
Radial Lead Fuses
TE5® > Time-Lag > 369 Series
369 Series, TE5® Time-Lag Fuse
Description
TE5®, Time-lag type, 300V rated and designed in accordance
to IEC60127-3.
Features
• Lead-free
• Reduced PCB space
requirements
• Direct solderable or
plug-in versions
• Internationally approved
• Low internal resistance
• Shocksafe casing
• Vibration resistant
• Halogen free
Agency Approvals
Applications
Agency Agency File Number Ampere Range
E67006
800mA - 6.3A
• Electronic Ballast
Electrical Characteristics for Series
JET 1896-31007-2002
1023263 1A - 6.3A
DE1-52036
1A - 5A
1A, 1.6A, 2A,
3.15A, 4A, 6.3A
% of Ampere
Rating
150%
210%
275%
400%
1000%
Opening Time
1 Hour, Minimum
120 sec., Maximum
400 ms., Min.; 10 sec., Max.
150 ms., Min.;, 3 sec., Max.
20 ms., Min.; 150 ms., Max.
Electrical Characteristics
Amp
Code
0800 0.800 300
110 0 1. 00 300 115 400 5.80 x x x x
116 0 1.60 300 95 600 13.50 x x x x
1200 2.00 300 90 700 21.00 x x x x
1315 3.15 300 80 110 0 55.00 x x x x
1400 4.00 300 75 1200 100.00 x x x x
1500 5.00 300 70 1000 90.00 x x x
1630 6.30 300 65 1200 126.00 x x x
Amp
Rating
(A)
Voltage
Rating
(V)
Breaking Capacity
50A@300VAC
50-60 Hz/cos
ϕ
= 1
Voltage
Drop
1.0 × I
max. (mV)
110 280 3.80
N
Power
Dissipation
1.5 × I
N
max. (mW)
Melting
Integral
10 × I
min. (A
N
2
s)
Agency Approvals
x
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/19/13
Additional Information
Datasheet
Resources
Samples

Radial Lead Fuses
0.001
0.01
0.1
1
10
100
1000
10000
100000
CURRENT IN AMPERES
TIME IN SECONDS
0.11 10 1001000
.800A
1A
1.25A
2A
1.6A
2.5A
3.15A
4A
5A
6.3A
Temperature (°C) - Measured on bottom side of board
TE5® > Time-Lag > 369 Series
Temperature Rerating Curve
140
120
100
80
60
40
PERCENT OF RATI NG
20
0
-40-20 020406
23°C
AMBIENTTEM PERATURE (°C)
Average Time Current Curves
0
Soldering Parameters - Wave Soldering
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Time (Seconds)
102030405060708090
Preheat Time
100
110
120
130
Dwell Time
Recommended Process Parameters:
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
(Typical Industry Recommendation)
100
° C
150
° C
Preheat Time: 60-180 seconds
Solder Pot Temperature:
260
° C Maximum
Solder Dwell Time: 2-5 seconds
140
150
160
170
180
190
200
210
220
Cooling Time
Recommended Hand-Solder Parameters:
230
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 12/19/13