LTM3210 Data Sheet
Shenzhen Longsys Technology Co., Ltd. www.Longsys.com
o Room 306-310, Building 4, Software Park 1, Nanshan District, Shenzhen, China
-3-
1. Introduction ............................................................................................................... 4
2. Hardware Specification ............................................................................................ 6
2.1 LTM3210 module pinout ................................................................................................................................ 6
2.2 LTM3210 Interface summary ......................................................................................................................... 8
2.3 Bootstrap signals ............................................................................................................................................ 8
2.4 Electrical characteristics................................................................................................................................. 9
2.4.1 Absolute Maximum Ratings .......................................................................................................... 9
2.4.2 Recommended Operating Conditions ........................................................................................... 9
2.4.3 General DC electrical characteristics .......................................................................................... 10
2.4.4 LTM3210 radio Rx characteristics ............................................................................................... 10
2.4.5 LTM3210 radio Tx characteristics ................................................................................................ 11
2.5 Timing specifications ................................................................................................................................... 12
2.5.1 SPI master interface timing ......................................................................................................... 12
2.5.2 SPI slave interface timing ............................................................................................................ 13
3. Mechanical Interface Specification ....................................................................... 14
4. Manufacture information ....................................................................................... 15
4.1 Optical Inspection ........................................................................................................................................ 15
4.2 Rework ......................................................................................................................................................... 15
4.3 Handling ....................................................................................................................................................... 15
4.4 Soldering Recommendations ....................................................................................................................... 15
5. Ordering Information ............................................................................................. 16
6. FCC Statement ........................................................................................................ 17