TVS Diode Arrays (SPA
RoHS
GREEN
USB ControllerUSB Port
Ou
®
Diodes)
Low Capacitance ESD Protection - SP3011 Series
SP3011 Series 0.40pF Diode Array for uSb 3.0
Description
The SP3011 integrates six channels of ultra-low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for USB 3.0 ports that may experience
destructive electrostatic discharges (ESD). This high
density array can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. It’s extremely low loading
capacitance makes it ideal for protecting any high-speed
signal pins.
Pinout
8
7
*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the
opposite pin with the PCB trace.
14
1
Features
• ESD, IEC61000-4-2, ±8kV
contact, ±15kV air
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning, IEC61000-4-5,
3A (8/20μs)
• Low capacitance of 0.4pF
(TYP) per I/O
Pb
• Low leakage current of
0.1μA (TYP) at 5V
• Small form factor μDFN
(JEDEC MO-229) package
saves board space
Functional Block Diagram
Pin 11 Pin 8
Pin 13
Pin 14
Pin 9Pin 12
GND
(Pin 10)
Additional Information
Datasheet
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Resources
Samples
Applications
• Notebooks
• External Storage
• Digital Camcorder
• MP3/PMP Player
Application Example
V
BUS
SSTX+
SSTX-
tside
World
SSRX+
SSRX-
GND
D+
D-
• Desktops
• Ultramobile PC
• Smartphone
• Set Top Box (DVR/PVR)
IC
SP3011-06UTG
Signal GND
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays (SPA
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
0.0
0.1
0.2
0.3
0.4
0.5
0.0 1.0 2.0 3.0 4.0 5.0
Bias Voltage (V)
Capacitance (pF)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
1.01.5 2.02.5 3.0
Peak Pulse Current - IPP (A)
Clamp Voltage (V
C
)
-30
-25
-20
-15
-10
-5
0
10 100 1000 10000
Frequency (MHz)
Attenuation (dB)
®
Diodes)
Low Capacitance ESD Protection - SP3011 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Peak Current (tp=8/20μs) 3.0 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
Electrical Characteristics (T
OP
=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
1
Dynamic Resistance R
ESD Withstand Voltage
Diode Capacitance
Note: 1 Parameter is guaranteed by design and/or device characterization.
1
1
V
C
I/O-GND
RWM
LEAK
V
DYN
ESD
VR=5V, Any I/O to GND 0.1 0.5 µA
IPP=1A, tp=8/20µs, Fwd 11. 0 V
C
IPP=2A, tp=8/20µs, Fwd 12.5 V
IEC61000-4-2 (Contact) ±8 kV
IR ≤ 1µA 6.0 V
(VC2-VC1) / (I
) 1. 5 Ω
PP2-IPP1
IEC61000-4-2 (Air) ±15 kV
Reverse Bias=0V 0.4 pF
Insertion Loss (S21) I/O to GNDCapacitance vs. Bias Voltage
Clamping Voltage vs. I
PP
Pulse Waveform
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
L
T
P
SP
3011
06 U T
G
Series
Package
U=µDFN-14 (3.5x1.35mm)
T= Tape & Reel
G= Green
Number of
Channels
-06 = 6 Channels
–
TVS Diode Arrays
(SPA
®
Diodes)
R
*
6
Product Series
R = SP3011
Assembly Site
Number o
f
Channels
®
Diodes)
Low Capacitance ESD Protection - SP3011 Series
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
- Temperature Max (T
) 150°C
s(min)
) 200°C
s(max)
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
3°C/second max
+0/-5
°C
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
) 8 minutes Max.
P
Do not exceed 260°C
Part Numbering System
t
T
P
Ramp-up
t
amp-up
PreheatPrehea
S
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
P
t
L
Ramp-down
amp-d
Time
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Critical Zone
ritical Zon
L to TP
to
T
Part Marking System
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3011-06UTG µDFN-14 R*6 3000
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
TVS Diode Arrays (SPA
P0
D0
E
F
P1
P2
D1
W
T
B0
K0
A0
User Feeding Direction
Pin 1 Location
D
E
B
Top View
A
Bottom View
Side View
PIN 1 Index Area
1 2 3 4
A
C
b
A1
A2
Seating
Plane
Pin 1 Identification
Chamfer 0.10X45º
Soldering Pad Layout
Recomended
Symbol
Millimeter
Inches
Low Capacitance ESD Protection - SP3011 Series
Embossed Carrier Tape & Reel Specification — µDFN-14
Package Dimensions — µDFN-14 (3.5x1.35x0.5mm)
®
Diodes)
Symbol Millimeters
A0 1.58 ± 0.10
B0 3.73 ± 0.10
D0 0.60 + 0.05
D1 Ø 0.60 + 0.05
E 1.75 ± 0.10
F 5.50 ± 0.05
K0 0.68 ± 0.10
P0 2.00 ± 0.05
P1 4.00 ± 0.10
P2 4.00 ± 0.10
T 0.28 ± 0.02
W 12.00 + 0.30 /- 0.10
Package
JEDEC MO-229
Symbol
A 0.45 0.50 0.55 0.018 0.020 0.022
A1 0.00 0.02 0.05 0.000 0.001 0.002
A2 0.203 Ref 0.008 Ref
b 0.15 0.20 0.25 0.006 0.008 0.012
D 3.40 3.50 3.60 0.134 0.138 0.142
D2 - - - - - -
E 1.25 1.35 1.45 0.050 0.054 0.058
E1 - - - - - -
e 0.500 BSC 0.020 BSC
L 0.25 0.30 0.35 0. 010 0.012 0.014
Notes:
1. Dimension and tolerancing comform to ASME Y14.5M-1994.
2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily
exact.
Min Nom Max Min Nom Max
µDFN-14 (3.5x1.35x0.5mm)
Millimeters Inches
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
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