Littelfuse SP3006 User Manual

TVS Diode Arrays (SPA
654
123
®
Diodes)
Low Capacitance ESD Protection - SP3006 Series
SP3006 Series 0.5pF, 8kV Diode Array

Pinout and Functional Block Diagram

RoHS
Pb
GREEN

Description

The SP3006 Series includes ultra low capacitance back to­back zener diodes to protect high-speed ports of electronic equipment that may experience destructive electrostatic discharges (ESD). The robust diode can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Its very low loading capacitance makes it ideal for protecting high-speed data lines such as USB2.0, USB3.0, HDMI, and IEEE 1394.

Features

• ESD protection of ±8kV
contact discharge, ±15kV air discharge, (IEC61000-4-2)
• EFT protection, IEC61000-4-4, 40A (5/50ns)
• Low capacitance of 0.5pF
(@ V
=0V)
R
• Low leakage current of
0.5μA (MAX) at 5V
• Miniature SOT563
package (1.6x1.6x0.5mm) saves board space
• Lightning Protection,
IEC61000-4-5, 2.0A (8/20µs)
SP3006 Series
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

Applications

• Game Consoles
• LCD/ PDP TVs
• DVD Players
• Desktops
• MP3/ PMP

Application Example

USB Port
D+ D-
GND
• Digital Cameras
• Set Top Boxes
• Smart Phones
• Notebooks
• Computer Peripherals
USB Controller
IC
SP3006
©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information.
1
Revision: July 17, 2013
TVS Diode Arrays (SPA
0.0
1.0
0.2
0.4
0.6
0.8
1.2
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Bias (V)
Capacitance (pF)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
®
Diodes)
Low Capacitance ESD Protection - SP3006 Series

Absolute Maximum Ratings

Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Electrical Characteristics (T

Reverse Breakdown Voltage V
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
ESD Withstand Voltage
Diode Capacitance
Peak Current (tp=8/20μs) 2.0 A
Operating Temperature -40 to 125 °C
Storage Temperature -55 to 150 °C
=25ºC)
OP
Parameter Symbol Test Conditions Min Typ Max Units
BR
RWM
LEAK
1
1
1
C
V
V
I/O-I/O
C
ESD
IR=5mA 9.0 V
IR ≤ 1µA 6 V
VR=5V 0.5 µA
IPP=1A, tp=8/20µs, Fwd 12.5 V
=2A, tp=8/20µs, Fwd 15.0 V
I
PP
IEC61000-4-2 (Contact) ±8 kV
IEC61000-4-2 (Air) ±15 kV
Reverse Bias=0V 0.5 pF

Thermal Information

Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s)
260 °C
Note: 1. Parameter is guaranteed by design and/or device characterization.

Capacitance vs. Reverse Voltage

Pulse Waveform

2
Revision: July 17, 2013
Please refer to http://www.littelfuse.com for current information.
Specifications are subject to change without notice.
©2013 Littelfuse, Inc.
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
SP
3006
T
G
Series
Number of Channels
02 = 2 channel
Package
X = SOT563
T= Tape & Reel
G= Green
TVS Diode Arrays (SPA
®
Diodes)
02
X
®
Diodes)
Low Capacitance ESD Protection - SP3006 Series

Soldering Parameters

Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
- Temperature Max (T
) 150°C
s(min)
) 200°C
s(max)
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak Temperature (t
)
p
3°C/second max
+0/-5
°C
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
) 8 minutes Max.
P
Do not exceed 260°C

Product Characteristics

Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
t
T
P
T
L
T
S(max)
Temperature
T
S(min)
25
Ramp-up
amp-up
PreheatPrehea
t
S
time to peak temperature
P
t
L
Ramp-down
Critical Zone T
amp-d
Time
ritical Zon
L to TP
to

Ordering Information

Part Number Package Marking Min. Order Qty.
SP3006-02XTG SOT563 1*2 3000
SP3006 Series
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.

Part Numbering System

©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information.

Part Marking System

3
Revision: July 17, 2013
1 * 2
Product Series
1=SP3006 series
*
1
2
Assembly Site
(varies)
Number of Channels
(varies)
Package Dimensions — SOT563
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3006 Series
D
A
L
Recommended Solder Pad Layout
E
e
B
HE
c
Embossed Carrier Tape & Reel Specifications — SOT563
User Feeding Direction
Pin 1 Location

Package SOT 563

Pins 6
Millimeters Inches
Min Max Min Max
A 0.50 0.60 0.020 0.024
B 0.17 0.27 0.007 0.011
c 0.08 0.18 0.003 0.007
D 1.50 1.70 0.059 0.067
E 1. 10 1.30 0.043 0.051
e 0.50 BSC 0.020 BSC
L 0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
Millimetres Inches
Min Max Min Max
E 1.65 1.85 0.064 0.073
F 3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D 1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.10 0.154 0.161
10P0 40.0+/- 0.20 1.574+/-0.008
W 7.70 8.10 0.303 0.318
P 3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t 0.22 max 0.009 max
4
Revision: July 17, 2013
Please refer to http://www.littelfuse.com for current information.
Specifications are subject to change without notice.
©2013 Littelfuse, Inc.
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