TVS Diode Arrays (SPA
RoHS
GREEN
®
Diodes)
General Purpose ESD Protection - SP1011 Series
SP1011 Series 7pF 15kV Unidirectional TVS Array
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protection highspeed signal pins.
Pinout
I/O (1)
GND
I/O (2)
µDFN-6
(1.25x1.0x0.5mm)
I/O (4)
GND
I/O (3)
Features
• ESD, IEC61000-4-2,
±15kV contact, ±30kV air
• Lightning, IEC61000-4-5,
2A (t
=8/20µs)
p
• Low capacitance of 7 pF
(TYP) per I/O @ 2.5V
• Low leakage current of
1µA (MAX) at 5V
Pb
• Tiny μDFN( JEDEC MO-
229) package (1.25mm x
1.0mm x 0.5mm)
• EFT protection
IEC61000-4-4, 40A
(5/50ns)
Functional Block Diagram
654
1
Additional Information
Datasheet
Resources
Applications
• LCD/PDP TV
• DVD Player
• Desktop
• Set Top Box
• Mobile Phone
• Notebook
• MP3/PMP
• Digital camera
Application Example
2
3
Input
Outside World
Samples
SP1011-04UTG
Shield
Ground
Keyboard
Controller
D1
D2
D3
D4
Signal
Ground
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays (SPA
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Bias (V)
Capacitance (pF)
-30
-25
-20
-15
-10
-5
0
5
00001000100101
Frequency (MHz)
Attenuation (dB)
®
Diodes)
General Purpose ESD Protection - SP1011 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
Peak Pulse Current (tp=8/20μs) 2 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
Parameter Rating Units
Electrical Characteristics (T
OP
=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Voltage Drop V
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
1
Dynamic Resistance R
ESD Withstand Voltage
Diode Capacitance
Note:
1. Parameter is guaranteed by design and/or device characterization.
1
1
V
RWM
LEAK
V
DYN
ESD
C
R
C
IEC61000-4-2 (Contact Discharge) ±15 kV
IEC61000-4-2 (Air Discharge) ±30 kV
D
Capacitance vs. Reverse Bias
IR = 1mA 6.0 8.5 V
IR≤1µA 6 V
VR = 5V 0.1 1 µA
IPP=1A, tp=8/20μs, Fwd 8.7 V
I
=2A, tp=8/20μs, Fwd 10.2 V
PP
(VC2 - VC1) / (I
- I
) 1. 5 Ω
PP2
PP1
Reverse Bias = 0V 12 15 pF
Reverse Bias = 2.5V 7 pF
Insertion Loss (S21) I/O to GND
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 10/10/13
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
L
T
P
®
Diodes)
General Purpose ESD Protection - SP1011 Series
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (t
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (T
- Temperature (t
Peak Temperature (T
L
) 60 – 150 seconds
L
) 260
P
Time within 5°C of actual peak
Temperature (t
)
p
) 150°C
s(min)
) 200°C
s(max)
) 60 – 180 secs
s
3°C/second max
) (Liquidus) 217°C
+0/-5
20 – 40 seconds
°C
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Package Dimensions — µDFN-6 (1.25x1.0x0.5mm)
Top View
D
654
1
Pin 1 Index Area
2
3
0.05 C
A
E
B
A
L
Side View
b
4
3
A1
0.10
0.05
Bottom View
℮
5
6
2
1
A3
C
M
C
B
A
M
C
0.05
0.05
Pin 1 chamfer
0.10 x 45’
Seating plane
C
t
T
P
Ramp-up
t
S
amp-up
PreheatPrehea
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
P
t
L
Critical Zone
ritical Zon
L to TP
to
T
Ramp-down
amp-d
Time
Package µDFN-6 (1.25x1.0x0.5mm)
JEDEC MO-229
C
Symbol
Millimeters Inches
Min Max Min Max
A 0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.127 REF 0.005 REF
b 0.15 0.25 0.006 0. 010
D 1.20 1.30 0.047 0.051
D2 - - - -
E 0.95 1.05 0.037 0.041
E2 - - - -
e 0.4 REF 0.016 REF
L 0.25 0.35 0 .010 0.014
Recommanded Soldering Pad for µDFN-6L 1.25 x1.0x0.5 mm
1.1
0.4
1.1
0.3
0.4
0.1
0.3
Total:+/- 0.01mm
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
TVS Diode Arrays (SPA
O*4
O
4
Product Series
Number of Channels
O = SP1011
Assembly Site
*
®
Diodes)
General Purpose ESD Protection - SP1011 Series
Part Numbering System
1011
SP
TVS Diode Arrays
®
(SPA
Diodes)
Series
Number of
Channels
Part Marking System
–
04
U T
G
G= Green
T= Tape & Reel
Package
U: µDFN-6
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1011-04UTG µDFN-6 (1.25x1.0x0.5mm) O4 3000
Embossed Carrier Tape & Reel Specification —µDFN-6 (1.25x1.0x0.5mm)
Symbol
E 1.65 1.85 0.06 0.07
F 3.45 3.55 0.14 0.14
D1 0.50 0.65 0.02 0.03
D 1.50 MIN 0.06 MIN
P0 3.90 4.10 0.15 0.16
10P0 40.0 ± 0.20 1.57 ± 0.01
W 7.90 8.30 0.31 0.33
P2 1.95 2.05 0.08 0.08
A0 1.09 1. 1 9 0.04 0.05
B0 1.42 1.52 0.06 0.06
K0 0.71 0.81 0.03 0.03
t 0.25 TYP 0.01 TYP
K0
P2
A0
D1
D
P0
t
E
W
F
B0
Millimeters Inches
Min Max Min Max
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 10/10/13
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