LITE ON TECHNOLOGY MZ0100S 1 User Manual

PRODUCT REQUIREMENT SPECIFICATION

MZ0100S-1

ZigBee Module

Version 1.2

Author: Javon Tseng Editor: Javon Tseng

Project Leader: Daniel KW Yang Approved by: Daniel KW Yang

Change History

Revision Date Author Change List

1 Nov, 01, 2014 Javon Tseng Initial

1.1 Dec. 31, 2014 Jesse Yang Added PA feature

1.2 Apr.26, 2015 Rocky Chen Update

* This document contains confidential proprietary information and is property of LTC. The contents of

this document should not be disclosed to unauthorized persons without the written consent of LTC.

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C

ONTENT

1 PRODUCT OVERVIEW .................................................................................................................3

1.1 DESCRIPTION ........................................................................................................................3

1.2 FEATURES .............................................................................................................................3

1.3 GENERAL SPECIFICATIONS .................................................................................................3

2. PIN ASSIGNMENT AND DESCRIPTION .........................................................................................5

3. RECOMMENDED FOOTPRINT .....................................................................................................6

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1 Product Overview

1.1 Description

The MZ0100S-1, ZigBee Module is using 32-bit ARM® Cortex®-M3 microprocessor and

an integrated ultra-low power 2.4GHz ISM band, compliance with IEEE 802.15.4

transceiver. These ZigBee Module is available in 33-pin stamp holes packages with up to

512KB Flash, and 64KB of SRAM. MZ0100S is based on

SILICON LABS EM3585

single chip

ZigBee solution the Wireless sensor networking, Industrial control, Machine-to-Machine

(M2M) and emerging Internet of Things (IoT) markets.

1.2 Features

 32-bit ARM Cortex-M3 Processor

 Frequency 2.4 GHz, IEEE 802.15.4 compliant RF transceiver

 64KB of RAM

 512KB Flash

 External PA integrated

 Support on-chip OTA, over-the-air, upgrade

 Excellent Receiver Sensitivity of -101dBm

 Programmable Output Power up to +19dBm, configurable

 Operating temp: -40~85 oC

 Total 33-pin Stamp Holes, SMT

 Type A form factor: 24x17mm

 RoHS Compliant

1.3 General Specifications

RF Chipset SILICON LABS EM3585

Standard 2.4 GHz IEEE 802.15.4-2003 ZigBee

Bus Interface Data: SPI, UART and I2C (SW configurable)

RF Frequency Range 2.405~2.475 GHz (channel 11 -26)

Power Amplify External

Transmit Output Power +19dBm

Receiver Sensitivity -101dBm

Operating Voltage 2.1V~3.6V

Operation temperature -40~+85 oC

Transmit Mode: 54.4mA

Power Consumption

Receive Mode: 29.4mA
Deep Sleep Mode: 7uA

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