LOGIC LMS12JC40, LMS12JC35 Datasheet

DEVICES INCORPORATED
LMS12
12-bit Cascadable Multiplier-Summer
LMS12
DEVICES INCORPORATED
12-bit Cascadable Multiplier-Summer
FEATURES DESCRIPTION
❑❑
12 x 12-bit Multiplier with
❑❑
❑❑
Summer has 26-bit Input Port Fully
❑❑
Independent from Multiplier Inputs
❑❑
Cascadable to Form Video Rate FIR
❑❑
Filter with 3-bit Headroom
❑❑
A, B, and C Input Registers Sepa-
❑❑
rately Enabled for Maximum Flexibility
❑❑
28 MHz Data Rate for FIR Filtering
❑❑
Applications
❑❑
High Speed, Low Power CMOS
❑❑
Technology
❑❑
84-pin PLCC, J-Lead
❑❑
The LMS12 is a high-speed 12 x 12-bit combinatorial multiplier integrated with a 26-bit adder in a single 84-pin package. It is an ideal building block for the implementation of very high­speed FIR filters for video, RADAR, and other similar applications. The LMS12 implements the general form (AB) + C. As a result, it is also useful in implementing polynomial approxi­mations to transcendental functions.
ARCHITECTURE
A block diagram of the LMS12 is shown below. Its major features are discussed individually in the follow­ing paragraphs.
MULTIPLIER
The A11-0 and B11-0 inputs to the LMS12 are captured at the rising edge of the clock in the 12-bit A and B input registers, respectively. These registers are independently enabled by the
LMS12 BLOCK DIAGRAM
A
11-0
12
ENA ENB
CLK
C
25-0
A REGISTER
24
PRODUCT REGISTER
SIGN
EXTENDED
26 26
26
C REGISTER
B
11-0
B REGISTER
242
12
26
S REGISTER
S
OE
25-0
FTS
ENA and ENB inputs. The registered input data are then applied to a 12 x 12-bit multiplier array, which produces a 24-bit result. Both the inputs and outputs of the multiplier are in two’s complement format. The multiplication result forms the input to the 24-bit product register.
SUMMER
The C25-0 inputs to the LMS12 form a 26-bit two’s complement number which is captured in the C register at the rising edge of the clock. The C register is enabled by assertion of the ENC input. The summer is a 26-bit adder which operates on the C register data and the sign extended contents of the product register to produce a 26-bit sum. This sum is applied to the 26-bit S register.
OUTPUT
The FTS input is the feedthrough control for the S register. When FTS is asserted, the summer result is applied directly to the S output port. When FTS is deasserted, data from the S register is output on the S port, effecting a one-cycle delay of the summer result. The S output port can be forced to a high-impedance state by driving the OE control line high. FTS would be asserted for conventional FIR filter applications, however the insertion of zero-coefficient filter taps may be accomplished by negating FTS. Negating FTS also allows application of the same filter transfer function to two interleaved datas­treams with successive input and output sample points occurring on alternate clock cycles.
ENC
Multiplier-Summers
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DEVICES INCORPORATED
FIGURE 1. FLOW DIAGRAM FOR 5-TAP FIR FILTER
x(n)
h
h
4
3
LMS12
12-bit Cascadable Multiplier-Summer
h
2
h
1
h
0
x(n)
A
4
h
4
–1
Z
h
Z
APPLICATIONS
The LMS12 is designed specifically for high-speed FIR filtering applications requiring a throughput rate of one output sample per clock period. By cascading LMS12 units, the transpose form of the FIR transfer function is implemented directly, with each of the LMS12 units supplying one of the filter weights, and the cascaded summers accumulating the results. The signal flow graph for a 5-tap FIR filter and the equivalent implementa­tion using LMS12’s is shown in Figure 1.
–1
Z
A
3
3
–1
–1
Z
h
2
–1
Z
–1
Z
A
2
The operation of the 5-tap FIR filter implementation of Figure 1 is depicted in Table 1. The filter weights h4 - h0 are assumed to be latched in the B input registers of the LMS12 units. The x(n) data is applied in parallel to the A input registers of all devices. For descriptive purposes in the table, the A register contents and sum output data of each device is labelled
–1
Z
h1
–1
Z
y(n)
A
1
h
Z
A
0
0
–1
according to the index of the weight applied by that device; i.e., S0 is produced by the rightmost device, which has h0 as its filter weight and A0 as its input register contents. Each column represents one clock cycle, with the data passing a particular point in the system illustrated across each row.
y(n)
Multiplier-Summers
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LMS12
DEVICES INCORPORATED
TABLE 1. TIMING EXAMPLE FOR 5-TAP NONDECIMATING FIR FILTER
CLK Cycle 1 2 3 4 56789
X(n) Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7 Xn+8 A4 Register Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7
Sum 4 h4Xn h4Xn+1 h4Xn+2 h4Xn+3 h4Xn+4 h4Xn+5 h4Xn+6 A3 Register Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7
Sum 3 h3Xn h3Xn+1 h3Xn+2 h3Xn+3 h3Xn+4 h3Xn+5 h3Xn+6
+h4Xn–1 +h4Xn +h4Xn+1 +h4Xn+2 +h4Xn+3 +h4Xn+4 +h4Xn+5
A2 Register Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7 Sum 2 h2Xn h2Xn+1 h2Xn+2 h2Xn+3 h2Xn+4 h2Xn+5 h2Xn+6
+h3Xn–1 +h3Xn +h3Xn+1 +h3Xn+2 +h3Xn+3 +h3Xn+4 +h3Xn+5 +h4Xn–2 +h4Xn–1 +h4Xn +h4Xn+1 +h4Xn+2 +h4Xn+3 +h4Xn+4
A1 Register Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7 Sum 1 h1Xn h1Xn+1 h1Xn+2 h1Xn+3 h1Xn+4 h1Xn+5 h1Xn+6
+h2Xn–1 +h2Xn +h2Xn+1 +h2Xn+2 +h2Xn+3 +h2Xn+4 +h2Xn+5 +h3Xn–2 +h3Xn–1 +h3Xn +h3Xn+1 +h3Xn+2 +h3Xn+3 +h3Xn+4 +h4Xn–3 +h4Xn–2 +h4Xn–1 +h4Xn +h4Xn+1 +h4Xn+2 +h4Xn+3
A0 Register Xn Xn+1 Xn+2 Xn+3 Xn+4 Xn+5 Xn+6 Xn+7 Sum 0 h0Xn h0Xn+1 h0Xn+2 h0Xn+3 h0Xn+4 h0Xn+5 h0Xn+6
+h1Xn–1 +h1Xn +h1Xn+1 +h1Xn+2 +h1Xn+3 +h1Xn+4 +h1Xn+5 +h2Xn–2 +h2Xn–1 +h2Xn +h2Xn+1 +h2Xn+2 +h2Xn+3 +h2Xn+4 +h3Xn–3 +h3Xn–2 +h3Xn–1 +h3Xn +h3Xn+1 +h3Xn+2 +h3Xn+3 +h4Xn–4 +h4Xn–3 +h4Xn–2 +h4Xn–1 +h4Xn +h4Xn+1 +h4Xn+2
12-bit Cascadable Multiplier-Summer
FIGURE 2A.INPUT FORMATS
11 10 9 2 1 0
0
2–12
–2
–2
(Sign)
11 10 9 2 1 0
11
–2
(Sign)
2102
9
FIGURE 2B.OUTPUT FORMATS
25 24
3
2
–2
2
(Sign)
25 24
25
24
–2
2
(Sign)
A
IN
Fractional Two’s Complement
–102–11
2–92
Integer Two’s Complement
22212
0
Fractional Two’s Complement
23 22 21 14 13 12
1202–1
2
Integer Two’s Complement
23 22 21 14 13 12
23222221
2
2–82–92
2142132
–10
B
IN
11 10 9 2 1 0
0
–2
(Sign)
2–12
–2
2–92
–102–11
11 10 9 2 1 0
11
–2
(Sign)
2102
9
22212
0
11 10 9 2 1 0
–112–122–13
2
–202–212–22
2
11 10 9 2 1 0
12
1121029
2
22212
0
Multiplier-Summers
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DEVICES INCORPORATED
LMS12
12-bit Cascadable Multiplier-Summer
MAXIMUM RATINGS
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground............................................................................ –0.5 V to +7.0V
Input signal with respect to ground ........................................................................................ –3.0V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0V to +7.0 V
Output current into low outputs............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS
Active Operation, Commercial 0°C to +70°C 4.75 V VCC 5.25 V Active Operation, Military –55°C to +125°C 4.50V VCC 5.50 V
ELECTRICAL CHARACTERISTICS
Above which useful life may be impaired (Notes 1, 2, 3, 8)
To meet specified electrical and switching characteristics
Mode Temperature Range (Ambient) Supply Voltage
Over Operating Conditions (Note 4)
Symbol Parameter Test Condition Min Typ Max Unit
VOH Output High Voltage VCC = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage VCC = Min., IOL = 4.0 mA 0.5 V VIH Input High Voltage 2.0 VCC V V IL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground VIN VCC (Note 12) ±20 µA IOZ Output Leakage Current Ground VOUT VCC (Note 12) ±20 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 15 25 mA ICC2 VCC Current, Quiescent (Note 7) 1.0 mA
Multiplier-Summers
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08/16/2000–LDS.S12-J
DEVICES INCORPORATED
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
SWITCHING CHARACTERISTICS
LMS12
12-bit Cascadable Multiplier-Summer
COMMERCIAL OPERATING RANGE (0°C to +70°C)
Symbol Parameter Min Max Min Max Min Max Min Max
tCP Clock Period 40 35 30 25 tPW Clock Pulse Width 15 15 12 8 tSAB A, B, Data Setup Time 1 5 12 12 10 tSC C Data Setup Time 15 10 7 7 tSEN ENA, ENB, ENC Setup Time 15 12 12 10 tHAB A, B, Data Hold Time 5 5 5 2 tHC C Data Hold Time 5 5 5 2 tHEN ENA, ENB, ENC Hold Time 5 5 5 2 tD Clock to S–FT = 1 50 40 35 30
Clock to S–FT = 0 25 25 25 20
tENA Three-State Output Enable Delay (Note 11) 25 25 25 20 tDIS Three-State Output Disable Delay (Note 11) 22 22 22 20
Notes 9, 10 (ns)
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65
LMS12–
*
50
*
40 35
SWITCHING WAVEFORMS
INPUTS
A, B, C
ENA
ENB, ENC
CLOCK
S OUTPUTS
OE
R OUTPUTS
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*DISCONTINUED SPEED GRADE
t
t
SAB
t
SEN
t
DIS
SC
t
HAB
t
HC
t
HEN
t
HIGH IMPEDANCE
5
PW
t
PW
t
D
t
ENA
Multiplier-Summers
08/16/2000–LDS.S12-J
DEVICES INCORPORATED
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
4
4
SWITCHING CHARACTERISTICS
LMS12
12-bit Cascadable Multiplier-Summer
MILITARY OPERATING RANGE (–55°C to +125°C)
Symbol Parameter Min Max Min Max Min Max
tCP Clock Period 40 35 30 tPW Clock Pulse Width 15 15 12 tSAB A, B, Data Setup Time 15 15 12 tSC C Data Setup Time 15 15 12 tSEN ENA, ENB, ENC Setup Time 15 15 12 tHAB A, B, Data Hold Time 5 5 5 tHC C Data Hold Time 5 5 5 tHEN ENA, ENB, ENC Hold Time 5 5 5 tD Clock to S–FT = 1 50 45 35
Clock to S–FT = 0 25 25 25
tENA Three-State Output Enable Delay (Note 11) 25 25 25 tDIS Three-State Output Disable Delay (Note 11) 22 22 22
Notes 9, 10 (ns)
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*
65
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LMS12–
*
50
40
*
SWITCHING WAVEFORMS
INPUTS
A, B, C
ENA
ENB, ENC
CLOCK
S OUTPUTS
OE
R OUTPUTS
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*DISCONTINUED SPEED GRADE
t
SAB
t
SC
t
SEN
t
DIS
t
HAB
t
HC
t
HEN
t
HIGH IMPEDANCE
6
PW
t
PW
t
D
t
ENA
Multiplier-Summers
08/16/2000–LDS.S12-J
DEVICES INCORPORATED
S1
I
OH
I
OL
V
TH
C
L
DUT
NOTES
LMS12
12-bit Cascadable Multiplier-Summer
1. Maximum Ratings indicate stress specifications only. Functional oper­ation of these products at values beyond those indicated in the Operating Condi­tions table is not implied. Exposure to maximum rating conditions for ex­tended periods may affect reliability.
2. The products described by this spec­ification include internal circuitry de­signed to protect the chip from damag­ing substrate injection currents and ac­cumulations of static charge. Neverthe­less, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values.
3. This device provides hard clamping of transient undershoot and overshoot. In­put levels below ground or above VCC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera­tion will not be adversely affected, how­ever, input current levels will be well in excess of 100 mA.
4. Actual test conditions may vary from those designated but operation is guar­anteed as specified.
5. Supply current for a given applica­tion can be accurately approximated by:
2
NCV F
where
4
N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency
6. Tested with all outputs changing ev­ery cycle and no load, at a 5 MHz clock rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed but not 100% tested.
9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed.
This device has high-speed outputs ca­pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended:
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common.
b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers.
c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin.
10. Each parameter is shown as a min­imum or maximum value. Input re­quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter­nal system must supply at least that much time to meet the worst-case re­quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case operation of any device always provides data within that time.
11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt­age, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z­to-1 and 1-to-Z tests.
12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
FIGURE B. THRESHOLD LEVELS
t
VOL*
V
DIS
0.2 V
0.2 V
OH
*
3.5V Vth 0 1 0V Vth
t
ENA
OE
Z
Z
1.5 V 1.5 V
0
1
V
Measured V
OL
*
OH
*
V
Measured V
1.5 V
1.5 V
OL
with IOH = –10mA and IOL = 10mA
OH
with IOH = –10mA and IOL = 10mA
Z Z
7
Multiplier-Summers
08/16/2000–LDS.S12-J
DEVICES INCORPORATED
ORDERING INFORMATION
84-pin
LMS12
12-bit Cascadable Multiplier-Summer
CLK
B B
ENB
S S S S S S OE
FTS
V
B B B
B B B B B
CC
B1B0ENA
12
2
13
3
14
4
15 16
5
17
6
18
7
19
8
20
9
21
10
22
11
23 24
25
25
24
26
23
27
22
28
21
29
20
30 31 32
S19S18S17S16S15S14S13S12S11S
A11A10A9A8A7A6A5A4A3A2A1A0ENC
1234567
891011 78 77 76 75
84 83 82 81 80 79
C0C1C2C3C
Top
View
36353433 50 51 52 53
4443 45 46 47 493837 39 40 41 42
10
S9S8S7S6S5S4S3S2S1S
48
4
74
GND
73
C
5
72
C
6
71
C
7
70
C
8
69
C
9
68
C
10
67
C
11
66
C
12
65
C
13
64
C
14
63
C
15
62
C
16
61
C
17
60
C
18
59
C
19
58
C
20
57
C
21
56
C
22
55
C
23
54
C
24
0
25
C
Speed
40 ns 35 ns
Plastic J-Lead Chip Carrier
(J3)
0°C to +70°C — COMMERCIAL SCREENING
LMS12JC40 LMS12JC35
Multiplier-Summers
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DEVICES INCORPORATED
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
12-bit Cascadable Multiplier-Summer
ORDERING INFORMATION
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84-pin
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Speed
0°C to +70°C — COMMERCIAL SCREENING
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
12345
A
A
ENA
B
1
B
2
B
4
B
B
C
B
3
CLK
D
B
5
6
B
E
B
B
8
B
9
F
B
7
ENB
B
G
S
S
24
25
S
H
S
21
S
22
J
FTS
S
20
K
S
19
OE
S
L
S
17
CC
V
S
6
A
A
A
A
6
7
5
8
A
3
A
4
Top View
A
9
11
A
10
0
10
Through Package
11
(i.e., Component Side Pinout)
23
S
10
S
9
S
15
S
12
S
18
S
14
16
13
S
11
S
8
Discontinued Package
Ceramic Pin Grid Array
(G3)
9
7 8 9 10 11
A
2
ENC
C
1
C
2
GND
A
1
0
C
3
C
C
A
0
S
5
S
6
S
3
S
7
S
4
4
C
5
C
8
C
13
C
11
C
14
C
15
C
18
C
17
C
20
C
23
S
0
C
24
S
2
S
1
6
C
C
7
C
9
C
12
C
10
C
16
C
19
C
21
C
22
C
25
Multiplier-Summers
LMS12
08/16/2000–LDS.S12-J
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