Transient Voltage Suppression Diodes
Bi-directional
Surface Mount > 3.0SMC Series
3.0SMC Series
Uni-directional
Maximum Ratings and Thermal Characteristics
(T
=25OC unless otherwise noted)
A
Parameter Symbol Value Unit
Power Dissipation on Infinite Heat
Sink at T
Peak For ward Surge Current, 8.3ms
Single Half Sine Wave (Note 1)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
Operating Junction and Storage
Temperature Range
Typical Thermal Resistance Junction
to Lead
Typical Thermal Resistance Junction
to Ambient
Notes:
1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
=50OC
A
P
M(AV)
I
FSM
V
F
, T
T
J
STG
R
uJL
R
uJA
Functional Diagram
6.5 W
300 A
3.5 V
-55 to 150 °C
15 °C/W
75 °C/W
RoHS
Description
The 3.0SMC series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• For surface mounted
applications in order to
optimize board space
• Low prole package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• I
is specified @ 8/20µS
PP
surge waveform
• Built-in strain relief
•
VBR @TJ= VBR@25°C × (1+αT
x (TJ - 25))
(αT: Temperature Coefficient)
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical I
less than 1µA
R
above 20V
• High temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• Meet MSL level1, per
J-STD-020, LF maximum
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Glass passivated chip
junction
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
bus and other vulnerable circuits used in Telecom,
CC
Computer, Industrial and Consumer electronic applications.
Cathode
Uni-directional
Anode
Additional Information
Datasheet
Resources
Specifications are subject to change without notice.
Samples
© 2014 Littelfuse, Inc.
Revised: 01/24/14
Transient Voltage Suppression Diodes
Voltage Transients
Time
Voltage Across TVS
Current Through TVS
Voltage or Current
Surface Mount > 3.0SMC Series
Electrical Characteristics (T
Part
Number
Marking
(Uni)
3.0SMC20A
3.0SMC24A
3.0SMC28A
3.0SMC30A
3.0SMC33A
YLA 20.0 22.20 24.50 1 42 74 0 1
YLC 24.0 26.70 29.50 1 51 520 1
YLE 28.0 31.10 34.40 1 59 470 1
YLF 30.0 33.30 36.80 1 62 420 1
YLG 33.0 36.70 40.60 1 70 365 1
I-V Curve Characteristics
Uni-directional
BR
V
Vc
VR
=25°C unless otherwise noted)
A
TVS Diode Arrays (SPA
Reverse
Stand off
Voltage V
(Volts)
IR
VF
IT
Breakdown
Voltage V
(Volts) @ I
R
MIN MAX
BR
T
V
™
Family of Products)
T
Maximum
Clamping
Voltage V
@ 8/20µS
Ipp (V)
Test
Current
I
(mA)
C
Maximum
Peak Pulse
Current Ipp
@8/20µS
(A)
Maximum
Reverse
Leakage IR
@ V
R
(µA)
Ipp
P
Peak Pulse Power Dissipation -- Max power dissipation
PPM
V
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
R
V
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
BR
V
Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current)
C
I
Reverse Leakage Current -- Current measured at V
R
V
Forward Voltage Drop for Uni-directional
F
Ratings and Characteristic Curves (T
Figure 1 - TVS Transients Clamping Waveform
R
=25°C unless otherwise noted)
A
Figure 2 - Peak Pulse Power Rating
1000
100
10
1
-Peak Pulse Power (KW)
PPM
P
0.31x0.31" (8.0x8.0mm)
Copper Pad Area
0.1
0.001 0.01 0.11
td-Pulse Width (ms)
10
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/24/14
continues on next page.
Transient Voltage Suppression Diodes
I
PP
- Peak Pulse Current, % I
PP
0
0
50
100
t
r=8µS
Peak
Value
Half Value
t
d=20µS
t-Time (µS)
Waveform = tr x t
d
t
r
= rise time to peak value
t
d
= decaytime to half value
0
20
40
60
80
100
0255075 100 125 150 175
TA-Ambient temperature (ºC)
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
P
, Steady Sate Power
Surface Mount > 3.0SMC Series
Ratings and Characteristic Curves (T
Figure 3 - Peak Pulse Power or Current Derating Curve
TVS Diode Arrays (SPA
vs Initial Junction Temperature
=25°C unless otherwise noted) (Continued)
A
™
Family of Products)
Figure 4 - Pulse Waveform
Figure 5 - Typical Junction Capacitance Figure 6 - Steady State Power Derating Curve
100000
10000
1000
Uni-directio nal
Cj (pF)
100
@ VR
Uni-directio nal V
10
1
1.0 10.0 100.01000.0
VBR - Reverse Breakdown Voltage (V)
= OV
6.5
6
5.5
5
4.5
4
3.5
3
2.5
Dissipation (W)
2
1.5
M(AV)
1
0.5
0
0255075100 125150 175
TA - Ambient Temperature(ºC)
Figure 7 - Maximum Non-Repetitive Peak Forward
(A)
- Peak Forward Surge Current
FSM
I
Surge Current Uni-Directional only
350
300
250
200
150
100
50
0
110 100
Number of Cycles at 60 Hz
Specifications are subject to change without notice.
© 2014 Littelfuse, Inc.
Revised: 01/24/14
Transient Voltage Suppression Diodes
DO-214AB (SMC J-Bend)
B
F
G
H
E
C
D
A
Cathode Band
Surface Mount > 3.0SMC Series
Soldering Parameters
TVS Diode Arrays (SPA
Reflow Condition Lead–free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Time (min to max) (ts) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 280°C
Physical Specifications
Weight 0.007 ounce, 0.21 grams
Case
Polarity
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Color band denotes positive end
(cathode) except Bidirectional.
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
°C
20 – 40 seconds
) 8 minutes Max.
P
™
Family of Products)
t
T
P
Ramp-up Critical Zone
T
L
T
s(max)
T
s(min)
Temperature (T)
25˚C
t
s
Preheat
t 25˚C to Peak
Time (t)
p
t
L
Ramp-down
Environmental Specifications
High Temp. Storage JESD22-A103
HTRB JESD22-A108
Temperature Cycling JESD22-A104
MSL JEDEC-J-STD-020, Level 1
H3TRB JESD22-A101
T
T
to
L
P
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
Dimensions
L
K
J
I
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/24/14
RSH JESD22-B106
Dimensions
Inches Millimeters
Min Max Min Max
A 0.114 0.126 2.900 3.200
B 0.260 0.280 6.600 7. 11 0
C 0.220 0.245 5.590 6.220
D 0.079 0.103 2.060 2.620
E 0.030 0.060 0.760 1.520
F - 0.008 - 0.203
G 0.305 0.320 7.750 8.130
H 0.006 0.012 0.152 0.305
I 0.129 - 3.300 -
J 0.094 - 2.400 -
K - 0.165 4.200
L 0.094 - 2.400 -
Transient Voltage Suppression Diodes
V
R
VOLTA GE
5%
V
BR
VOLTA GE TOLERANCE
SERIES
3.0SMC
XX A
F
XXX
YMXXX
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Littelfuse Logo
Cathode Band
(for uni-directional products only)
0.47
(12.0)
0.157
(4.0)
0.157
(4.0)
0.49
(12.5)
0.80 (20.2)
Arbor Hole Dia.
13.0 (330)
Dimensions are in inches
(and millimeters).
Direction of Feed
0.059
DIA
(1.5)
Cover tape
Surface Mount > 3.0SMC Series
Part Numbering System Part Marking System
Packaging Options
Part number Component Package Quantity Packaging Option Packaging Specification
3.0SMCxxX DO-214AB 3000 Tape & Reel – 16mm/13” tape EIA STD RS-481
Tape and Reel Specification
Cathode
Specifications are subject to change without notice.
© 2014 Littelfuse, Inc.
Revised: 01/24/14
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