Littelfuse MLN User Manual

Page 1
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
MLN SurgeArray™ Suppressor
Size Table
Metric EIA
3216 1206
RoHS
Description
The MLN SurgeArray™ Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards.
SurgeArray™ devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18V
. SurgeArray™ devices are rated to the IEC
DC
61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections.
The inherent capacitance of the SurgeArray™ Suppressor permits it to function as a fi lter/suppressor, thereby replacing separate Zener/capacitor combinations.
The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips.
MLN Series
Applications
• Data, Diagnostic I/O Ports
• Analog Signal/ Sensor Lines
• Portable/Hand­Held Products
• Mobile
Communications/ Cellular Phones
• Computer/DSP Products
• Industrial Instruments Including Medical
Features
• RoHS Compliant
• Four individual devices in one chip
• ESD rated to IEC 61000-4-2 (Level 4)
• AC characterized for impedance and capacitance
• Low adjacent channel crosstalk, -55dB at 10MHz (Typ)
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifi cations table.
Continuous MLN Series Units
Steady State Applied Voltage:
DC Voltage Range (V
Operating Ambient Temperature Range (T
Storage Temperature Range (T
) 5.5 - 18 V
M(DC)
) -55 to +125 ºC
A
) -55 to +150 ºC
STG
• Low leakage
• Operating voltage up to 18V
M(DC)
• -55ºC to 125ºC operating temp range
• Low-profi le, PCMCIA compatible
© 2013 Littelfuse, Inc.
Specifi cations are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information.
63
Revised: October 9, 2013
MLN SurgeArray™ Suppressor
Page 2
Varistor Products
z
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Device Ratings and Specifi cations Any Single Section
Maximum Ratings (125 ºC ) Specifi cations (25 ºC )
Maximum
Non-
repetitive
Surge Current
(8/20μs)
I
TM
Part Number
Maximum
Continuous
Working
Voltage
V
M(DC)
(V) (A) (J) (V) (V) (V) (V) (V) (V) (pF) (pF)
V5.5MLN41206 5.5 30 0.10 15.5 at 2A 60 35 45 7.10 10.8 430 520
V9MLN41206 9.0 30 0.10 23.0 at 2A 95 50 75 11.0 16.0 250 300
V14MLN41206 14.0 30 0.10 30.0 at 2A 110 55 85 15.9 20.3 140 175
V18MLN41206 18.0 30 0.10 40.0 at 2A 165 63 100 22.0 28.0 100 125
V18MLN41206L 18.0 30 0.05 50.0 at 1A 200 95 130 25.0 35.0 45 75
NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preffered test method).
Maximum
Non-
repetitive
Surge Energy
(10/1000μs)
W
TM
Maximum
Clamping
Voltage (at
Noted 8/20μs)
Typical ESD
Supression Voltage
(Note1)
Current
(Note 2)
V
8kV Contact
C
Peak Clamp Peak TYP MAX
3. Corona discharge through air (represents actual ESD event)
4. Capacitance may be customized, contact Sales.
(Note 3) 15kV Air
Nominal Voltage
at 1mA DC Test
Current
N(DC)
V
N(DC)
Max
V
Min
Capacitance
at 1 MHz
(1V p-p)
(Note 4)
C
Peak Current and Energy Derating Curve
For applications exceeding 125ºC ambient temperature, the peak surge current and energy ratings must be reduced.
100
90
80
70
60
50
40
30
20
PERCENT OF RATED VALUE
10
0
-55 50 60 70 80 90 100 110 120 130 140 150
Figure 1
AMBIENT TEMPERATURE (oC)
Typical Performance Curves
Equivalent Series Resistance
1000
Peak Pulse Current Test Waveform for Clamping Voltage
100
90
50
10
PERCENT OF PEAK VALUE
O
1 TIME
Figure 2
01 = Virtual Origin of Wave T = Time from 10% to 90% of Peak T
= Rise Time = 1.25 x T
1
T
= Decay Time
2
(Impulse Duration)
t
t
1
t
2
Example:
For an 8/20 μs Current Waveform: 8μs = T
= Rise Time
1
20μs = T
= Virtual Time
2
to Half Value
Impedance vs Frequency, 1206 Size
10000
1000
100
10
OHMS
1
0.1 1MHz
10MHz 100MHz 1GHz 10GH
Figure 3
MLN SurgeArray™ Suppressor
Frequency
100
V5.5
10
Impeance |Z| (Ω)
1
0.1
0.1 1 10 100 1000
Figure 4
64
Revised: October 9, 2013
Please refer to www.littelfuse.com/series/MLN.html for current information.
V9
V14
V18
V18L
Frequency (MHz)
Specifi cations are subject to change without notice.
© 2013 Littelfuse, Inc.
Page 3
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Typical Performance Curves (continued)
Nominal Voltage Stability to IEC 1000-4-2 (8kV Contact Method, One Section)
NOMINAL VOLTAGE
Figure 5
25
20
15
NOM (V)
10
V
5
0
0 10 100 1000 10000
NUMBER OF DISCHARGES
V18
V14
V9
V5.5
V-I Characteristic, 1206 size
100
MAXIMUM STANDBY
V18L
V18
V14
10
V9
Varistor Voltage (V)
V5.5
1 10μA 100μA 1mA 10mA 100mA 1A 10A 100A
Figure 7
MAXIMUM CLAMP VOLTAGE
Current (A)
V18L
V18
V14
V9
V5.5
1206 Size Pulse Rating for Long Duration Surges (Any Single Section)
100
NUMBER OF SURGES
10
Surge Current (A)
0.1
Figure 6
1
2
10
1
1
100
3
10
4
10
5
10
6
10
Square Wave Impulse Duration (µs)
Capacitance vs Frequency, 1206 Size
500
400
300
200
Capacitance (pF)
100
0
Figure 8
V5.5
V9
V14
V18
V18L
Frequency (MHz)
MLN Series
0000100010010
10001001010.1
Adjacent Channel Crosstalk
0
-20
-40
-60
Crosstalk (dB)
-80
-100
-120
Figure 9
0.001
0.01
Frequency (MHz)
© 2013 Littelfuse, Inc.
Specifi cations are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information.
V5.5
V18L
V18
V14
V9
V
= 1V
IN
RMS
Z = 50Ω
10001001010.1
65
Revised: October 9, 2013
MLN SurgeArray™ Suppressor
Page 4
Varistor Products
)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of components in surface mount technology are IR Re-fl ow and Wave soldering. Typical profi les are shown on the right.
The recommended solder for the MLN suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder fl ux.
Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled.
When using a refl ow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning.
Refl ow Solder Profi le
250
200
150
100
TEMPERATURE °C
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
PREHEAT DWELL
PREHEAT ZONE
Figure 10
Wave Solder Profi le
300
250
200
150
100
TEMPERATURE °C
50
MAXIMUM TEMPERATURE
230°C
RAMP RATE <2°C/s
TIME (MINUTES
MAXIMUM WAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
40-80
SECONDS
ABOVE 183°C
Figure 11
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 TIME (MINUTES)
MLN SurgeArray™ Suppressor
66
Revised: October 9, 2013
Please refer to www.littelfuse.com/series/MLN.html for current information.
Specifi cations are subject to change without notice.
© 2013 Littelfuse, Inc.
Page 5
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS CHIP LAYOUT DIMENSIONS
E
D
T
W
A
B
C
Dimension
1206 Size
IN MM
A 0.035 0.890
B 0.065 1.650
C 0.100 2.540
D 0.018 0.460
E 0.030 0.790
L 0.126 -/+0.008 3.200 -/+0.200
W 0.063 -/+0.008 1.600 -/+0.200
T 0.053 Max 1.350 Max
BW 0.016 -/+0.004 0.410 -/+0.100
BL 0.007 +0.01/- 0.002 0.180 +0.25/-0.050
P 0.030 Ref 0.760 Ref
X 0.045 -/+0.004 1.140 -/+0.100
S 0.015 -/+0.004 0.380 -/+0.100
X
P
L
S
BL
BW
MLN Series
Part Numbering System
V 18 1206
DEVICE FAMILY
TVSS Device
MAXIMUM DC WORKING VOLTAGE
MULTILAYER DESIGNATOR SERIES DESIGNATOR
N: Array
NUMBER OF SECTIONS
ML N
4
L
W T
PACKING OPTIONS*
A:
Bulk Pack, 2500 pieces H: 7in (178mm) Diameter Reel, 2500 pieces T: 13in (330mm) Diameter Reel, 10,000 pieces
END TERMINATION
W: (Silver/Platinum/Palladium)Ag/P
CAPACITANCE OPTION
DEVICE SIZE: 1206: 120mil x 60mil
d/Pt
(no letter): Standard L: Low Capacitance Version
Packaging*
Quantity
Device Size
1206 10,000 2,500 2,500
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2013 Littelfuse, Inc.
Specifi cations are subject to change without notice. Please refer to www.littelfuse.com/series/MLN.html for current information.
13” Inch Reel
("T" Option)
7” Inch Reel ("H" Option)
Bulk Pack
("A" Option)
Revised: October 9, 2013
67
MLN SurgeArray™ Suppressor
Page 6
Tape and Reel Specifi cations
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
t
1
K
0
t
2
D
0
D
1
P
0
P
2
E
F
B
P
1
A
0
W
0
EMBOSSMENT
PLASTIC CARRIER TAPE
TOP TAPE
8mm
NOMINAL
Symbol Description Dimensions in Millimeters
A
B
K
W
P
P
P
D
D
T
T
Notes :
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
Width of Cavity Dependent on Chip Size to Minimize Rotation.
0
Length of Cavity Dependent on Chip Size to Minimize Rotation.
0
Depth of Cavity Dependent on Chip Size to Minimize Rotation.
0
Width of Tape 8 -/+0.2
Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.5
F
Distance Between Drive Hole Centers and Tape Edge 1.75 -/+0.1
E
Distance Between Cavity Center 4 -/+0.1
1
Axial Distance Between Drive Hole Centers and Cavity Centers 2 -/+0.1
2
Axial Distance Between Drive Hole Centers 4 -/+0.1
0
Drive Hole Diameter 1.55 -/+0.05
0
Diameter of Cavity Piercing 1.05 -/+0.05
1
Embossed Tape Thickness 0.3 Max
1
Top Tape Thickness 0.1 Max
2
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
MLN SurgeArray™ Suppressor
68
Revised: October 9, 2013
Please refer to www.littelfuse.com/series/MLN.html for current information.
Specifi cations are subject to change without notice.
© 2013 Littelfuse, Inc.
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