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1812L
User Manual
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Littelfuse 1812L User Manual

POLY-FUSE® Resettable PTCs
Surface Mount > 1812L Series
1812L Series
Agency Approvals
AGENCY AGENCY FILE NUMBER
E183209
R50119118
Electrical Characteristics
RoHS
Description
Features
• RoHS compliant, lead-free and halogen-free
• Fast response
• Compact design
• Low resistance
• Low-prole
• Compatible with high
temperature solders
Applications
• Plug and play protection
for motherboards and peripherals
• PCI cards
• Game console port
protection
• USB peripherals
1812L Series
I
I
V
I
Part Number Marking
hold
(A)
(A)
trip
max
(Vdc)
(A)
max
P d typ.
(W)
1812L010 LF 010 0.10 0.30 30 100 0.8 0.50 1.50 1.600 15.000
1812L010/60 LF010-60 0.10 0.30 60 10 0.8 0.50 1.50 1.600 15.000
1812L014 LF014 0.14 0.34 60 10 0.8 1.50 0.15 1.500 6.000
1812L020 LF020 0.20 0.40 30 100 0.8 8.00 0.02 0.800 5.000 1812L020/60 LF020-60 0.20 0.40 60 40 0.8 1. 0 0 2.00 1.400 4.400 1812L035/30 LF035-30 0.35 0.75 30 100 0.8 8.00 0.15 0.400 1.700
1
1812L050
LF050 0.50 1. 0 0 15 100 0.8 8.00 0.15 0.150 1.000
1812L050/30 LF050-30 0.50 1. 0 0 30 10 0 0.8 8.00 0.15 0.150 1.000
1
1812L075
LF075 0.75 1.50 13.2 100 0.8 8.00 0.20 0.100 0.450 1812L075/24 LF075-24 0.75 1.50 24 100 0.8 8.00 0.20 0.110 0.290 1812L075/33 LF075-33 0.75 1.50 33 20 0.8 8.00 0.20 0.110 0.400
1
1812L110
LF110 1. 10 2.20 8 10 0 0.8 8.00 0.30 0.040 0.210 1812L110/16 LF110-16 1. 10 1.95 16 10 0 0.8 8.00 0.30 0.060 0.180 1812L110/24 LF110-24 1. 10 1.95 24 20 0.8 8.00 0.50 0.060 0.200 1812L110/33 LF110-33 1. 10 1.95 33 20 0.8 8.00 0.50 0.060 0.200
1812L125/6 LF125-6 1.25 2.50 6 10 0 0.8 8.00 0.40 0.050 0.140
1812L125/16 LF125 1.25 2.50 16 100 0.8 8.00 0.40 0.050 0.140
1
1812L150
LF150 1.50 3.00 8 10 0 0.8 8.00 0.30 0.040 0.110 1812L150/12 LF150-12 1.50 3.00 12 100 0.8 8.00 0.50 0.040 0.110 1812L150/24 LF150-24 1.50 3.00 24 20 0.8 8.00 1.50 0.040 0.120
1
1812L160
LF160 1.60 2.80 8 10 0 0.8 8.00 1. 0 0 0.030 0.100
Max. Time To Trip Resistance Agency Approvals
R
Current
(A)
Time
(Sec.)
R
min
(Ω)
(Ω)
1max
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
X X
1812L160/12 LF160-12 1.60 2.80 12 100 0.8 8.00 1. 0 0 0.030 0.100 X X
1812L200TH 1LF200 2.00 3.50 8 10 0 0.8 8.00 2.00 0.020 0.070 X X
I
= Hold current: maximum current device will pass without tripping in 20°C still air.
hold
I
= Trip current: minimum current at which the device will trip in 20°C still air.
trip
V
= Maximum voltage device can withstand without damage at rated current (I max)
max
I
= Maximum fault current device can withstand without damage at rated voltage (V
max
P
= Power dissipated from device when in the tripped state at 20°C still air.
d
Caution: Operation beyond the specied rating may result in damage and possible arcing and ame.
1 Some older references to these devices may include “–C“ in the Part Number. The “–C“ should be omitted when placing new orders for the device.
)
max
= Minimum resistance of device in initial (un-soldered) state.
R
min
R
= Typical resistance of device in initial (un-soldered) state.
typ
R
= Maximum resistance of device at 20°C measured one hour after tripping or reow
1max
soldering of 260°C for 20 sec.
continues on next page.
© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/05/13
Electrical Characteristics
POLY-FUSE® Resettable PTCs
Surface Mount > 1812L Series
Part Number Marking
I
hold
(A)
I
V
(A)
trip
(Vdc)
max
I
max
(A)
P d
typ. (W)
Max. Time To Trip Resistance Agency Approvals
Current
(A)
Time
(Sec.)
R
R
(Ω)
min
(Ω)
1max
1812L200/12 LF200-12 2.00 3.50 12 10 0 1. 0 8.00 2.00 0.020 0.070 X X 1812L200/16 LF200-16 2.00 3.50 16 10 0 1. 0 8.00 2.00 0.020 0.070 X X
1812L260TH
1
LF260 2.60 5.00 8 100 0.8 8.00 2.50 0.015 0.047 X X 1812L260/12 LF260-12 2.60 5.00 12 10 0 0.8 8.00 5.00 0.015 0.055 X X 1812L260/16 LF260-16 2.60 5.00 16 10 0 1.2 8.00 5.00 0.015 0.050 X X
1812L300 LF300 3.00 5.00 6 10 0 0.8 8.00 4.00 0.012 0.040 X X
I
= Hold current: maximum current device will pass without tripping in 20°C still air.
hold
I
= Trip current: minimum current at which the device will trip in 20°C still air.
trip
V
= Maximum voltage device can withstand without damage at rated current (I max)
max
I
= Maximum fault current device can withstand without damage at rated voltage (V
max
P
= Power dissipated from device when in the tripped state at 20°C still air.
d
Caution: Operation beyond the specied rating may result in damage and possible arcing and ame.
1 Some older references to these devices may include “–C“ in the Part Number. The “–C“ should be omitted when placing new orders for the device.
)
max
= Minimum resistance of device in initial (un-soldered) state.
R
min
R
= Typical resistance of device in initial (un-soldered) state.
typ
R
= Maximum resistance of device at 20°C measured one hour after tripping or reow
1max
soldering of 260°C for 20 sec.
Temperature Rerating
Ambient Operation Temperature
-40°C -20°C 0°C 20°C 40°C 50°C 60°C 70°C 85°C
Part Number Hold Current (A)
1812L010 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.03
1812L010/60 0.14 0.13 0.11 0.10 0.09 0.08 0.07 0.07 0.05
1812L014 0.23 0.19 0.17 0.14 0.12 0.10 0.09 0.08 0.06
1812L020 0.29 0.26 0.23 0.20 0.17 0.15 0.14 0.12 0.10 1812L020/60 0.30 0.27 0.23 0.20 0.17 0.14 0.13 0.11 0.08 1812L035/30 0.50 0.45 0.40 0.35 0.30 0.26 0.24 0.20 0.16
1812L050 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.29 1812L050/30 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.29
1812L075 1. 1 5 1. 01 0.88 0.75 0.65 0.60 0.55 0.49 0.43 1812L075/24 1.06 0.95 0.84 0.75 0.60 0.55 0.50 0.45 0.37 1812L075/33 1. 10 1.0 0 0.88 0.75 0.66 0.60 0.56 0.47 0.36
1812L110 1.59 1.43 1.26 1. 10 0.95 0.87 0.80 0.71 0.60 1812L110/16 1.58 1.43 1.27 1. 10 0.95 0.85 0.77 0.71 0.58 1812L110/24 1.55 1.40 1.25 1. 10 0.93 0.83 0.73 0.63 0.50 1812L110/33 1.55 1.40 1.25 1. 10 0.93 0.83 0.73 0.63 0.50
1812L125/6 2.00 1.75 1.52 1.25 1. 00 0.95 0.90 0.75 0.53
1812L125/16 2.00 1.75 1.52 1.25 1. 00 0.95 0.90 0.75 0.53
1812L150 2.06 1.93 1.79 1.50 1.28 1. 10 1.02 0.80 0.68 1812L150/12 2.04 1.88 1.68 1.50 1.25 1. 10 1.00 0.80 0.60 1812L150/24 2.05 1.87 1.67 1.50 1.25 1.08 0.95 0.77 0.60
1812L160 2.20 2.06 1.91 1.60 1.36 1. 17 1.09 0.85 0.72 1812L160/12 2.20 2.06 1.91 1.60 1.36 1. 17 1.09 0.85 0.72 1812L200TH 2.60 2.44 2.22 2.00 1,78 1.67 1.50 1.45 1.29 1812L200/12 2.80 2.60 2.36 2.00 1.72 1.56 1.40 1.20 1.04 1812L200/16 2.80 2.60 2.36 2.00 1.72 1.56 1.40 1.20 1.04 1812L260TH 3.40 3.16 3.00 2.60 2.30 2.15 2.00 1.85 1.63 1812L260/12 3.40 3.16 3.00 2.60 2.30 2.15 2.00 1.85 1.63 1812L260/16 3.66 3.30 2.96 2.60 2.23 2.06 1.89 1.61 1.30
1812L300 4.13 3.75 3.30 3.00 2.61 2.43 2.25 2.00 1.78
Notes: The temperature rerating data is only for reference, please contact Littelfuse technical support for detail temperature rerating information.
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/05/13
POLY-FUSE® Resettable PTCs
Surface Mount > 1812L Series
Temperature Rerating Curve
170%
150%
130%
110%
90%
70%
50%
Percentage of Rated Current
30%
10%
-40 -30 -20 -10010 20 30 40 50 60 70 80 85
Temperature (°C)
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Meets EIA Specication RS186-9E, ANSI/ J-STD-002 Category 3.
Environmental Specifications
Operating/Storage Temp. -40°C to +85°C
Max. Device Surface Temp. in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
Moisture Level Sesitivity Level 1, J–STD–020C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
+85°C, 85% R.H.,1000 hours
-/+5% typical resistance change
MIL–STD–202, Method 107G +85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215, No change
MIL–STD–883C, Method 2007.1, Condition A, No change
1812L Series
Soldering Parameters
Condition Reow
Peak Temp/ Duration Time 260°C / 10 Sec
Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec
Preheat 120°C~ 180°C 50 Sec ~ 150 Sec
Storage Condition 0°C~35°C,
• Recommended reow methods: IR, vapor phase oven, hot air oven, N
environment for lead–free
2
• Recommended maximum paste thickness is 0.25mm (0.010 inch)
• Devices can be cleaned using standard industry methods and
solvents.
Note: If reow temperatures exceed the recommended prole,
devices may not meet the performance requirements.
<
70%RH
=
260
220
180
120
Temperature (°C)
Preheating
0
50 to 150
Soldering Cooling
60 to 100
Time(s)
120
© 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/05/13
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