TVS Diode Arrays (SPA
I/O2
I/O1
GND
I/O3
V
I/O4
®
Diodes)
Low Capacitance ESD Protection - SP3001 Series
SP3001 Series 0.65pF Diode Array
Pinout
I/O 1
GND
I/O 2
I/O 4
V
CC
I/O 3
RoHS
Pb
GREEN
Description
The SP3001 has ultra low capacitance rail-to rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
Features
• Low capacitance of
0.65pF (TYP) per I/O
• ESD protection of ±8kV
contact discharge, ±15kV
air discharge,
(IEC61000-4-2)
• EFT protection,
IEC61000-4-4,
• Low leakage current of
0.5μA (MAX) at 5V
• Small SC70 ( JEDEC MO-
203) package saves board
space
• Lightning Protection,
IEC61000-4-5, 2.5A
(8/20µs)
40A (5/50ns)
Functional Block Diagram
CC
Additional Information
Datasheet
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Resources
Samples
Applications
• Computer Peripherals
• Mobile Phones
• PDA’s
• Digital Cameras
Application Example
+5V
D2+
D2-
D1+
D1-
HDMI
or DVI
Interface
D0+
D0-
Clk+
Clk-
6 5 4
SP300x-04
1 2 3
IC
6 5 4
SP300x-04
1 2 3
Gnd
D2+
Gnd
D2-
D1+
Gnd
D1-
HDMI
or DVI
Connector
D0+
Gnd
D0-
Clk+
Gnd
Clk-
• Network Hardware/Ports
• Test Equipment
• Medical Equipment
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +V
pins on the SP300x-04
CC
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+V
of the SP300x-04 can be
CC
floated or NC.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3001 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (T
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
ESD Withstand Voltage
Diode Capacitance
Diode Capacitance
Note: 1. Parameter is guaranteed by design and/or device characterization.
Peak Current (tp=8/20μs) 2.5 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
=25ºC)
OP
Parameter Symbol Test Conditions Min Typ Max Units
RWM
LEAK
1
1
1
1
V
C
I/O-GND
C
V
C
ESD
I/O-I/O
IR ≤ 1µA 6 V
VR=5V 0.5 µA
IPP=1A, tp=8/20µs, Fwd 9.5 11. 0 V
=2A, tp=8/20µs, Fwd 10.6 13.0 V
I
PP
IEC61000-4-2 (Contact) ±8 kV
IEC61000-4-2 (Air) ±15 kV
Reverse Bias=0V 0.7 0.8 0.9 pF
Reverse Bias=1.65V 0.55 0.65 0.75 pF
Reverse Bias=0V 0.35 pF
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
150
260 °C
°C
1
0
-1
-2
-3
-4
-5
-6
Insertion Loss [dB]
-7
-8
-9
-10
1.E+06 1.E+07 1.E+081.E+09 1.E+10
Frequency [Hz]
Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
I/O Capacitance (pF)
0.60
0.55
0.50
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
= 3.3V
V
CC
I/O DC Bias (V)
V
CC
= Float
VCC = 5V
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
L
T
P
®
Diodes)
Low Capacitance ESD Protection - SP3001 Series
Capacitance vs. Frequency
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
Capacitance [F]
4E-13
2E-13
0
1.E+06 1.E+07 1.E+08 1.E+09
Frequency [Hz]
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
P
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 260°C
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
°C
20 – 40 seconds
) 8 minutes Max.
P
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
t
T
P
Ramp-up
t
amp-up
PreheatPrehea
S
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
P
t
L
Critical Zone
ritical Zon
T
L to TP
to
Ramp-down
amp-d
Time
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
Package Dimensions — SC70-6
D
*
4
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3001 Series
e
e
6
1
B
C
4
5
E
3
2
D
A2
A
A1
Part Marking System
D*4
Product Series
D = SP3001 series
Ordering Information
HE
L
Assembly Site
(varies)
Solder Pad Layout
Number of Channels
Package SC70-6
Pins 6
JEDEC MO-203
Millimeters Inches
Min Max Min Max
A 0.80 1.10 0.031 0.043
A1 0.00 0.10 0.000 0.004
A2 0.70 1. 0 0 0.028 0.039
B 0.15 0.30 0.006 0.012
c 0.08 0.25 0.003 0 .010
D 1.85 2.25 0.073 0.089
E 1.15 1.35 0.045 0.053
e 0.65 BSC 0.026 BSC
HE 2.00 2.40 0.079 0.094
L 0.26 0.46 0. 010 0.018
Part Numbering System
3001
SP
TVS Diode Arrays
®
(SPA
Diodes)
Series
Number of Channels
-04 = 4 channel
-04JT
G
G= Green
T= Tape & Reel
Package
J = SC70-6
Part Number Package Marking Min. Order Qty.
SP3001-04JTG SC70-6 D*4 3000
Embossed Carrier Tape & Reel Specification — SC70-6
Symbol
Millimetres Inches
Min Max Min Max
E 1.65 1.85 0.064 0.072
F 3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D 1.40 1.60 0.055 0.062
D1 1. 00 1.25 0.039 0.049
P0 3.90 4.10 0.153 0.161
10P0 40.0± 0.20 1.574±0.007
W 7.70 8.10 0.303 0.318
P 3.90 4.10 0.153 0.161
A0 2.14 2.34 0.084 0.092
B0 2.24 2.44 0.088 0.960
K0 1. 1 2 1.32 0.044 0.052
t 0.27 max 0.010 max
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
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