Littelfuse SP3003 User Manual

TVS Diode Arrays (SPA

NC

V

CC

I/O 1

GND

I/O 2

I/O 4

V

CC

I/O 3

I/O 1

GND

I/O 2

SP3003-04X/J

SP3003-02X/J

SP3003-04J/XTG

SP3003-04ATG

SP3003-02J/XTG SP3003-08ATG

1

2

3

6

5

4

1

2

3

4

5

10

9

8

7

6

1

2

3

1

2

3

4

5

10

9

8

7

6

5

4

I/O 1

I/O 2

V

NC

GND

CC

NC

NC

NC

I/O 3

I/O 4

SP3003-04A

I/O 1

I/O 2

NC

I/O 3

I/O 4

SP3003-08A

GND

I/O 8

I/O 7

I/O 6

I/O 5

RoHS

GREEN

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

SP3003 Series 0.65pF Diode Array

Pinout

SP3003-02UTG

(AEC-Q101 qualified)

Pb

Description

The SP3003 has ultra low capacitance rail-to-rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.

Features

• ESD protection of ±8kV

contact discharge,
±15kV air discharge,
(IEC61000-4-2)

• EFT protection,
IEC61000-4-4, 40A
(5/50ns)

• Lightning Protection,

IEC61000-4-5, 2.5A
(8/20µs)

• Low capacitance of

0.65pF (TYP) per I/O

• Low leakage current of

0.5μA (MAX) at 5V

• Complete line of small

packaging helps save
board space (SC70,
SOT553, SOT563,
MSOP10, µDFN-6L)

• AEC-Q101 qualied
(µDFN package)

Functional Block Diagram

Additional Information

Datasheet

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13

Resources

SP3003-02UTG

Samples

Applications

• LCD/ PDP TVs

• DVD Players

• Desktops

• MP3/ PMP

• Set Top Boxes

• Mobile Phones

• Notebooks

• Computer Peripherals

• Digital Cameras

Application Example

*Package is shown as transparentDVI/ HDMI Port

D2+

GND

D2-

Vcc/NC

D1+

GND

D1-

D0+

GND

D0-

CLK+

GND

CLK-

Vcc/NC

GND

GND

IC

Signal GND

A single, 4 channel SP3003-04 device can be used to
protect four (4) of the data lines in a HDMI/DVI interface
so two (2) SP3003-04 devices provide protection for all
eight (8) TMDS lines.

TVS Diode Arrays (SPA

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

Absolute Maximum Ratings

Symbol Parameter Value Units

I

PP

T

OP

T

STOR

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.

Electrical Characteristics (T

Reverse Standoff Voltage V

Reverse Leakage Current I

Clamp Voltage

ESD Withstand Voltage

Diode Capacitance

Diode Capacitance

Note: 1. Parameter is guaranteed by design and/or device characterization.

Peak Current (tp=8/20μs) 2.5 A

Operating Temperature –40 to 125 °C

Storage Temperature –55 to 150 °C

=25ºC)

OP

Parameter Symbol Test Conditions Min Typ Max Units

RWM

LEAK

1

1

1

1

V

C

I/O-GND

C

V

C

ESD

I/O-I/O

IR ≤ 1µA 6 V

VR=5V 0.5 µA

IPP=1A, tp=8/20µs, Fwd 10.0 12.0 V

IPP=2A, tp=8/20µs, Fwd 11. 8 15.0 V

IEC61000-4-2 (Contact) ±8 kV

IEC61000-4-2 (Air) ±15 kV

Reverse Bias=0V 0.7 0.8 0.95 pF

Reverse Bias=1.65V 0.55 0.65 0.8 pF

Reverse Bias=0V 0.35 pF

Thermal Information

Parameter Rating Units

Storage Temperature Range –55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature
(Soldering 20-40s)

260 °C

1

0

-1

-2

-3

-4

-5

-6

Insertion Loss [dB]

-7

-8

-9

-10

1.E+06 1.E+07 1.E+08 1.E+09 1.E+10

Frequency [Hz]

Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND

1.00

0.95

0.90

0.85

0.80

0.75

0.70

0.65

I/O Capacitance (pF)

0.60

0.55

0.50

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

VCC = 3.3V

I/O DC Bias (V)

VCC = Float

= 5V

V

CC

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 08/20/13

TVS Diode Arrays (SPA

t

R

R

o

C

e

T

L

T

P

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

Capacitance vs. Frequency

1.4E-12

1.2E-12

1E-12

8E-13

6E-13

Capacitance [F]

4E-13

2E-13

0

1.E+06

1.E+07 1.E+08 1.E+09

Frequency [Hz]

Soldering Parameters

Reflow Condition Pb – Free assembly

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp
(TL) to peak

T

to TL - Ramp-up Rate 3°C/second max

S(max)

Reflow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak
Temperature (tp)

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (TP) 8 minutes Max.

Do not exceed 260°C

) 150°C

s(min)

) 200°C

s(max)

3°C/second max

+0/-5

°C

20 – 40 seconds

Product Characteristics

Lead Plating

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute
Material

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

T

P

T

L

T

S(max)

Temperature

T

S(min)

25

Matte Tin (SC70-x, MSOP-10) Pre-Plated

Frame (SOT5x3, µDFN-6)

Silicon

t

P

Ramp-up

amp-up

t

L

PreheatPrehea

t

S

time to peak temperature

Critical Zone

ritical Zon

T

L to TP

to

Ramp-down

amp-d

Time

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13

Package Dimensions — SC70-5

e

e

5

not used

2

D

4

HE

E

3

A2

A

A1

L

6

1

B

C

Recommended Solder Pad Layout

TVS Diode Arrays (SPA

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

Package SC70-5

Pins 5

JEDEC MO-203

Millimeters Inches

Min Max Min Max

A 0.80 1. 10 0.031 0.043

A1 0.00 0.10 0.000 0.004

A2 0.70 1. 0 0 0.028 0.039

B 0.15 0.30 0.006 0.012

c 0.08 0.25 0.003 0.010

D 1.85 2.25 0.073 0.089

E 1. 1 5 1.35 0.045 0.053

e 0.65 BSC 0.026 BSC

HE 2.00 2.40 0.079 0.094

L 0.26 0.46 0. 010 0.018

Package Dimensions — SC70-6

e

e

6

1

B

C

4

5

E

3

2

D

A2

A

A1

Recommended Solder Pad Layout

HE

L

Package Dimensions — SOT553

A

L

HE

c

6

D

5

(not used)

2

e

4

E

3

B

Recommended
Solder Pad Layout

Package SC70-6

Pins 6

JEDEC MO-203

Millimeters Inches

Min Max Min Max

A 0.80 1. 10 0.031 0.043

A1 0.00 0.10 0.000 0.004

A2 0.70 1. 0 0 0.028 0.039

B 0.15 0.30 0.006 0.012

c 0.08 0.25 0.003 0.010

D 1.85 2.25 0.073 0.089

E 1. 1 5 1.35 0.045 0.053

e 0.65 BSC 0.026 BSC

HE 2.00 2.40 0.079 0.094

L 0.26 0.46 0. 010 0.018

Package SOT 553

Pins 5

Millimeters Inches

Min Max Min Max

A 0.50 0.60 0.020 0.024

B 0.17 0.27 0.007 0.011

c 0.08 0.18 0.003 0.007

D 1.50 1.70 0.059 0.067

E 1. 10 1.30 0.043 0.051

e 0.50 BSC 0.020 BSC

L 0.10 0.30 0.004 0.012

HE 1.50 1.70 0.059 0.067

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 08/20/13

TVS Diode Arrays (SPA

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

Package Dimensions — SOT563

D

6

5

4

E

3

2

e

B

A

L

HE

c

Package Dimensions — MSOP10

Recommended Solder Pad

Recommanded Solder Pad Layout

Layout

Recommended
Solder Pad Layout

Package SOT 563

Pins 6

Millimeters Inches

Min Max Min Max

A 0.50 0.60 0.020 0.024

B 0.17 0.27 0.007 0.011

c 0.08 0.18 0.003 0.007

D 1.50 1.70 0.059 0.067

E 1. 10 1.30 0.043 0.051

e 0.50 BSC 0.020 BSC

L 0.10 0.30 0.004 0.012

HE 1.50 1.70 0.059 0.067

Package MSOP10

JEDEC MO-187

Pins 10

Millimeters Inches

Min Max Min Max

A - 1. 10 - 0.043

A1 0.00 0.15 0.000 0.006

B 0.17 0.27 0.007 0.011

c 0.08 0.23 0.003 0.009

D 2.90 3.10 0.114 0.122

E 4.67 5.10 0.184 0.200

E1 2.90 3.10 0.114 0.122

e 0.50 BSC 0.020 BSC

HE 0.40 0.80 0.016 0.031

Package Dimensions —µDFN-6L

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13

Recommended
Solder Pad Layout

Package

µDFN-6L

JEDEC MO-229

Pins 6

Millimeters Inches

Min Max Min Max

A 0.45 0.55 0.018 0.022

A1 0.00 0.05 0.000 0.002

A3 0.125REF 0.005REF

b 0.35 0.45 0.014 0.018

b1 0.15 0.25 0.006 0.010

D 1.55 1.65 0.062 0.065

D2 - - - -

E 0.95 1.05 0.038 0.042

E2 - - - -

e 0.50REF 0.020REF

L 0.33 0.43 0.013 0.017

TVS Diode Arrays (SPA

Low Capacitance ESD Protection - SP3003 Series

Embossed Carrier Tape & Reel Specification — MSOP-10

User Feeding Direction

Pin 1 Location

®

Diodes)

Millimetres Inches

Min Max Min Max

E 1.65 1.85 0.065 0.073

F 5.40 5.60 0.213 0.220

D 1.50 1.60 0.059 0.063

D1 1.50 Min 0.059 Min

P0 3.90 4.10 0.154 0.161

10P0 40.0± 0.20 1.574±0.008

W 11.90 12.10 0.469 0.476

P 7.90 8.10 0.311 0.319

A0 5.20 5.40 0.205 0.213

B0 3.20 3.40 0.126 0.134

K0 1.20 1.40 0.047 0.055

t 0.30 ± 0.05 0.012± 0.002

Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6

E 1.65 1.85 0.064 0.073

F 3.45 3.55 0.135 0.139

P2 1.95 2.05 0.077 0.081

D 1.40 1.60 0.055 0.063

D1 1. 00 1.25 0.039 0.049

P0 3.90 4.10 0.154 0.161

10P0 40.0± 0.20 1.574±0.008

W 7.70 8.10 0.303 0.318

P 3.90 4.10 0.153 0.161

User Feeding Direction

Pin 1 Location

A0 2.14 2.34 0.084 0.092

B0 2.24 2.44 0.088 0.960

K0 1. 1 2 1.32 0.044 0.052

t 0.27 max 0.010 max

Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563

E 1.65 1.85 0.064 0.073

F 3.45 3.55 0.135 0.139

P2 1.95 2.05 0.076 0.081

D 1.40 1.60 0.055 0.063

D1 0.45 0.55 0.017 0.021

P0 3.90 4.10 0.154 0.161

10P0 40.0± 0.20 1.574±0.008

W 7.70 8.10 0.303 0.318

P 3.90 4.10 0.153 0.161

User Feeding Direction

Pin 1 Location

A0 1.73 1.83 0.068 0.072

B0 1.73 1.83 0.068 0.072

K0 0.64 0.74 0.025 0.029

t 0.22 max 0.009 max

Millimetres Inches

Min Max Min Max

Millimetres Inches

Min Max Min Max

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 08/20/13

TVS Diode Arrays (SPA

®

Diodes)

Low Capacitance ESD Protection - SP3003 Series

Embossed Carrier Tape & Reel Specification — µDFN-6L

Millimetres Inches

Min Max Min Max

E 1.65 1.85 0.064 0.073

F 3.45 3.55 0.135 0.139

P2 1.95 2.05 0.076 0.081

D 1.40 1.60 0.055 0.063

D1 0.45 0.55 0.017 0.021

P0 3.90 4.10 0.154 0.161

10P0 40.0±0.20 1.574±0.008

W 7.90 8.30 0.311 0.319

P0 3.90 4.10 0.154 0.161

A0 1. 1 5 1.25 0.045 0.049

B0 1.75 1.85 0.069 0.073

K0 0.65 0.75 0.026 0.03

t 0.22 max 0.009 max

Part Marking System

F * *

Product Series

F=SP3003 series

Assembly Site

Part Numbering System

3003

SP

TVS Diode Arrays

®

(SPA

Diodes)

Series

Number of Channels

-02 = 2 channel
(SC70-5, SOT553, µDFN-6L packages)

-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)

-08 = 8 channel
(MSOP-10 packages)

-0xxT

*

*

F

Number of Channels

(varies)

(varies)

G

G= Green

T= Tape & Reel

Package

A = MSOP-10, 4000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
U= µDFN-6L, 3000 quantity

Ordering Information

Part Number Package Marking Min. Order Qty.

SP3003-02JTG SC70-5 F*2 3000

SP3003-02UTG

µDFN-6L

SP3003-02XTG SOT553 F*2 3000

SP3003-04ATG MSOP-10 F*4 4000

SP3003-04JTG SC70-6 F*4 3000

SP3003-04XTG SOT563 F*4 3000

SP3003-08ATG MSOP-10 F*8 4000

FH2 3000

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13