TVS Diode Arrays (SPA
I/O 1
I/O 2
SC70-6 and SOT23-6
V
CC
I/O 3
I/O 4
GND
1
2
6
3
5
4
Gnd
I/O 1
NC
I/O 4
I/O 2
I/O 3
V
CC
μDFN-6
(1.6x1.6x0.5mm)
RoHS
GREEN
®
Diodes)
Low Capacitance ESD Protection - SP3002 Series
SP3002 Series 0.85pF Diode Array
Pinout
Pb
Description
The SP3002 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Features
• Low capacitance of
0.85 pF (TYP) per I/O
• ESD protection of
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• EFT protection,
IEC61000-4-4, 40A
(5/50ns)
• Low leakage current of
0.5μA (MAX) at 5V
• Small packaging options
saves board space
• Lightning Protection,
IEC61000-4-5, 4.5A
(8/20µs)
Functional Block Diagram
I/O2
V
CC
I/O4
Applications
• Computer Peripherals
• Mobile Phones
• PDA’s
• Network Hardware/Ports
• Test Equipment
• Medical Equipment
• Digital Cameras
Application Example
I/O1
Additional Information
Datasheet
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
GND
Resources
I/O3
Samples
D2+
D2-
D1+
D1-
HDMI
or DVI
Interface
D0+
D0-
Clk+
Clk-
+5V
D2+
Gnd
D2-
6 5 4
SP300x-04
1 2 3
IC
6 5 4
SP300x-04
1 2 3
Gnd
D1+
Gnd
D1-
HDMI
or DVI
Connector
D0+
Gnd
D0-
Clk+
Gnd
Clk-
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +V
pins on the SP300x-04
CC
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+V
of the SP300x-04 can be
CC
oated or NC.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
TVS Diode Arrays (SPA
equency [Hz]
Insertion Loss [dB]
®
Diodes)
Low Capacitance ESD Protection - SP3002 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (T
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
ESD Withstand Voltage
Diode Capacitance
Diode Capacitance
Note: 1. Parameter is guaranteed by design and/or device characterization.
Peak Current (tp=8/20μs) 4.5 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
=25ºC)
OP
Parameter Symbol Test Conditions Min Typ Max Units
RWM
LEAK
1
1
1
1
V
C
I/O-GND
C
V
C
ESD
I/O-I/O
IR ≤ 1µA 6.0 V
VR=5V 0.5 µA
IPP=1A, tp=8/20µs, Fwd 9.5 11. 0 V
I
=2A, tp=8/20µs, Fwd 10.6 13.0 V
PP
IEC61000-4-2 (Contact) ±12 kV
IEC61000-4-2 (Air) ±15 kV
Reverse Bias=0V 0.95 1. 1 1.25 pF
Reverse Bias=1.65V 0.7 0.85 1. 0 pF
Reverse Bias=0V 0.5 pF
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
150
260 °C
°C
0
-5
-10
-15
-20
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Fr
Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
I/O Capacitance (pF)
0.70
0.60
0.50
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
CC
= Float
VCC = 3.3V
VCC = 5V
I/O DC Bias (V)
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/25/13
TVS Diode Arrays (SPA
equency [Hz]
Capacitance [F]
t
R
R
o
C
e
T
L
T
P
®
Diodes)
Low Capacitance ESD Protection - SP3002 Series
Capacitance vs. Frequency
2E-12
1.8E-12
1.6E-12
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06 1.E+07 1.E+08 1.E+09
Fr
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 260°C
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
°C
20 – 40 seconds
) 8 minutes Max.
P
Product Characteristics
Lead Plating
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
T
P
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
SC70 & SOT23: Matte Tin
μDFN: Pre-Plated Frame
Ramp-up
amp-up
PreheatPrehea
t
S
t
P
t
L
Critical Zone
ritical Zon
L to TP
to
T
Ramp-down
amp-d
Time
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
Package Dimensions — SC70-6
Recommended Solder Pad Layout
e
e
6
1
B
C
4
5
HE
E
3
2
D
A2
A
A1
L
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3002 Series
Package SC70-6
Pins 6
JEDEC MO-203
Min Max Min Max
A 0.80 1.1 0 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 00 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0. 010
D 1.85 2.25 0.073 0.089
E 1.15 1.35 0.045 0.053
e 0.65 BSC 0.026 BSC
Solder Pad Layout
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0. 010 0.018
Millimeters Inches
Package Dimensions — SOT23-6
P
Package SOT23-6
Pins 6
JEDEC MO-178
Millimeters Inches
Min Max Min Max
A 0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b 0.350 0.500 0.0138 0.0196 -
C 0.080 0.220 0.0031 0.009 -
D 2.800 3.000 0.11 0.118 3
E 2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e 0.95 Ref 0.0374 Ref -
e1 1.9 Ref 0.0748 Ref -
L 0.100 0.600 0.004 0.023 4,5
N 6 6 6
a 0º 10º 0º 10º -
M 2.590 0.102 -
O 0.690 .027 TYP -
P 0.990 .039 TYP -
R 0.950 0.038 -
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
M
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
Notes
R
O
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/25/13
TVS Diode Arrays (SPA
D
E
B
1
2
3
654
Top View
Pin 1 Index Area
A
A
1
2
3
54
6
L
Pin 1 chamfer
0.10 x 45’
℮
0.05 C
Bottom View
0.05 C
0.05 C
b
A1
A3
C
Seating plane
Side View
0.10
C
A
M
B
0.05
C
M
D2
E2
®
Diodes)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — μDFN-6 (1.6x1.6x0.5mm)
Package μDFN-6 (1.6x1.6x0.5mm)
JEDEC MO-229
Symbol
A 0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.127 Ref 0.005 Ref
b 0.20 0.30 0.008 0.012
D 1.50 1.70 0.060 0.067
D2 1.05 1.30 0.042 0.052
E 1.50 1.70 0.060 0.067
E2 0.40 0.65 0.016 0.026
e 0.50 Ref 0.020 Ref
L 0.25 0.40 0.010 0.016
Millimeters Inches
Min Max Min Max
Part Numbering System
SP3002
TVS Diode Arrays
®
(SPA
Diodes)
Series
Number of Channels
-04 = 4 channel
Part Marking System
Product Series
E = SP3002 series
E*4
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
-04 TG
E
Assembly Site
*
G= Green
T= Tape & Reel
Package
H = SOT23-6
J = SC70-6
U = μDFN-6
*
4
Number of Channels
(varies)
Ordering Information
Part Number Package Marking Min. Order
SP3002-04HTG SOT23-6 E*4 3000
SP3002-04JTG SC70-6 E*4 3000
SP3002-04UTG
μDFN-6
(1.6x1.6x0.5mm)
E*4 3000
Qty.
TVS Diode Arrays (SPA
D
Low Capacitance ESD Protection - SP3002 Series
Embossed Carrier Tape & Reel Specification — SC70-6
®
Diodes)
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
ACCESS HOLE
180mm
14.4mm
13mm
60mm
DIA. HOLE
8mm
1.5mm
SOT-23 (8mm POCKET PITCH)
4.0mm
4.0mm
Symbol
Millimetres Inches
Min Max Min Max
E 1.65 1.85 0.064 0.073
F 3.45 3.55 0.135 0.139
P2 1.95 2.05 0.077 0.081
D 1.40 1.60 0.055 0.063
D1 1.0 0 1.25 0.039 0.049
P0 3.90 4.10 0.154 0.161
10P0 40.0± 0.20 1.574±0.008
W 7.70 8.10 0.303 0.318
P 3.90 4.10 0.153 0.161
A0 2.14 2.34 0.084 0.092
B0 2.24 2.44 0.088 0.096
K0 1. 1 2 1.32 0.044 0.052
t 0.27 Max 0.010 Max
2.0mm
1.75mm
C
L
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
8.4mm
USER DIRECTION OF FEED
PIN 1
Embossed Carrier Tape & Reel Specification — μDFN-6 (1.6x1.6x0.5mm)
P2
D1
A0
t
E
W
F
B0
P0
Symbol
E 1.65 1.85 0.06 0.07
F 3.45 3.55 0.14 0.14
D1 1.0 0 1.25 0.04 0.05
D 1.50 MIN 0.06 MIN
P0 3.90 4.10 0.15 0.16
10P0 40.0± 0.20 1.57±0.01
W 7.90 8.30 0.31 0.33
P2 1.95 2.05 0.08 0.08
A0 1.78 1.88 0.07 0.07
B0 1.78 1.88 0.07 0.07
K0 0.84 0.94 0.03 0.04
t 0.25 TYP 0.01 TYP
K0
Millimetres Inches
Min Max Min Max
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/25/13
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