®
1
2
1
2
RoHS
GREEN
Keypads
TVS Diode Arrays (SPA
TVS Diode Arrays (SPA
General Purpose ESD Protection - SP1006 Series
General Purpose ESD Protection – SP1006 Series
®
Diodes)
Diodes)
SP1006 Series 25pF 30kV unidirectional Discrete TVS
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes at ±30kV
(contact discharge, IEC 61000-4-2) without performance
degradation. Additionally, each diode can safely dissipate
5A of 8/20µs surge current (IEC61000-4-5) with very low
clamping voltages.
Features
Pinout
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning, IEC61000-4-5,
5A (8/20µs)
Pb
• Low leakage current of
0.5µA (MAX) at 5V
• Space efficient 0201
footprint)
Functional Block Diagram
Additional Information
Datasheet
Resources
Samples
Applications
• Mobile phones
• Smart phones
• PDAs
• Digital cameras
Application Example
P1
P2
Outside
World
P4
• Portable navigation
devices
• Portable medical devices
I/O Controller
IC P3
SP1006 (x4)
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays (SPA
0
5
10
15
20
25
30
0.00.5 1.01.5 2.02.5 3. 03.5 4.04.5 5.0
Bias Voltage (V)
Capacitance (pF)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
TVS Diode Arrays (SPA
®
®
Diodes)
Diodes)
General Purpose ESD Protection - SP1006 Series
General Purpose ESD Protection – SP1006 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Peak Pulse Current (tp=8/20μs) 5 A
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 30s) 260 °C
Electrical Characteristics (T
OP
=25ºC)
Parameter Symbol Test Conditions Min Ty p Max Units
Reverse Standoff Voltage V
Breakdown Voltage V
Forward Voltage Drop V
Leakage Current I
Clamp Voltage
1
Dynamic Resistance R
ESD Withstand Voltage
Diode Capacitance
Note: 1 Parameter is guaranteed by design and/or device characterization.
1
1
V
RWM
BR
LEAK
V
DYN
ESD
C
IR=1mA (Pin 1 to 2) 7. 8 V
F
IR=1mA (Pin 2 to 1) 0.8 V
Ipp=1A, tp=8/20µs (Pin 1 to 2) 8.3 V
C
I
=2A, tp=8/20µs (Pin 1 to 2) 9.2 V
pp
(VC2 - VC1) / (I
IEC61000-4-2 (Contact Discharge) ±30 kV
IEC61000-4-2 (Air Discharge) ±30 kV
Reverse Bias=0V 25 pF
D
Reverse Bias=2.5V 15 pF
6.0 V
VR=5V 0.1 0.5 μA
- I
) 0.9 Ω
PP2
PP1
Pulse WaveformCapacitance vs. Reverse Bias
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
®
Peak Pulse Current-IPP (A)
Clamp Voltage (V
C
)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
1.01.5 2.02.5 3.03.5 4.0
t
R
R
o
C
e
T
L
T
P
BOTTOM VIEW
TVS Diode Arrays (SPA
TVS Diode Arrays (SPA
General Purpose ESD Protection - SP1006 Series
General Purpose ESD Protection – SP1006 Series
®
Diodes)
Diodes)
Clamping Voltage vs. I
PP
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (t
Average ramp up rate (Liquidus) Temp (T
to peak
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
Peak Temperature (T
- Temperature (T
- Temperature (t
) 260
P
L
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
) 150°C
s(min)
) 200°C
s(max)
) 60 – 180 secs
s
)
L
3°C/second max
) (Liquidus) 217°C
L
) 60 – 150 seconds
+0/-5
°C
20 – 40 seconds
t
T
P
Ramp-up
t
amp-up
PreheatPrehea
S
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
P
t
L
Critical Zone
ritical Zon
T
L to TP
to
Ramp-down
amp-d
Time
Package Dimensions — μDFN-2 (0201)
TOP VIEW
D
E
0.10
0.05
0.10
C
A
SEATING
PLANE
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
SIDE VIEW
2
b
B
A
C
C
A1
2X
0.10
K1
2X
0.10CC
1
Package μDFN-2 (0201)
JEDEC MO-236
Symbol
Millimeters Inches
Min Max Min Max
A 0.34 0.40 0.014 0.016
L
A1 0.00 0.05 0.000 0.002
A2 0.075 REF 0.003 REF
b 0.20 REF 0.008 REF
D 0.55 0.65 0.022 0.026
A2
0.08
C
E 0.25 0.35 0. 010 0.014
L 0.175 0.275 0.007 0.011
K1 0.15 REF 0.006 REF
TVS Diode Arrays (SPA
U: μDFN-2
SP
1006
01 U T
G
Series
Package
T= Tape & Reel
G= Green
Number of Channels
–
TVS Diode Arrays
(SPA
®
Diodes)
Pin 1
Pin 2
Stripe
TVS Diode Arrays (SPA
®
®
Diodes)
Diodes)
Part Numbering System
Part Marking System
General Purpose ESD Protection - SP1006 Series
General Purpose ESD Protection – SP1006 Series
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1006-01UTG μDFN-2
II
10000
Embossed Carrier Tape & Reel Specification — μDFN-2
P0
P2
W
0º MAX
A0
K0
P1
T
B0
D0
0.20 ± 0.05
0º MAX
Symbol
E
F
A0 0.36 0.42 0.014 0.017
B0 0.66 0.72 0.026 0.028
D0 1.40 1.60 0.055 0.063
E 1.65 1.85 0.065 0.073
F 3.45 3.55 0.136 0.140
K0 0.39 0.45 0.015 0.018
P0 1.95 2.05 0.077 0.081
P1 1.95 2.05 0.077 0.081
P2 3.90 4.10 0.154 0.161
T 0.18 0.22 0.007 0.009
W 7.90 8.30 0.311 0.327
Millimetres Inches
Min Max Min Max
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
Loading...