TVS Diode Arrays (SPA
I/O
I/O
3
4
Ref
Ref
2
2
RoHS
GREEN
®
Diodes)
Lightning Surge Protection- SRDA05 Series
SRDA05 Series 8pF 30A Diode Array
Pinout
1
1
2
1
3
1
2
Ref
8
I/O
7
6
I/O
Ref
54
Pb
Description
The SRDA05 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect I/O pins against
ESD and lightning induced surge events. This robust device
can safely absorb up to 30A per IEC61000-4-5 (tp=8/20μs)
without performance degradation and a minimum ±30kV
ESD per IEC61000-4-2 international standard. Its low
loading capacitance makes it ideal for high-speed interface
protection.
Features
• Lightning protection,
IEC61000-4-5, 30A
(8/20µs)
• EFT, IEC61000-4-4, 50A
(5/50ns)
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• Low clamping voltage
• Low leakage current
• SOIC-8 surface mount
package (JEDEC MS-012)
SOIC-8 (Top View)
Note: Pinout diagrams above shown as device footprint on circuit board.
Functional Block Diagram
I/O 1
I/O 4
Ref 1
Ref2
I/O 2
I/O 3
Additional Information
Datasheet
Resources
Samples
Applications
• Tertiary (IC Side)
Protection:
- T1/E1/T3/E3
- HDSL/SDSL
- Ethernet
• RS232, RS485
Application Example
R Tip
R Ring
T1/E1/T3/E3
Transceiver
T Tip
SRDA05-4
1
• Video Line Protection
• Security Cameras
• Storage DVRs
• Network Equipment
• Instrumentation, Medical
Equipment
58
4
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
T Ring
T1/E1/T3/E3 Interface Protection
TVS Diode Arrays (SPA
0.01
0.1
1
10
0.11 10 1001000
Pulse Duration-tp(µS)
Peak Pulse Power-P
pk
(kW)
0.00.5 1.01.5 2.02.5 3.03.5 4.04.5 5.0
Bias Voltage (V)
Normalized Capacitance (pF) Cj(VR)/Cj(VR=0)
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.5
0.8
0.6
0.4
0.2
0.0
®
Diodes)
Lightning Surge Protection- SRDA05 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
P
pk
I
pp
T
op
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Peak Pulse Power (8/20µs) 600 W
Peak Pulse Current (8/20µs) 30 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
Electrical Characteristics (TOP = 25°C)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Stand-Off Voltage V
Reverse Leakage Current I
Reverse Breakdown Voltage V
Clamping Voltage, Line-Ground
Clamping Voltage, Line-Ground
Clamping Voltage, Line-Ground
Clamping Voltage, Line-Ground
1
V
1
V
1
V
1
V
Dynamic Resistance, Line-Ground
ESD Withstand Voltage
Diode Capacitance
1
Parameter is guaranteed by design and/or device characterization.
1
1
1
R
V
C
C
I/O-GND
RWM
R
BR
C
C
C
C
DYN
ESD
I/O-I/O
IEC61000-4-2 (Contact Discharge) ±30 - - kV
IEC61000-4-2 (Air Discharge) ±30 kV
IT≤1µA - - 5.0 V
VR= 5V - - 10 µA
It = 1mA 6 - - V
IPP= 1A, tp=8/20 µs - 9.2 - V
IPP= 2A, tp=8/20 µs - 10.0 - V
IPP= 10A, tp=8/20 µs - 14.5 - V
IPP= 25A, tp=8/20 µs - 21.0 - V
( VC2-VC1)/(I
Reverse Bias=0V - 4.0 - pF
Reverse Bias=0V - 8.0 - pF
Thermal Information
Parameter Rating Units
SOIC Package 170 °C/W
Operating Temperature Range –40 to 125 °C
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
) - 0.8 -
PP2-IPP1
260 °C
SP4040
W
Normalized Capacitance vs. Bias Voltage
Non-Repetitive Peak Pulse Power vs. Pulse Time
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
51
0.00
5.00
10.00
15.00
20.00
25.00
1.010.020.030.0
Peak Pulse Current-I
PP
(A)
Clamp Voltage (V
C
)
®
Diodes)
Lightning Surge Protection- SRDA05 Series
Clamping Voltage vs. I
PP
Pulse Waveform
110%
100%
90%
80%
70%
PP
60%
50%
Percent of I
40%
30%
20%
10%
0%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Power Derating Curve
110
100
90
PP
80
70
60
50
40
30
% of Rated Power or I
20
10
0
0255075 100 12
Ambient Temperature-T
A
(oC)
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
50
Soldering Parameters
Reflow Condition Pb – Free assembly
T
P
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Reflow
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 260°C
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
20 – 40 seconds
) 8 minutes Max.
P
°C
Ramp-up
t
amp-up
PreheatPrehea
S
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
Ordering Information
Part Number Package Marking Min. Order Qty.
SRDA05-4BTG SOIC-8
LF SRDA05
SYYWW
t
P
t
L
Critical Zone
ritical Zon
L to TP
to
T
Ramp-down
amp-d
Time
2500
TVS Diode Arrays (SPA
User Feeding Direction
Pin 1 Location
SRDA
05 B
T
G
TVS Diode Arrays
(SPA
®
Diodes)
Voltage
Package
B = SOIC-8
T= Tape & Reel
G= Green
4
Channel
4= 4 Channels
Marking
L
SRDA05
SYYWW
Date code
Pin1
F
®
Diodes)
Lightning Surge Protection- SRDA05 Series
Part Numbering System
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
F
L
o
Recommended
Soldering Pad Outline
(Reference Only)
Part Marking System
Package SOIC
Pins 8
JEDEC MS-012
Millimetres Inches
Min Max Min Max
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 1.65 0.050 0.065
B 0.31 0.51 0.012 0.020
c 0.17 0.25 0.007 0.010
D 4.70 5.10 0.185 0.201
E 5.80
E1 3.80 4.00 0.150 0.157
e 1.27 BSC 0.050 BSC
L 0.40
6.20
1.27
0.228
0.016
0.244
0.050
Embossed Carrier Tape & Reel Specification — SOIC Package
Millimetres Inches
Min Max Min Max
E 1.65 1.85 0.065 0.073
F 5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D 1. 5 1. 6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W 11. 9 12.1 0.468 0.476
P 7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t 0.30 ± 0.05 0.012 ± 0.002
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
Loading...