LINEAR TECHNOLOGY LTC3809 Technical data

LTC3809
FEATURES
No Current Sense Resistor Required
Selectable Spread Spectrum Frequency Modulation for Low Noise Operation
Constant Frequency Current Mode Operation for Excellent Line and Load Transient Response
True PLL for Frequency Locking or Adjustment (Frequency Range: 250kHz to 750kHz)
Wide VIN Range: 2.75V to 9.8V
Wide V
0.6V ±1.5% Reference
Low Dropout Operation: 100% Duty Cycle
Selectable Burst Mode®/Pulse Skipping/Forced
Range: 0.6V to V
OUT
IN
Continuous Operation
Auxiliary Winding Regulation
Internal Soft-Start Circuitry
Power Good Output Voltage Monitor
Output Overvoltage Protection
Micropower Shutdown: IQ = 9µA
Tiny Thermally Enhanced Leadless (3mm × 3mm) DFN and 10-lead MSOP Packages
U
APPLICATIO S
One or Two Lithium-Ion Powered Devices
Portable Instruments
Distributed DC Power Systems
No R
SENSE
, Low EMI,
Synchronous DC/DC Controller
U
DESCRIPTIO
The LTC®3809 is a synchronous step-down switching regulator controller that drives external complementary power MOSFETs using few external components. The constant frequency current mode architecture with MOSFET
sensing eliminates the need for a current sense
V
DS
resistor and improves efficiency.
For noise sensitive applications, the LTC3809 can be ex­ternally synchronized from 250kHz to 750kHz. Burst Mode is inhibited during synchronization or when the SYNC/ MODE pin is pulled low to reduce noise and RF interference. To further reduce EMI, the LTC3809 incorporates a novel spread spectrum frequency modulation technique.
Burst Mode operation provides high efficiency operation at light loads. 100% duty cycle provides low dropout opera­tion, extending operating time in battery-powered systems.
The switching frequency can be programmed up to 750kHz, allowing the use of small surface mount inductors and capacitors.
The LTC3809 is available in the tiny footprint thermally enhanced DFN and 10-lead MSOP packages.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation. No R
is a trademark of Linear Technology Corporation.
SENSE
All other trademarks are the property of their respective owners. Protected by U.S. Patents including 5481178, 5929620, 6580258, 6304066, 5847554, 6611131, 6498466. Other Patents pending.
TM
TYPICAL APPLICATIO
High Efficiency, 550kHz Step-Down Converter
LTC3809
PLLLPF
15k
SYNC/MODE
V
FB
I
TH
RUN
GND
IPRG
187k
59k
470pF
V
SW
U
Efficiency and Power Loss vs Load Current
100
V
IN
2.75V TO 9.8V
10µF
IN
TG
BG
2.2µH
47µF
V
2.5V 2A
3809 TA01
OUT
EFFICIENCY (%)
VIN = 3.3V
90
80
70
60
50
1 100 1000 10000
EFFICIENCY
VIN = 5V
10
LOAD CURRENT (mA)
VIN = 4.2V
POWER LOSS V
IN
FIGURE 10 CIRCUIT V
= 4.2V
OUT
= 2.5V
10k
1k
POWER LOSS (mW)
100
10
1
0.1
3809 TA01b
3809fa
1
LTC3809
WW
W
ABSOLUTE MAXIMUM RATINGS
U
(Note 1)
Input Supply Voltage (VIN)........................ –0.3V to 10V
PLLLPF, RUN, SYNC/MODE,
IPRG Voltages .............................. –0.3V to (V
V
, ITH Voltages...................................... –0.3V to 2.4V
FB
+ 0.3V)
IN
SW Voltage ......................... – 2V to VIN + 1V (10V Max)
TG, BG Peak Output Current (<10µs)........................ 1A
U
W
U
PACKAGE/ORDER INFORMATION
TOP VIEW
PLLLPF
1
SYNC/MODE
2
11
3
V
FB
4
I
TH
5
RUN
10-LEAD (3mm × 3mm) PLASTIC DFN
DD PACKAGE
T
= 125°C, θJA = 43°C/W
JMAX
EXPOSED PAD (PIN 11) IS GND (MUST BE SOLDERED TO PCB)
10
SW
V
9
IN
TG
8
7
BG
6
IPRG
ORDER PART
NUMBER
LTC3809EDD
DD PART
MARKING
LBQY
Operating Temperature Range (Note 2)... – 40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Junction Temperature (Note 3)............................ 125°C
Lead Temperature (Soldering, 10 sec)
MSOP Package ................................................. 300°C
ORDER PART
NUMBER
LTC3809EMSE
MSE PART
MARKING
LTBQT
PLLLPF
SYNC/MODE
V
I
RUN
TOP VIEW
1 2 3
FB TH
10-LEAD PLASTIC MSOP
T
JMAX
EXPOSED PAD (PIN 11) IS GND (MUST BE SOLDERED TO PCB)
11 4 5
MSE PACKAGE
= 125°C, θJA = 40°C/W
10 9 8 7 6
SW V
IN
TG BG IPRG
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 4.2V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Main Control Loops
Input DC Supply Current (Note 4) Normal Operation 350 500 µA Sleep Mode 105 150 µA Shutdown RUN = 0V 9 20 µA UVLO V
Undervoltage Lockout Threshold (UVLO) VIN Falling 1.95 2.25 2.55 V
Shutdown Threshold of RUN Pin 0.8 1.1 1.4 V
Regulated Feedback Voltage (Note 5) 0.591 0.6 0.609 V
Output Voltage Line Regulation 2.75V < VIN < 9.8V (Note 5) 0.01 0.04 %/V
Output Voltage Load Regulation ITH = 0.9V (Note 5) 0.1 0.5 %
VFB Input Current (Note 5) 9 50 nA
Overvoltage Protect Threshold Measured at V
= UVLO Threshold – 200mV 3 10 µA
IN
V
Rising 2.15 2.45 2.75 V
IN
I
= 1.7V –0.1 –0.5 %
TH
FB
0.66 0.68 0.7 V
2
3809fa
LTC3809
ELECTRICAL CHARACTERISTICS
The indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 4.2V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Overvoltage Protect Hysteresis 20 mV
Auxiliary Feedback Threshold 0.325 0.4 0.475 V
Top Gate (TG) Drive Rise Time CL = 3000pF 40 ns
Top Gate (TG) Drive Fall Time CL = 3000pF 40 ns
Bottom Gate (BG) Drive Rise Time CL = 3000pF 50 ns
Bottom Gate (BG) Drive Fall Time CL = 3000pF 40 ns Maximum Current Sense Voltage (∆V
+
(SENSE
– SW) IPRG = 0V (Note 6) 70 85 100 mV
Soft-Start Time (Internal) Time for VFB to Ramp from 0.05V to 0.55V 0.5 0.74 0.9 ms
Oscillator and Phase-Locked Loop
Oscillator Frequency Unsynchronized (SYNC/MODE Not Clocked)
Phase-Locked Loop Lock Range SYNC/MODE Clocked
Phase Detector Output Current Sinking f Sourcing f
Spread Spectrum Frequency Range Minimum Switching Frequency 460 kHz
SYNC/MODE Pull-Down Current SYNC/MODE = 2.2V 2.6 µA
SENSE(MAX)
) IPRG = Floating (Note 6) 110 125 140 mV
IPRG = V
PLLLPF = Floating 480 550 600 kHz PLLLPF = 0V 260 300 340 kHz PLLLPF = V
Minimum Synchronizable Frequency 200 250 kHz Maximum Synchronizible Frequency 750 1000 kHz
OSC OSC
Maximum Switching Frequency 635 kHz
(Note 6) 185 204 223 mV
IN
650 750 825 kHz
–3 µA
3 µA
> f
SYNC/MODE
< f
SYNC/MODE
IN
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The LTC3809E is guaranteed to meet specified performance from 0°C to 70°C. Specifications over the –40°C to 85°C operating range are assured by design characterization, and correlation with statistical process controls.
Note 3: T dissipation P
is calculated from the ambient temperature TA and power
J
according to the following formula:
D
T
= TA + (PD • θJA °C/W)
J
Note 4: Dynamic supply current is higher due to gate charge being delivered at the switching frequency.
Note 5: The LTC3809 is tested in a feedback loop that servos I specified voltage and measures the resultant V
Note 6: Peak current sense voltage is reduced dependent on duty cycle to a percentage of value as shown in Figure 1.
voltage.
FB
to a
TH
3809fa
3
LTC3809
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs Load Current Efficiency vs Load Current
100
FIGURE 10 CIRCUIT
95
V
= 3.3V
OUT
90
85
80
V
= 1.8V
75
EFFICIENCY (%)
70
65
60
1 100 1k 10k
OUT
10
LOAD CURRENT (mA)
V
= 2.5V
OUT
V
= 1.2V
OUT
SYNC/MODE = V
VIN = 5V
IN
3809 G01
100
FIGURE 10 CIRCUIT
95
= 5V, V
V
IN
90
85
BURST MODE (SYNC/MODE =
80
V
75
70
EFFICIENCY (%)
65
60
55
50
1 100 1k 10k10
= 2.5V
OUT
)
IN
LOAD CURRENT (mA)
FORCED CONTINUOUS (SYNC/MODE = 0V)
PULSE SKIPPING (SYNC/MODE = 0.6V)
T
= 25°C unless otherwise noted.
A
Maximum Current Sense Voltage vs ITH Pin Voltage
3809 G02
100
80
60
40
20
CURRENT LIMIT (%)
0
–20
Burst Mode OPERATION (I
TH
Burst Mode OPERATION (I
TH
FORCED CONTINUOUS MODE PULSE SKIPPING MODE
0.5
RISING)
FALLING)
1 1.5
ITH VOLTAGE (V)
2
3809 G03
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
Load Step (Burst Mode Operation)
I
L
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = V FIGURE 10 CIRCUIT
100µs/DIV
IN
Load Step (Pulse Skipping Mode)
I
L
3809 G04
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
Load Step (Forced Continuous Mode)
I
L
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = 0V FIGURE 10 CIRCUIT
100µs/DIV
Start-Up with Internal Soft-Start
3809 G05
V
OUT
1.8V
500mV/DIV
4
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = V FIGURE 10 CIRCUIT
FB
100µs/DIV
3809 G06
= 4.2V
V
IN
= 1
R
LOAD
FIGURE 10 CIRCUIT
200µs/DIV
3809 G07
3809fa
UW
TEMPERATURE (°C)
–60
–10
–8
–6
NORMALIZED FREQUENCY (%)
–4
–2
0
4
–20 20
60
100
3809 G13
8
2
6
10
–40 0
40
80
INPUT VOLTAGE (V)
2
70
SLEEP CURRENT (µA)
80
100
46
8
10
3809 G16
120
90
110
130
35
7
9
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3809
TA = 25°C unless otherwise noted.
Regulated Feedback Voltage vs Temperature
0.606
0.604
0.602
0.600
0.598
FEEDBACK VOLTAGE (V)
0.596
0.594 –60
–20 20
–40 0
TEMPERATURE (°C)
60
40
Maximum Current Sense Threshold vs Temperature
135
IPRG = FLOAT
130
125
120
MAXIMUM CURRENT SENSE THRESHOLD (mV)
115
–60
–40 0
–20 20
TEMPERATURE (°C)
40
60
80
80
3809 G11
3809 G08
100
100
Undervoltage Lockout Threshold vs Temperature
2.55
2.50
2.45
2.40
2.35
2.30
INPUT VOLTAGE (V)
2.25
2.20
2.15 –60
–40 0
VIN RISING
VIN FALLING
–20 20
TEMPERATURE (°C)
SYNC/MODE Pull-Down Current vs Temperature
2.80
2.75
2.70
2.65
2.60
2.55
2.50
2.45
SYNC/MODE PULL-DOWN CURRENT (µA)
2.40 –60
–40 0
–20 20
TEMPERATURE (°C)
Shutdown (RUN) Threshold vs Temperature
1.20
1.15
1.10
RUN VOLTAGE (V)
1.05
1.00 –60
–40 0
40
60
80
100
3809 G09
–20 20
TEMPERATURE (°C)
40
60
80
100
3809 G10
Oscillator Frequency vs Temperature
40
60
80
100
3809 G12
Oscillator Frequency vs Input Voltage
5
4
3
2
1
0
–1
–2
–3
NORMALIZED FREQUENCY SHIFT (%)
–4
–5
2
35
46
INPUT VOLTAGE (V)
7
Shutdown Quiescent Current vs Input Voltage
18
16
14
12
10
8
6
4
SHUTDOWN CURRENT (µA)
2
8
9
10
3809 G14
0
2
35
46
INPUT VOLTAGE (V)
7
8
9
10
3809 G15
Sleep Current vs Input Voltage
3809fa
5
LTC3809
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UU
PI FU CTIO S
PLLLPF (Pin 1): Frequency Set/PLL Lowpass Filter. When synchronizing to an external clock, this pin serves as the low pass filter point for the phase-locked loop. Normally, a series RC is connected between this pin and ground.
When not synchronizing to an external clock, this pin serves as the frequency select input. Tying this pin to GND selects 300kHz operation; tying this pin to VIN selects 750kHz operation. Floating this pin selects 550kHz operation.
Connect a 2.2nF capacitor between this pin and GND, and a 1000pF capacitor between this pin and the SYNC/MODE when using spread spectrum modulation operation.
SYNC/MODE (Pin 2): This pin performs four functions: 1) auxiliary winding feedback input, 2) external clock syn­chronization input for phase-locked loop, 3) Burst Mode, pulse skipping or forced continuous mode select, and 4) enable spread spectrum modulation operation in pulse skipping mode. Applying a clock with frequency between 250kHz to 750kHz causes the internal oscillator to phase­lock to the external clock and disables Burst Mode opera­tion but allows pulse skipping at low load currents.
To select Burst Mode operation at light loads, tie this pin to VIN. Grounding this pin selects forced continuous operation, which allows the inductor current to reverse. Tying this pin to VFB selects pulse skipping mode. In these cases, the frequency of the internal oscillator is set by the voltage on the PLLLPF pin. Tying to a voltage between
1.35V to VIN – 0.5V enables spread spectrum modulation operation. In this case, an internal 2.6µA pull-down cur- rent source helps to set the voltage at this pin by tying a resistor with appropriate value between this pin and VIN.
Do not leave this pin floating.
RUN (Pin 5): Run Control Input. Forcing this pin below
1.1V shuts down the chip. Driving this pin to VIN or releasing this pin enables the chip to start-up with the internal soft-start.
IPRG (Pin 6): Three-State Pin to Select Maximum Peak Sense Voltage Threshold. This pin selects the maximum allowed voltage drop between the VIN and SW pins (i.e., the maximum allowed drop across the external P-channel MOSFET). Tie to V or 125mV respectively.
BG (Pin 7): Bottom (NMOS) Gate Drive Output. This pin drives the gate of the external N-channel MOSFET. This pin has an output swing from PGND to V
TG (Pin 8): Top (PMOS) Gate Drive Output. This pin drives the gate of the external P-channel MOSFET. This pin has an output swing from PGND to VIN.
VIN (Pin 9): Chip Signal Power Supply. This pin powers the entire chip, the gate drivers and serves as the positive input to the differential current comparator.
SW (Pin 10): Switch Node Connection to Inductor. This pin is also the negative input to the differential current comparator and an input to the reverse current compara­tor. Normally this pin is connected to the drain of the external P-channel MOSFET, the drain of the external N-channel MOSFET and the inductor.
GND (Pin 11): Exposed Pad. The Exposed Pad is ground and must be soldered to the PCB ground for electrical contact and optimum thermal performance.
, GND or float to select 204mV, 85mV
IN
.
IN
VFB (Pin 3): Feedback Pin. This pin receives the remotely sensed feedback voltage for the controller from an exter­nal resistor divider across the output.
ITH (Pin 4): Current Threshold and Error Amplifier Com­pensation Point. Nominal operating range on this pin is from 0.7V to 2V. The voltage on this pin determines the threshold of the main current comparator.
6
3809fa
LTC3809
U
U
W
FU CTIO AL DIAGRA
V
IN
5
11
2
0.4V
2.6µA
1
RUN
GND
SYNC/MODE
PLLLPF
C
IN
9
V
VOLTAGE
REFERENCE
UNDERVOLTAGE
LOCKOUT
V
IN
0.7µA
t = 1ms INTERNAL SOFT-START
BURST DEFEAT
CLOCK DETECT
IN
V
REF
0.6V
SENSE
V
IN
UVSD
SS
BURSTDIS FCB
PHASE
DETECTOR
V
CO
CLK
SLOPE
+
V
IN
0.3V
+
ICMP
0.15V
IPRG
6
CLK
S
Q
R
+
SLEEP
BURSTDIS
SWITCHING LOGIC AND
BLANKING
CIRCUIT
FCB
OV
I
REV
+
UV
GND
ANTI-SHOOT-
THROUGH
PV
IN
+
+
+ +
EAMP
+
I
REV
RICMP
V
REF
0.6V SS
SW
GND
8
10
7
0.68V
0.54V
V
FB
4
3
TG
SW
BG
I
V
MP
L
C
OUT
MN
TH
R
C
C
C
FB
3809 FD
V
OUT
R
B
R
A
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7
LTC3809
OPERATIO
U
(Refer to Functional Diagram)
Main Control Loop
The LTC3809 uses a constant frequency, current mode architecture. During normal operation, the top external P-channel power MOSFET is turned on when the clock sets the RS latch, and is turned off when the current comparator (ICMP) resets the latch. The peak inductor current at which ICMP resets the RS latch is determined by the voltage on the ITH pin, which is driven by the output of the error amplifier (EAMP). The V voltage feedback signal from an external resistor divider. This feedback signal is compared to the internal 0.6V reference voltage by the EAMP. When the load current increases, it causes a slight decrease in V
0.6V reference, which in turn causes the ITH voltage to increase until the average inductor current matches the new load current. While the top P-channel MOSFET is off, the bottom N-channel MOSFET is turned on until either the inductor current starts to reverse, as indicated by the current reversal comparator IRCMP, or the beginning of the next cycle.
Shutdown and Soft-Start (RUN Pin)
The LTC3809 is shut down by pulling the RUN pin low. In shutdown, all controller functions are disabled and the chip draws only 9µA. The TG output is held high (off) and the BG output low (off) in shutdown. Releasing the RUN pin allows an internal 0.7µA current source to pull up the RUN pin to VIN. The controller is enabled when the RUN pin reaches 1.1V.
The start-up of V internal soft-start. During soft-start, the error amplifier EAMP compares the feedback signal VFB to the internal soft-start ramp (instead of the 0.6V reference), which rises linearly from 0V to 0.6V in about 1ms. This allows the output voltage to rise smoothly from 0V to its final value while maintaining control of the inductor current.
is controlled by the LTC3809’s
OUT
pin receives the output
FB
relative to the
FB
Light Load Operation (Burst Mode Operation, Continuous Conduction or Pulse Skipping Mode) (SYNC/MODE Pin)
The LTC3809 can be programmed for either high effi­ciency Burst Mode operation, forced continuous conduc­tion mode or pulse skipping mode at low load currents. To select Burst Mode operation, tie the SYNC/MODE pin to VIN. To select forced continuous operation, tie the SYNC/ MODE pin to a DC voltage below 0.4V (e.g., GND). Tying the SYNC/MODE to a DC voltage above 0.4V and below
1.2V (e.g., VFB) enables pulse skipping mode. The 0.4V threshold between forced continuous operation and pulse skipping mode can be used in secondary winding regula­tion as described in the Auxiliary Winding Control Using SYNC/MODE Pin discussion in the Applications Informa­tion section.
When the LTC3809 is in Burst Mode operation, the peak current in the inductor is set to approximately one-fourth of the maximum sense voltage even though the voltage on the ITH pin indicates a lower value. If the average inductor current is higher than the load current, the EAMP will decrease the voltage on the ITH pin. When the ITH voltage drops below 0.85V, the internal SLEEP signal goes high and the external MOSFET is turned off.
In sleep mode, much of the internal circuitry is turned off, reducing the quiescent current that the LTC3809 draws. The load current is supplied by the output capacitor. As the output voltage decreases, the EAMP increases the I voltage. When the ITH voltage reaches 0.925V, the SLEEP signal goes low and the controller resumes normal opera­tion by turning on the external P-channel MOSFET on the next cycle of the internal oscillator.
When the controller is enabled for Burst Mode or pulse skipping operation, the inductor current is not allowed to reverse. Hence, the controller operates discontinuously.
TH
8
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