Surface Mount Multilayer Varistors (MLVs) > MLN Series
MLN SurgeArray™ Suppressor
Size Table
MetricEIA
32161206
RoHS
Description
The MLN SurgeArray™ Suppressor is designed to
help protect components from transient voltages that
exist at the circuit board level. This device provides four
independent suppressors in a single leadless chip in order
to reduce part count and placement time as well as save
space on printed circuit boards.
SurgeArray™ devices are intended to suppress ESD, EFT
and other transients in order to protect integrated circuits
or other sensitive components operating at any voltage
up to 18V
. SurgeArray™ devices are rated to the IEC
DC
61000-4-2 human body model ESD to help products attain
EMC compliance. The array offers excellent isolation and
low crosstalk between sections.
The inherent capacitance of the SurgeArray™ Suppressor
permits it to function as a fi lter/suppressor, thereby
replacing separate Zener/capacitor combinations.
The MLN array is manufactured using the Littelfuse
Multilayer technology process and is similar to the
Littelfuse ML and MLE Series of discrete leadless chips.
MLN Series
Applications
• Data, Diagnostic
I/O Ports
• Analog Signal/
Sensor Lines
• Portable/HandHeld Products
• Mobile
Communications/
Cellular Phones
• Computer/DSP
Products
• Industrial Instruments
Including Medical
Features
• RoHS Compliant
• Four individual
devices in one chip
• ESD rated to IEC
61000-4-2 (Level 4)
• AC characterized
for impedance and
capacitance
• Low adjacent channel
crosstalk, -55dB
at 10MHz (Typ)
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifi cations table.
Specifi cations are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
V5.5
V18L
V18
V14
V9
V
= 1V
IN
RMS
Z = 50Ω
10001001010.1
65
Revised: October 9, 2013
MLN SurgeArray™ Suppressor
Page 4
Varistor Products
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Surface Mount Multilayer Varistors (MLVs) > MLN Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-fl ow
and Wave soldering. Typical profi les are shown on the right.
The recommended solder for the MLN suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder fl ux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a refl ow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.