LINEAR TECHNOLOGY LTM8032 Technical data

OUTPUT V
REG
IC REGULATOR
REF
GND
VINSWITCH PIN
SWITCH
CONTROL
FEEDBACK NODE
+V
OUTPUT V
REG
IC REGULATOR
REF
GND
V
IN
SWITCH
PIN
SWITCH
CONTROL
FEEDBACK NODE
+V
STEP-UP STEP-DOWN
AN122 F02
DIODE TURN-ON TIME
DIODE ON VOLTAGE
IC BREAKDOWN LIMIT
AN122 F03
DIODE UNDER TEST
MEASUREMENT POINT
PULSE IN t
RISE
≤ 2ns
AMPLITUDE = 5V + V
FWD
L DESIGN IDEAS
Diode Turn-On Time Induced Failures in Switching Regulators
Never Has So Much Trouble Been Had by So Many with So Few Terminals
by Jim Williams and David Beebe
This article is excerpted from the Linear Technology Application Note AN122 with the same title.
Introduction
Most circuit designers are familiar with diode dynamic characteristics such as charge storage, voltage dependent capacitance and reverse recovery time. Less commonly acknowledged and manufacturer specified is diode forward turn-on time. This parameter describes the time required for a diode to turn on and clamp at its forward volt­age drop. Historically, this extremely short time, units of nanoseconds, has been so small that user and vendor alike have essentially ignored it. It is rarely discussed and almost never specified. Recently, switching regula­tor clock rate and transition time have become faster, making diode turn-on time a critical issue. Increased clock rates are mandated to achieve smaller magnetics size; decreased transition times somewhat aid overall efficiency but are principally needed to minimize IC heat rise. At clock speeds beyond about 1MHz, transition time losses are the primary source of die heating.
A potential difficulty due to diode
turn-on time is that the resultant
Figure 2. Diode forward turn-on time permits transient excursion above nominal diode clamp voltage, potentially exceeding IC breakdown limit.
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transitory “overshoot” voltage across the diode, even when restricted to nanoseconds, can induce overvoltage stress, causing switching regulator IC failure. As such, careful testing is required to qualify a given diode for a particular application to insure reli­ability. This testing, which assumes low loss surrounding components and layout in the final application, measures turn-on overshoot voltage due to diode parasitics only. Improper
Figure 1. Typical voltage step-up/step-down converters. Assumption is diode clamps switch pin voltage excursion to safe limits.
associated component selection and layout will contribute additional over­stress terms.
Diode Turn-On Time Perspectives
Figure 1 shows typical step-up and step-down voltage converters. In both cases, the assumption is that the diode clamps switch pin voltage excursions to safe limits. In the step-up case, this limit is defined by the switch pins
Figure 3. Conceptual method tests diode turn-on time at 1A. Input step must have exceptionally fast, high fidelity transition.
Linear Technology Magazine • March 2009
DESIGN IDEAS L
AN122 F05
LT1086
22µF22µF
120Ω
1k
1k
+V ADJUST (RISE TIME TRIM)
+V TYPICAL 17VVIN = 20V
*
+V
Q1
Q4
+V
Q2
Q5
+V
Q3
Q6
5Ω**
OUTPUT
62Ω50Ω
2pF TO 12pF EDGE PURITY
EDGE PURITY
100Ω
PULSE
INPUT
MINIMIZE INDUCTANCE IN ALL PATHS
= 2N3866
= 2N3375
** = TEN PARALLELED 50Ω RESISTORS * = BYPASS EVERY TRANSISTOR WITH 22µF SANYO OSCON PARALLELED WITH
2.2µF MYLAR
+
+
*
*
1V/DIV
2ns/DIV
AN122 F06
AN122 F04
DIODE UNDER TEST
OSCILLOSCOPE
1GHz BANDWIDTH
t
RISE
= 350ps
PULSE CURRENT
AMPLIFIER t
RISE
= 2ns
PULSE GENERATOR
t
RISE
< 1ns
Z0 PROBE
≈1A
TYPICALLY 5V TO 6V, 30ns WIDE
Figure 4. Detailed measurement scheme indicates necessary performance parameters for various elements. Subnanosecond rise time pulse generator, 1A, 2ns rise time amplifier and 1GHz oscilloscope are required.
maximum allowable forward voltage. The step-down case limit is set by the switch pins maximum allowable reverse voltage.
a finite length of time to clamp at its forward voltage. This forward turn­on time permits transient excursions above the nominal diode clamp volt­age, potentially exceeding the IC’s breakdown limit. The turn-on time is typically measured in nanoseconds, making observation difficult. A further complication is that the turn-on over­shoot occurs at the amplitude extreme of a pulse waveform, precluding high resolution amplitude measurement. These factors must be considered when designing a diode turn-on test method.
Linear Technology Magazine • March 2009
Figure 5. Pulse amplifier includes paralleled, darlington driven RF transistor output stage. Collector voltage adjustment (“rise time trim”) peaks Q4 to Q6 FT, input RC network optimizes output pulse purity. Low inductance layout is mandatory.
Figure 2 indicates the diode requires
Figure 3 shows a conceptual method for testing diode turn-on time. Here, the test is performed at 1A although other currents could be used. A pulse
Figure 6. Pulse amplifier output into 5. Rise time is 2ns with minimal pulse-top aberrations.
steps 1A into the diode under test via the 5 resistor. Turn-on time volt­age excursion is measured directly at the diode under test. The figure
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