LITTELFUSE SMTBJ120A, SMTBJ120B, SMTBJ170A, SMTBJ170B, SMTBJ200A Datasheet

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2.0

B

3.30/3.94

A

5.21/5.59

4.06/4.57

.102
.203

0.76/1.27

SEATING PLANE

2.18/2.44

FEATURES

● Bi-directional transient voltage protection

● Glass passivated junction

● Nano second clamping response

● Surge capability up to 250 (Amps)

● No performance degradation under service life

● Industry standard DO-2144AA Jedec outline

● Available on tape (12mm)

● UL recognised

MECHANICAL CHARACTERISTICS

● Transfer molded, void free epoxy body

● Terminals: modified ‘J’ bend for large contact area

● Tin/Lead plated leads

● Maximum case temperature for soldering purposes: 230°C for 10 seconds

● Standard packaging: 12mm tape (meets EIA 481-1)

● Device marking, device code, logo

59

All dimensions in mm

Solder Pads

SMTBJ SiBOD™series

2.16 2.74 2.16

2.26

60

www.littelfuse.com

SMTBJ SiBOD™series

ELECTRICAL CHARACTERISTICS @ 25°C Tamb

SYMBOL
V

RM

V

BR

V

BO

V

T

PARAMETER
Stand-off voltage
Breakdown voltage
Breakover voltage
On-state voltage

ABSOLUTE RATINGS

SYMBOL

Ipp

Itsm
di/dt
T stg
Tj
TL

PARAMETER

Peak Pulse Current

Non-repetitive surge peak on-state current
Critical rate of rise of on-state current
Storage and operating junction temperature range

Maximum temperature for soldering
(For period of 10 seconds max)

10/1000 µsec

8-20 µs expo

tp20 ms

Non-repetitive

Type A

50

150

Type B
100
250

All parameters are tested using Fet Test™ Model 3600.

Device
Type

SMTBJ050 A or B
SMTBJ070 A or B
SMTBJ100 A or B
SMTBJ120 A or B
SMTBJ170 A or B
SMTBJ200 A or B

Vrm

50

70
100
120
170
200

Irm

@ Vrm

(µA)

1
1
1
1
1
1

Vbr

MIN

60

80
110
140
180
220

Vbo

MAX

80
120
135
165
215
265

Vt

TYP

@ 1A

<2V
<2V
<2V
<2V
<2V
<2V

Ibo

TYP

(mA)

50
50
50
50
50
50

Ih

MIN

(mA)

150
150
150
150
150
150

I

RM

I

BO

I

H

Stand-off current

Breakover current
Holding current

30

100

-40 to +150
150
230

A
A
A

A/µs

°C
°C
°C

VALUE