Littelfuse SP3050 User Manual

TVS Diode Arrays (SPA

Pb

VCC

10/100

Ethernet

PHY

TX +

TX -

RX +

RX -

VCC

GND

SP3050-04HTG

TX +

TX -

RX +

RX -

Unused

Unused

Unused

RJ45

Unused

To Twisted-Pair Network

75

75

75

75

1

2

3

6

5

4

10/100 Ethernet Differential Protection

™

Family of Products)

Lightning Surge Protection - SP3050 Series

SP3050 Series 6V 10A Rail Clamp Array

Pinout

I/O 1

GND

I/O 2

Functional Block Diagram

I/O 4

V

CC

I/O 3

RoHS

GREEN

Description

The SP3050 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect each I/O pin
against ESD and high surge events. This robust device can
safely absorb surge current per IEC61000-4-5 (t

=8/20µs)

P

without performance degradation and a minimum ±20kV
ESD per IEC61000-4-2. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins.

Features

•ESD,IEC61000-4-2,

±20kV contact, ±30kV air

•EFT,IEC61000-4-4,40A

(5/50ns)

•Lightning,IEC61000-4-5,

•Lowcapacitanceof2pF

(TYP) per I/O

•Lowleakagecurrentof

0.5μA (MAX) at 5V

•SmallSOT23-6packaging

10A (8/20μs)

Applications

•LCD/PDPTVs

•Monitors

•Notebooks

•10/100/1000Ethernet

•Firewire

•SetTo pBoxes

•FlatPanelDisplays

•PortableMedical

SP3050

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

6

1

4

5

3

2

Application Examples

USB Dual Port Protection

USB

Controller

10/100/1000

Ethernet

PHY

TX +

RX +

RX -

VCC

GND

TX -

C

T

C

T

10/100/1000 Ethernet Protection

1

2

3

SP3050-04HTG

VCC

V

BUS

R

T

R

T

V

BUS

C

T

R

T

R

T

C

T

6

5

4

SP3050-04HTG

75

V

BUS

D +

USB

D -

Port

GND

V

BUS

V

BUS

D +

USB
Port

D -

GND

RJ45

Unused

Unused

TX +

TX -

RX +

RX -

To Twisted-Pair Network

Unused

Unused

75

75

75

©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.

129

Revision: June 27, 2011

SP3050 Series

TVS Diode Arrays (SPA

™

Family of Products)

Lightning Surge Protection - SP3050 Series

Absolute Maximum Ratings

Symbol Parameter Value Units

OP

V

C

C

LEAK

I/O-GND

1

=25ºC)

RWM

R

V

C

DYN

ESD

I/O-I/O

10 A

IR ≤ 1µA 6.0 V

IR = 1mA 8.0 V

VR=5V 0.1 0.5 µA

IPP=1A, tp=8/20µs, I/O to GND

I

=5A, tp=8/20µs, I/O to GND

PP

I

=8A, tp=8/20µs, I/O to GND

PP

(VC2 - VC1) / (I

IEC61000-4-2 (Contact) ±20 kV

IEC61000-4-2 (Air) ±30 kV

Reverse Bias=0V 2.4 3.0 pF

Reverse Bias=1.65V 2.0 pF

Reverse Bias=0V 1. 2 pF

I

PP

P

PK

T

OP

T

STOR

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.

1

Non-repetitive pulse per waveform on page 3

Peak Current (tp=8/20μs)

Peak Pulse Power (tp=8/20μs) 150 W

Operating Temperature -40 to 85 °C

Storage Temperature -50 to 150 °C

Electrical Characteristics (T

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage V

Reverse Voltage Drop V

Reverse Leakage Current I

Clamp Voltage

Dynamic Resistance R

ESD Withstand Voltage

Diode Capacitance

Diode Capacitance

Notes: 1 Parameter is guaranteed by design and/or device characterization.

2

Repetitive pulse per waveform on page 3.

1

1

1

1

Thermal Information

Parameter Rating Units

Storage Temperature Range -65 to 150 °C

Maximum J unction Temperature 150 °C

Maximum L ead Temperature
(Soldering 20-40s)

2

2

2

- I

) 0.7 Ω

PP2

PP1

8.8 10.0 V

11. 5 13.0 V

13.2 15.0 V

260 °C

Clamping Voltage vs. I

20.0

18.0

16.0

)

14.0

C

12.0

10.0

8.0

6.0

Clamp Voltage (V

4.0

2.0

0.0
1 2 3 4 5 6 7 8 9 10

SP3050 Series

PP

Peak Pulse Current-IPP (A)

Product Characteristics

Lead Plating Matte Tin

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Subsitute Material Silicon

Body Material Molded Epoxy

Flammability UL94-V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

130

Revision: June 27, 2011

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/SPA for current information.

©2011 Littelfuse, Inc.