LITE ON TECHNOLOGY CX8703BD120 User Manual

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COMPANY CONFIDENTIAL

品名 (Part Name)

SMSC CX870-3B-D120 Module

承認書版本(Approval Sheet Rev.)

Preliminary version

客戶料號 (Customer Part No.)

光寶料號 (Liteon Part No.)

AAZ500009G0

Prepared by

Reviewed by

Approved by

Frank Gung

Total Pages

Date

Sales

2013/12/16

Elisa Liou

4F, 90, Chien 1 Road, Chungho, New Taipei City

235, Taiwan, R.O.C.

TEL: +886-2-2222-6181

Fax: +886-2-2222-3882

光寶科技股份有限公司

台北縣中和市建一路 90 號 4F

電話: 02-2222-6181 傳真: 02-2222-3882

承認書

(Specification Sheet)

客戶名稱:

Customer Name: D&M Holdings Inc.

客戶簽認 Customer Approval: _________________________________________

COMPANY CONFIDENTIAL

Index

Index ......................................................................................................................................................... 2

Part1. Module Spec Sheet .................................................................................................................... 5

1 Introduction .................................................................................................................................... 5

2 Block Diagram ................................................................................................................................ 5

3 Board Pictures ................................................................................................................................. 6

3.1 Top View of CX Module ........................................................................................................ 6

3.2 Bottom View of CX Module .................................................................................................. 7

3.2.1 CX Module Bottom View w/64-pin Low Density Connector ............................................. 7

3.2.2 CX Module Bottom View w/120-pin Media Connector ..................................................... 7

3.3 Production Module with Top and RF shields in place – Top View ........................................ 8

3.4 Production Module with 64-pin Connector Option – Side View ........................................... 8

3.5 Example Production Module Showing Soldered RF Shield .................................................. 9

3.6 Production Module with Bottom Shield (Part Numbers with a “B” after the configuration letter) 10

3.6.1 Including J3 Low Density 64-pin connector – Bottom View ............................................ 10

3.6.2 Including J2 High Density 120-pin connector – Bottom View ......................................... 10

4 Ordering Guide ............................................................................................................................. 11

4.1 Part Number Syntax ............................................................................................................. 11

5 Electrical Specifications ............................................................................................................... 12

5.1 Absolute Maximum Ratings................................................................................................. 13

5.2 Operating Conditions ........................................................................................................... 13

5.3 WiFi Specification (CX870 only) ........................................................................................ 14

6 Regulatory Compliance and Quality .......................................................................................... 15

6.0.1 Antenna Considerations ............................................................................................................. 15

6.0.2 CX Power Settings Used For Modular Approval ...................................................................... 16

6.0.3 FCC IC Warning Message ......................................................................................................... 16

6.1 RoHS .................................................................................................................................... 19

6.2 Environmental Test ............................................................................................................... 19

6.3 ESD and Transient Test (Applies to LAN and USB external connections only) ................. 19

6.4 Magnetic Field Test .............................................................................................................. 20

6.5 MTBF ................................................................................................................................... 20

6.6 Mechanical Specifications .................................................................................................... 20

6.7 Module Quality .................................................................................................................... 20

7 Board Dimensions and Weight .................................................................................................... 21

7.1 Top & Bottom View of CX870 Module without Bottom Shield ......................................... 21

7.1.1 Top & Bottom View of CX Module with Bottom Shield .................................................. 21

7.2 Side View of CX870 module without Bottom Shield .......................................................... 22

7.2.1 Side View of CX Module with Bottom Shield except CX870-3JB .................................. 22

7.2.2 Side View of CX870 Module with Bottom Shield part number CX870-3JB only ........... 23

7.3 3D View of CX870 Module without Bottom Shield ............................................................ 23

7.4 Module Weight ..................................................................................................................... 23

8 Connectors and Connections ....................................................................................................... 24

8.1 WLAN UFL Antenna Connector (optional) ......................................................................... 24

8.2 Module Connectors .............................................................................................................. 24

8.2.1 Pin Descriptions ................................................................................................................ 25

8.2.2 Connector PIN Assignments ............................................................................................. 30

8.2.3 GPIO Assignments ............................................................................................................ 32

9 Application Guidelines ................................................................................................................. 32

9.1 Power Supply sequencing and Reset Timing ....................................................................... 32

COMPANY CONFIDENTIAL

9.1.1 Power up, Reset and Power Down Timing ....................................................................... 33

9.2 RF Considerations ................................................................................................................ 33

10 Revision Control ........................................................................................................................ 34

Part2. Antenna Spec Sheet ................................................................................................................ 42

1 RFDPA870930IMAB301 ................................................................................................................ 42

2 RFDPA870945IMAB301 ................................................................................................................ 43

COMPANY CONFIDENTIAL

Date

Version

Description

12/02/2013

Rev 00

Preliminary Version for AAZ500009G0 (CX870-3B-D120)

12/16/2013

Rev 01

Add antenna spec. sheet (Part 2)

Revision History

This documentation describes the marketing requirements specification of the Lite-on made CX870 Wireless module. It is a confidential document of LITEON.

COMPANY CONFIDENTIAL

Ethernet

Transceiver

DM870A

DM875

256 Mbit

SDRAM

RJ-45

Transformer

Mem.

Bus

USB

GPIO

24.000 MHz

NAND-Flash

2.4 GHz RF transceiver

802.11

RMII

USB

Type-A

UART

3.3V

JukeBlox Networked Media Module – CX Series

1.2V

UART

GPIO

DAC

PCB

Antenna

RF Amp. ANT

switch

Ext.

Antenna

PWM DAC

1.9V

Flash

NOR-Flash

I2C

Apple Co-

processor

I2C

JTAG

LCD

3x6bit RGB

Display

SSM

4/8bit MMC

SD-Card

RST

Reset In

Video Out

Audio I/O

A/D, D/A

S/PDIF

CCIR-656

Ports

SPI

SPI Ctrl.

Host

Controller/

LCD setup

PCB

Antenna

Ext.

Antenna

Part1. Module Spec Sheet

1 Introduction

The CX-series module is a single-board networked media player module, based on SMSC’s DM870A and DM875 media processors, and enables fast product developments with Ethernet, USB and optional WiFi connectivity. The module connects to standard legacy components in various audio, video/LCD and control formats.

2 Block Diagram

Note: Choice of antenna is a build option, see Ordering Guide.

COMPANY CONFIDENTIAL

PCB antenna

External Antenna

Connectors

SMSC processor

Ethernet PHY

PCB antenna

SDRAM

802.11b/g front-end

3 Board Pictures

Please note that all production modules include the RF and top shield. The below top view has the shields temporarily removed to show the components. Also, please note that the 64-pin connector mounted on the module is the male gender.

3.1 Top View of CX Module

COMPANY CONFIDENTIAL

LCD connector

FLASH

Media

connector

FLASH

Low density connector

LCD

connector

3.2 Bottom View of CX Module

3.2.1 CX Module Bottom View w/64-pin Low Density Connector

3.2.2 CX Module Bottom View w/120-pin Media Connector

COMPANY CONFIDENTIAL

3.3 Production Module with Top and RF shields in place – Top View

3.4 Production Module with 64-pin Connector Option – Side View

COMPANY CONFIDENTIAL

3.5 Example Production Module Showing Soldered RF Shield

COMPANY CONFIDENTIAL

3.6 Production Module with Bottom Shield (Part Numbers with a “B”

after the configuration letter)

3.6.1 Including J3 Low Density 64-pin connector – Bottom View

3.6.2 Including J2 High Density 120-pin connector – Bottom View

COMPANY CONFIDENTIAL

One Ant.

Two Ant.

CX870-3B-D120 Module DM870A+T6201 Planned X X X X X X X X

CX Modules Co nfiguration Ma trix

SKU

Type

IC's

Phase

WiFi (onmodule PCB diveristy)

Ext. Diverstiy Antennas (UFL Conn.s)

Eth

Top Module Shield

USB Host

Low Density 64-pin conn.

HiDensity 120-pin Conn.

HiDensity LCD Conn.

64 MB

SDRAM

32MB SDRAM

Bottom Module Shield

1.9V

Status

16MB SDRAM

8MB SDRAM

1Gb NAND

32MB NOR

8MB NOR

4 Ordering Guide

Note: Please note that the Apple Authentication Coprocessor will not be provided on the CX module. The Apple Authentication Coprocessor

should be provided on the product motherboard, connected to the SDA, SCL signals from the CX module.

Note: Shaded rows indicate Custom or Obsolete configuration - NOT TO BE USED FOR NEW/STANDARD MP DESIGNS. Status code: C - Custom | S - Standard | O - Obsolete | A - Available

* Connector on board, but requires board modification to enable the connector. + The position of the X in the One Ant. column indicates that there is one external antenna connector provided. The position of the X in the Two Ant. column indicates that there are two external antenna connectors provided. Do not use a module which has two external antenna connectors with only one external antenna connected. Leaving one antenna socket open will degrade WiFi performance. SMSC recommends always using modules with two external antennas for best performance.

% The CX870-3DS is the same as CX870-3D, except that the RF shield is soldered in place.

4.1 Part Number Syntax

COMPANY CONFIDENTIAL

Parameter

State

Model

Voltage

Symbol

min.

typ.

max.

Units

Power Supply Input Voltage

VIN

3.0

1.08

1.8

3.3

1.2

1.9

3.6

1.32

2.0

V V V

Logic Input high voltage

VIH

1.7 5.5

Logic Input low voltage

VIL

-0.3 0.7

Logic Input threshold voltage

VIT

1.29

1.39

1.5

Schmitt-trigger input low to high threshold voltage

IT+

1.58

1.65

1.71

Schmitt-trigger input high to low threshold voltage

IT-

0.95

1.01

1.06

Logic Output high voltage

VOH

2.4 V Logic Output low voltage

VOL

0.4

Logic Low-level output current (VOL=0.4V)

IOL

-9.6

-15.6

-19.3

Logic High-level output current (VOH=2.4V)

IOH

11.1

22.5

35.3

Current Consumption Reset State

CX870

3.3

I3.3 60

1.2

I1.2 32

1.9

I1.9 18

Operating in idle state

3.3

I3.3 185

241

1.2

I1.2 337

438

1.9

I1.9 257

334

Playback over WiFi high mips & rate condition

3.3

I3.3 240

312

1.2

I1.2 347

451

1.9

I1.9 258

335

5 Electrical Specifications

Note: The maximum current values are 30% larger than the typical values. The maximum values

are intended to be used for power supply sizing calculations.

COMPANY CONFIDENTIAL

Parameter

Component

Min

Max

Units

3.3V Supply Voltage

Main

-0.5

4.6

1.2V Supply Voltage

-0.5

1.8

1.9V Supply Voltage

-0.5

2.2 V Logic Input Voltage

-0.5 6 V

Logic Output Voltage

-0.5

4.6

Parameter

Min

Max

Units

Operating Temperature

+70

°C

Operating Humidity

90 (non condensing)

%RH

Storage Temperature

-10

+75

°C

Storage Humidity

95 (non condensing)

%RH

Storage Temperature Cycle Test 24 hrs

-10

+75

°C

5.1 Absolute Maximum Ratings

5.2 Operating Conditions

COMPANY CONFIDENTIAL

Feature

Description

WLAN Standards

IEEE 802.11b IEEE 802.11g

Frequency Band

2.412 – 2.472 GHz (2.4GHz ISM Band, 13 Channels) Channel 1 - Channel 13 North America FCC, Japan Telec, Europe ETSI

Modulation

802.11b mode (DS-SS: IEEE 802.11b)

802.11g mode (OFDM: IEEE 802.11g)

Transmission Speed

802.11b mode 11Mbps, 5.5Mbps, 2Mbps, 1Mbps

802.11g mode 54Mbps, 48Mbps, 36Mbps, 24Mbps, 18Mbps, 12Mbps, 9Mbps, 6Mbps

Tx Power

802.11b mode: 16.5dBm, +/-1dB

802.11g mode: 15.0dBm, +/-1dB Using nominal production settings as follows:

Channel RF11 Rate: 11B ='3' (11Mbps), 11G = '8' (54Mbps) MIB: 11B=9, 11G=1 (Reference for Tx Power Tuning) Room temperature

The above TX Power specifications will apply to modules shipped from Liteon after 9 April 2012.

Power-on Ramp

< 2us

RF Carrier Suppression

< 15dBc

TX EVM

802.11b mode: <-22dB

802.11g mode: <-25dB

Rx Sensitivity (incl. CE2 Mother board)

802.11b mode: <=-82dBm @ 1Mbps, <=81dBm @ 2Mbps, <=-81dBm @ 5.5Mbps, <=-78dBm @ 11Mbps

802.11g mode: <=-82dBm @ 9Mbps, <=-81dBm @ 18Mbps, <=-75dBm @ 36Mbps, <=-70dBm @ 54Mbps

Throughput Rate (measured for each module)

See factory test specification

5.3 WiFi Specification (CX870 only)

Note: About Tx Power, different (higher/lower) RF output power settings may be used for specific

regions, antennas and/or enclosures, in which case re-certification may be required.

COMPANY CONFIDENTIAL

Description

Country

Compliance

Module Versions Passed

Electromagnetic Compatibility (Prescan)

USA Europe

FCC CFR47 Part15B EN 55022 EN 55024 EN 61000-3-2 EN 61000-3-3 EN 61000-4-2 EN 61000-4-3 EN 61000-4-4 EN 61000-4-5 EN 61000-4-6 EN 61000-4-8 EN 61000-4-11

Radio Regulations (CX870 only)

USA Japan Canada Europe New Zealand/Australia China Korea

FCC Part 15C Telec IC RSS-210 CE AZ/NZS:4268 SRRC KCC

B, D, F, H, I, J B B, D, F, H, I, J B

Cfg Code

Ant. Type

Ant. Gain (dBi)

Ant. Model Name

CX870-3F

Printed on PCB

3.56

Liteon N/A

CX870-3J

Dipole

MAG. LAYERS EDA-8709-2G4C1-A66

CX870-3K

PIFA

2.1

MAG. LAYERS MSA-3612-2G4C1-A1

CX870-3IB

Dipole

MAG. LAYERS EDA-8709-2G4C1-A66

CX870-3B-D60

PIFA

2 2

1.7

MSA-0354-2G4C1-A3, black 200mm (max) MSA-0345-2G4C1-A3, gray 200mm (max) MSA-5103-2G4C1-A1, black 200mm MSA-5403-2G4C1-A1, gray 200mm MSA-5103-2G4C1-A3, black 300mm

6 Regulatory Compliance and Quality

SMSC does not certify all module variants for all countries. Please see above table for those module versions for which certain certifications have already been done.

Please contact your SMSC sales office for the latest information about which modules are certified for which countries, and arranging for additional certification for your chosen module if needed. Any additional certifications will need to be paid for by the customer.

Product manufacturers are responsible for the end product certification. SMSC can help manufacturers to prepare for the WiFi Alliance tests by providing an example test plan and the required

commands to enable special test modes. Please contact your SMSC sales office about WiFi Alliance logo certification assistance.

The CX module has received Limited Module Approval (LMA) from FCC. This is because the CX module does not have a built-in +1.9V regulator circuit. SMSC recommends that customers follow the +1.9V supply voltage requirements given in

this data sheet, and follow the +1.9V power supply design given in “CX Module Power Supply_V1.1.pdf” document or later

version. If the power supply recommendations are followed, then customers will not need to go through formal certification of the product for WiFi related RF behavior for FCC. It is the product manufacturers responsibility to make sure that the power supply recommendations are followed, and that the RF behavior meets the certification requirements when the module is installed in the final product.

Please check the SMSC/BridgeCo Customer Portal at https://portal.bridgeco.net/ for documents about WiFi certification and recommended interfacing and power supply schematics.

6.0.1 Antenna Considerations

Here are the antennas used for certification:

COMPANY CONFIDENTIAL

1.7

MSA-5403-2G4C1-A3, gray 300mm MSA-5103-2G4C1-A2, black 400mm MSA-5403-2G4C1-A2, gray 400mm

CX870-3BB

Dipole

3.2

WINiZEN W1E-WO-08

CX870-3HB

Dipole

MAG. LAYERS EDA-8709-2G4C1-A66

CX870-3HB

PIFA

2.8

3010000243ID (DA-E670) 3010000218ID (DA-E750)

Notes about antenna changes:

1) Equivalent antennas from other manufacturers may be substituted, and then marketed without a Class II permissive change

2) Equivalent antennas must be of the same type (e.g. dipole, PIFA, etc.), must be of equal or less gain than the antennas listed and previously authorized under the same FCC ID, and must have similar in band and out of band characteristics (consult specification sheet for cutoff frequencies).

3) In case of new antenna types, or higher gain antennas, a Class II permissive change is required and compliance with FCC section 15.203 must be met.

6.0.2 CX Power Settings Used For Modular Approval

6.0.3 FCC IC Warning Message FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

COMPANY CONFIDENTIAL

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/ TV technician for help.

CAUTION:

Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment.

Labeling requirements

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

RF exposure warning

This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers must be provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

Information for the OEMs and Integrators

The following statement must be included with all versions of this document supplied to an OEM or integrator, but should not be distributed to the end user.

This device is intended for OEM integrators only. Please See the full Grant of Equipment document for other restrictions. This device must be operated and used with a locally approved access point.

Information To Be Supplied to the End User by the OEM or Integrator

The following regulatory and safety notices must be published in documentation supplied to

the end user of the product or system incorporating an adapter in compliance with local regulations. Host system must be labeled with "Contains FCC ID: PPQ-CX8703BD120 “, FCC ID displayed on label and Contains IC : 4491A-CX8703BD120.

Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian ICES-003 and RSS-210.

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Radio Frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.

This device has also been evaluated and shown compliant with the IC RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a person's body).

This device has been certified for use in Canada. Status of the listing in the Industry

Canada’s REL (Radio Equipment List) can be found at the following web address:

http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng

Additional Canadian information on RF exposure also can be found at the following web address:

COMPANY CONFIDENTIAL

No.

Manufacturer

Model No.

Peak Gain

Walsin

RFDPA870920IMAB301 (200mm)(Main)(Aux)

2.14 dBi

Walsin

RFDPA870930IMAB301(300mm) (Main)(Aux)

1.2 dBi

Walsin

RFDPA870945IMAB301(450mm) (Main)(Aux)

1.16 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100645SA6B301(450mm) (Main)(Aux)

0.2 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100630SA6B301(300mm) (Main)(Aux)

0.3 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100620SA6B301(200mm) (Main)(Aux)

0.4 dBi

http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html

Canada, avis d'Industry Canada (IC) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210.

Son fonctionnement est soumis aux deux conditions suivantes : (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.

Informations concernant l'exposition aux fré quences radio (RF)

La puissance de sortie émise par l’appareil de sans fil Dell est inférieure à la limite

d'exposition aux fréquences radio d'Industry Canada (IC). Utilisez l’appareil de sans fil Dell de façon à minimiser les contacts humains lors du fonctionnement normal.

Ce périphé rique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20 cm du corps d'une personne). Ce périphé rique est homologué pour l'utilisation au Canada. Pour consulter l'entrée correspondant à l’appareil dans la liste d'équipement radio (REL - Radio Equipment List) d'Industry Canada rendez-vous sur:

http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng

Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur :

http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html

Information To Be Supplied to the End User by the OEM or Integrator

The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system

incorporating an adapter in compliance with local regulations. Host system must be labeled with "Contains IC: 740B-VX77A “ , IC ID

displayed on label.

This radio transmitter FCCID: PPQ-CX8703BD120 has been approved by FCC to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Antenna List

Note: The antenna connector is Reverse SMA type.

This radio transmitter IC: 4491A-CX8703BD120 has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet émetteur radio IC: 4491A-CX8703BD120 a été approuvé par Industrie Canada pour fonctionner avec les types d'antennes énumérés ci‐ dessous avec le gain maximal admissible et impédance d'antenne requise pour chaque type d'antenne indiqué. Types d'antennes n'est pas inclus dans cette liste, ayant un gain supérieur au gain maximal indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil.

Antenna List

No.

Manufacturer

Model No.

Peak Gain

Walsin

RFDPA870920IMAB301 (200mm)(Main)(Aux)

2.14 dBi

Walsin

RFDPA870930IMAB301(300mm) (Main)(Aux)

1.2 dBi

Walsin

RFDPA870945IMAB301(450mm) (Main)(Aux)

1.16 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100645SA6B301(450mm) (Main)(Aux)

0.2 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100630SA6B301(300mm) (Main)(Aux)

0.3 dBi

Walsin

RFDPA870900SBAB801 + RFCBA100620SA6B301(200mm) (Main)(Aux)

0.4 dBi

COMPANY CONFIDENTIAL

Note: The antenna connector is Reverse SMA type.

6.1 RoHS

Uses only RoHS compliant components

6.2 Environmental Test

Withstands 4 hours at 70°C, 90% RH

6.3 ESD and Transient Test (Applies to LAN and USB external

connections only)

ESD: +/- 2kV operation, +/- 4kV no destruction (part of CE test) Fast electrical transients: +/- 500V operation, +/- 1000V no destruction (part of CE test)

COMPANY CONFIDENTIAL

6.4 Magnetic Field Test

Passes EN55022 and EN55024 (part of CE test)

6.5 MTBF

>10000 hours

6.6 Mechanical Specifications

Passes drop test according to I.E.C. 68-2-32, height 100 cm, 1 corner, 6 faces. Passes vibration test with sine, vertical, 60 minutes, 600 to 18000 cpm, 1G

6.7 Module Quality

Defect Rate: < 1% AQL CR=0, MA=0.4, MI=0.4

COMPANY CONFIDENTIAL

7 Board Dimensions and Weight

7.1 Top & Bottom View of CX870 Module without Bottom Shield

7.1.1 Top & Bottom View of CX Module with Bottom Shield

COMPANY CONFIDENTIAL

Note:

1. All dimensions are measured in millimetres (mm).

2. PCB’s thickness: 1.00 +/- 0.10mm

3. Tolerance: +/-0.10mm

4. Outline Tolerance: +/-0.10mm

5. NPTH Hole: +/-0.05mm

6. PTH Hole: +/-0.075mm

7. Connector positions, board dimensions, mounting

hole positions and sizes are the same for all module variants.

8. Connector position tolerance: +/- 0.38mm

9. The 64-pin connector mounted on the module along

one edge is the male gender.

10. Not all module variants have all connectors. Please

see the Ordering Guide table for details of connector options.

7.2 Side View of CX870 module without Bottom Shield

7.2.1 Side View of CX Module with Bottom Shield except CX870-3JB

COMPANY CONFIDENTIAL

7.2.2 Side View of CX870 Module with Bottom Shield part number CX870-3JB only

7.3 3D View of CX870 Module without Bottom Shield

Note: A 3D file of the CX module in .stp format is available from

the SMSC Customer Portal.

7.4 Module Weight

CX870: 20g

Note: Module weight applies to all versions of the module.

COMPANY CONFIDENTIAL

Connector Number

Connector Purpose

Connector Type

Number of Pins

Pin Configuration

Mating Connector Part Numbers

LCD

B2B

Connector

2 x 15 x 0.5mm

14-5046-030-145-829+ (Kyocera)

Media

120

2 x 60 x 0.5mm

14-5046-120-145-829+ (Kyocera)

Low Density

2 x 32 x 2.54mm

CSHA201-3202A001A1AB

8 Connectors and Connections

8.1 WLAN UFL Antenna Connector (optional)

The module includes two PCB strip antennas operated in diversity mode. Alternatively, one or two coaxial antenna connectors are provided for connecting external (to the module) antennas. The choice between using the strip antenna or using the coaxial sockets is a build option, determined by the position of surface mount capacitors on the module PCB. If the PCB antennas are chosen, then diversity mode is always used. If external (to the module) antenna sockets are used, then two external antennas should be used to provide 2X diversity operation.

If external antenna is used, please choose the proper part number indicating two external antenna sockets. Do not use a module which has two external antenna sockets with only one external antenna connected; this will result in reduced WiFi performance.

Please see ordering guide for build option details.

The surface-mount antenna socket used in the CX module is:

UF.L type Ultra Small Surface Mount Coaxial Connector

8.2 Module Connectors

The CX860/870 module uses 3 board-to-board connectors as interfaces to the product main board. The part numbers for the connectors needed on the product main board, which mate with the connectors on the CX module, are shown in the table below.

COMPANY CONFIDENTIAL

Signal(s)

Type

Description

POWER

VIN(+3.3V)

Power supply input ; +3.3V.

VIN (+1.2V)

Power supply input ; +1.2V.

VIN (+1.9V)

Power Supply input; +1.9V for powering RF section. Make sure this is a clean supply.

3V3RTC

The RTC function is no longer supported. This pin should be left open.

GND

Ground (GND) connection for power supply 0V, signal returns and shielding.

SPI

SPI_DOUT

SPI data from DM870A to host controller.

SPI_DIN

SPI data from host controller to DM870A.

SPI_CLK

SPI clock from host controller to DM870A. Maximum recommended frequency is 2MHz, typical frequency is 1MHz. See Note 2 below.

SPI_NCS0

SPI chip select from host controller to DM870A.

PDOUT1

This signal is used as SPI_REQ, SPI request signal, from DM870A to host controller for eDMP applications. Logic 1 indicates that there is an SPI message waiting to be read, the host controller should start the SPI clock and read any changed registers. Logic 0 indicates that all changed register messages have been read and the message buffer is empty. Also GPIO-06.

SPI_NCS1

Not used. Leave open.

UART

RXD1

UART1 input to the DM870A, used for shell access. SMSC recommends providing a connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM port. Such a connection can be used for product development debugging, and for module programming control on the product manufacturing line and for module control during certification procedures.

TXD1

UART1 output from the DM870A, used for shell access. SMSC recommends providing a connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM port. Such a connection can be used for product development debugging, and for module programming control on the product manufacturing line and for module control during certification procedures.

RXD0

UART0 input. Optionally used for controlling an iPod via UART.

TXD0

UART0 output. Optionally used for controlling an iPod via UART.

The pinout and signal names are shown on the next page. The following table provides an overview for the most important control and interface signals.

8.2.1 Pin Descriptions

COMPANY CONFIDENTIAL

AUDIO

AV2DATA0

I2S or left justified audio data output. Typically connected to external D/A converter input or to external DSP for further audio processing. Used for main left and right channel audio output data. See Note 3.

AV2CTRL0

LRCK, audio data word clock at the audio sample rate (Fs). Maximum currently supported frequency is 192kHz.

AV2CTRL1

MCLK, audio master clock at 256Fs. This can be used to clock an external D/A converter or DSP.

AV2CLK

SCLK, audio data bit clock at 64Fs. Allows for up to 32 audio data bits per sample word.

AV4DATA1

SPDIF format output. Can support samples rates up to 192kHz, so the maximum instantaneous frequency on this pin is 24.576MHz.

AV4DATA0

SPDIF input. Not used at present. Leave open.

AV2DATA1

I2S or left justified audio data output. Not used at present. Leave open.

AOUTLP/AOUTLN, AOUTRP/AOUTRN

Differential stereo output from PWM-DAC, right and left channels. These signals require analog low pass filtering. SMSC is not recommending using the PWM-DAC outputs because of the potential for high out-of-band noise and uncharacterized audio quality. SMSC recommends using an external D/A converter connected to AV2DATA0.

AV2DATA2

I2S or left justified audio data input. Can be driven from an optional external A/D converter used to interface to iPod analog output or other analog audio sources. If not used, leave open.

AV2DATA3

I2S or left justified audio data input. Not used at present. Leave open.

CONTROL

NCS3

This signal is configured as GPIO-17 and is currently not used. DM870A-internal pull-up. Leave this pin open.

PDOUT0

Factory Reset. GPIO-04. Return the CnE to factory settings. High-active input, DM870A-internal pull-down. Pull to GND with a 10kohm resistor, unless return to factory settings from a hardware control is needed. Normally, return to factory settings is controlled from the host controller via SPI register. This pin is only monitored during the boot up process.

VCO0

Infrared sensor input. GPIO-05. This is a Schmitt-Trigger input and can handle inputs with slow slopes. Used for aDMP firmware builds for infrared remote control sensor output connection to DM870A. For applications with a host controller, pull this pin to +3.3V via a 10kohm resistor.

AV3CLK

ETH_NRESET Low-active reset for the on-board ethernet PHY. This output is driven by the DM870A. GPIO-12. Leave this pin open.

AV3CTRL0, AV3CTRL1

I/O

I2C_SCL, I2C_SDA bus created by GPIO-13 and GPIO-14. No internal pull-ups; Use 4.7kohm pull up resistor on each pin to +3.3V. Maximum frequency is 400kHz.

NRESET_MOD

Low-active input to reset the module. This signal must be driven by an external reset generator, or by a GPIO output from a host controller. See the application section of this data sheet for the timing requirements for NRESET_MOD. Includes internal 10K pull-up resistor to +3.3V.

NPD_RF

Active low input to shut down the power for the 802.11 RF section. Internal 10kohm pull-up resistor to +3.3V. Leave open if powering down the RF section is not required.

COMPANY CONFIDENTIAL

ETHERNET

ETH_RXN, ETH_RXP, ETH_TXN, ETH_TXP

Ethernet signals between the PHY on the module and the external magnetics (transformer). See Note 4. Maximum bit rate is 100Mbps.

ETH_LED_SPEED, ETH_LED_ACT

O 3.3V push-pull outputs (max. ±12mA) to drive the ethernet LEDs. 100Mbps speed mode and activity are indicated by the outputs being low. Connect to LEDs through 220ohm resistors.

USB

USB_DN, USB_DP

USB data signals, normally connected to type A connector, USB switch or iPod dock connector. Maximum bit rate is USB High Speed at 480Mbps.

USB_VBUS

Analog input for monitoring USB type A connector power. Connect to the +5V power which is driving the USB type A connector power pins. If this pin drops below 4.6V, then the DM870A will drive the USBVBUSDRV signal low to control an external power MOSFET to disconnect +5V power from the USB type A connector. See Note 5.

USBVBUSDRV

Logic output to control an external MOSFET that is in series with USB type A connector power. See USB_VBUS above and Note 5.

JTAG

TMS,TCK,TDI, TDO

I/O

JTAG port for DM870A. Leave open.

SSM

SSMD4, SSMD5, SSMD6, SSMD7

I/O

Can be used to drive external shift registers to make extended GPIO signals (see Note 6), or as individual GPIO signals, or to make an SD card interface. SD card firmware is not supported at present in JB2. Can be mapped to GPIO #s 08,09,10,11. Leave open if not used.

SSMD0, SSMD1, SSMD2, SSMD3, SSMCLK, SSMCP, SSMCMD, SSMWP

I/O

Used to make an SD card interface. SD card firmware is not supported at present in JB2. Leave open.

VIDEO

AV0CLK, AV0CTRL0, AV0CTRL1, AV0CTRL2, AV0DATA0, AV0DATA1, AV0DATA2, AV0DATA3, AV1DATA0, AV1DATA1, AV1DATA2, AV1DATA3

ITU-R BT.656 digital video output signals. Optionally used to make a TVout menu display, or to display decoded album art. Can be connected to video D/A converter (see Note 7), or connected to a video DSP.

COMPANY CONFIDENTIAL

GPIO (not already mentioned elsewhere in this table)

A22 O GPIO18 Reserved for NOR flash address A22. Leave open.

A23 O GPIO-16 Reserved for NOR flash address A23. Leave open.

NWAIT

I/O

GPIO-15 Not currently assigned. Leave open.

NCS2

GPIO-19 Assigned to iPod dock connector iPod NDETECT. See Note 8.

VCO1

I/O

GPIO-07 Not currently assigned. Leave open.

MIICRS

I/O

GPIO-00 Not currently assigned. Leave open.

MIICOL

I/O

GPIO-01 Not currently assigned. Leave open.

MIITXER

I/O

GPIO-02 Not currently assigned. Leave open.

MIITXCLK

I/O

GPIO-03 iPod dock connector Accessory Power signal. See Note 8.

MII

MIITXD0, MIITXD1, MIIRXD0, MIIRXD1

I/O

Can be used, with GPIO signals above, to drive an external ethernet PHY. This is not supported by JB2 firmware. Leave open.

LCD

LCDD0, LCDD1, LCDD2, LCDD3, LCDD4, LCDD5, LCDD6, LCDD7, LCDD8, LCDD9, LCDD10, LCDD11, LCDD12, LCDD13, LCDD14, LCDD15, LCD16, LCDD17, LCDCLK, LCDCTRL0, LCDCTRL1, LCDCTRL2, LCDCTRL3

Uses optional J1 LCD connector. Connect to local LCD display. See Note 9. Leave open if not used.

COMPANY CONFIDENTIAL

Notes:

1. Signal type codes: I – 3.3V level Digital Logic Input into the DM870A O – 3.3V level Digital Logic Output from the DM870A IO – 3.3V level Digital Logic Input and Output (bi-directional) signal M – Miscellaneous, see text for description P – Power Supply

2. For SPI timing diagram for eDMP applications, please see: BridgeCo_JB2x - DeviceControlProtocol_Registers_v_2_1.pdf, or later version.

For detailed setup and hold timing details, see DM870A IC data sheet:

DM870A DS rev. 1.3_12-15-11.pdf, or later version.

3. For audio port timing diagrams, and for detailed setup and hold timing, please see DM870A IC data sheet: DM870A DS rev. 1.3_12-15-11.pdf, or later version.

4. For example ethernet external schematic, see: CX Module Ethernet (RJ45 + Ext.Magnetics)_V1.2.pdf, or later version.

This schematic is typically compressed into a zip file, for example: CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar

5. For example USB schematics, see: CX Module USB_V1.2.pdf, or later version.

This schematic is typically compressed into a zip file, for example: CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar

6. For example use of extended GPIO shift registers, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

7. For example connection to a video D/A converter, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

8. iPod dock connector pin and GPIO assignments are under discussion. Please contact SMSC for

recommendations for iPod dock connections to CX870 module.

9. For example connection to an LCD display, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

10. All the above signals are brought out to J2 pins. Not all the above signals are brought out to J3, the 64-pin

low density connector. The J3 pin assignments table shows which signals are brought out to the J3 pins.

11. SMSC has a set of example motherboard schematics that shows example external circuitry that is typically

connected to the module. Please check the SMSC/BridgeCo customer portal at https://portal.bridgeco.net/ for a copy of these example schematics. These schematics are typically compressed into a zip file, for example:

CX Module_Interface Schematics_one_page_V1.2_Jun_11.rar

12. Please check the SMSC/BridgeCo Customer Portal Download area for the latest version of the SMSC

documents. Go to https://portal.bridgeco.net/. If you do not have an account, please contact SMSC.

COMPANY CONFIDENTIAL

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

GND 1 2 GND VIN (+3.3V) 3 4 VIN (+3.3V) VIN (+3.3V) 5 6 VIN (+3.3V)

GND 7 8 GND VIN (+1.2V) 9 10 VIN (+1.2V) VIN (+1.2V) 11 12 VIN (+1.2V)

GND 13 14 GND VIN (+1.9V) 15 16 VIN (+1.9V)

GND 17 18 GND

3V3RTC 19 20 GND

GND 21 22 TMS B15

GND 23 24 TCK C14

D15 SPI_DOUT 25 26 TDI A16 D14 SPI_DIN 27 28 TDO A15 B16 SPI_CLK 29 30 SPI_NCS0 C15 C13 TXD0 31 32 SPI_NCS1 B17 B14 RXD0 33 34 NRESET_MOD Module reset input A14 RXD1 35 36 SSMD6 C12 GPIO-10 SPI_E_CLK B13 TXD1 37 38 SSMD4 A12 GPIO-08 SPI_E_SDO

GND 39 40 SSMD2 C11

SPI_E_NCS GPIO-11 D12 SSMD7 41 42 SSMD1 B11 SPI_E_SDI GPIO-09 B12 SSMD5 43 44 SSMCMD A13

D11 SSMD3 45 46 SSMWP D9 A11 SSMD0 47 48

NCS3 H18 GPIO-17 BIST activate

C10 SSMCLK 49 50 NCS2 J17 GPIO-19 iPod NDETECT D10 SSMCP 51 52 GND

GND 53 54 USB_VBUS D2

A1 USB_DN 55 56 GND B1 USB_DP 57 58 AOUTRN L3 E3 USBVBUSDRV 59 60 AOUTRP L4

GND 61 62 GND

K4 AOUTLP 63 64 PDOUT1 J1 GPIO-06 SPI_REQ L2 AOUTLN 65 66 VCO1 J2 GPIO-07

GND 67 68

PDOUT0 K1 GPIO-04 Factory reset

GPIO-16 H17 A23 69 70

VCO0 K2 GPIO-05 IR input

GPIO-18 H16 A22 71 72

AV3CLK R4 GPIO-12 ETH NRESET

I2C SDA GPIO-14 T3 AV3CTRL1 73 74 AV0CTRL0 M1 I2C SCL GPIO-13 U2 AV3CTRL0 75 76 AV1DATA3 N4

M3 AV0CTRL2 77 78 AV1DATA2 P1 M2 AV0CTRL1 79 80 AV1DATA1 P2

L1 AV0CLK 81 82 AV1DATA0 P3 M4 AV0DATA3 83 84 GND N1 AV0DATA2 85 86 AV2CTRL1 T1 MCLK N2 AV0DATA1 87 88 GND N3 AV0DATA0 89 90 AV2CLK R1 SCLK

GND 91 92 GND LRCK T1 AV2CTRL0 93 94 AV4DATA1 U3 SPDIF output A/D data 1 P4 AV2DATA3 95 96 AV4DATA0 V2 SPDIF input A/D data 0 R3 AV2DATA2 97 98 GND D/A data 1 T2 AV2DATA1 99 100 ETH_LED_ACT D/A data 0 U1 AV2DATA0 101 102 ETH_LED_SPEED

GND 103 104 MIICRS R14 GPIO-00

ETH_RXN 105 106 MIICOL T13 GPIO-01 ETH_RXP 107 108 MIITXER T11 GPIO-02

109 110 MIITXCLK R12 GPIO-03 iPod Access Power

ETH_TXN 111 112 MIITXD0 U10

ETH_TXP 113 114 MIITXD1 V10

GND 115 116 MIIRXD0 U12

GPIO-15 K18 NWAIT 117 118 MIIRXD1 V12

NPD_RF 119 120 GND

USB

Video Output

Ethernet

USB

Video Output

Ethernet

PIN Number

SPI

Debug UART

JTAG

SPI

8.2.2 Connector PIN Assignments

J2 – Media Connector

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This

allows for easy cross-reference to the DM860A or DM870A data sheet information.

J1 – LCD Connector

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

GND

1 2 GND

V8 LCDD0

3 4 LCDD1 U8

T8 LCDD2

5 6 LCDD3 R8

V7 LCDD4

7 8 LCDD5 U7

T7 LCDD6

9 10 LCDD7 R7

V6 LCDD8

11 12 LCDD9 U6

T6 LCDD10

13 14 LCDD11 R6

V5 LCDD12

15 16 LCDD13 U5

T5 LCDD14

17 18 LCDD15 V4

U4 LCDD16

19 20 LCDD17 V3

GND

21 22 GND

T10 LCDCLK

23 24 LCDCTRL0 R9

T9 LCDCTRL1

25 26 LCDCTRL2 U9

V9 LCDCTRL3

27 28 GND

GND 29 30 GND

PIN Number

LCD Interface

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

GND

1 2 GND

VIN (+3.3)

3 4 RXD0 B14

VIN (+3.3)

5 6 TXD0 C13

GND

7 8 GND

VIN (+1.9)

9 10 VIN (+1.2)

VIN (+1.9)

11 12 VIN (+1.2)

GND

13 14 GND

Free GPIO-15

K18 NWAIT

15 16 RXD1 A14

iPod NDETECT GPIO-19

J17 NCS2

17 18 TXD1 B13

D13 NRESET

19 20 GND

3V3RTC

21 22 AV2CTRL1 R2 MCLK

GND

23 24 AV2CTRL0 T1 LRCK

D14 SPI_DIN

25 26 AV2CLK R1 SCLK

D15 SPI_DOUT

27 28 AV2DATA2 R3 A/D data 0

B16 SPI_CLK

29 30 AV2DATA0 U1 D/A data 0

C15 SPI_NCS0

31 32 AV4DATA1 T2 SPDIF output

Free GPIO-17 H18 NCS3

33 34 AV4DATA0 V2 SPDIF input

GND

35 36 GND

E-GPIO_NCS/TBA GPIO-11

D12 SSMD7

37 38 USB_DN A1

I2C SDA GPIO-14

T3 AV3CTRL1

39 40 USB_DP B1

I2C SCL GPIO-13 U2 AV3CTRL0

41 42 USBVBUSDRV E3

GND

43 44 USB_VBUS D2

SPI_REQ GPIO-06 J1 PDOUT1

45 46 GND

Factory Reset GPIO-04 K1 PDOUT0

47 48 SSMD5 B12

GPIO-09

E-GPIO_SDI/TBA

IR input GPIO-05 K2 VCO0

49 50 SSMD4 A12 GPIO-08

E-GPIO_SDO/TBA

GND

51 52 GND

ETH_LED_SPEED

53 54 ETH_LED_ACT

iPod Access Power

GPIO-03 R12 MIITXCLK

55 56 SSMD6 C12 GPIO-10

E-GPIO_CLK/TBA

ETH_RXN

57 58 ETH_RXP

ETH_TXN

59 60 ETH_TXP

Free GPIO-00 R14 MIICRS

61 62 MIICOL T13

GPIO-01 Free

GND 63 64 GND

PIN Number

Debug UART

USB

SPI

Ethernet Ethernet

Ethernet

COMPANY CONFIDENTIAL

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This allows for easy cross-reference to the DM860A or DM870A data sheet information.

J3 – Low Density Connector

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This

allows for easy cross-reference to the DM860A or DM870A data sheet information.

COMPANY CONFIDENTIAL

GPIO

PIN Name

PIN Number

Function

MIICRS

Free

MIICOL

Free

MIITXCLK

iPOD Access Power

PDOUT0

Factory Reset

VCO0

IR Input

PDOUT1

Host NIREQ

SSMD4

E_GPIO_SDO/TBA

SSMD5

E_GPIO_SDI/TBA

SSMD6

E_GPIO_CLK/TBA

SSMD7

E_GPIO_NCS/TBA

AV3CTRL0

I2C_SCL

AV3CTRL1

I2C_SDA

NWAIT

Free

NCS3

Free

NCS2

IPOD NDETECT

8.2.3 GPIO Assignments

GPIO Assignments for J3 64-pin Low Density Connector

Note: Not all 20 GPIO signals are brought out to J3 64-pin low density connector. For the CX870-3K, GPIOs 00,

01 and 03 are not brought out to J3 64-pin low density connector. J3 pin numbers 61, 62 and 55 are not connected to any signal in the CX870-3K module.

9 Application Guidelines

9.1 Power Supply sequencing and Reset Timing

There are strict power sequencing and reset timing requirements.

 Power up the I/O voltage (3.3V) first and hold NRESET_MOD low.  The core voltage (1.2V) must never be higher than (I/O voltage +0.5 V).  The core voltage (1.2V) must be within the specified core voltage limits less than 300ms after the I/O voltage (3.3V)

reaches the specified I/O voltage limits.

 Throughout the power down process, the 3.3V supply must maintain a higher voltage than the 1.2V supply, until both

have reached ground potential.

 To assure a proper IC reset, the power supplies must be present for a minimum time of 2ms before NRESET_MOD is

Please see the power and reset timing figure in Section 9.1.1 below. About 1.9V, the arrival of 1.9V supply should lag behind the arrival of the 3.3V. The delay between the 1.9V and the 3.3V is

not critical. Typical delay is approximately 10ms, for example using 10kohm resistor and 0.1uF capacitor on the enable pin of a 1.9V dc-to-dc converter.

de-asserted.

COMPANY CONFIDENTIAL

Time

Voltage

NRESET_MOD

+1.2V

+3.3V

< 300ms

>= 2ms

Power Up Power Down

9.1.1 Power up, Reset and Power Down Timing

9.2 RF Considerations

Note that overall system, RF and WiFi performance is significantly affected by the product design, environment and the application. It is the responsibility of the product designer to ensure proper system level shielding (if required) and to verify performance and fitness for the given product features and applications. The WiFi performance will be affected by the RF environment surrounding the CX module. Please ensure that the CX module is positioned in a “quiet” RF environment, as far away as possible from high frequency clock signals and any other sources of RF energy. Also, make sure the antenna is not shielded by any metal objects, for example loudspeakers or other metal parts. Please make sure that the power supplies, in particular the +1.9V supply, are quiet and free from noise. SMSC recommends that systems implementing AirPlay should use a module configuration that includes on-module shielding, as well as paying particular attention to system configuration and shielding. In particular, SMSC is recommending the use of the Bottom Shield versions of the modules, which allows greater freedom in antenna positioning. Also, please see the SMSC Application Note:

SMSCAppNote - CX870_Antenna_Placement_V1_4.pdf

regarding antenna positioning guidelines. Please see below picture for the recommended keep out area and cable routing for the antennas.

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

V2.8 (093012)

Sept 30, 2012 / SHs

Updated Section 4 Ordering Guide with 2 new rows for CX870-3LB & CX870-3MB and moved the row for CX870-3KB to be with them.

New SKUs available.

V2.8 (092412)

Sept 24, 2012 / SHs

Updated cover page with new Microchip logo; removed SMSC logo from header; removed SMSC logo & address from legal text (page 2); added info about Microchip to legal text; updated © to 2012.

Microchip purchased SMSC.

Updated filename to ‘CX_Module_DS_Rev2-8_MM-DD-YY.pdf’.

Data covers all CX modules.

Removed CX860 from Section 7.4 Module Weight.

No CX860 module available.

Updated left side of footer to ‘SMSC CX Module’.

Data sheet is for all CX modules.

Updated title of Section 7.1.1 to ‘Top & Bottom View of CX Module with Bottom Shield’.

Drawings are for all CX modules.

Updated title of Section 7.2.1 to ‘Side View of CX Module with Bottom Shield except CX870-3JB’.

Drawings are for all CX modules. In Sections 3.1, 3.2, 3.2.1 & 3.2.2, updated occurrences of ‘CX870’ to ‘CX Module’.

Pictures are for all CX modules.

Updated Section 4 Ordering Guide to remove rows for CX870-3DB and CX870-3DBS, and add a row for CX870-3KB.

Updated to show actual status.

Removed ‘I2C’ box, arrow & label in Section 2

Block Diagram.

Correction.

V2.8 (090912)

Sept 9, 2012 / SHs

Updated Section 2 Block Diagram to show obscured black lines leading out from LCD & SSM blocks.

Correction.

In Section 2 Block Diagram changed “DM860A

or DM870A” to “DM870A or DM875”

CX module uses DM870A and DM875.

In Section 1 Introduction, changed “DM860A

and DM870A” to “DM870A and DM875”

CX module uses DM870A and DM875.

In Section 4 Ordering Guide, added a ‘Status’

column and status code key.

To show current availability status of each module version.

In Section 4 Ordering Guide, added row for CX875-3PB.

To give details of newly available module version.

In Section 4 Ordering Guide, changed “SMSC

IC’s” heading to “SMSC ICs”.

Correction.

In Section 6.0.1 Antenna Considerations, replaced text list with a new table.

Updated information and in a clearer format.

Added a new section 6.0.2 CX Power Settings Used For Modular Approval.

To provide more details about CX module power settings.

In Section 6 Regulatory Compliance and Quality, updated the Compliance entry for New Zealand / Australia for Radio Regulations from “CE” to “AZ/NZS:4268”

Updated information.

In Section 9.2 RF Considerations, changed the application note file path from “App Note Antenna Placement recommendation CX870 modules rev1.1.pdf” to “SMSCAppNote CX870_Antenna_Placement_V1_4.pdf”

Provide most up to date Application Note file. In Section 9.2 RF Considerations, added note &

picture regarding recommended keep out area and cable routing for antennas.

Provide information about keep out areas and cable routing.

In Notes of Section 8.2.1 Pin Descriptions, added text regarding schematics being compressed into zip files to Notes 4, 5 & 11.

Provide further information about schematic files. V2.7

June 13,

In Section 4 Ordering Guide, made rows for

All new designs should use modules with a

10 Revision Control

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

(061312)

2012 / SHs

CX870-3B, 3H, 3I, 3J shaded.

bottom shield, so modules without a bottom shield are now marked as "NOT TO BE USED FOR NEW/STANDARD MP DESIGNS" by shading the rows in the Ordering Guide table for those modules with no bottom shield.

V2.6 (050812)

May 8, 2012 / SHs

Removed entries in ‘8MByte NOR’ column for modules 3A, 3B, 3D, 3DS in Section 4 Ordering Guide

Correction.

V2.5 (042212)

April 22, 2012 / SHs

Updated title of Section 7.2.1 Side View of CX870 Module with Bottom Shield to include “…except CX870-3JB”

Reflect addition of separate section (7.2.2) for the CX870-3JB module.

Added Section 7.2.2 Side View of CX870 Module with Bottom Shield part number CX870-3JB only

CX870-3JB has thinner bottom shield than other modules.

V2.4 (032312)

March 23, 2012 / SHs

Added IC PIN entry for MIICRS in J3 Low Density Connector table in Section 8.2.2 Connector PIN Assignments.

CX module uses DM870A. Changed "MMIICRS" to "MIICRS" in Section

8.2.3 GPIO Assignments.

Correction.

Changed "MMIICRS" to "MIICRS" in J3 Low Density Connector table in Section 8.2.2 Connector PIN Assignments.

Correction. Changed "MMIICRS" to "MIICRS" in GPIO table in Section 8.2.1 Pin Descriptions.

Correction.

Added important note text to Tx Power row in Section 5.3 WiFi Specification.

To indicate which modules the Tx Power specifications relate to.

Removed the ‘m’ from "+/-1dBm" in the Tx Power row in Section 5.3 WiFi Specification.

Correction.

V2.4 (031712)

March 17, 2012 / SHs

In Section 5.3 WiFi Specifications, updated Transmission Speed entry

Add missing 2Mbps speed.

In Section 4 Ordering Guide, changed all occurrences of DM870 to DM870A & DM860 to DM860A

CX module uses DM870A.

In Section 2 Block Diagram, changed all occurrences of DM870 to DM870A & DM860 to DM860A

CX module uses DM870A.

In Section 1 Introduction, changed all occurrences of DM870 to DM870A & DM860 to DM860A

CX module uses DM870A. In Section 8.2.1 Pin Descriptions, changed all occurrences of DM870 to DM870A

CX module uses DM870A.

In the Notes for Section 8.2.1 Pin Descriptions, changed dat_DM870_16_datasheet.pdf to DM870A DS rev. 1.3_12-15-11.pdf

CX module uses DM870A. Changed all occurrences of DM870 to DM870A throughout the datasheet.

CX module uses DM870A.

Updated J1, J2 & J3 tables in Section 8.2.2 Connector PIN Assignments, changing DM870 to DM870A.

CX module uses DM870A.

Changed "WiFi (on-module PCB diversity)" column heading to "Internal PCB Diversity Antennas" in Section 4 Ordering Guide

Improve clarity of meaning. Added ‘FCC’ to North America in Frequency Band entry in Section 5.3 WiFi Specification

Specify North American WiFi regulatory certification body.

Updated TX EVM entry in Section 5.3 WiFi Specifications

Update values to better reflect actual performance.

Updated Rx Sensitivity entry in Section 5.3 WiFi Specifications

Update values to better reflect actual performance.

Updated Tx Power entry in Section 5.3 WiFi Specifications

Show test conditions.

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

V2.4 (031212)

March 12, 2012 / SHs

Added Section 3.6 Production Module with Bottom shield (Part Numbers with a "B" after the configuration letter)

Show module versions with bottom shield. Added Section 3.6.1 Including J3 Low Density 64-pin connector - Bottom View

Show bottom shield.

Added Section 3.6.2 Including J2 High Density 120-pin connector - Bottom View

Show bottom shield.

V2.4 (031012)

March 10, 2012 / SHs

Updated Section 4 Ordering Guide & Section

4.1 Part Number Syntax drawing with bottom shield versions

Bottom shield versions added to table and Syntax drawing.

Added another note to Section 8.2.3 GPIO Assignments

Document missing GPIOs for CX870-3K.

Updated TX Power row in Section 5.3 WiFi Specification (CX870 only)

Show improved tolerances for TX power.

Added Section 7.1.1 Top & Bottom View of CX870 Module with Bottom Shield

Show drawings of module with Bottom Shield.

Added Section 7.2.1 Side View of CX870 Module with Bottom Shield

Show drawings of module with Bottom Shield.

Added a note to Section 7.3 3D View of CX870 Module

To indicate availability of digital copy of 3D view of module.

Added additional text to Section 9.2 RF Considerations

Providing further recommendations regarding the use of bottom shield versions and to indicate the availability of a pdf about antenna positioning guidelines.

V2.3 (112011)

November 20, 2011 / SHs

Added CX870-3DS option to Section 4 Ordering Guide

To indicate soldered shield version.

V2.2 (110811)

November 8, 2011 / SHs

Added CX870-3K option to Section 4 Ordering Guide.

Added -3K option.

V2.1 (100711)

October 7, 2011 / SHs

Updated title of Section 6.1 from “1 RoHS” to

“RoHS”.

Correcting typo.

In Section 10 Revision Control table, updated an entry for V2.0 b in the Reason for Change column from “RTV” to “RTC”

Correcting typo.

Removed “Preliminary Datasheet” from the

footer.

CX module is in production, so the datasheet is no longer preliminary.

Removed the word “Preliminary” from the title

page.

CX module is in production, so the datasheet is no longer preliminary.

V2.0 (100211)

October 2, 2011 / SHs

Updated Section 5.3 WiFi Specification “TX Power” entry for 802.11g

Correspond to actual production test limits.

Updated Section 6.0.1 Antenna Considerations with updated module numbering scheme

Revert to original module numbering scheme.

Updated Section 6.7 Module Quality with new Defect Rate

Data is now available.

Updated Section 4.1 Part Number Syntax with removal of Antenna Configuration number and Note

Revert to original part numbering scheme. Updated Section 10 Revision Control with new Reason for Change column

Corporate standard.

V2.0 (092611)

Sept. 26, 2011 / SHs

Change from BridgeCo logos and disclaimer text to SMSC logos and disclaimer text

Corporate standard.

Updated location of red boxes in Section 3.2.1 CX870 Bottom View with 64-pin Low density connector

Improve alignment of red box to photo.

Updated location of red boxes in Section 3.2.2 CX870 Bottom View with 120-pin Media connector

Improve alignment of red box to photo. Moved Section 5.3 WiFi Specification on to one page

Improve readability.

Updated Customer Portal information in Section 6 Regulatory Compliance and Quality

Easier to access URL directly.

Reverted Antenna Considerations back to Section 6.0.1; subsequently all subsections in

Decided to keep original part numbering scheme to avoid unnecessary paper work and

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

Section 6 reverted back to original numbering

the need to redo certifications.

Updated Notes 11 & 12 in Section 8.2.1 Pin Descriptions with updated Customer Portal information

Easier to access URL directly. Updated Table of Contents

Keep TOC aligned with actual content.

V2.0 c

Sept. 14, 2011 / SHs

Updated font styling of Table of Contents

Easier to read.

Update Section 2 Block Diagram : moved RJ45+Transformer & USB Type A boxes inside the drawing boundary

Improve accuracy of drawing. Updated Section 5.3 WiFi Specification (CX870 only) TX Power Description entry

Align data with test limits.

Updated Section 5.3 WiFi Specification (CX870 only) Rx Sensitivity Description entry

Align data with test limits.

Updated Section 5.3 WiFi Specification (CX870 only) : add a Note underneath the table

Clarification of the possible effect of changing the TX Power setting.

Updated Section 4 Ordering Guide : changed CX870-3D row Two Ant entry from (X)* to X

Change to match final CX870-3D configuration.

Updated Section 4 Ordering Guide : removed the two blank rows

Improve readability.

V2.0 b

Sept. 10, 2011 / SHs

Updated the Description for pin NCS3 in Section

8.2.1 Pin Descriptions

Update to align with actual use.

Updated Section 4 Ordering Guide : added gray background to CX870-3F & CX870-3G

Internal antenna versions are not available until performance issues are resolved.

Updated Section 4 Ordering Guide : removed the 2 from A, H, I & J version Part Numbers

Decided to keep original part numbering scheme to avoid unnecessary paper work and the need to redo certifications.

Updated Section 4 Ordering Guide : split Ext. Diversity Antennas column into two, added two sub-columns “One Ant.” & “Two Ant.”, moved Xs to correspond with correct sub-column

Show the number of external antenna connections. Updated Section 4 Ordering Guide : CX870-3D : removed X from WiFi column

CX870-3D is not configured for internal antenna.

Updated Section 4 Ordering Guide : updated + Note text

Explained about one or two external antenna options.

Updated Section 4 Ordering Guide : moved the + from Part Numbers column to Ext. Diversity Antennas column

Proper link for "+" Note. Updated Section 4 Ordering Guide : removed # Note completely

Content now covered by "+" Note

Updated Section 4.1 Part Number Syntax : Updated graphic

Explain antenna configuration field

Updated Section 4.1 Part Number Syntax : Updated Note text

Explain about one or two antenna configuration.

Updated text in Section 8.1 WLAN UFL Antenna Connector

Remove references to part numbering scheme which includes the number of antennas, and repeat advice to use two external antennas.

Removed RTC elements from Section 2 Block Diagram

Support for RTC is removed.

Updated the Description for pin 3V3RTC in Section 8.2.1 Pin Descriptions

Support for RTC is removed.

V2.0 a

August 22, 2011 / SHs

Added Section 3.5 Example Production Module Showing Soldered RF Shield

Photo shows that RF shield is soldered, needed for Japan Telec certification.

V2.0

August 12, 2011 / SHs

Updated Note Section 4.1 Part number syntax

Highlighted that CX870-3D does not follow the new part numbering scheme. This Note was subsequently deleted, so this is not relevant any more.

Updated all Section 3 Board Pictures to new versions + inserted new Sections 3.2.1 & 3.2.2 which show two different bottom views

Improve accuracy of data sheet photos.

V1.9 c

August 2, 2011 / SHs

 Updated Key Features on Title page:

removed (optional) from “WiFi-certified

802.11b/g” entry

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

 Updated Antenna Configuration entry in

Section 4.1 Part number syntax

V1.9 b

July 28, 2011 / SHs

 Updated Section 4.1 Part number syntax

o Updated graphic o Added a Note

 Changed intro text in Section 3 Board

Pictures

 Updated Section 4 Ordering Guide

o Changed CX870-3B1 to

CX870-3B

o Updated the text for + note o Added a note to CX870-3B Ext.

Diversity Antenna column

o Added a new # note

 Added Section 6.0.1 Antenna

Considerations

V1.9 a

July 25, 2011 / SHs

 Inserted new photo for Section 3.1 Top

View of CX870

 Inserted new photo for Section 3.2 Bottom

View of CX870

 Added new Section 3.3 Production Module

with Top & RF shields

 Added new Section 3.4 Production Module

with 64-pin Connector Option

 Updated Section 4 Ordering Guide

o Added gray background to

CX870-3D

o Changed CX870-3A to

CX870-3A2

o Changed CX870-3B to

CX870-3B1

o Changed CX870-3H to

CX870-3H2

o Changed CX870-3I to

CX870-3I2

o Changed CX870-3J to

CX870-3J2

o Added a Note to the Part

Number title

 Updated Section 8.1 WLAN UFL Antenna

Connector with new text

 Updated Section 5.3 WiFi Specification TX

EVM entry to

-9dB@6MHz

 Updated Section 6 Regulatory Compliance

& Quality with Module Versions Passed for Radio Regulations entries

 Replaced the Note in Section 6 to be main

body text and updated the text.

 Added new Section 4.1 Part number

syntax

 Updated module weight to 20g

V1.8 a

July 10, 2011 / SHs

 Update section 8.1 WLAN UFL Antenna

Connector

 Deleted section 8.1.1 Coaxial antenna

connector dimensions

V1.8

July 5, 2011 / SHs

 Updated the acceptable surface-mount

receptacle parts in Section 8.1 WLAN UFL Antenna Connector

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

 Added Appendix 1: Certification Notices

V1.7 c

May 13, 2011 / SHs

 Updated “Module Quality” Defect Rate

field entry

 Updated “Board Dimensions & Weight”

drawings

 Updated the “Electrical Specifications”

table

 Added another Note to the “Pin

Descriptions” section

V1.7 b

May 11, 2011 / SHs

 Updated Note 8 in “Pin Descriptions” table  Re-imported “Board Dimensions &

Weight” drawings

 Updated “Board Pictures” images  Updated board photo on Cover page  Updated the Feature list on Cover page  Updated J1, J2 & J3 “Connector PIN

Assignments” tables: removed Power

column & re-organised columns

 Changed “Application Notes” title to

“Application Guidelines”

V1.7 a

May 6, 2011 / SHs

 Re-imported Block Diagram as a wmf file  Updated “Power up, Reset & Power down

Timing” figure

 Updated “Pin Descriptions” table  Re-organised text in “Power Supply

sequencing & Reset Timing”

 Re-imported J2 & J3 Connector PIN

Assignment tables

V1.7

May 4, 2011 / SHs

 Added note to Module Weight section  Updated the Ordering Guide – Part

Numbers & added new J version

 Added new text to the Board Pictures

section

 Updated all Mechanical Drawings and

added & removed Notes

 Updated the J3 Low Density Connector

table

 Updated the GPIO Assignment table  Added new Power Supply & Timing figure  Updated the text in the “Power Supply

sequencing and Reset Timing” section

 Updated the Key Connections table  Updated “Key Connections” section title to

“Pin Descriptions”

 Updated “Detailed Connector PIN

Descriptions” section title to “Connector

PIN Assignments”

 Updated J2 Media Connector table

V1.6 d

March 3, 2011 / SHs

 Updated J3 Low Density Connector table  Update GPIO Assignments section and

table

V1.6 c

February 24, 2011 / SHs

 Updated all mechanical drawings in

“Board Dimensions and Weights” section

 Deleted warning note in “Board

Dimensions and Weights” section

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

V1.6 b

February 23, 2011 / SHs

 Updated “J3-Low density connector” pin

description table

 Updated “GPIO Assignments” table

V1.6

February 11, 2011 / SHs

 Entirely updated the “Ordering Guide”  Added a Note to the “Ordering Guide”  Updated the subsection titles for the

“Board Pictures” section

 Updated the Block Diagram – changed

‘WiFi Antenna’ to ‘Ext. Antenna’

V1.5 b

January 27, 2011 / SHs

 Added Note to “Board Dimensions and

Weight” section

V1.5 a

January 24, 2011 / SHs

 Updated the “Ordering Guide” – removed

Mfg column and consolidated into one table

 Updated the Header to reflect Preliminary

nature of datasheet

V1.5

January 22, 2011 / SHs

 Updated the datasheet to be a Preliminary

Datasheet

 Added new feature to Summary on Front

Page

 Updated “J3 - Low Density Connector”

table

 Updated “GPIO Assignments” table  Added note to “Board Dimensions &

Weight – Side Views of CX870 module” section

 Updated text in “Application Notes –

Power Supply Sequencing & Reset Timing” section

 Updated “Block Diagram”  Updated text in “Connectors &

Connections – WLAN UFL Antenna Connector” section

V1.4 b

January 11, 2011 / SHs

 Updated the Application Notes, RF

Considerations section

V1.4

January 3, 2011 / SHs

 Updated the module photo on the Title

page

 Updated the Application Notes, RF

Considerations section

V1.3

December 23, 2010 / SHs

 Updated Ordering Guide  Added Notes to Ordering Guide  Updated Block Diagram  Updated “J3 – Low Density Connector”

table

 Updated “Electrical Specifications” table  Added Power Consumption data to

“Electrical Specifications” table

 Updated the Board Dimensions and

Weight images

 Updated the “GPIO Assignments” table  Added another Application Note  Added titles to Application Notes

V1.2

December 19, 2010 / SHs

 Inserted CX860 and CX870 Module

Weights

 Updated module image on Front Page

V1.1

December 13, 2010 / SHs

 Added the Ordering Guide.  Updated the Block Diagram.

COMPANY CONFIDENTIAL

Revision

Date / Author

Details of Change

Reason for Change

 Updated the “Electrical Specifications”

table

 Updated the “Absolute Maximum Ratings”

table

 Updated the Notes for “Regulatory

Compliance and Quality” section

 Updated “Key Connections” table  Updated “J2 – Media Connector” table  Updated “J3 – Low Density Connector”

table

 Updated “GPIO Assignments” table  Added Board Pictures  Replaced Mechanical Drawings in “Board

Dimensions and Weight” section

V1.0

October 18, 2010 / SHs

 Initial Version

COMPANY CONFIDENTIAL

Part2. Antenna Spec Sheet

1 RFDPA870930IMAB301

COMPANY CONFIDENTIAL

2 RFDPA870945IMAB301

LITE ON TECHNOLOGY CX8703BD120 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual