36 point, transistor output 24 point

XBC-DP60SU

AC100~220V power supply, DC 24V input 36 point, transistor output 24 point

XBC-DR10E

AC100~220V power supply, DC 24V input 6 point, relay output 4 point

XBC-DR14E

AC100~220V power supply, DC 24V input 8 point, relay output 6 point

XBC-DR20E

AC100~220V power supply, DC 24V input 12 point, relay output 8 point

XBC-DR30E

AC100~220V power supply, DC 24V input 18 point, relay output 12 point

XBC-DN10E

AC100~220V power supply, DC 24V input 6 point, transistor output 4 point

XBC-DN14E

AC100~220V power supply, DC 24V input 8 point, transistor output 6 point

XBC-DN20E

AC100~220V power supply, DC 24V input 12 point, transistor output 8 point

XBC-DN30E

AC100~220V power supply, DC 24V input 18 point, transistor output 12 point

XBC-DP10E

AC100~220V power supply, DC 24V input 6 point, transistor output 4 point

XBC-DP14E

AC100~220V power supply, DC 24V input 8 point, transistor output 6 point

XBC-DP20E

AC100~220V power supply, DC 24V input 12 point, transistor output 8 point

XBC-DP30E

AC100~220V power supply, DC 24V input 18 point, transistor output 12 point

XBM-DN16S

DC24V Power supply, DC24V Input 8 point, Transistor output 8 point

XBM-DN32S

DC24V Power supply, DC24V Input 16 point, Transistor output 16 point

XBM-DR16S

DC24V Power supply, DC24V Input 8 point, Relay output 8 point

Expansion Module

XBE-DC08A

DC24V Input 8 point

XBE-DC16A/B

DC24V Input 16 point

XBE-DC32A

DC24V Input 32 point

XBE-RY08A

Relay output 8 point

XBE-RY08B

Relay output 8 point (independent point)

XBE-RY16A

Relay output 16 point

XBE-TN08A

Transistor output 8 point

XBE-TN16A

Transistor output 16 point

XBE-TN32A

Transistor output 32 point

XBE-TN64A

Transistor output 64 point (sink type)

XBE-TP16A

Transistor output 16 point (source type)

XBE-TP32A

Transistor output 32 point (source type)

XBE-DR16A

DC24V Input 8 point, Relay output 8 point

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XGB series’ product list is as follows.

2-3

Chapter 2 System Configuration

Types

Model

Description

Remark

Special Module

XBF-AD04A

Current/Voltage input 4 channel

XBF-DC04A

Current output 4 channel

XBF-DV04A

Voltage output 4 channel

XBF-AH04A

Current/voltage input 2 channel, output 2 channel

XBF-RD04A

RTD (Resistance Temperature Detector) input 4 channel

XBF-TC04S

TC (Thermocouple) input 4 channel

XBF-AD08A

Current/voltage input 8 channel

XBF-PD02A

2 axes, line driver type

XBF-HD02A

High Speed Counter 2channel, line driver type

XBF-HO02A

High Speed Counter 2channel, open collector type

XBF-AD04C

Current/Voltage input 4 channel, High resolution

XBF-DV04C

Current output 4 channel, High resolution

XBF-DC04C

Voltage output 4 channel, High resolution

Communication

Module

XBL-C21A

Cnet (RS-232C/Modem) I/F

XBL-C41A

Cnet (RS-422/485) I/F

XBL-EMTA

Enet I/F

XBL-EIMT/F/H

RAPIEnet I/F

XBL-EIPT

EtherNet/IP module

XBL-CMEA

CANopen Master

XBL-CSEA

CANOpen Slave

Option

Module

XBO-M1024

Memory module

XBO-AD02A

Current/voltage input 2channel

XBO-DA02A

Current/voltage output 2 channel

XBO-AH02A

Current/Voltage input 1 channel, output 1 channel

XBO-RD01A

RTD input 1 channel

XBO-TC02A

Thermocouple input 2 channel

XBO-DC04A

DC 24V input 4 point (“S” type HSC 4 channel)

XBO-TN04A

Sink type transistor output 4 channel (“S” type Positioning 2 axes (low speed))

XBO-RTCA

RTC module

XBO-M2MB

Memory module

Download

Cable

PMC-310S

Connection cable (PC to PLC), 9pin(PC)-6pin(PLC)

USB-301A

Connection cable (PC to PLC), USB

Download Cable (PMC-310S) Diagram

Note

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2-4

Chapter 2 System Configuration

2.3 Classification and Type of Product Name

X B M - D R X X

Relay output (R) Sink type transistor output (N) Source type transistor output (P)

No. of IO point

XGB PLC economy (E) XGB PLC standard (S) XGB PLC High-end type (H)

XGB PLC

Module type basic unit (M) Compact type basic unit(C)

DC input

MK language supported (B) IEC language supported (E)

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2.3.1 Classification and type of basic unit

Name of basic unit is classified as follows.

2-5

Chapter 2 System Configuration

Classification

Name

DC input

Relay output

Transistor output

Power

Modular type main unit

XBM-DR16S

8 point

None

DC24V

XBM-DN16S

8 point

None

8 point

XBM-DN32S

16 point

None

16 point

Compact type main nit

XBC-DR32H

16 point

None

AC110V~220V

XBC-DN32H

16 point

None

16 point

XBC-DR64H

32 point

None

XBC-DN64H

32 point

None

32 point

XBC-DN20S(U)

12 point

None

8 point

XBC-DN30S(U)

18 point

None

12 point

XBC-DN40SU

24 point

None

16 point

XBC-DN60SU

36 point

None

24 point

XBC-DP20SU

12 point

None

8 point

XBC-DP30SU

18 point

None

12 point

XBC-DP40SU

24 point

None

16 point

XBC-DP60SU

36 point

None

24 point

XBC-DR20SU

12 point

8 point

None

XBC-DR30SU

18 point

12 point

None

XBC-DR40SU

24 point

16 point

None

XBC-DR60SU

36 point

24 point

None

XBC-DR10E

6 point

4 point

None

XBC-DR14E

8 point

6 point

None

XBC-DR20E

12 point

8 point

None

XBC-DR30E

18 point

12 point

None

XBC-DN10E

6 point

None

4 point

XBC-DN14E

8 point

None

6 point

XBC-DN20E

12 point

None

8 point

XBC-DN30E

18 point

None

12 point

XBC-DP10E

6 point

None

4 point

XBC-DP14E

8 point

None

6 point

XBC-DP20E

12 point

None

8 point

XBC-DP30E

18 point

None

12 point

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2-6

Chapter 2 System Configuration

Name

DC input

Relay output

Transistor output

Reference

XBE-DC08A

8 point

None

XBE-DC16A/B

16 point

None

XBE-DC32A

32 point

None

XBE-RY08A/B

None

8 point

None

XBE-RY16A

None

16 point

None

XBE-TN08A

None

8 point

Sink type

XBE-TN16A

None

16 point

XBE-TN32A

None

32 point

XBE-TP08A

None

8 point

Source type

XBE-TP16A

None

16 point

XBE-TP32A

None

32 point

XBE-DR16A

8 point

None

X B E - DC

X X

Relay output(RY) Transistor output (TN/TP) Digital input (DC) Digital input+ sink type transistor output (DN) Digital input+ source type transistor output (DP)

No. of IO point

XGB series

I/O expansion module

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2.3.2 Classification and type of expansion module

Name of expansion module is classified as follows.

2-7

Chapter 2 System Configuration

Classification

Name

No. of

input ch.

Input type

No. of

output ch.

Output type

Analog input

XBF-AD04A

Voltage/Current

None

XBF-AD08A

Voltage/Current

None

XBF-AD04C

Voltage/Current

None

Analog output

XBF-DC04A

None - 4

Current

XBF-DC04C

None - 4

Current

XBF-DV04A

None - 4

Voltage

XBF-DV04C

None - 4

Voltage

Analog I/O

XBF-AH04A

Voltage/Current

RTD input

XBF-RD04A

PT100/JPT100

None - TC input

XBF-TC04S

K, J, T, R

None - Position

XBF-PD02A

- - 2

LineDrive Type

High Speed

Counter

XBF-HD02A

LineDrive Type

XBF-HO02A

OpenCollector

Type

X B F - AD

X X

Analog input (AD) Analog voltage output (DC) Analog current output (DV) Voltage, current I/O (AH) RTD input (RD) Thermocouple input (TC)

Position (PD) High Speed Counter (HD, HO)

No. of IO point

XGB series

Expansion special module

Non-insulation type (A) Insulation type (S) High resolution (C)

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2.3.3 Classification and type of special module

Special module is classified as follows.

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Chapter 2 System Configuration

Classification

Name

Type

Cnet Comm. Module

XBL-C21A

RS-232C, 1 channel

XBL-C41A

RS-422/485, 1 channel

FEnet Comm. Module

XBL-EMTA

Electricity, open type Ethernet

RAPIEnet Comm. Module

XBL-EIMT

Comm. Module between PLCs, electric media, 100 Mbps industrial Ethernet supported

XBL-EIMF

Comm. Module between PLCs, fiberoptic media, 100 Mbps industrial Ethernet supported

XBL-EIMH

Comm. Module between PLCs, electric/ fiberoptic media, 100 Mbps industrial Ethernet supported

EtherNet/IP Comm. Module

XBL-EIPT

Electricity, open type Ethernet

CANopen

XBL-CMEA

CANopen Master

XBL-CSEA

CANopen Slave

X B L - C21A

Cnet 1 channel (RS-232C): C21A Cnet 1 channel (RS-422/485): C41A FEnet 1 port: EMTA RAPIEnet 2 port: EIMT/F/H EtherNet/IP 2 port: EIPT CANopen Master: CMEA CANopen Slave: CSEA

XGB series

Expansion communication module

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2.3.4 Classification and type of communication module

Name of communication module is classified as follows.

2-9

Chapter 2 System Configuration

Classification

Name

No. of input

Input type

No. of

output CH

Output type

DC input

XBO-DC04A

DC 24V

None - TR output

XBO-TN04A

None - 4

DC 24V

Analog input

XBO-AD02A

Voltage/current

None

Analog output

XBO-DA02A

None - 2

Voltage/current

Analog I/O

XBO-AH02A

Voltage/current

RTD input

XBO-RD01A

PT100/JPT100

None - TC input

XBO-TC02A

K, J

None

RTC module

XBO-RTCA

None

Memory module

XBO-M2MB

None

X B O - AD

X X

DC input (DC) TR output (TN) Analog input (AD) Analog output (DA) Voltage, current I/O (AH) RTD input (RD) Thermocouple input (TC) RTC module (RTC) Memory module (M)

No. of IO point Memory capacity

XGB PLC

Option module

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2.3.5 Classification and type of option module

Name of option module is classified as follows.

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Chapter 2 System Configuration

2.4 System Configuration

Built-in RS-232C Connection

PADT connection

Built-in RS-485 Connection RS-232C / RS-485

XBC-DN30S(U)

XP30-TTA

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2.4.1 Cnet I/F system

Cnet I/F System is used for communication between the main unit and external devices using RS232C/RS-422 (485) Interface. The XGB series has a built-in RS-232C port, RS-485 port For “E” type, only one communication port between RS-232C and RS-485 can be used and you can specify at parameter setting window. For “S” type, RS-232C and RS-485 can be used independently and add RS-232C dedicated Cnet I/F module (XBL-C21A) and RS-422/485 dedicated Cnet I/F module (XBL-C41A). It is possible to configure the following communication system on demand

(1) 1:1 communication system

(a) 1:1 communication of an external device (computer) with main unit using a built-in port

(RS-232C/RS-485)

(b) 1:1 communication with main unit using a built-in RS-485 port

(In case of built-in RS-232C,it is for connecting to HMI device.)

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Chapter 2 System Configuration

Modem

XBL-C21A

XBC-DN30S(U)

XBL-C21A XBM-DN32S

Modem

XBL-C21A XBC-DN30S(U)

Built-in RS-232C/485 connection

XP30-TTA

XBC-DN30S(U)

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(d) 1:1 communication of an external device (monitoring unit) with main unit using a built-in RS-

232C/485 port.

2-12

Chapter 2 System Configuration

1) Refer to ‘XGB Cnet I/F user manual’ for details

Note

Max. 32 stations

PADT Connection

Built-in RS-232C connection

XBM-DN32S

XBC-DN30S(U)

Max. 32 stations

PADT connection

Built-in RS-232C connection Max. 32 stations

XBL-C41A XBC-DN30S(U)

XBL-C41A

XBC-DN30S(U)

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(2) 1:n Communication system

(a) Using RS-485 built-in function can connect between one computer and multiple main units for up to 32 stations.

(b) Using RS-485 built-in function/expansion Cnet I/F module can be connect for up to 32 stations.

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Chapter 2 System Configuration

Hub

Router or gateway

Public line

1) Refer to ‘XGB FEnet I/F user manual’ for details

Note

100Base-TX

HMI

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2.4.2 Ethernet system

Ethernet made by cooperation of Xerox, Intel, DEC is standard LAN connection method (IEEE802.3), which is network connection system using 1.5KB packet with 100Mbps transmission ability. Since Ethernet can combine a variety of computer by network, it is called as standard specification of LAN and diverse products. By adopting CSMA/CD method, it is easy to configure the network and collect large capacity data.

2-14

Chapter 3 General Specifications

No.

Items

Specification

Reference

Ambient Temp.

0 ~ 55 C

Storage Temp.

25 ~ 70 C

Ambient humidity

5 ~ 95%RH (Non-condensing)

Storage humidity

5 ~ 95%RH (Non-condensing)

Vibration

resistance

Occasional vibration

Frequency

Acceleration

Amplitude

Times

IEC61131-2

10  f  57Hz



0.075mm

10 times

each

direction

(X,Y and Z)

57  f  150Hz

9.8m/s2 (1G)



Continuous vibration

Frequency

Acceleration

Amplitude

10  f  57Hz



0.035mm

57  f  150Hz

4.9m/s2 (0.5G)



Shock resistance

 Peak acceleration : 147 m/s2 (15G)  Duration : 11ms  Half-sine, 3 times each direction per each axis

Noise resistance

Square wave

impulse noise

AC: 1,500 V DC: 900 V

LSIS standard

Electrostatic

discharge

Voltage: 4kV (Contact discharge)

IEC61131-2

IEC61000-4-2

Radiated

electromagnetic

field noise

80 ~ 1,000 MHz, 10V/m

IEC61131-2,

IEC61000-4-3

Fast transient

/Burst noise

Segment

Power supply

module

Digital/Analog Input/Output,

Communication Interface

IEC61131-2

IEC61000-4-4

Voltage

2kV

1kV

Environment

Free from corrosive gases and excessive dust

Altitude

Up to 2,000 ms

Pollution degree

2 or less

Cooling

Air-cooling

1) IEC (International Electrotechnical Commission): An international nongovernmental organization which promotes internationally cooperated standardization in electric/electronic field, publishes international standards and manages applicable estimation system related with.

2) Pollution degree: An index indicating pollution degree of the operating environment which decides insulation performance of the devices. For instance, Pollution degree 2 indicates the state generally that only non-conductive pollution occurs. However, this state contains temporary conduction due to dew produced.

Notes

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Chapter 3 General Specifications

3.1 General Specifications

The General specification of XGB series is as below.

3-1

4.1 Performance Specifications

XBC-DR10E

XBC-DR14E

XBC-DR20E

XBC-DR30E

Directed by program instruction

Number of

instructions

(Adjustable by parameter setting)

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Chapter 4 CPU Specifications

The following table shows the general specifications of the XGB compact type CPU (XBC-Dx10/14/20/30E).

Specifications (“E” type)

Items

Program control method Reiterative operation, fixed cycle operation, constant scan

I/O control method Program language Ladder Diagram, Instruction List

Basic 28 Application 677

Processing speed (Basic instruction)

Program capacity 4 k steps Max. I/O points

P P0000 ~ P127F (2,048 point)

M M0000 ~ M255F (4,096 point)

K K00000 ~ K2559F (Special area: K2600 ~2559F ) (40, 9 60 poin t) L L00000 ~ L1279F (20,480 point)

XBC-DN10E XBC-DN14E XBC-DN20E XBC-DN30E XBC-DP10E XBC-DP14E XBC-DP20E XBC-DP30E

Scan synchronous batch processing method (Refresh method),

0.24 ㎲/Step

14 point

Main + 1 option

18 point

Main + 1 option

28 point

Main + 2 options

38 point

Main + 2 options

Remark

F F000 ~ F255F (4,096 point) T

Data area

C C000 ~ C255 (256 point)

S S00.00 ~ S127.99

D D0000 ~ D5119 (5120 word)

Z Z000~Z127 (128 Word)

Total program 128 Initial task 1 Cyclic task Max. 8 I/O task Max. 4 Internal device task Max. 8 Operation mode RUN, STOP, DEBUG Self-diagnosis function Detects errors of scan time, memory, I/O Program port RS-232C (Loader)

100ms, 10ms, 1ms : T000 ~ T255 (256 point)

U00.00 ~ U07.31 (Analog data refresh area: 256 word, analog data refresh area)

Word

Back-up method Latch area setting in basic parameter

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Specifications (“E” type)

Items

Internal consumption current

Weight

XBC-DR10E XBC-DR14E XBC-DR20E XBC-DR30E XBC-DN10E XBC-DN14E XBC-DN20E XBC-DN30E XBC-DP10E XBC-DP14E XBC-DP20E XBC-DP30E

250mA 280mA 350mA 470mA 180mA 190mA 200mA 210mA 180mA 190mA 200mA 210mA 330g 340g 450g 465 g

313g 315g 418g 423g 313g 315g 418g 423g

Remark

Directed by program instruction

Number of

instructions

Program capacity

15 k steps

F0000 ~ F1023F (16,384 point)

(Adjustable by parameter setting)

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he following table shows the general specifications of the XGB compact type CPU (XBC-DN20/30S).

Items

XBC-DN20S XBC-DN30S

Program control method Reiterative operation, fixed cycle operation, constant scan

Specifications (“S” type)

Remark

I/O control method Program language Ladder Diagram, Instruction List

Basic 28 Application 687

Processing speed (Basic instruction)

Max. I/O points 244 poi nt (Main + Expansion 7 stages) 254 point (Main + Expansion 7 stages)

P P0000 ~ P1023F (16,384 point)

M M0000 ~ M1023F (16,384 point)

K K0000 ~ K4095F (65,536 point) L L0000 ~ L2047F (32,768 point)

Data area

C C0000 ~ C1023 (1,024)

S S00.00 ~ S127.99

D D0000 ~ D10239 (10,240 word)

Scan synchronous batch processing method (Refresh method),

94 ns/Step

100ms, 10ms, 1ms : T0000 ~ T1023 (1,024 point)

U U00.00 ~ U0A.31 (Analog data refresh area: 352 word)

Z Z000~Z127 (128 Word)

R R0000~R10239 (10,240 word)

Total program 128 Initial task 1 Cyclic task Max. 8 I/O task Max. 8 Internal device task Max. 8 Operation mode RUN, STOP, DEBUG Self-diagnosis function Detects errors of scan time, memory, I/O Program port RS-232C 1 channel Back-up method Latch area setting in basic parameter Internal consumption current 240 mA 255 mA Weight 470g 475g

Word

XBC-DR20SU

XBC-DR30SU

XBC-DR40SU

XBC-DR60SU

XBC-DN20SU

XBC-DN30SU

XBC-DN40SU

XBC-DN60SU

XBC-DP20SU

XBC-DP30SU

XBC-DP40SU

XBC-DP60SU

Scan synchronous batch processing method (Refresh method), Directed by program instruction

Number of

instructions

7 stages)

+ Expansion

7 stages)

+ Expansion

7 stages)

+ Expansion

7 stages)

(Adjustable by parameter setting)

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he following table shows the general specifications of the XGB compact type CPU

T (XBC-Dx20/30/40/60SU).

Specifications (“SU” type)

Items

Program control method Reiterative operation, fixed cycle operation, constant scan I/O control method Program language Ladder Diagram, Instruction List

Basic 28 Application 687

Processing speed (Basic instruction)

94 ns/Step

Program capacity 15 k steps

Max. I/O points

244 point (Main + Expansion

254 point (Main

264 point (Main

284 point (Main

P P0000 ~ P1023F (16,384 point)

M M0000 ~ M1023F (16,384 point)

K K0000 ~ K4095F (65,536 point) L L0000 ~ L2047F (32,768 point) F F0000 ~ F1023F (16,384 point)

100ms, 10ms, 1ms : T0000 ~ T1023 (1,024 point)

Data area

C C0000 ~ C1023 (1,024)

S S00.00 ~ S127.99

Remark

D D0000 ~ D10239 (10,240 word) U U00.00 ~ U0A.31 (Analog data refresh area: 352 word)

Z Z000~Z127 (128 Word)

R R0000~R10239 (10,240 word)

Total program 128 Initial task 1 Cyclic task Max. 8 I/O task Max. 8 Internal device task Max. 8 Operation mode RUN, STOP, DEBUG Self-diagnosis function Detects errors of scan time, memory, I/O Program port RS-232C 1 channel, USB 1 channel Back-up method Latch area setting in basic parameter

Word

XBC-DR20SU

XBC-DR30SU

XBC-DR40SU

XBC-DR60SU

XBC-DN20SU

XBC-DN30SU

XBC-DN40SU

XBC-DN60SU

XBC-DP20SU

XBC-DP30SU

XBC-DP40SU

XBC-DP60SU

478 mA

626 mA

684 mA

942 mA

514g

528g

594g

804g

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Specifications (“SU” type)

Items

Internal consumption current

Weight

Remark

252 mA 310 mA 288 mA 340 mA 305 mA 352 mA 355 mA 394 mA

475g 476g 578g 636g 442g 446g 544g 717g

tput, Adjustable operation scan time, Anti Windup, Delta

Max. 16 loops are supported

Dedicated protocol support

User defined protocol support

parameter

485 1 port

8kHz 3 channel

4 different counter modes according to input pulse and

phase pulse input: addition/subtraction counter by B

2 phase pulse input: addition/subtraction counter

• 2 phase pulse input:

differences

Acceleration / Deceleration method : trapezoidal method

JOG operation

Setting range: 1~ 100 ,00 0 ( H igh / Low s peed)

Additional

function

Inching operation, Speed synchronizing operation, Position synchronizing operation, linear interpolation operation etc.

10㎲ 2 point

(P0002 ~ P0007)

10㎲ 2 point

(P0002 ~ P0007)

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Items

Specifications

Remark

“E” type “S(U)” type

PID control function

Controlled by instructions, Auto-tuning, PWM output, Forced ou MV function, SV-Ramp function

MODBUS protocol support

Supported

in “S(U)”

type

Cnet I/F function

Capacity

Select one port between RS232C 1 port, RS-485 1 port

1 phase: 4 kHz 4 channel 2 phase: 2 kHz 2 channel

addition/subtraction method

RS-232C 1 port, RS-

respectively

1 phase: 100 kHz 2 channel,

20kHz 6 channel

2 phase: 50 kHz 1 channel,

• 1 phase pulse input: addition/subtraction counter

• 1

Counter

mode

High-speed counter

phase

•

• 2 phase pulse input:

addition/subtraction by rising pulse phase differences

addition/subtraction by rising/falling pulse phase

• Internal/External preset function

Additional

function

• Latch counter function

• Comparison output function

• Revolution number per unit time function

No. of control axis: 2 axes

Built-in function

Basic function

Control method: position/speed control Control unit: pulse Positioning data: 80 data/axis (operation step No. 1~80) Operation mode: End/Keep/Continuous Operation method: Single, Repeated operation

Supported in “S(U)” type transistor output

Positioning

function

Positioning function

Return to Origin

Positioning method: Absolute / Incremental Address range: -2,147,483,648 ~ 2,147,483,647 Speed: Max. 100kpps(setting range 1 ~ 100,000pps)

By Home and DOG (Off) By Home and DOG (On) By DOG

Pulse catch

External interrupt

50 ㎲ 4 point (P0000 ~ P0003)

4 point: 50 ㎲ (P0000 ~ P0003)

Input filter Select among 1,3,5,10,20,70,100 ㎳ (Adjustable)

(P0000 ~ P0001) 50 ㎲ 6 point

(P0000 ~ P0001)

50 ㎲ 6 point

4.2 Names of Part and Function

“E” Type

PADT connecting connector

▪ PADT connector

RS-232C 1 channel

Output terminal block

▪ Output terminal block

RUN/STOP mode

▪ Sets the operation mode of main unit

(In case of STOP, remote mode is available)

Output indicator LED

▪ Output indicator LED

Power supply connector

▪ Dip switch for setting O/S download/Operation mode Off: User mode, available to download program using PADT

Option board holder

▪For connection option board

④

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⑦

①

⑤

⑥

⑧

⑪

③

⑪

②

No. Name Description

①

Input indicator LED ▪ Input indicator LED

⑨

⑩

② ③ Input terminal block ▪ Input terminal block

④

⑤

⑥

⑦

⑧

⑨

⑩

⑪

switch

Status indicator LED

Built-in communication Connecting connector

OS mode dip switch

STOP → RUN: execute operation of program

RUN → STOP: stop operation of program

It indicates CPU module’s status.

▪ PWR(Red on): Power status ▪ RUN(Green on): RUN status ▪ Error(Red flickering): In case of error, it is flickering.

 Built-in RS-232C/485 connecting connector

▪ AC100~240V power supply connector

On: Boot mode, available to download O/S

“S” Type

PADT connecting connector

▪ PADT connector

RS-232C 1 channel

Output terminal block

▪ Output terminal block

RUN/STOP mode

▪ Sets the operation mode of main unit

(In case of STOP, remote mode is available)

Output indicator LED

▪ Output indicator LED

Power supply connector

▪ Dip switch for setting O/S download/Operation mode Off: User mode, available to download program using PADT

Option board holder

▪ For connection option board

⑤

①

②

③

⑩ ⑥

⑦

⑧

④

⑨

⑪

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No. Name Description

①

② ③

④

⑤

⑥

⑦

⑧

⑨

⑩

⑪

Input indicator LED ▪ Input indicator LED

Input terminal block ▪ Input terminal block

STOP → RUN: execute operation of program

switch

Status indicator LED

Built-in communication Connecting connector

OS mode dip switch

RUN → STOP: stop operation of program

It indicates CPU module’s status.

▪ PWR(Red on): Power status ▪ RUN(Green on): RUN status

▪ Error(Red flickering): In case of error, it is flickering.

 Built-in RS-232C/485 connecting connector

▪ AC100~240V power supply connector

On: Boot mode, available to download O/S

“SU” Type

PADT connecting connector

▪ PADT connector

RS-232C 1 channel, USB 1 channel

Output terminal block

▪ Output terminal block

▪ Sets the operation mode of main unit

(In case of STOP, remote mode is available)

Output indicator LED

▪ Output indicator LED

Power supply connector

▪ Dip switch for setting O/S download/Operation mode Off: User mode, available to download program using PADT

Option board holder

▪For connection option board

⑤

①

②

③

⑩ ⑥

⑦

⑧

④

⑨

⑪

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No. Name Description

①

② ③

④

⑤

⑥

⑦

Input indicator LED ▪ Input indicator LED

Input terminal block ▪ Input terminal block

RUN/STOP mode switch

Status indicator LED

STOP → RUN: execute operation of program

RUN → STOP: stop operation of program

It indicates CPU module’s status.

▪ PWR(Red on): Power status ▪ RUN(Green on): RUN status

▪ Error(Red flickering): In case of error, it is flickering.

⑧

⑨

⑩

⑪

Built-in communication Connecting connector

OS mode dip switch

 Built-in RS-232C/485 connecting connector

▪ AC100~240V power supply connector

On: Boot mode, available to download O/S

4.3 Power Supply Specifica t ions

Specification

Dx10/14E

Dx20/30E

Dx20S(U)

Dx30S(U)

Dx40SU

Dx60SU

(UL warranty voltage)

Input voltage range

Inrush current

50A

or less

Input current

Efficiency

65% or more

power failure

output

DC5V

500mA

800mA

1.5A

2.0A

2.5A

DC24V

0.2A

0.3A

0.5A

Output voltage ripple

Power supply status indication

LED On when power supply is normal

Cable specification

0.75 ~ 2 mm2

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It describes the power supply specification of main unit.

Items

Rated voltage

XBC-

AC 100 ~ 240 V

AC85~264V(-15%, +10%)

Input

Permitted momentary

Peak

0.5A or less (220V), 1A or less (110V)

Less than 10 ㎳

Rated

Output

DC5V (±2%)

* Use the power supply which has 4 A or more fuse for protecting power supply.

XBC-

XBM-DR16S

400

XBM-DN16S

250

XBM-DN32S

280

XBC-DR32H

660

XBC-DR64H

1,040

XBC-DN32H

260

XBC-DN64H

330

XBC-DN30S

255

XBC-DN20S

240

XBC-DN20SU

252

XBC-DN30SU

270

XBC-DN40SU

288

XBC-DN60SU

340

XBC-DP20SU

305

XBC-DP30SU

352

XBC-DP40SU

355

XBC-DP60SU

394

XBC-DR20SU

478

XBC-DR30SU

626

XBC-DR40SU

684

XBC-DR60SU

942

XBC-DR30E

470

XBC-DR20E

350

XBC-DR14E

280

XBC-DR10E

250

XBC-DN30E

210

XBC-DN20E

200

XBC-DN14E

190

XBC-DN10E

180

XBC-DP30E

210

XBC-DP20E

200

XBC-DP14E

190

XBC-DP10E

180

XBE-DC32A

XBE-DC16A/B

XBE-DC08A

XBE-RY16A

440

XBE-RY08A/B

240

XBE-TN32A

XBE-TN16A

XBE-TN08A

XBE-TP32A

XBE-TP16A

XBE-TP08A

XBE-DR16A

250

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1) Consumption current (DC 5V)

Type Model

Main unit

Consumption current (Unit : ㎃)

Expansion I/O module

XBF-AD04A

120

XBF-AD08A

105

XBF-AH04A

120

XBF-DV04A

110

XBF-DC04A

110

XBF-RD04A

100

XBF-TC04S

100

XBF-PD02A

500

XBF-HD02A

260

XBF-HO02A

200

XBF-AD04C

100

XBF-DC04C

160

XBF-DV04C

160

XBL-C21A

120

XBL-C41A

120

XBL-EMTA

300

XBL-EIMT

280

XBL-EIMF

670

XBL-EIMH

480

XBL-EIPT

290

XBL-CMEA

211

XBL-CSEA

202

XBO-DC04A

XBO-TN04A

100

XBO-AD02A

XBO-DA02A

150

XBO-AH02A

150

XBO-RD01A

XBO-TC02A

XBO-RTCA

XBO-M2MB

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Type Model

Expansion special module

Expansion communication module

Consumption current (Unit : ㎃)

Option module

4.4 Calculation Example of Consum pt ion Current/Voltage

Internal 5V

(Unit : ㎃)

Consumption current

Consumption voltage

Internal 5V

(Unit : ㎃)

Consumption current

Consumption voltage

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Calculate the consumption current and configure the system not to exceed the output current capacity of

basic unit.

(1) XGB PLC configuration example 1 Consumption of current/voltage is calculated as follows.

Type Model Unit No.

Main unit XBC-DN20S 1 240

XBE-DC32A 2 50

XBE-TN32A 2 80 Expansion module

In case system is configured as above, since 5V consumption current is total 850mA and 5V output of XGB standard type main unit is maximum 1.5A, normal system configuration is available.

(2) XGB PLC configuration example 2

Type Model Unit No.

XBF-AD04A 1 120

XBF-DC04A 1 110

XBL-C21A 1 110

850 ㎃

4.25 W 0.85 * 5V = 4.25W

consumption

current

consumption

current

Remark

In case contact points are On.

(Maximum consumption current)

All channel is used.

(Maximum consumption current)

Remark

Main unit XBC-DN30S 1 255

XBE-DR16A 2 250

Expansion module

If system is configured as above, total 5V current consumption is exceeded 1,985 mA and it exceeds the 5V output of XGB standard type main unit. Normal system configuration is not available. Although we assume the above example that all contact points are on, please use high-end type main unit which 5V output capacity is higher than standard type main unit.

XBE-RY16A 2 440

XBF-AD04A 2 120

XBL-C21A 1 110

1,985 ㎃

9.925 W

In case all contact points are On.

(Maximum consumption current)

All channel is used.

(Maximum consumption current)

1.985ⅹ 5V = 9.925W

Internal 5V

(Unit : ㎃)

Consumption current

Consumption voltage

4.5 Data Backup Time

“SU” type

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(3) XGB PLC configuration example 3

Type Model Unit No.

Main unit XBC-DN32H 1 260

XBE-DR16A 2 250

Expansion module

The above system is an example using XBC-DN32H about system example (2). Unlike (2) example, 5V output capacity of XBC-DN32H is maximum 2A, normal configuration is available.

When RTC module is not installed with main unit, data is kept by super capacitor. The following table shows the data backup time of the main un it,

Type Data backup time Remark

XBE-RY16A 2 440

XBF-AD04A 2 120

XBL-C21A 1 110

1,990 ㎃

9.95 W

consumption

current

Remark

In case of all contact points are

On.

(Maximum consumption current)

All channel is used.

(Maximum consumption current)

1.99A ⅹ 5V = 9.95W

XBC

“S” type

XBC

“E” type

But charge super capacitor enough while power is on over 30 minute. In case super capacitor is not charged enough or power is off more than data backup time, latch data is

not kept and warning occurs. At this time, phenomenon and measure are as follows.

(1) Phenomenon

(a) RUN mode

1) In case of Remote Run mode, operation mode changes to Stop mode. In case of Local Run mode, it operates normally with abnormal data back up warnin g

2) In case of Stop mode, abnormal data backup warning occurs.

(b) Latch data

1) Latch area 1,2 : all data are cleared into “0”.

2) K area, F area : all data are cleared into “0”. (2) Measure (a) In case abnormal data backup warning occurs when turning off and turning on within data backup

time, technical assistance of main unit is necessary. Be careful data backup time is getting shorter at high temperature.

backup by the Capacitor 18 Days

RTC module installed 3 Yeas

At normal temperature (25℃)

backup by the Capacitor 5 Days

RTC module installed 3 Yeas

Notice

Above data backup time can be different according to temperature condition.

Chapter 5 Program Configuration and Operation Method

5.1 Program Instruction

Stage

Processing description

 A stage to start the scan processing which is executed once

when power is applied or Reset is executed, as below.

I/O module reset Self-diagnosis execution Data clear Address allocation of I/O module and type register

 If initializing task is designated, Initializing program is executed.

 Reads the state of input module and saves it in input image

area before starting the operation of program.

 Performs the operation in order from the program start to last

step.

 Performs the operation in order from the program start to last step.

 A processing stage to return to the first step after CPU module

completes 1 scan processing and the processing performed is as below.

Update the current value of timer and counter etc. User event, data trace service Self-diagnosis High speed link, P2P e-Service Check the state of key switch for mode setting

Start

Initialization processing

Input image area refresh

Program operation processing

Program start

Program last step

Output image area refresh

END

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Chapter 5 Program Configuration and Operation Method

5.1.1 Program execution methods

(1) Cyclic operation method (Scan)

This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared program from the beginning to the last step, which is called „program scan‟. The series of processing like this is called „cyclic operation method‟. The processing is divided per stage as below.

5 - 1

Chapter 5 Program Configuration and Operation Method

Remark

1) Momentary power failure? This means the state that the voltage of supply power at power condition designated by PLC is

lowered as it exceeds the allowable variable range and the short time (some ms ~ some dozens ms) interruption is called „momentary power failure‟ ).

 CPU keeps the operation.

 Restart processing like at power input shall

be performed.

Input power

Within 10 ms momentary

power failure

Momentary power failure exceeding 20ms

momentary power failure exceed

Input power

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(2) Interrupt operation (Cycle time, Internal device)

This is the method that stops the program operation in proceeding temporarily and carries out the operation processing which corresponds to interrupt program immediately in case that there occurs the status to process emergently during PLC program execution.

The signal to inform this kind of urgent status to CPU module is called „interrupt signal‟. There is a Cycle time signal that operates program every appointed time and external interrupt signal that operates program by external contact (“S” type: P000~P007, “E” type: P000~P003). Besides, there is an internal device start program that starts according to the state change of device assigned inside.

(3) Constant Scan (Fixed Period)

This is the operation method that performs the scan program every appointed time. This stands by for a while after performing all the scan program, and starts again the program scan when it reaches to the appointed time. The difference from constant program is the update of input/output and the thing to perform with synchronization.

At constant operation, the scan time indicates the net program processing time where the standby time is deducted. In case that scan time is bigger than „constant‟, [F0005C] „_CONSTANT_ER‟ flag shall be „ON‟.

5.1.2 Operation processing during momentary power failure

CPU module detects the momentary power failure when input power voltage supplied to power module is lower than the standard. If CPU module detects the momentary power failure , it carries out the operation processing as follows. If momentary power failure within 10 ms is occurred, main unit (CPU) keeps the operation. But, if momentary power failure above 10 ㎳, the operation is stop and the output is Off. Restart processing like at power input shall be performed.

(1) Momentary power failure within 10 ms

(2) Momentary power failure exceeding 10 ms

5 - 2

Chapter 5 Program Configuration and Operation Method

Type

MPU processing time

Expansion interface processing time

Executing

ladder

(4Kstep)

PLC internal

processing

time

Digital I/O module

(32 point, 1 unit)

Analog module

(8 channel, 1 unit)

Comm. module

(main/expansion)

(200 byte, 1 block)

“E” type

5.4 ㎳

1.0㎳

0.5 ㎳

“S” type

3.0 ㎳

0.5㎳

0.3 ㎳

3.0㎳

0.8 ㎳

Program Scan

①Ladder Scan

Ladder Scan

I/O Module Data Refresh

②System check &

Task processing

④Network Service

③I/O data Refresh

Network Module Data exchange

Input

Output

Expansion Module Interface

⑤ XG5000 Service

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5.1.3 Scan time

The processing time from program step 0 to the next step 0 is called „Scan Time‟.

(1) Scan time calculation expression

Scan time is the sum of the processing time of scan program and interrupt program prepared by the user

and PLC internal time, and is distinguished by the following formula.

(a) Scan time = Scan program processing time ＋ Interrupt program processing time ＋ PLC internal

processing time

 Scan program processing time = processing time of user program except interrupt program  Interrupt program processing time = Sum of interrupt program proceeding time processed during 1 scan  PLC internal processing time = Self-diagnosis time ＋ I/O refresh time ＋ Internal data processing time

＋ Communication service processing time

(b) Scan time depends on whether to execute interrupt program and communication processing.

The main unit executes controls along the following steps. A user can estimate the control performance of a

system that the user is to structure from the following calculation.

Scan time = ① Scan program process ＋ ② System check & Task process ＋ ③I/O data Refresh

+ ④ Network Service + ⑤ XG5000 Service + ⑥ User Task Program process

① Scan program process = no. of instruction x process speed per each instruction (refer to XGK/XGB

instruction user manual)

② System check & Task process: 600 ㎲ ~ 1.0 ms [varies depending on the usage of auxiliary functions] ③ XG5000 Service process time: 100 ㎲ at the max data monitor ④ Task Program process time: sum of task processing time that occurs within a scan; the time calculation

by task programs are as same as that of scan program.

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(2) Example

The scan time of a system consisting of main unit (program 4kstep) + five 32-point I/O modules + one analog

module + one communication modules (200 byte 1 block)

Scan time(㎲) = ladder execution time + system processing time + digital module I/O processing time +

analog I/O processing time + communication module processing time + XG5000 Service processing time

= (2047 x (0.67(LOAD)+ 0.80(OUT)) + (500) + (300 x 5) + (3000 x 1) + (800 x 1) + (100) ㎲ = 3009 + 500 + 1500 + 3000 + 800 + 100㎲ = 8909㎲ = 8.9㎳ (But, in case of online editing or writing XG-PD parameter, scan time increases temporary up to 100ms)

(3) Scan time monitor

(a) Scan time can be monitored 『Online』-『PLC Information』-『Performance』.

(b) Scan time is save in special relay (F) area as follows.

 F0050: max. value of scan time (unit: 0.1 ms)  F0051: min. value of scan time (unit: 0.1 ms)  F0052: current value of scan time (unit: 0.1 ms)

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Chapter 5 Program Configuration and Operation Method

Remark

1) The setting range of Watchdog Timer is 10 ~ 1000ms (Unit: 1ms).

WDT instruction execution

0 1 2 3 …..

…8 9

SCAN END

WDT Reset

0 1 2 …

WDT count(ms)

0 1 2 …

…6 7

SCAN END

0 1 2 …

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5.1.4 Scan Watchdog timer

WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of

PLC CPU module.

(1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT is set

in Basic parameter of XG5000.

(2) If WDT detects the excess of detection setting time while watching the elapsed time of scan during

operation, it stops the operation of PLC immediately and keeps or clears the output according to parameter setting

(3) If the excess of Scan Watchdog Time is expected in the program processing of specific part while performing

the user program (FOR ~ NEXT instruction, CALL instruction), clear the timer by using „WDT‟ instruction.

„WDT‟ instruction initializes the elapsed time of Scan Watchdog Timer and starts the time measurement from

0 again. (For further information of WDT instruction, please refer to Instruction.)

(4) To clear the error state of watchdog, we can use the following method : power re-supply, manipulation of

manual reset switch, mode conversion to STOP mode.

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Chapter 5 Program Configuration and Operation Method

Preset value

Timer output relay

Timer type

t1+PT

t5+PT

Input condition

Output relay

Preset value

Current value

t0+PT

t4+PT

Input condition

Output relay

Preset value

Current value

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5.1.5 Timer processing

The XGB series use up count timer. There are 5 timer instructions such as on-delay (TON), off-delay (TOFF), integral (TMR), monostable (TMON), and re-triggerable (TRTG) timer. The measuring range of 100msec timer is 0.1 ~ 6553.5 seconds, 10msec timer is 0.01 ~ 655.35 seconds, and that of 1msec timer is 0.001 ~ 65.53 seconds. Please refer to the „XG5000 User manual‟ for details.

(1) On delay timer

The current value of timer starts to increase from 0 when the input condition of TON instruction turns on. When the current value reaches the preset value (Current value=Preset value), the timer output relay (Txxxx) turns on. When the timer input condition is turned off, the current value becomes 0 and the timer output relay is turned off.

(2) Off delay timer

The current value of timer set as preset value and the timer output relay is turned on when the input condition of TOFF instruction turns on. When the input condition is turned off, the current value starts to decrease. The timer output relay is turned off when the current value reaches 0.

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Chapter 5 Program Configuration and Operation Method

Timer input condition

Timer output relay

Preset value

Current value

Timer reset input

t5+PT

PT = (t1-t0)+(t3-t2)

Timer input condition

Timer output relay

Preset value

Current value

t0+PT

t2+PT

t4+PT

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(3) Integral timer

In general, its operation is same as on-delay timer. Only the difference is the current value will not be clear when the input condition of TMR instruction is turned off. It keeps the elapsed value and restart to increase when the input condition is turned on again. When the current value reaches preset value, the timer output relay is turned on. The current value can be cleared by the RST instruction only.

(4) Monostable timer

In general, its operation is same as off-delay timer. However, the change of input condition is ignored while the timer is operating (decreasing). When current value reaches preset value the timer output relay is turned off and current value is cleared.

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Remark

The Maximum timer error of timers of XGB series is „1 scan time + the time from 0 step to timer instruction‟

t0 Tt3

t0+PT

Timer input condition

Timer output relay

Preset value (PV)

Current value (ET)

(정

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(5) Retriggerable timer

The operation of retriggerable timer is same as that of monostable timer. Only difference is that the retriggerable timer is not ignore the input condition of TRTG instruction while the timer is operating (decreasing). The current value of retriggerable timer will be set as preset value whenever the input condition of TRTG instruction is turned on.

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5.1.6 Counter processing

The counter counts the rising edges of pulses driving its input signal and counts once only when the input signal is switched from off to on. XGB series have 4 counter instructions such as CTU, CTD, CTUD, and CTR. The followings shows brief information for counter operation. Refer to the „XGB Instruction Manual‟ for details.

 Up counter increases the current value.  Down counter decreases the current value.  Up/Down counter compares the input value from both counters input.

 Ring counter increase the current value and the current value is cleared as 0 when the current value

reaches the preset value.

(1) Renewal of counter‟s current value and contact On/Off (a) Up counter

 Up counter increases the current value at the rising edges of input.  The counter output contact (Cxxx) is turned On when the current value reaches the preset value.

When the reset input is turned On, the counter output contact (Cxxx) is turned Off.

(b) Down counter

 Down counter decreases the current value at the rising edges of input.  The counter output contact (Cxxx) is turned On when the current value reaches the preset value.

When the reset input is turned On, the counter output contact (Cxxx) is turned Off.

 The current value is increased with the rising edge of up-count input signal, and decreased with the

rising edge of down-count input signal. The counter output contact (Cxxx) is turned On when the current value is same as or more than current value. The counter output contact (Cxxx) is turned Off when the current value is same as or less than current value.

 When the reset input is turned On, the current value is cleared as 0.

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Chapter 5 Program Configuration and Operation Method

Remark

1) Use of High Speed Counter In order to counter pulse that is faster than maximum counting speed of normal counter, use

built-in High Speed counter function.

Maximum counting speed

)

(

100

max



n : duty (%)

: scan time [s]

Off

T1 ≤ T2, n = x 100 [%]

T1 > T2, n = x 100 [%]

T1+T2

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(d) Ring counter

 The current value is increased with the rising edge of the counter input signal, and the counter output

contact (Cxxx) is turned on when the current value reaches the preset value. Then the current value and counter output contact (Cxxx) is cleared as 0 when the next rising edge of the counter input signal is applied.

 When the reset input is turned On, the counter output contact is cleared as 0.

(2) Maximum counting speed

The maximum counting speed of determined by the length of scan time. Counting is possible only when the on/off switching time of the counter input signal is longer than scan time.

 Duty is the ratio of the input signal‟s on time to off time as a percentage.

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Chapter 5 Program Configuration and Operation Method

5.2 Program Execution

Program type

Description

Initializing program

 It will be executed till the specific Flag „INIT_DONE‟ is on. And while the

initialization task is executed, cycle task, external interrupt task and internal device task are not executed. I/O refresh, high speed counter and communication are executed

Scan program

 The scan program is executed regularly in every scan.

Cycle time interrupt program

 The program is performed according to the fixed time interval in case that the

required processing time condition is as below.

 In case that the faster processing than 1 scan average processing time is

required

 In case that the longer time interval than 1 scan average processing time is

required

 In case that program is processed with the appointed time interval

External interrupt program

 The external interrupt program is performed process on external interrupt

signal.

Subroutine program

 Only when some condition is satisfied.(in case that input condition of CALL

instruction is On)

Start processing

Scan program

END processing

Subroutine program

External interrupt program

Cycle time program

Only when some condition is satisfied.

Initializing program

It executes up to execution of INIT_DONE instruction when initializing program is designated.

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5.2.1 Configuration of program

All functional elements need to execute a certain control process are called as a „program‟. Program is stored in

the built-in RAM mounted on a CPU module or flash memory of a external memory module. The following table shows the classification of the program.

5.2.2 Program execution methods

Here describes the program proceeding method that is executed when the power is applied or key switch is „RUN‟.

The program performs the operation processing according to the configuration as below.

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Chapter 5 Program Configuration and Operation Method

Remark

(1) Write the interrupt program as shortly as possible. In case same interrupt occurs repeatedly before completion of interrupt, program is not executed and O/S watch dog error may occur. (2) Though interrupt which has lower priority occurs many times during execution of interrupt which has higher priority, interrupt which has lower priority occurs only one time.

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(1) Scan program

(a) Function

 This program performs the operation repeatedly from 0 step to last step in order prepared by the program

to process the signal that is repeatedly regularly every scan.

 In case that the execution condition of interrupt by task interrupt or interrupt module while executing

program is established, stop the current program in execution and perform the related interrupt program.

(2) Interrupt program

(a) Function

 This program stops the operation of scan program and then processes the related function in prior to

process the internal/external signal occurred periodically/non-periodically.

(b) Type

 Task program is divided as below. ▶ Cycle time task program: available to use up to 8. ▶ Internal device task program: available to use up to 8. ▶ I/O (External contact task program): “S” type available to use up to 8. (P000 ~ P007) “E” type available to use up to 4. (P000~P003)

 Cycle time task program ▶ Performs the program according to the fixed time internal.

 Internal device task program ▶ Performs the corresponding program when the start condition of internal device occurs. ▶ The start condition detection of device shall be performed after processing of scan program.

 I/O (External contact task program) ▶ Performs the program according to the input external signal (“S” type: P000~P007, “E” type:

P000~P003).

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Interrupt source

Interrupt name

priority

Task No.

Program

Initializing

Interrupt 0_

- - -

Cycle time 1

Interrupt 1_cycle time

2 0 Cycle time 1

External

Interrupt 2_external

2 8 External

Internal device

Interrupt 3_internal

Internal

Cycle time 2

Interrupt 4_cycle time

3 1 Cycle time 2

Remark

 In case that several tasks to be executed are waiting, execute from the highest Task Program in

priority. When the same priority tasks are waiting, execute from the order occurred.

 While interrupt executing, if the highest interrupt is occurred, the highest interrupt is executed earliest of

all.

 When power On, All interrupts are in the state „Enable‟. In case you don‟t use it, disable the

interrupts by using DI instruction. If you want to use it again, enable by using EI instruction.

 Internal device interrupt is executed after END instruction.

Initializing

(Before INIT_DONE instruction)

Cycle time 1 execution

Interrupt 1_Cycle time

occur

Cycle time 1/

external occur

simultaneously

Cycle time 1 execution

External I/O execution

Internal device

Interrupt occur

Internal device interrupt

execution

Cycle time 1

execution

Timed-driven 1 execution

Cycle time 2

occur

Cycle time 2 execution

END

Scan program

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5.2.3 Interrupt

For your understanding of Interrupt function, here describes program setting method of XG5000 which is an XGB

programming S/W. Example of interrupt setting is as shown bellows.

 Interrupt setting

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(1) How to prepare interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each

task. For further information, please refer to XG5000 user‟s manual.

(It can be additional when XG5000 is not connected with PLC.)

(a) Click right button of mouse on project name and click 『Add item』-『Task』.

(b) The screen of Task setting is shown. Click 『Initialization』 in Execution condition and make a Task

name.

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(d) Make initializing program. In initializing program, INIT_DONE instruction must be made. If not, Scan

program is not executed.

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(2) How to prepare Cycle interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each

task. For further information, please refer to XG5000 user‟s manual.

(It can be additional when XG5000 is not connected with PLC)

(a) Click right button of mouse at registered task and select『Add Item』-『Task』.

 It shows setting screen of Task.

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Chapter 5 Program Configuration and Operation Method

Classification

Description

Remark

Task name

Make Task name.

Character, number available

Priority

Set the priority of task. (2~7)

“2” is the highest priority number.

Task number

Set the Task number.

 Cycle time task (0 ~ 7): 8  External I/O task (8 ~ 15): “S” type: 8,

“E” type: 4

 Internal device task (16 ~ 23): 8

Execution condition

Initialization

Set the initial program when running the project.

Till the execution of INIT_DONE instruction

Cycle time

Set the cyclic interrupt.

0~4294967295 ㎳ available

I/O

Set the external I/O.

P000 ~ P007 available

Internal device

Set the internal device to interrupt execution.

 Bit: Among Rising, Falling, Transition, On, Off  Word: Among >,>=,<,<=

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(b) Task type

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(d) Register the Program name and Program description.

(e) It is displayed the program window to write task program.

(f) It is displayed the setting in project window.

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Type Spec.

Cycle time task

(Interval task)

I/O task

(Interrupt task)

Internal device task

(Single task)

“S” type

“E” type

Max. Task number

8 8 4 8

Start condition

Cyclic (setting up to max. 4,294,967.295 sec. by 1ms unit)

Rising or falling edge of main unit‟s contact P000 ~P007

Rising or falling edge of main unit‟s contact P000 ~P003

Internal device execution condition

Detection and execution

Cyclic execution per setting time

Immediate execution at the edge of main unit‟s contact

Retrieve the condition and execute after completing Scan Program

Detection delay time

Max. 1 ms delay

Max. 0.05 ms delay

Delay as much as max. scan time

Execution priority

2~7 level setting (2 level is highest in priority)

Task no.

Within 0~7 range without user duplication

With 8~15 range without user duplication

Within 16~23 range without user duplication

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(3) Task type

Task type and function is as follows.

(4) Processing methods of task program

Here describes common processing method and notices for Task program. (a) Feature of task program

1) Task Program is executed only when execution condition occurs without every scan repeat processing. When preparing Task Program, please consider this point.

2) For example, if a timer and counter were used in cyclic task program of 10 second cycle, this timer

occurs the tolerance of max. 10 seconds and the counter and the timer and as the counter checks the input status of counter per 10 seconds, the input changed within 10 seconds is not counted up.

(b) Execution priority

1) In case that several tasks to be executed are waiting, execute from the highest Task Program in priority. When the same priority tasks are waiting, execute from the order occurred.

2) In case Cycle time task and external I/O task is occurred concurrently, execute from the highest task

program. (In sequence of XG5000 setting)

3) The task program priority should be set considering the program features, importance and the

emergency when the execution requested.

There are some causes for Task Program processing delay as below. Please consider this when task

setting or program preparation.

1) Task detection delay (Refer to detailed description of each task.)

2) Program proceeding delay caused by Priority Task Program proceeding

(d) Relationship of initialize, Scan Program and Task Program

1) ser identification task does not start while performing Initialization Task Program.

2) As Scan Program is set as lowest priority, if task occurs, stop Scan Program and process Task Program

in advance. Accordingly, if task occurs frequently during 1 scan or concentrates intermittently, scan time may extend abnormally. Cares should be taken in case of task condition setting.

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(e) Protection of Program in execution from Task Program

1) In case that the continuity of program execution is interrupted by high priority Task Program during program execution, it is available to prohibit the execution of Task Program partially for the part in problem. In this case, it is available to perform the program protection by „ DI (Task Program Start Disabled) and „EI (Task Program Start Enabled)‟ application instruction.

2) Insert „DI‟ application instruction in the start position of the part requiring the protection and insert „EI‟

application instruction in the position to release. Initialization Task is not influenced by „DI‟, „EI‟

application instruction.

3) If interrupt is occurred while „CALLP‟ instruction executing, interrupt program is executed after „CALLP‟ instruction execution.

(5) Cyclic task program processing method

Here describes the processing method in case that task (start condition) of Task program is set as Cycle

time.

(a) Items to be set in Task

Set the execution cycle and priority which are the start condition o f Task program to execution. Check the

task no. to manage the task.

(b) Cyclic task processing

Performance the corresponding cyclic task program per setting time interval (execution cycle).

1) When cyclic task program is in execution currently or waiting for execution, if the demand to execute the same task program occurs, the new occurred task shall be disregarded.

2) Timer that makes a demand to execute cyclic task program only while operation mode is Run mode, shall be added. The shutdown time shall be all disregarded.

3) When setting the execution cycle of cyclic task program, consider the possibility that the demand to execute several cyclic task program at the same time occurs.

If 4 cyclic task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of

execution per 20 seconds shall be occurred at the same time and scan time may extend instantaneously.

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(6) I/O task program processing

It described the I/O task program processing. (“S” type: P000~P007, “E” type: P000~P003)

(a) Items to be set in Task

Set the execution condition and priority to the task being executed. Check the task no. to manage the task.

(b) I/O task processing

If interrupt signal from external signal (I/O) is occurred on main unit (“S” type: P000 ~ P007. “E” type:

P000~P003), task program is executed by external (I/O) signal.

1) If task program which is executed by interrupt signal is on execution or standby status, new task program which is requested by identical I/O is ignored.

2) Only operation mode is Run mode, execution request of task program is recognized. Namely, execution request of task program is ignored when operation mode is Stop mode.

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(7) Internal device task program processing

Here describes the processing method of international device task program which extended the task (start

condition) of task program from contact point to device as execution range.

(a) Items to be set in Task

Set the execution condition and priority to the task being executed. Check the task no. for task

management.

(b) Internal device task processing

After completing the scan program execution in CPU module, if the condition that becomes the start

condition of internal device task program is met, according to the priority, it shall be executed.

1) Accordingly, even if the execution condition of internal device task program occurs in Scan Program

or Task Program (Cycle time, I/O), it shall not be executed immediately but executed at the time of completion of Scan Program.

2) If the demand to execute Internal Device Task Program occurs, the execution condition shall be examined at the time of completion of Scan Program. Accordingly, if the execution condition of Internal Device Task occurs by Scan Program or Task Program (Cycle time) during „1 scan‟ and disappears, the task shall not be executed as it is not possible to detect the execution at the time of examination of execution condition.

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Interrupt type

Interrupt name

Priority

Task No.

Program

Cycle time

10 ㎳_cycle time

Program 1

Internal device

Internal device_M00

Program 2

I/O

I/O_P00 2 8

Program 3

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(8) Verification of task program

(a) Is the task setting proper?

If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time

may lengthen or be irregular. In case not possible to change the task setting, verify max. scan time.

(b) Is the priority of task arranged well?

The low priority task program shall be delayed by the high priority task program, which results in disabling the processing within the correct time and even task collision may occur as next task occurs in the state that the execution of previous task is delayed. Consider the emergency of task and execution time etc when setting the priority.

If the execution time of Task Program is longer, scan time may lengthen or be irregular. Even it may cause the collision of task program. Write the execution time as short as possible. (Especially, when writing the cyclic task program, write the execution time so that the task program can be executed within 10% cycle of the shortest task among several tasks.)

(d) Is program protection for the high priority task needed during program execution?

If other task is inserted during task program execution, complete the task in execution and operate the standby tasks in the order of high priority. In case that it is not allowed to insert other task in Scan Program,

prevent the insert partially by using „DI‟ and „EI‟ application instruction. The problem may occur while

processing the global variables used commonly with other program or special or communication module.

(9) Program configuration and processing example

If task and program are registered as below.

1) Scan program name: “ Scan Program”

2) Execution time respective program: Scan program = 17㎳, Program 1 = 2㎳, Program 2= 7㎳,

Program 3 = 2㎳

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Process per time

Time (㎳)

Process

Scan started and scan program started to execute.

0~6

Scan program is executed.

6~8

Scan program is stop because execution external I/O (P000) is requested. And program 3 is executed. Request of execution at 7[ms] is ignored because program 3 has been executing.

8~10

Program 3 is finished and Scan program is continued.

10~12

Scan program is stop by request of „10 ㎳_Cycle time‟ interrupt signal and execute program

12~20

Program 1 is finished and Scan program is continued.

Request of „Cycle time‟ interrupt signal and „External I/O (P000)‟ signal is occurred concurrently but priority of „External I/O‟ signal is higher than „Cycle time‟ interrupt signal so program 3 is executed and program 1 is standby.

20~22

Program 3 is finished and Scan program is continued.

22~24

After program 3 is completed, program 1 (the program of „10ms_Cycle time‟ is executed.

24~25

P1 execution completed and the stopped scan program execution finished

At the finished point of scan program, check the request of Internal device „M000‟ execution and execute program 2.

25~30

Program P2 is executed.

30~32

When „10 ㎳_Cycle time‟ interrupt signal is occurred, the priority of that is higher than Internal device „M000‟ though program 2 is stopped and program 1 is executed.

32~34

P1 executed completed and the stopped P2 execution finished

New scan starts (Start scan program execution)

Scan program

Program 1

10ms_Cycle time

Program 2

Internal device_M000

Program 3

External I/O_P000

Time

0 6 7 8 10

Scan started (Initial operation started)

Scan program stopped

New scan started

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5.3 Operation Mode

RUN mode first scan start

Initialize data area

Examine Program effectiveness and judge the

possibility of execution

Execute input refresh

Program execute, Interrupt Program execute

Communication service and internal processing

Execute output refresh

Operation

mode change

RUN mode keep

Change to other mode

Operation by changed operation

mode

Examine the normal operation or missing of

built-in module

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For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode.. Here describes the operation processing of each operation mode.

5.3.1 RUN mode

This is the mode to executed program operation normally.

(1) Processing at mode change

At the beginning, execute initialization of data area and examine the effectiveness of program and judge the

possibility of execution.

(2) Operation processing contents

Execute I/O refresh and program operation.

(a) Detects the start condition of Interrupt Program and executes Interrupt Program.

(b) Examines the normal operation or missing of built-in module.

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5.3.2 STOP mode

This is the mode in stop state without Program operation. It is available to transmit the program through XG5000

only in Remote STOP mode.

(1) Processing at Mode Change

Clear the output image area and execute output refresh.

(2) Operation Processing Contents

(a) Executes I/O refresh. (b) Examines the normal operation or missing of built-in module. (c) Communication service or other internal processing.

5.3.3 DEBUG mode (Supported at “S” type)

This is the mode to detect Program error or trace the operation process and the conversion to this mode is available only in STOP mode. This is the mode to check the program execution state and the contents of each data and verify the program.

(1) Processing at mode change

(a) Initializes the data area at the beginning of mode change. (b) Clears the output image area and execute input refresh.

(2) Operation processing contents

(a) Executes I/O refresh. (b) Debug operation according to setting state. (c) After finishing Debug operation by the end of Program, execute output refresh. (d) Examine the normal operation or missing of built-in module. (e) Executes communication service or other service.

(3) Debug operation

 It describes debug mode.

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Item

Description

Remark

Start/Stop Debugging

Change the debug ↔ stop mode

It starts debug operation.

Step Over

It operates by 1 step.

Step Into

It starts the subroutine program.

Other operation is

identical to Step Over.

Step Out

It finished the subroutine program.

Go to Cursor

It operates to current cursor position.

Set/Remove Breakpoints

Set/Removes current cursor position to break points.

Breakpoints List

It displays list of breakpoints.

Breakpoint Conditions

It specifies device value and number of scan.

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(a) Set/Remove Breakpoints ▪ Sets breakpoint at current cursor position. After breakpoint setting, (breakpoint setting indicator) is

displayed.

(b) Go ▪ Run the program to breakpoint. At break-pointer (stop indicator) is displayed.

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(d) Breakpoint List ▪ It displays current Breakpoint List. It supports Select All, Reset All, Goto, Remove, Remove All.

(e) Break condition ▪ It sets Device Break and Scan Break.

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Remark

1) Refer to XG5000 Users Manual „Chapter 12 Debugging‟ for detailed information.

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Operation mode switch

XG5000 command

Operation mode

RUN

unchangeable

Local Run

STOP

RUN

Remote Run

STOP

Remote Stop

Debug

Debug Run

Mode change

Previous operation mode

RUN -> STOP - Stop

Warning

In case of changing Remote RUN mode to RUN mode by switch, PLC operation continues the

operation without interruption.

It is available to modify during RUN in RUN mode by switch but the mode change operation by

XG5000 is limited. This should be set only in case that remote mode change is not allowed.

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5.3.4 Change operation mode

(1) Operation Mode Change Method

The method to change operation mode are as follows. (a) By mode key of CPU module

(b) By connecting the programming tool (XG5000) to communication port of CPU (c) By changing the operation mode of other CPU module connected to network by XG5000 connected to

communication port of CPU. (d) By using XG5000, HMI, computer link module connected to network (e) By „STOP„ instruction during program execution

(2) Type of operation mode

The operation mode setting is as follows.

(a) Remote mode conversion is available only in the state of „Remote Enabled: On‟, „Mode switch: Stop‟.

In case of changing the Remote „RUN‟ mode to „STOP‟ by switch, operate the switch as follows.

(STOP)  RUN  STOP.

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Chapter 5 Program Configuration and Operation Method

5.4 Memory

Area per device

Device features

Description

“E” type

“S” type

P0000 ~ P127f

P0000~ P1023f

I/O device “P”

Image area to save the state of I/O device. After reading the input module state, saves it in the

corresponding P area and sends P area Data saving the operation result to output module.

M0000 ~ M255f

M0000~ M1023f

Internal device “M”

Internal Memory provided to save Bit Data in

Program

L0000 ~ L1279f

L0000~ L2047f

Communication device

“L”

Device to indicate high speed link/P2P service state

information of communication module.

K00000 ~ K2559f

K00000~ K4095f

Preservation device “K”

Device area to preserve the data during power

shutdown, which is used without setting power shutdown preservation parameter separately. (Pay attention to write in special area (K2600 ~ 2559F)).

F0000 ~ F255f

F0000~ F1023f

Special device “F”

System flag area that manages the flag necessary

for system operation in PLC.

T0000 ~ T255

T0000~ T1023

Timer device “T”

Area to save the state of contact/current value/set

value of timer device

C0000 ~ C255

C0000~ C1023

Counter device “C”

Area to save the state of contact/current value/set

value of counter device

S00.00 ~ S127.99

S00.00~ S127.99

Step controller “S” 128 x 100 step

Relay for step control

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There are two types of memory in CPU module that the user can use. One is Program Memory that saves the user program written by the user to build the system, and the other is Data Memory that provides the device area to save the data during operation.

5.4.1 Data memory

(1) Bit device area

Various Bit Device are provided per function. The indication method is indicated by device type for first digit,

word position by decimal for middle digit and bit position by hexadecimal for the last digit.

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Chapter 5 Program Configuration and Operation Method

Area per device

Device features

Description

“E” type

“S” type

D00000 ~

D5119

D0000~ D10239

Data register “D”

Area to preserve the internal data. Bit expression possible. (D0000.0)

U00.00 ~

U0A.31

U00.00~ U0A.31

Analog data register “U”

in the slot. Bit expression possible

Z000 ~

Z127

Z000~ Z127

Index register “Z”

Dedicated device to use Index function Bit expression impossible

T0000 ~

T255

T0000~ T1023

Timer current value register “T”

Area to indicate the current value of timer

C0000 ~

C255

C0000~ C1023

Counter current value register “C”

Area to indicate the current value of counter

R0000~ R10239

File register “R”

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(2) Word device area

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Chapter 5 Program Configuration and Operation Method

5.5 Configuration Diagram of Data Memory

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WWoorrdd ddaattaa aarreeaa

UUsseerr PPrrooggrraamm aarreeaa

I/O Relay

(2048 points)

“P”

Link Relay (20480 points)

“L”

Keep Relay (40960 points)

“K”

Special Relay (4096 points)

“F”

Auxiliary Relay (4096 points)

“M”

P000

P127 M000

L0000

M255 K000

K2559 F000

F255

Data Register

(5120 words)

“D”

D0000

D5119

Timer setting value (256 words)

T000

T255 T000

Timer current value (256 words)

T255 C000

C255 C000

C255

Parameter area

User Program area

(4 K step)

Timer

(256 points)

“T”

T000

Step controller (128 x 100 step)

S00.00~S127.99

“S”

S000

S127

0 ~ F

0000 ~ FFFF

Counter (256 points)

“C”

C000

C255

Counter setting value

(256 words)

Counter current value (256 words)

Index Register

(128 words)

U0A.31

Z127

“Z”

Analog Data Register

(1024 words)

“U”

U00.00

Z000

L1279

T255

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5.5.1 “E” type

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Chapter 5 Program Configuration and Operation Method

BBiitt ddaattaa aarreeaa

WWoorrdd ddaattaa aarreeaa

I/O Relay

(16384 points)

“P”

Link Relay (32768 points)

“L”

Keep Relay (65536 points)

“K”

Special Relay (16384 points)

“F”

Auxiliary Relay (16384 points)

“M”

P0000

P1023 M0000

L0000

M1023 K0000

K4095 F0000

F1023

Data Register

(10240 words)

“D”

D0000

D10239

Parameter area

User Program area

(15 K step)

Timer

(1023 points)

“T”

T0000

Step controller (128 x 100 step)

S00.00~S127.99

“S”

S000

S127

0 ~ F

0000 ~ FFFF

Counter (1023 points)

“C”

C0000

C1023

Timer setting value (1024 words)

T0000

T1023 T0000

Timer current value (1024 words)

T1023 C0000

C1023 C0000

C1023

Counter setting value

(1024 words)

Counter current value (1024 words)

U0A.31

Analog Data Register

(1024 words)

“U”

U00.00

Index Register

(128 words)

Z127

“Z”

Z000

User Program area

L2047

T1023

File register (10240 words)

“R”

R0000

R10239

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5.5.2 “S” type

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Chapter 5 Program Configuration and Operation Method

Device

1st latch

2nd latch

Features

P X X

Image area to save the state of I/O device

M O O

Internal device area

K X X

Device keeping the device state during power shutdown

F X X

System flag area

T O O

Timer related area (Bit/words both)

C O O

Counter related area (Bit/words both)

S O O

Relay for step control

D O O

General words data save area

U X X

Analog Data Register (latch disabled )

L X X

High speed link/P2P Service state device of communication module (latch enabled)

Z X X

Index dedicated Register (latch disabled)

R O O

File register (latch enabled)

Remark

▪ K, L, R devices are basically latched.

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5.5.3 Data latch area setting

When PLC stops and restarts the data required for operation or the data occurred during operation, if you want to keep and use those data, data latch can be used and it is available to use a certain area of some data device as latch area by parameter setting.

The below shows the features for latch device.

(1) Latch area setting

(a) Click Device Area Setup of Basic parameter settings.

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Chapter 5 Program Configuration and Operation Method

No.

Classification

Detailed operation

Latch 1

Latch 2

Power change

Off/On

Keep

Reset by XG5000

Overall reset

Reset

Keep

Program write (online)

Keep

Data broken SRAM broken by battery error

Reset

Data broken by other reason

Reset

XG5000 online Clear Latch 1

Reset

Keep

Clear Latch 2

Reset

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(2) Data latch area operation

(a) The method to delete the latched data is as below.

- latch 1, latch 2 clear operation by XG5000

- write by Program (initialization program recommended)

- write „0‟ FILL from XG5000 monitor mode.

For keep or reset (clear) operation of latch area data according to PLC operation, please refer to the below table.

(b) Latch 1 area is cleared by『Online』-『Reset PLC』- “Overall reset”.

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Chapter 5 Program Configuration and Operation Method

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(3) Data initialization

In case of Memory Delete state, the memory of all device shall be cleared as „0‟. In case of giving the data

value at the beginning according to system, please use the initialization task.

(a) Device area is cleared by click „Clear‟ in 『Online』-『Clear PLC』-『Clear Memory』.

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Chapter 6 CPU Functions

6.1 Type Setting

PLC

Series

CPU type

Description

Reference

XGB

XGB-DR16C3

Dedicated product

Modular type

XGB-DR32HL

Dedicated product

Modular type

XGB-XBCE

“E” type : XBC-DR10/14/20/30E

Compact type

XGB-XBCH

“H” type : XBC-DR32/64H , XBC-DN32/64H

Compact type

XGB-XBCS

“S(U)” type : XBC-DR20/30/40/60SU,

XBC-DN20/30S(U), XBC-DN40/60SU

Compact type

XGB-XBMS

“S” type : XBM-DN16/32S , XBM-DR16S

Modular type

XGB-XECH

“H” type : XEC-DR32/64H, XEC-DN32/64H

Compact type IEC language

Remark

▪ In case type is different, connection is not available.

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Chapter 6 CPU Functions

It describes setting of XGB PLC type.

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Chapter 6 CPU Functions

6.2 Parameter Setting

6.3 Self-diagnosis Function

Item

Description

Remarks

Error/Warning

Display the current error/warning.

Error Log

Display a log of error/warning occurred.

Saving up to 100

Remark

(1) Saved data are not deleted until selecting a menu of XG5000 and clicking “Delete”.

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6.3.1 Saving of error log

CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking

『Error/Warning』 of 『Online』 shows the current error and previous error log.

6.3.2 Troubleshooting

(1) Trouble types

Trouble occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble is divided into trouble mode stopping operation for the safety and warning mode generating alert to user with a mode in trouble.

The causes troubling PLC system are as follows.

 PLC hardware trouble

 System configuration error  Operation error while operating user program  Error detected owing to external device in trouble

(2) Operation mode if trouble occurs

PLC system logs any trouble occurred in flag and determines whether to stop or resume operation depending on trouble mode.

(a) PLC hardware trouble

In case an error occurs so that PLC such as CPU module and power module may not work normally, the system is halted, but any warning may not interfere with the operation.

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Chapter 6 CPU Functions

Remark

(1) If any trouble occurs, the trouble number is saved in a special relay F002,003. (2) For details of flag, refer to the appendix 1 Flag List.

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(b) Operation error while operating user program

Representing an error occurred during operation of user program, in case of numeric operation error, it displays the error in error flag but the system resumes operating. However, if the operation time exceeds by the operation monitoring time limit and I/O module does not control it normally, the system is halted.

Representing the detection of external device to be controlled by users program of PLC, if an error is detected, the system is halted, but any warning may not interfere with the operation.

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Chapter 6 CPU Functions

6.4 Remote Functions

Remark

(1) For details regarding remote functions, refer to „Ch10 Online‟ of XG5000 Users Manual.

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CPU module may change operation by communication as well as by key switches mounted on the module. To operate it remotely, it is necessary to set „RUN/STOP‟ switch to „STOP‟.

(1) Remote operations are as follows.

(a) Operable by accessing to XG5000 through RS-232C port mounted on CPU module. (b) Can operate other PLC connected to PLC network with CPU module connected to XG5000.

(2) Remote RUN/STOP

(a) Remote RUN/STOP is the externally controlled RUN/STOP function.

(b) It is convenient when CPU module is located at a position hard to control or when CPU module

within control panel is to control RUN/STOP function remotely.

(3) Remote DEBUG

(a) It manages debugging remotely when remote mode is STOP. Namely, DEBUG operation is to execute

program operation depending on designated operation conditions.

(b) Remote DEBUG is a convenient function when confirming program operation status or data during

system debugging.

(4) Remote Reset

(a) Remote reset is to reset CPU module remotely if an error occurs at a place hard to directly control

CPU module.

(b) Like operation by switches, it supports „Reset‟ and „Overall Reset‟.

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Chapter 6 CPU Functions

6.5 Forced Input/Output On and Off Function

Item

Description

Move address

Move to the beginning and end of I/O area (P000↔P127)

Move to ±8 of I/O area displayed at the very left.

Move to ±1 of I/O area.

Application

Set whether to allow or not Force I/O

Single

Flag

Set whether to allow or not Force I/O by bits.

Data

Set Force I/O data on or off by bits.

Select All

Set to allow Force I/O with all I/O area on

Delete All

Delete to allow Force I/O with all I/O area off.

Setting device

Display I/O area set as a bit.

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Force I/O function is used to force to turn I/O areas on or off, regardless of program results.

6.5.1 Force I/O setup

Click『 Online 』-『 Force I/O 』.

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Chapter 6 CPU Functions

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6.5.2 Processing time and processing method of Force Input/Output On and Off

(1) Forced Input

Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among data read from input module with the data as Force and updates input image area. Therefore, user program executes operations with actual input data while Force input area is operated with data set as Force.

(2) Forced Output

Regarding output, at the time of output refresh upon the execution user program operation, it replaces the data of contact set as Force On/Off among data of output image area containing operation results with data set as Force and outputs the data in output module. Unlike (Force) input, the output image area is not changed by Force On/Off setting.

(3) Cautions when using Force I/O function

(a) It operates from the time when I/O is individually set as „Allow‟ after setting Force data. (b) It is possible to set Force input although I/O module is not actually mounted. (c) Despite of the power changed Off -> On, operation mode changes or any operation by pressing reset

key, the data of which On/Off is set before is kept in CPU module. (d) Even in STOP mode, Force I/O data is not removed. (e) To set new data from the beginning, it is necessary to deselect all settings of I/O by using „Delete All‟

option.

(4) Operation in case of error

(a) If error occurs after setting forced output, PLC operates based on “Keep output when an error occurs”

in Basic parameter and “Emergency output” in I/O parameter.

If you set “Emergency output” as “Clear” after setting “Keep output when an error occurs”, output is

cleared when an error occurs. If you set “Emergency output” as “Hold” after setting “Keep output when

an error occurs”, output is held when an error occurs.

(b) If you don‟t set “Keep output when an error occurs”, output is off when an error occurs.

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Chapter 6 CPU Functions

6.6 Direct Input/Output Operation

Remark

- When using IORF instruction to read/write data at expansion module, scan time increases by 2ms. So when executing interrupt task program by external input less than 10ms or cycle time task less than 10ms, task collision may occurs.

-For details regarding IORF instruction, refer to XGK/XGB Instructions List.

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Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is

scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after „END‟ instruction on program.

This function may be useful when directly reading the status of input contact during program operation by

refreshing I/O by means of „IORF‟ instruction or outputting operation results to output contact.

„IORF‟ command is operated when M00000 is ON. First operand designates slot number. Second operand

designates the upper 32 bit data as mask data. Third operand designates the lower 32 bit data as mask data. The bit to refresh set as 1 (hFF) and others set as 0 (h00) (not refreshed).

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Chapter 6 CPU Functions

6.7 Diagnosis of External Device

FSET F2020

M000

FSET F2002

Error device bit On

Error detection request On

FSET F2030

M000

FSET F2003

Warning device bit On

Warning detection request On

FRST F2030

Warning cancellation

Warning detection request On

FSET F2003

M000

M001

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This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of the system. Use of this flag displays faults of external device without any complicated program prepared and monitors fault location without any specific device (XG5000 and etc) or source program.

(1) Detection and classification of faults in external device

(a) The trouble (fault) of external device may be detected by user program and largely divided, depending

on the type, into error and warning; the former requires halt of PLC operation and the latter simply

displays the status while PLC keeps working. (b) „Error‟ uses „F202 (_ANC_ERR)‟ and „Warning‟ uses „F203 (_ANC_WB) flag‟. (c) As the detection request flag, ‟Error‟ uses „F2002 (_CHK_ANC_ERR) flag‟ while „Warning‟ uses

„F2003 (_CHK_ANC_WB) flag‟.

(2) Troubleshooting external device

(a) When detecting any trouble of external device in user program, it writes a value except „0‟ by classifying

the type, which is defined by a user in „F202 (_ANC_ERR)‟ while the detection request flag checks it at the time when the program ends with „F2002 (_CHK_ANC_ERR) On, and PLC outputs based on the “Emergency Output” setting in I/O parameter, making it as the same error status as detected by PLC itself.

(b) If any trouble occurs, a user may identify the cause by using XG5000 and alternatively by monitoring

„F202 (_ANC_ERR) flag‟.

 Example

are off (error LED switches on and off every second.)

(3) Processing warning of external device

(a) When detecting any warning of external device in user program, it turns on a flag in the warning

position of system flag „F203 (_ANC_WB) and if turning on the detection request flag, „F2003 (_CHK_ANC_WB)‟ , it displays warning at the time when scan program ends. If a warning occurs, the

detection request flag, „F2003 (_CHK_ANC_WB)‟ is automatically off (F203 is not deleted). (b) If a warning occurs, the LED switches on and off every other second. (c) If turning off a bit in question of F203 and turning on F2003 bit after processing warning, warning is

cancelled and the LED turns off.

 Example

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Chapter 6 CPU Functions

6.8 Allocation of Input/Output Number

System Configuration

Number of Connection stage

Type

I/O allocation

Remarks

XBC-DN30S(U)

Input : P0000 ~ P003F Output : P0040 ~ P007F

Main unit fixed

XBE-DC32A

Input : P0080~P011F

Actual input: P0080 ~ P009F

XBE-TN32A

Output : P0120 ~ P015F

Actual output : P0120 ~ P013F

XBL-C21A

P0160 ~ P019F

XBF-AD04A

P0200 ~ P023F

XBF-DV04A

P0240 ~ P027F

XBE-DC32A

Input : P0280 ~ P031F

Actual input : P0280 ~ P029F

XBE-TN32A

Output : P0320 ~ P035F

Actual output : P0320 ~ P033F

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Allocation of I/O number is to allocate an address to every I/O of each module to read data from input module and output data to output module when it executes operations. XGB series adopts 64 points occupation to every module.

(1) Allocation of I/O number

124 points are allocated to main unit and 64 points are allocated to every module except main unit (incl. special, communication).

Empty I/O point is available for internal relay. (2) In case of allocating IO of IO parameter, allocation information is displayed.

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Chapter 6 CPU Functions

I/O module allocation information

Description of each module

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In case of using monitor function of XG5000, I/O allocation information is displayed.

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LSIS XBC-DP20SU, XGT Series, XBC-DR30SU, XBC-DN20SU, XBC-DN20S User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Revision History

◎ Contents ◎

Chapter 1 Introduction

1.1 Guide to Use This Manual

1.2 Features

1.3 Terminology

Chapter 2 System Configuration

2.1 XGB System Configuration

2.2 Product List

2.3 Classification and Type of Product Name

2.4 System Configuration

Chapter 3 General Specifications

3.1 General Specifications

4.1 Performance Specifications

Chapter 4 CPU Specifications

4.2 Names of Part and Function

4.3 Power Supply Specifica t ions

4.4 Calculation Example of Consum pt ion Current/Voltage

4.5 Data Backup Time

Chapter 5 Program Configuration and Operation Method

5.1 Program Instruction

5.2 Program Execution

5.3 Operation Mode

5.4 Memory

5.5 Configuration Diagram of Data Memory

Chapter 6 CPU Functions

6.1 Type Setting

6.2 Parameter Setting

6.3 Self-diagnosis Function

6.4 Remote Functions

6.5 Forced Input/Output On and Off Function

6.6 Direct Input/Output Operation

6.7 Diagnosis of External Device

6.8 Allocation of Input/Output Number