Datasheet LF2249QC25, LF2249QC33 Datasheet (LOGIC)

DEVICES INCORPORATED
LF2249
12 x 12-bit Digital Mixer
LF2249
DEVICES INCORPORATED
FEATURES
40 MHz Data and Computation Rate
Two 12 x 12-bit Multipliers with
❑❑
Individual Data Inputs
❑❑
Separate 16-bit Input Port for
❑❑
Cascading Devices
❑❑
Independent, User-Selectable 1–16
❑❑
Clock Pipeline Delay for Each Data Input
❑❑
User-Selectable Rounding of Products
❑❑ ❑❑
Fully Registered, Pipelined
❑❑
Architecture
❑❑
Three-State Outputs
❑❑ ❑❑
Fully TTL Compatible
❑❑ ❑❑
Replaces TRW/Raytheon/Fairchild
❑❑
TMC2249
❑❑
120-pin PQFP
❑❑
12 x 12-bit Digital Mixer
DESCRIPTION
The LF2249 is a high-speed digital mixer comprised of two 12-bit multipliers and a 24-bit accumulator. All multiplier inputs are user acces­sible, and each can be updated on every clock cycle. The LF2249 utilizes a pipelined architecture with fully registered inputs and outputs and an asynchronous three-state output enable control for optimum flexibility.
Independent input register clock enables allow the user to hold the data inputs over multiple clock cycles. Each multiplier input also includes a user-selectable 1-16 clock pipeline delay. The output of each multiplier can be independently negated under
user control for subtraction of prod­ucts. The sum of the products can also be internally rounded to 16 bits during the accumulation process.
A separate 16-bit input port con­nected to the accumulator is included to allow cascading of multiple LF2249s. Access to all 24 bits of the accumulator is gained by switching between upper or lower 16-bit words. The accumulated output data is updated on every clock cycle.
All inputs and outputs of the LF2249 are registered on the rising edge of clock, except for OE. Internal pipeline registers for all data and control inputs are provided to maintain
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2
3
4
5
6
LF2249 BLOCK DIAGRAM
ADEL
3-0A11-0
CLK
NEG
RND
CAS
15-0
CASEN
SWAP
1
FT
4
4
16
ENA BDEL
1–16 1–16
2's COMP
3
3-0B11-0
16
2 : 1
ENB
CDEL
3-0C11-0
16
10 0 1
2 : 1
ENC DDEL
1–16 1–16
2's COMP
24
16MS LS
2 : 1
3-0D11-0
END
7
8
9
4
4
NEG
ACC
2
10
11
OE
NOTE: NUMBERS IN REGISTERS INDICATED NUMBER OF PIPELINE DELAYS.
16
S
15-0
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DEVICES INCORPORATED
15 14 13 10 9 81211 76543210
–2
23222221
2182172
16
2202
19
215214213212211210292
8
(Sign)
15 14 13 10 9 81211 76543210
–2
23222221
2182172
16
2202
19
215214213212211210292
8
(Sign)
LF2249
12 x 12-bit Digital Mixer
synchronous operation between the incoming data and all available control functions. The LF2249 oper­ates at a clock rate of 40 MHz over the full commercial temperature and supply voltage ranges.
Because of its flexibility, the LF2249 is ideally suited for applications such as image switching and mixing, digital quadrature mixing and modulating, FIR filtering, and arithmetic function and waveform synthesis.
SIGNAL DEFINITIONS Power
VCC and GND
+5 V power supply. All pins must be connected.
Clock
DETAILED VIEW OF BLOCK DIAGRAM OUTLINED AREA
ADEL
3-0
4 12
CLK
16 : 1
A
R
11-0
1
R
R
2
16
ENA
CLK — Master Clock
The rising edge of CLK strobes all en­abled registers. All timing specifica­tions are referenced to the rising edge of CLK.
Inputs
A11-0–D11-0 — Data Inputs
A11-0–D11-0 are 12-bit data input regis­ters. Data is latched into the input reg­isters on the rising edge of CLK. The contents of the input registers are clocked into the top of the correspond­ing 16-stage pipeline delay (pushing the contents of the register stack down one register position) on the next clock cycle if the pipeline register stack is enabled. The LSBs are A0-D0 (Figure 1a).
CAS15-0 — Cascade Data Input
CAS15-0 is the 16-bit cascade data input port. Data is latched into the register on the rising edge of CLK. The LSB is CAS0 (Figure 1a).
12
FIGURE 1A.INPUT FORMATS
Data Input
10 9 811 76543210
11
–2
(Sign)
210292
8
272625242322212
Cascade Input
FIGURE 1B.OUTPUT FORMATS
Sum Output (Upper 16 bits)
Sum Output (Lower 16 bits)
15 14 13 10 9 81211 76543210
15214213
2
2122
11
210292
8
272625242322212
0
0
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DEVICES INCORPORATED
LF2249
12 x 12-bit Digital Mixer
Outputs
S15-0 — Data Output
The current 16-bit result is available on the S15-0 outputs. The output data may be either the upper or lower 16 bits of the accumulator output, de­pending on the state of SWAP. The LSB is S0 (Figure 1b).
Controls
ENA–END — Pipeline Register Enable
Input data in the N (N = A, B, C, or D) input register is latched into the corre­sponding pipeline register stack on each rising edge of CLK for which ENN is LOW. Data already in the N register stack is pushed down one register posi­tion. When ENN is HIGH, the data in the N pipeline register stack does not change, and the data in the N input register will not be stored in the register stack.
ADEL3-0–DDEL3-0 — Pipeline Delay
Select
NDEL (N = A, B, C, or D) is the 4-bit
registered pipeline delay select word.
NDEL determines which stage of the N
pipeline register stack is routed to the multiplier inputs. The minimum delay is one clock cycle (NDEL = 0000), and the maximum delay is 16 clock cycle (NDEL = 1111). Upon power up, the values of ADEL–DDEL and the con­tents of the pipeline register stacks are unknown and must be initialized by the user.
NEG1–NEG2 — Negate Control
The NEG1 and NEG2 controls deter­mine whether a subtraction or accumu­lation of products is performed. When NEG1 is HIGH, the product A x B is negated, causing the product to be sub­tracted from the accumulator contents. Likewise, when NEG2 is HIGH, the product C x D is negated, causing the product to be subtracted as well. NEG1 and NEG2 determine the operation to be performed on the data input during the current clock cycle when ADEL– DDEL = 0000.
CASEN — Cascade Enable
When CASEN is LOW, data being in­put on the CAS15-0 inputs during that clock cycle will be registered and accu­mulated internally. When CASEN is HIGH, the CAS15-0 inputs are ignored.
FT — Feedthrough Control
When FT is LOW and ADEL–DDEL = 0000, data being input on the CAS15-0 inputs is delayed three clock cycles to align the data with the data being input on the A11-0–D11-0 inputs. When FT is HIGH, the cascade data being input is routed around the three delay registers to simplify the cascading of multiple devices.
ACC — Accumulator Control
The ACC input determines whether in­ternal accumulation is performed on the data input during the current clock cycle. If ACC is LOW, no accumulation is performed, the prior accumulated sum is cleared, and the current sum of products is output. When ACC is HIGH, the emerging products are added to the sum of the previous prod­ucts.
RND — Rounding Control
When RND is HIGH, the sum of the products of the data being input on the current clock cycle will be rounded to 16 bits. To avoid the accu­mulation of roundoff errors, round­ing is only performed during the first cycle of each accumulation process.
SWAP — Output Select
The SWAP control allows the user to access all 24 bits of the accumulator output by switching between upper and lower 16-bit words. When SWAP is HIGH, the upper 16 bits of the accu­mulator are always output. When SWAP is LOW, the lower 16 bits of the accumulator are output on every other clock cycle. As long as SWAP remains LOW, new output data will not be clocked into the output regis­ters.
OE — Output Enable
When the OE signal is LOW, the current data in the output registers is available on the S15-0 pins. When OE is HIGH, the outputs are in a high-impedance state.
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LF2249
12 x 12-bit Digital Mixer
MAXIMUM RATINGS
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground............................................................................ –0.5 V to +7.0V
Input signal with respect to ground ............................................................................... –0.5 V to VCC + 0.5 V
Signal applied to high impedance output ...................................................................... –0.5 V to VCC + 0.5 V
Output current into low outputs............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS
Active Operation, Commercial 0°C to +70°C 4.75 V VCC ≤ 5.25 V Active Operation, Military –55°C to +125°C 4.50 V VCC 5.50V
ELECTRICAL CHARACTERISTICS
Above which useful life may be impaired (Notes 1, 2, 3, 8)
To meet specified electrical and switching characteristics
Mode Temperature Range (Ambient) Supply Voltage
Over Operating Conditions (Note 4)
Symbol Parameter Test Condition Min Typ Max Unit
VOH Output High Voltage Vcc = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage Vcc = Min., IOL = 4.0 mA 0.4 V VIH Input High Voltage 2.0 VCC V VIL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground VIN VCC (Note 12) ±10 µA IOZ Output Leakage Current (Note 12) ±40 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 100 mA ICC2 VCC Current, Quiescent (Note 7) 6mA CIN Input Capacitance T A = 25°C, f = 1 MHz 10 pF COUT Output Capacitance TA = 25°C, f = 1 MHz 10 pF
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7
4
SWITCHING CHARACTERISTICS
LF2249
12 x 12-bit Digital Mixer
COMMERCIAL OPERATING RANGE (0°C to +70°C)
Symbol Parameter Min Max Min Max Min Max
tCYC Cycle Time 40 33 25 tPWL Clock Pulse Width, LOW 15 15 10 tPWH Clock Pulse Width, HIGH 10 10 10 tS Input Setup Time 8 8 7 tH Input Hold Time 0 0 0 tD Output Delay 17 15 14 tENA Three-State Output Enable Delay (Note 11) 15 15 15 tDIS Three-State Output Disable Delay (Note 11) 15 15 15
MILITARY OPERATING RANGE (–55°C to +125°C)
Symbol Parameter Min Max Min Max
tCYC Cycle Time 40 33 tPWL Clock Pulse Width, LOW 15 15 tPWH Clock Pulse Width, HIGH 10 10 tS Input Setup Time 8 8 tH Input Hold Time 0 0 tD Output Delay 17 15 tENA Three-State Output Enable Delay (Note 11) 15 15 tDIS Three-State Output Disable Delay (Note 11) 15 15
Notes 9, 10 (ns)
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Notes 9, 10 (ns)
40
LF2249-
*
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33 25
LF2249-
*
40
33
*
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2
3
4
5
6
7
8
9
SWITCHING WAVEFORMS
123 678
CLK
t
A
11-0
– D
11-0
CONTROLS (Except OE)
S
15-0*
OE
*Assumes ADEL–DDEL = 0000
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*DISCONTINUED SPEED GRADE
N
S
t
10
11
N + 1
tPWH tPWL
N + 2
tDIS
HIGH IMPEDANCE
5
tD
SN SN + 1 SN + 2
tENA
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DEVICES INCORPORATED
S1
I
OH
I
OL
V
TH
C
L
DUT
OE
0.2 V
t
DIS
t
ENA
0.2 V
1.5 V 1.5 V
3.5V Vth
1
Z
0
Z
Z
1
Z
0
1.5 V
1.5 V
0V Vth
VOL*
V
OH
*
V
OL
*
V
OH
*
Measured V
OL
with IOH = –10mA and IOL = 10mA
Measured V
OH
with IOH = –10mA and IOL = 10mA
NOTES
LF2249
12 x 12-bit Digital Mixer
1. Maximum Ratings indicate stress specifications only. Functional oper­ation of these products at values beyond those indicated in the Operating Condi­tions table is not implied. Exposure to maximum rating conditions for ex­tended periods may affect reliability.
2. The products described by this spec­ification include internal circuitry de­signed to protect the chip from damag­ing substrate injection currents and ac­cumulations of static charge. Neverthe­less, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values.
3. This device provides hard clamping of transient undershoot and overshoot. In­put levels below ground or above VCC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera­tion will not be adversely affected, how­ever, input current levels will be well in excess of 100 mA.
9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed.
This device has high-speed outputs ca­pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended:
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common.
11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt­age, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z­to-1 and 1-to-Z tests.
12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
FIGURE B. THRESHOLD LEVELS
4. Actual test conditions may vary from those designated but operation is guar­anteed as specified.
5. Supply current for a given applica­tion can be accurately approximated by:
2
NCV F
where
4
N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency
6. Tested with all outputs changing ev­ery cycle and no load, at a 25 MHz clock rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed but not 100% tested.
b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers.
c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin.
10. Each parameter is shown as a min­imum or maximum value. Input re­quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter­nal system must supply at least that much time to meet the worst-case re­quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case operation of any device always provides data within that time.
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ORDERING INFORMATION
120-pin
LF2249
12 x 12-bit Digital Mixer
DDEL0
DDEL1
DDEL2
DDEL3
END
D0D1D2D3D4D5D6D7D8GND
D9D10
D11
VCC
C11
C10C9C8C7C6C5C4C3C2
C1
CLK
ACC NEG NEG2
RND
S S14
GND
S S12 S11
VCC
S10
GND
VCC
GND
OE
SWAP BDEL BDEL1
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
1 2
1
3 4 5
15
6 7 8
13
9 10 11 12 13
S9
14 15
S8
16
7
S
17 18
S6 S5
19 20 21
S4
22
S3
23
S2
24 25
1
S
26
S0
27 28 29
0
30
3132333435363738394041424344454647484950515253545556575859
0
B
B1B2B3B4B5B6B7
ENB
BDEL2
BDEL3
Top
View
8
B9
B
GND
103
B10
B11
A11
VCC
999897969594939291
102
101
100
A9A8A7A6A5A4A3A2A1
A10
90
C0
89
ENC
88
CDEL CDEL2 CDEL1 CDEL0 FT CASEN CAS
0
CAS1 CAS2 CAS3 CAS4 CAS5 CAS6 CAS7 CAS8 CAS9 GND
10
CAS CAS11 CAS12 CAS13 CAS14 CAS15 NC ADEL ADEL1 ADEL2 ADEL3
3
0
87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
60
A0
ENA
1
2
3
4
5
6
7
8
Speed
33 ns 25 ns
0°C to +70°C — COMMERCIAL SCREENING
–40°C to +85°C — COMMERCIAL SCREENING
Plastic Quad Flatpack
(Q1)
LF2249QC33 LF2249QC25
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1
1
1
1
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ORDERING INFORMATION
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23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
23456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012
Speed
0°C to +70°C — COMMERCIAL SCREENING
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
12345
A
END
DDEL
DDEL
3
0
B
ACC
NEG
DDEL
1
C
RND
S
15
CLK
D
S
NEG
14
S
13
E
S
12
S
11
GND
F
S
10
S
9
V
G
S
8
S
7
GND
H
V
S
5
S
6
J
S
3
S
4
GND
K
S
1
S
2
SWAP
L
BDEL
0
S
0
BDEL
M
BDEL
3
OE
B
N
ENB
BDEL
1
B
6
D
2
D
4
D
7
D
0
D
3
D
D
1
6
D
5
KEY
Top View
GND
CC
1
DDEL
2
2
Through Package
(i.e., Component Side Pinout)
CC
B
0
B
4
2
B
3
1
B
5
2
GND
B
6
8
B
B
7
B
9
Discontinued Package
Ceramic Pin Grid Array
(G4)
8
7 8 9 10 11
D
8
D
10
C
11
C
9
D
9
D
11
C
10
C
7
V
CC
C
8
C
4
CC
A
9
A
V
B
10
B
11
5
A
1
A
10
A
7
A
4
A
11
A
8
A
6
LF2249
12 x 12-bit Digital Mixer
12 13
C
6
C
3
C
0
C
5
C
2
CDEL
2
C
1
ENC
CDEL
1
CDEL
3
CDEL
0
CASEN
0
3
CAS
CAS
CAS
CAS
CAS
CAS
NC
ADEL
A
2
0
3
7
9
11
14
CAS
CAS
CAS
2
ADEL
CAS
CAS
CAS
CAS
ENA
1
4
5
8
10
12
15
1
08/16/2000–LDS.2249-J
FT
CAS
2
CAS
6
GND
CAS
13
ADEL
ADEL
A
0
A
3
Video Imaging Products
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