Datasheet LF2242JC33, LF2242JC25, LF2242QC33, LF2242QC25 Datasheet (LOGIC)

DEVICES INCORPORATED
DEVICES INCORPORATED
FEATURES DESCRIPTION
LF2242
12/16-bit Half-Band Interpolating/
LF2242
Decimating Digital Filter
Decimating Digital Filter
❑❑
40 MHz Clock Rate
❑❑ ❑❑
Passband (0 to 0.22f
❑❑
)
S
Ripple: ±0.02 dB
❑❑
Stopband (0.28f
❑❑
to 0.5fS)
S
Rejection: 59.4 dB
❑❑
User-Selectable 2:1 Decimation or
❑❑
1:2 Interpolation
❑❑
12-bit Two’s Complement Input
❑❑
and 16-bit Output with User-Selectable Rounding, 8- to 16-Bits
❑❑
User-Selectable Two’s Complement
❑❑
or Inverted Offset Binary Output Formats
❑❑
Three-State Outputs
❑❑ ❑❑
Replaces TRW/ Raytheon/
❑❑
Fairchild TMC2242
❑❑
Package Styles Available:
❑❑
• 44-pin PLCC, J-Lead
• 44-pin PQFP
The LF2242 is a linear-phase, half- band (low pass) interpolating/ decimating digital filter that, unlike intricate analog filters, requires no tuning. The LF2242 can also signifi­cantly reduce the complexity of traditional analog anti-aliasing pre­filters without compromising the signal bandwidth or attenuation. This can be achieved by using the LF2242 as a decimating post-filter with an A/D converter and by sampling the signal at twice the rate needed. Likewise, by using the LF2242 as an interpolating pre-filter with a D/A converter, the corresponding analog reconstruction post-filter circuitry can be simplified.
The coefficients of the LF2242 are fixed, and the only user programming required is the selection of the mode (interpolate, decimate, or pass­through) and rounding. The asyn­chronous three-state output enable control simplifies interfacing to a bus.
Data can be input into the LF2242 at a rate of up to 40 million samples per second. Within the 40 MHz I/O limit, the output sample rate can be one­half, equal to, or two times the input
sample rate. Once data is clocked in, the 55-value output response begins after 7 clock cycles and ends after 61 clock cycles. The pipeline latency from the input of an impulse response to its corresponding output peak is 34 clock cycles.
The output data may be in either two’s complement format or inverted offset binary format. To avoid truncation errors, the output data is always internally rounded before it is latched into the output register. Rounding is user-selectable, and the output data can be rounded from 16 bit values down to 8 bit values.
DC gain of the LF2242 is 1.0015 (0.0126 dB) in pass-through and decimate modes and 0.5007 (–3.004 dB) in interpolate mode. Passband ripple does not exceed ±0.02 dB from 0 to 0.22fS with stopband attenuation greater than 59.4 dB from 0.28fS to
0.5fS (Nyquist frequency). The response of the filter is –6 dB at 0.25fS. Full compliance with CCIR Recom­mendation 601 (–12 dB at 0.25fS) can be achieved by cascading two devices serially.
LF2242 BLOCK DIAGRAM
SI
11–0
CLK
INTERPOLATION
CIRCUIT
3
TO ALL REGISTERS
55-TAP
FIR
FILTER
RND
3
3
ROUND
CIRCUIT
2–0
161212
DECIMATION
CIRCUIT
3
OE
16
SO
15–0
TCO
AND LIMIT
SYNCINT DEC
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DEVICES INCORPORATED
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
FIGURE 1. FREQUENCY RESPONSE OF FILTER
0 –10 –20 –30 –40 –50
GAIN (dB)
–60 –70 –80
0 0.1
SIGNAL DEFINITIONS
Power
VCC and GND
+5 V power supply. All pins must be connected.
ƒ
0.2
S
ƒ
S
FREQUENCY (NORMALIZED)
Inputs
SI11–0 — Data Input
12-bit two’s complement data input port. Data is latched into the register on the rising edge of CLK. The LSB is SI0 (Figure 2).
0.3
Controls
INT — Interpolation Control
When INT is LOW and DEC is HIGH (Table 1), the device internally forces every other incoming data sample to zero. This effectively halves the input data rate and the output amplitude.
DEC — Decimation Control
When DEC is LOW and INT is HIGH (Table 1), the output register is strobed on every other rising edge of CLK (driven at half the clock rate), decimating the output data stream.
ƒ
0.4
S
ƒ
0.5
S
ƒ
S
TABLE 1. MODE SELECTION
INT DEC MODE
0 0 Pass-through* 0 1 Interpolate 1 0 Decimate 1 1 Pass-through*
*Input and output registers run at full
clock rate
Clock
CLK — Master Clock
The rising edge of CLK strobes all regis­ters. All timing specifications are refer­enced to the rising edge of CLK.
SYNC — Synchronization Control
Incoming data is synchronized by hold­ing SYNC HIGH on CLKN, and then by bringing SYNC LOW on CLKN+1 with the first word of input data. SYNC is held LOW until resynchronization is desired, or it can be toggled at half the clock rate. For interpolation (INT = LOW), input data should be presented at the first ris­ing edge of CLK for which SYNC is LOW and then at every alternate rising edge of CLK thereafter. SYNC is inactive if DEC and INT are equal (pass-through mode).
Outputs
SO15-0 Data Output
The current 16-bit result is available on the SO15-0 outputs. The LF2242’s limiter ensures that a valid full-scale (7FFF positive or 8000 negative) output will be generated in the event of an internal overflow. The LSB is SO0 (Figure 2).
2
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DEVICES INCORPORATED
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
FIGURE 2. INPUT AND OUTPUT FORMATS
Two’s Complement Input Format
10 9 8 2 1 011 3
02–12–2
–2
(Sign)
–3
2
2–82–92
Two’s Complement Output Format (TCO = 1, Non-interpolate)
14 13 12 2 1 015 3
02–12–2
–2
(Sign)
–3
2
–122–132–14
2
Two’s Complement Output Format (TCO = 1, Interpolate)
14 13 12 2 1 015 3
1202–1
–2
(Sign)
–2
2
–112–122–13
2
Inverted Offset Binary Output Format (TCO = 0, Non-interpolate)
14 13 12 2 1 015 3
02–12–2
2
(Sign)
–3
2
–122–132–14
2
Inverted Offset Binary Output Format (TCO = 0, Interpolate)
14 13 12 2 1 015 3
1202–1
2
(Sign)
–2
2
–112–122–13
2
–10
–11
2
–15
2
–14
2
–15
2
–14
2
RND2-0 — Rounding Control
The rounding control inputs set the posi­tion of the effective LSB of the output data by adding a rounding bit to the internal bit position that is one below that speci­fied by RND2-0. All bits below the effec­tive LSB position are subsequently ze­roed (Table 2).
TCO — Two’s Complement Format Control
The TCO input determines the format of the output data. When TCO is HIGH, the output data is presented in two’s comple­ment format. When TCO is LOW, the data is in inverted offset binary format (all output bits are inverted except the MSB — the MSB is unchanged).
OE — Output Enable
When the OE signal is LOW, the current data in the output register is available on the SO15-0 pins. When OE is HIGH, the outputs are in a high-impedance state.
TABLE 2. ROUNDING FORMAT
RND2-0 SO15 SO14 SO13 SO12 • • • SO8 SO7 SO6 SO5 SO4 SO3 SO2 SO1 SO0
000XXXX• • • XXXXXXXXR 001XXXX• • • XXXXXXXR0 010XXXX• • • XXXXXXR00 011XXXX• • • XXXXXR000 100XXXX• • • XXXXR0000 101XXXX
• • • XXXR00000
110XXXX• • • XXR000000 111XXXX• • • XR0000000
'R' indicates the half-LSB rounded bit (effective LSB position)
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DEVICES INCORPORATED
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
MAXIMUM RATINGS
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground............................................................................ –0.5 V to +7.0V
Input signal with respect to ground ............................................................................... –0.5 V to VCC + 0.5 V
Signal applied to high impedance output ...................................................................... –0.5 V to VCC + 0.5 V
Output current into low outputs............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS
Active Operation, Commercial 0°C to +70°C 4.75 V VCC 5.25V Active Operation, Industrial -40°C to +85°C 4.75 V VCC 5.25V
ELECTRICAL CHARACTERISTICS
Above which useful life may be impaired (Notes 1, 2, 3, 8)
To meet specified electrical and switching characteristics
Mode Temperature Range (Ambient) Supply Voltage
Over Operating Conditions (Note 4)
Symbol Parameter Test Condition Min Typ Max Unit
VOH Output High Voltage VCC = Min., IOH = –2.0 mA 2.4 V VOL Output Low Voltage VCC = Min., IOL = 4.0 mA 0.4 V VIH Input High Voltage 2.0 VCC V V IL Input Low Voltage (Note 3) 0.0 0.8 V IIX Input Current Ground VIN VCC (Note 12) ±10 µA IOZ Output Leakage Current (Note 12) ±10 µA ICC1 VCC Current, Dynamic (Notes 5, 6) 80 mA ICC2 VCC Current, Quiescent (Note 7) 10 mA CIN Input Capacitance TA = 25°C, f = 1 MHz 10 pF COUT Output Capacitance TA = 25°C, f = 1 MHz 10 pF
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DEVICES INCORPORATED
SWITCHING CHARACTERISTICS
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
COMMERCIAL OPERATING RANGE (0°C to +70°C)
Notes 9, 10 (ns)
LF2242–
33 25
Symbol Parameter Min Max Min Max
tCYC Cycle Time 33 25 tPW Clock Pulse Width 10 10 tS Input Setup Time 10 8 tH Input Hold Time 0 0 tD Output Delay 20 16 tDIS Three-State Output Disable Delay (Note 11) 15 15 tENA Three-State Output Enable Delay (Note 11) 15 15
SWITCHING WAVEFORMS:PASS-THROUGH MODE (INT = DEC)
CLK
SYNC
SI
SO
11-0
15-0
123 7
t
t
PW
t
H
N
t
S
N+1 N+2
PW
t
D
HIGH IMPEDANCE
t
DIS
t
ENA
f(N)f(
8910
N+1
)f(
N+2
)
OE
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DEVICES INCORPORATED
SWITCHING WAVEFORMS:INTERPOLATE MODE (INT = 0, DEC = 1)
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
123 7
CLK
tS
tPW
tPW
SYNC
SI11-0
SO15-0
N
tH
N+2
tDIS
tD
HIGH IMPEDANCE
tENA
OE
SWITCHING WAVEFORMS:DECIMATE MODE (INT = 1, DEC = 0)
123 7
CLK
t
PW
SYNC
t
t
S
PW
8910
f(N)f(N+1)f(N+2)
8910
SO
SI
11-0
15-0
N
N+1 N+2
t
H
t
D
HIGH IMPEDANCE
t
DIS
t
ENA
f(N)f(
N+2
)
OE
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DEVICES INCORPORATED
NOTES
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
1. Maximum Ratings indicate stress specifications only. Functional oper­ation of these products at values beyond those indicated in the Operating Condi­tions table is not implied. Exposure to maximum rating conditions for ex­tended periods may affect reliability.
2. The products described by this spec­ification include internal circuitry de­signed to protect the chip from damag­ing substrate injection currents and ac­cumulations of static charge. Neverthe­less, conventional precautions should be observed during storage, handling, and use of these circuits in order to avoid exposure to excessive electrical stress values.
3. This device provides hard clamping of transient undershoot and overshoot. In­put levels below ground or above VCC will be clamped beginning at –0.6 V and VCC + 0.6 V. The device can withstand indefinite operation with inputs in the range of –0.5 V to +7.0 V. Device opera­tion will not be adversely affected, how­ever, input current levels will be well in excess of 100 mA.
4. Actual test conditions may vary from those designated but operation is guar­anteed as specified.
5. Supply current for a given applica­tion can be accurately approximated by:
2
NCV F
where
4
N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency
6. Tested with all outputs changing ev­ery cycle and no load, at a 20 MHz clock rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed but not 100% tested.
9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30 pF minimum, and may be distributed.
This device has high-speed outputs ca­pable of large instantaneous current pulses and fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The following measures are recommended:
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to the Device Under Test (DUT) as possible. Similar capacitors should be installed between device VCC and the tester common, and device ground and tester common.
b. Ground and VCC supply planes must be brought directly to the DUT socket or contactor fingers.
c. Input voltages should be adjusted to compensate for inductive ground and VCC noise to maintain required DUT input levels relative to the DUT ground pin.
10. Each parameter is shown as a min­imum or maximum value. Input re­quirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter­nal system must supply at least that much time to meet the worst-case re­quirements of all parts. Responses from the internal circuitry are specified from the point of view of the device. Output delay, for example, is specified as a maximum since worst-case operation of any device always provides data within that time.
11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the ±200mV level from the measured steady-state output voltage with ±10mA loads. The balancing volt­age, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Z­to-1 and 1-to-Z tests.
12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
DUT
S1
I
OL
V
C
L
I
TH
OH
FIGURE B. THRESHOLD LEVELS
t
VOL*
V
DIS
0.2 V
0.2 V
OH
*
3.5V Vth 0 1 0V Vth
Z Z
t
ENA
OE
1.5 V 1.5 V
Z
0
Z
1
V
OL
*
OH
*
V
Measured V Measured V
1.5 V
1.5 V
OL
with IOH = –10mA and IOL = 10mA
OH
with IOH = –10mA and IOL = 10mA
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ORDERING INFORMATION
LF2242
12/16-bit Half-Band Interpolating/
Decimating Digital Filter
44-pin
SO
12
SO
11
SO
10
SO SO
GND
CC
V
SO SO SO SO
44-pin
13SO14SO15
SO
7 8 9 10
9
11
8
12 13 14
7
15
6
16
5
17
4
SO3SO2SO1SO
OE
TCO
Top
View
0
RND2RND1RND
DEC
INT
44123456
43 42 41 40
2524 26 27 281918 20 21 22 23
0SI0SI1SI2
SYNC
CLK
11
GND
SI
39 38 37 36 35 34 33 32 31 30 29
GND
GND
CC
V SI
10
SI
9
SI
8
SI
7
SI
6
SI
5
SI
4
SI
3
V
CC
SO SO SO
SO SO
GND
V SO SO SO SO
12 11 10
9 8
CC
7 6 5 4
SO13SO14SO15OE
4443424140393837363534
1 2 3 4 5 6 7 8 9 10 11
1213141516171819202122
SO3SO2SO1SO
TCO
Top
View
0
RND2RND1RND
DEC
INT
0
SYNC
SI0SI1SI
CLK
GND
2
11
SI
33 32 31 30 29 28 27 26 25 24 23
GND
GND V
CC
SI
10
SI
9
SI
8
SI
7
SI
6
SI
5
SI
4
SI
3
V
CC
Speed
33 ns 25 ns
Plastic J-Lead Chip Carrier
(J1)
0°C to +70°C — COMMERCIAL SCREENING
LF2242JC33 LF2242JC25
–40°C to +85°C — COMMERCIAL SCREENING
Plastic Quad Flatpack
(Q4)
LF2242QC33 LF2242QC25
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