Surface Mount Polymeric Electrostatic Discharge Suppressors
Description
PULSE-GUARD ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important. Data ports
utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI and DVI can benefit from this new technology.
PULSE-GUARD suppressors use polymer composite
materials to suppress fast-rising ESD transients (as specified
in IEC 61000-4-2), while adding virtually no capacitance to
the circuit.
*Note: PGB1 0402 product not available as Halogen Free item.
See PGB2 0402 product instead, part number PGB2010402KRHF
(http://www.littelfuse.com/series/PGB2010402.html).
Typical Device Capacitance
1.00
0.10
Capacitance (pF)
0.01
Typical ESD Response
Voltage (V)
2
1200
1000
1001,00010,000
800
600
400
200
0
-250 255075100 125 150 175
Frequency (MHz)
PGB1010603
PGB102ST23
PGB1010402
Time (ns)
Dimensions
0402 Device
Dimensions: mm (inch)
0603 Device
Dimensions: mm (inch)
1.04
(0.041") REF
0.43 +/- 0.18
PGB102ST23
PGB1010603
PGB1010402
(0.017" +/- 0.007”)
Reflow Solder
0.51 (0.020")
3.05
(0.120")
0.76 (0.030")0.76 (0.030")
1.27 (0.050")
SOT23 Device
Dimensions: mm (inch)
0.81
(0.032")
TYP
Reflow Solder
1.02 (0.040")
2.29
1.02 (0.040")
(0.090")
0.64
(0.025")
0.51
(0.020")
(0.080")
0.36 (0.014")
3.00 +/- 0.20
(0.118" +/- 0.008")
0.69 +/- 0.10
(0.027" +/- 0.004)
1.27
(0.050")
1.02 (0.040")
2.03
1.66 +/- 0.06
(0.066" +/- 0.003”)
0.84 +/- 0.05
(0.033" +/- 0.002”)
Wave Solder
0.76 (0.030")
1.27 (0.050")
(0.075")
0.91
(0.036")
TYP
0.15 +/- 0.08
(0.006 +/- 0.003")
TYP
1.91
3.30
(0.130")
2.24 +/- 0.18
(0.088" +/- 0.007")
Wave Solder
1.02 (0.040")
2.54
(0.100")
0.64
(0.025")
Specifications are subject to change without notice.
Surface Mount Polymeric Electrostatic Discharge Suppressors
Physical Specifications
Materials
SolderabilityMIL-STD-202, Method 208
Soldering
Parameters
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin
Wave solder - 260°C, 10 seconds maximum
Reow solder - 260°C, 30 seconds maximum
Design Consideration
Because of the fast rise-time of the ESD transient, proper
placement of PULSE-GUARD suppressors are a key design
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PULSE-GUARD
suppressors (connected from signal/data line to ground)
directly behind the connector so that they are the first boardlevel circuit component encountered by the ESD transient.
Soldering Parameters
Environmental Specifications
Operating Temperature-65°C to +125°C
0402 series:
Moisture Resistance
Thermal Shock
Vibration
Chemical ResistanceMIL-STD-202, Method 215
Solder Leach Resistance and
Terminal Adhesion
40°C, 95% RH, 1000 hours
0603, ST23:
85°C, 85% RH, 1000 hours
MIL-STD-202, Method 107,
-65°C to 125°C, 30 min. cycle,
10 cycles
MIL-STD-202, Method 201, (10
to 55 to 10 Hz, 1 min. cycle, 2
hrs each in X-Y-Z)
IPC/EIA J-STD-002
Reflow ConditionPb – Free assembly
Pre Heat
- Temperature Min (T
- Temperature Max (T
)150°C
s(min)
)200°C
s(max)
- Time (min to max) (ts)60 – 180 seconds
Average ramp up rate (Liquidus Temp
(TL) to peak
T
to TL - Ramp-up Rate3°C/second max
S(max)
Reflow
- Temperature (TL) (Liquidus)217°C
- Temperature (tL)60 – 150 seconds
3°C/second max
Peak Temperature (TP)260°C
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate6°C/second max
Time 25°C to peak Temperature (TP)8 minutes max
t
T
P
amp-up
Ramp-up
T
L
T
S(max)
Preheat
T
S(min)
Temperature
25
time to peak temperature
t
reheat
S
P
t
L
Ramp-down
amp-d
Time
Based on IPC/JEDEC J-STD-020
3
Specifications are subject to change without notice.