Littelfuse CG-CG2SN User Manual

Gas Discharge Tube (GDT) Products

CG/CG2 Series

CG/CG2 Series

Agency Approvals

Description

Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.

GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.

The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.

AGENCY AGENCY FILE NUMBER

E128662

E320116

2 Electrode GDT Graphical Symbol

The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.

The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.

Features

• Rugged Ceramic-Metal
construction

• Low Capacitance
(<1.5pf)

Applications

• Communication lines
and equipment

• CATV equipment

• Test equipment

• Data lines

• Meets REA PE-80

• Available in surface
mount, and a variety of
lead options options

• Instrumentation circuits

• Medical electronics

• ADSL equipment

• Telecom SLIC
protection

• Power supplies

©2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.

CG/CG2 Series

Revised: January 10, 2013

Gas Discharge Tube (GDT) Products

CG/CG2 Series

Electrical Characteristics

Device Specifications (at 25°C) Life Ratings

DC Breakdown

in Volts

(@100V/s)

Part

Number

CG75
CG90
CG90 SN
CG110
CG2145
CG2145 SN
CG2230
CG2230 SN
CG2250
CG2250 SN
CG2300
CG2300 SN
CG2350
CG2350 SN
CG2420
CG2470
CG2470 SN
CG2600
CG2600 SN

MIN TYP MAX MAX MIN MAX TYP TYP

60 75 90 400 650
72 90 108 400 600
72 90 108 400 600

88 110 132 450 600
116 145 174 500 600
120 145 174 500 600
195 230 265 600 700
184 230 276 600 700
213 250 288 625 725
200 250 300 625 725
255 300 345 700 800
240 300 360 700 800
297 350 403 750 900
280 350 420 750 900
357 420 483 800 1000
400 470 540 850 1200
376 470 564 850 1200
510 600 690 1000 1400
480 600 720 1000 1400

CG28001680 800 920 1200 1500
CG210001850 1000 1150 1500 1600 65 A

NOTES:

1. Tested to UL1449 Third Edition

2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.

Impulse

Break-

down

in Volts

(@100V/µs)

Impulse

Break-

down In

Volts

(@1 Kv/µsec)

Insulation

Resistance

10

10

Ω

(at 50V)

10

Ω

10

(at 100V)

Capaci-

tance

Voltage

(@1MHz)

(on state

Voltage)
@1Amp

1.5 pf 15 V

Arc

Min

Surge

Life

(@500A

10/1000µs)

400

shots

Nominal

Impulse

Discharge

Current

(8/20µs)

10 shots

(@20kA)

10 shots

(@10kA)

Nominal

AC

Discharge

Current

(10x1sec

@50-60Hz)

20 A

3

10 A

Dischage

Current

(9 cycle
@50Hz)

100 A

AC

DC

Holdover

Voltage

Impulse

2

Discharge

(1 Application

@ 10/350µs)

52 V 4kA

80 V

135 V

Max

Current

2.5kA

Product Characteristics

LS, Axial:

Device: Tin Plated 2–5 Microns
Lead Wires: Tin Plated 17.5 ± 12.5 Microns
Construction: Ceramic Insulator

Materials

Product Marking

CG/CG2 Series

Core:
Device: Tin Plated 17.5 ± 12.5 Microns.
Construction: Ceramic Insulator
MS:
Device: Dull Tin Plated 7–9 Microns
Construction: Ceramic Insulator

LF Logo, Voltage and date code; Black in
positive print

Glow to arc
transition current

Glow Voltage

Storage and
Operational
Temperature

Maximum Follow
On Current

Revised: January 10, 2013

< 0.5Amps

60-160 Volts

-40 to +90

1

Customer should verify actual device performance in their specific applications.

230 Volts r.m.s, 200 Amps.

(800V and 1000V devices tested to UL1449 3rd edition)

Specifications are subject to change without notice.

Please refer to www.littelfuse.com for current information.

©2013 Littelfuse, Inc.

Gas Discharge Tube (GDT) Products

6.05 ± 0.2
[0.268 ± 0.0080]

5.58 [0.232]

8.71 [0.343]

2.29 [0.090]

5.89 [0.232]

DIA. MAX.

CG/CG2 Series

Device Dimensions

Leaded 'L' Type Straight Axial Devices

PROFILE VIEW

6.07 ± 0.15

[0.239 ± 0.006]

62 ± 2

0.81 DIA. TYP.

TOP VIEW

[0.032]

Core Devices

TOP VIEW PROFILE VIEW SEMI–PROFILE VIEW

8.10 Max.

[0.032 Max.]

.

8.10 Max

0.47 ± 0.1

[0.019 ± 0.0039]

6.07 ± 0.15
[0.239 ± 0.0059]

5.89 [0.232]

8.10

[0.319]

Leaded 'LS' Type Shaped Lead Devices

6.07 ± 0.3

[0.239 ± 0.012]

8.40 ± 0.3

[0.331 ± 0.012]

8.60

[0.339]

0.004

2 Surfaces

9.85 ± 0.30

[0.388 ± 0.012]

11.15 ± 0.30

[0.439 ± 0.012]

SOLDER PAD LAYOUT

9.85

[0.388]

11.65

[0.459]

0.40 ± 0.03

[0.0157 ± 0.0012]

1.80
[0.071]

'MS' Type Devices

R5.29 [R0.208]

TOP VIEW

8.30 ± 0.1

[0.327 ± 0.0039]

4 ± 0.2

[0.157 ± 0.0079]

PROFILE VIEW SEMI–PROFILE VIEW

5.58 [0.220]

6.05 ± 0.2

[0.238 ± 0.0079]

TOP VIEWPROFILE VIEW

8.10 Max.

[0.319 DIA Max.]

8.4 ± 0.3

[0.331 ± 0.012]

0.80

[0.032]

©2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.

Revised: January 10, 2013

[0.366 ± 0.0079]

9.30 ± 0.2

ø8.30±0.1

0.47 ± 0.1

[0.019 ± 0.0039]

SOLDER PAD LAYOUT

2.29 [0.090]

8.71 [0.343]

5.89 [0.232]

CG/CG2 Series

Gas Discharge Tube (GDT) Products

240

Temperature (°C) - Measured on bottom side of board

CG/CG2 Series

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow Condition Pb – Free assembly

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (Min to Max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus Temp
(T

) to peak

L

to TL - Ramp-up Rate 5°C/second max

T

S(max)

Reflow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak
Temperature (t

)

p

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

Do not exceed 260°C

) 150°C

s(min)

) 200°C

s(max)

3°C/second max

+0/-5

°C

10 – 30 seconds

) 8 minutes Max.

P

T

Temperature

S(max)

T

S(min)

T

P

T

L

25

time to peak temperature

Preheat

t

S

(t 25ºC to peak)

Ramp-up

t

P

Critical Zone

T

to T

L

P

t

L

Ramp-down

Time

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

300

280

260

240

220

200

180

160

140

120

100

80

60

40

20

0

0

102030405060708090

Time (Seconds)

Preheat Time

100

110

120

130

140

150

160

170

180

190

200

210

220

230

Dwell Time

Cooling Time

Soldering Parameters - Hand Soldering

Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.

Recommended Process Parameters:

Wave Parameter Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

Temperature Minimum:

Temperature Maximum:

Preheat Time: 60-180 seconds

Solder Pot Temperature:

Solder Dwell Time: 2-5 seconds

(Typical Industry Recommendation)

100

° C

150

° C

280

° C Maximum

CG/CG2 Series

Revised: January 10, 2013

Specifications are subject to change without notice.

Customer should verify actual device performance in their specific applications.

Please refer to www.littelfuse.com for current information.

©2013 Littelfuse, Inc.

Gas Discharge Tube (GDT) Products

22.8

[0.898]

52.4

[2.063]

6.4

[0.252]

<1.2 Max. Lead Bend

5.0 Pitch

[0.197]

CG/CG2 Series

Packaging Dimensions

For 'L' Type Axial Lead Items

<0.8 Max

52.4

[2.063]

22.8

[0.898]

6.4

[0.252]

Core and 'MS' Type Items

8.5 ± 0.1

[0.335 ± 0.004]

0.4 ± 0.05

[0.016 ± 0.002]

8.6 ± 0.1

[0.339 ± 0.004]

[0.630 +0.012 / -0.004]

[0.069 ± 0.004]

7.5 ± 0.1

[0.295 ± 0.004]

16 +0.3 / -0.1

1.75 ± 0.1

5.0 Pitch

[0.197]

10x4 ± 0.1 = 40 ± 0.2

[10 x 0.157 ± 0.004 = 1.575 ± 0.008]

1.5 DIA. MAX.

[0.059]

1.5 DIA. MAX.

[0.059]

<1.2 Max. Lead Bend

4 ± 0.1

[0.157 ± 0.004]

12 ± 0.1

[0.472 ± 0.004]

17.7

[0.697]

254.0 - 356.0

[10.0 - 14.0]

]

275.0

[10.83]

100.0

[3.94]

76.0

[2.99]

Direction of Feed

25.0

[0.98]

Direction of Feed

For 'LS' Type Shaped Lead Items

11.75 ± 0.1

[0.463 ± 0.004]

[0.075]

[0.315 ± 0.004]

1.9

0.5 ± 0.05

[0.020 ± 0.002]

8 ± 0.1

9 ± 0.1

[0.354 ± 0.004]

[0.945 +0.019 / -0.004]

0.5 ± 0.01

[0.020 ± 0.004]

©2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.

[0.069 ± 0.004]

11.5 ± 0.1

[0.453 ± 0.004]

24 +0.3 / -0.1

1.75 ± 0.1

1.5 DIA. MAX.

1.5 DIA. MAX.

[0.059]

10x4 ± 0.1 = 40 ± 0.2

[10x.157 ± 0.004 = 1.575 ± 0.008]

4 ± 0.1

[0.157 ± 0.004]

[0.059]

16 ± 0.1

[0.630 ± 0.004]

Revised: January 10, 2013

25.7

[1.01]

275.0

[10.82]

76.0

[2.99]

100.0

[3.93]

25.0

[0.98]

Direction of Feed

CG/CG2 Series

Gas Discharge Tube (GDT) Products

CG2 XXX XX * XX

Breakdown Voltage

75

90
110
145
230
250

300
350
470
600
800

1000

Series

CG -- for 75, 90, or 110V
CG2 -- for 145V to 1000V

Lead Option Code

Option Code*

(Blank) = No Leads / Core

L = Straight Leads
LS = Shaped Leads
MS = Surface Mount

Packaging Option Code

(Blank) = No Leads / Core, Bulk Bag - 400 pcs
L(Blank) = Straight Lead, Tray - 50 pcs
LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel
LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel
LS(Blank) = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel

SN = may have different DC Breakover
Voltage Limit. Please refer to Electrical
Characteristics table for additional
information.

CG/CG2 Series

Part Numbering System and Ordering Information

Examples:

CG75 -- A non-leaded 75V device

CG2230L -- A leaded 230V device

CG2800LTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D)

Notes:

CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.

CG/CG2 Series

Revised: January 10, 2013

Specifications are subject to change without notice.

Customer should verify actual device performance in their specific applications.

Please refer to www.littelfuse.com for current information.

©2013 Littelfuse, Inc.