The LTC®3809 is a synchronous step-down switching
regulator controller that drives external complementary
power MOSFETs using few external components. The
constant frequency current mode architecture with MOSFET
sensing eliminates the need for a current sense
V
DS
resistor and improves efficiency.
For noise sensitive applications, the LTC3809 can be externally synchronized from 250kHz to 750kHz. Burst Mode
is inhibited during synchronization or when the SYNC/
MODE pin is pulled low to reduce noise and RF interference.
To further reduce EMI, the LTC3809 incorporates a novel
spread spectrum frequency modulation technique.
Burst Mode operation provides high efficiency operation at
light loads. 100% duty cycle provides low dropout operation, extending operating time in battery-powered systems.
The switching frequency can be programmed up to 750kHz,
allowing the use of small surface mount inductors and
capacitors.
The LTC3809 is available in the tiny footprint thermally
enhanced DFN and 10-lead MSOP packages.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
No R
is a trademark of Linear Technology Corporation.
SENSE
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 5481178, 5929620, 6580258, 6304066, 5847554,
6611131, 6498466. Other Patents pending.
TM
TYPICAL APPLICATIO
High Efficiency, 550kHz Step-Down Converter
LTC3809
PLLLPF
15k
SYNC/MODE
V
FB
I
TH
RUN
GND
IPRG
187k
59k
470pF
V
SW
U
Efficiency and Power Loss vs Load Current
100
V
IN
2.75V TO 9.8V
10µF
IN
TG
BG
2.2µH
47µF
V
2.5V
2A
3809 TA01
OUT
EFFICIENCY (%)
VIN = 3.3V
90
80
70
60
50
1100100010000
EFFICIENCY
VIN = 5V
10
LOAD CURRENT (mA)
VIN = 4.2V
POWER LOSS
V
IN
FIGURE 10 CIRCUIT
V
= 4.2V
OUT
= 2.5V
10k
1k
POWER LOSS (mW)
100
10
1
0.1
3809 TA01b
3809fa
1
LTC3809
WW
W
ABSOLUTE MAXIMUM RATINGS
U
(Note 1)
Input Supply Voltage (VIN)........................ –0.3V to 10V
PLLLPF, RUN, SYNC/MODE,
IPRG Voltages .............................. –0.3V to (V
V
, ITH Voltages...................................... –0.3V to 2.4V
FB
+ 0.3V)
IN
SW Voltage ......................... – 2V to VIN + 1V (10V Max)
TG, BG Peak Output Current (<10µs)........................ 1A
U
W
U
PACKAGE/ORDER INFORMATION
TOP VIEW
PLLLPF
1
SYNC/MODE
2
11
3
V
FB
4
I
TH
5
RUN
10-LEAD (3mm × 3mm) PLASTIC DFN
DD PACKAGE
T
= 125°C, θJA = 43°C/W
JMAX
EXPOSED PAD (PIN 11) IS GND
(MUST BE SOLDERED TO PCB)
10
SW
V
9
IN
TG
8
7
BG
6
IPRG
ORDER PART
NUMBER
LTC3809EDD
DD PART
MARKING
LBQY
Operating Temperature Range (Note 2)... – 40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Junction Temperature (Note 3)............................ 125°C
Output Voltage Line Regulation2.75V < VIN < 9.8V (Note 5)0.010.04%/V
Output Voltage Load RegulationITH = 0.9V (Note 5) 0.10.5%
VFB Input Current(Note 5)950nA
Overvoltage Protect ThresholdMeasured at V
= UVLO Threshold – 200mV310µA
IN
V
Rising●2.152.452.75V
IN
I
= 1.7V–0.1–0.5%
TH
FB
0.660.680.7V
2
3809fa
LTC3809
ELECTRICAL CHARACTERISTICS
The ● indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 4.2V unless otherwise noted.
PARAMETERCONDITIONSMINTYPMAXUNITS
Overvoltage Protect Hysteresis20mV
Auxiliary Feedback Threshold0.3250.40.475V
Top Gate (TG) Drive Rise TimeCL = 3000pF40ns
Top Gate (TG) Drive Fall TimeCL = 3000pF40ns
Bottom Gate (BG) Drive Rise TimeCL = 3000pF50ns
Bottom Gate (BG) Drive Fall TimeCL = 3000pF40ns
Maximum Current Sense Voltage (∆V
+
(SENSE
– SW)IPRG = 0V (Note 6)●7085100mV
Soft-Start Time (Internal)Time for VFB to Ramp from 0.05V to 0.55V0.50.740.9ms
Oscillator and Phase-Locked Loop
Oscillator FrequencyUnsynchronized (SYNC/MODE Not Clocked)
Phase-Locked Loop Lock RangeSYNC/MODE Clocked
Phase Detector Output Current
Sinkingf
Sourcingf
Spread Spectrum Frequency RangeMinimum Switching Frequency460kHz
SYNC/MODE Pull-Down CurrentSYNC/MODE = 2.2V2.6µA
SENSE(MAX)
)IPRG = Floating (Note 6)●110125140mV
IPRG = V
PLLLPF = Floating480550600kHz
PLLLPF = 0V260300340kHz
PLLLPF = V
Minimum Synchronizable Frequency200250kHz
Maximum Synchronizible Frequency7501000kHz
OSC
OSC
Maximum Switching Frequency635kHz
(Note 6)●185204223mV
IN
650750825kHz
–3µA
3µA
> f
SYNC/MODE
< f
SYNC/MODE
IN
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC3809E is guaranteed to meet specified performance from
0°C to 70°C. Specifications over the –40°C to 85°C operating range are
assured by design characterization, and correlation with statistical process
controls.
Note 3: T
dissipation P
is calculated from the ambient temperature TA and power
J
according to the following formula:
D
T
= TA + (PD • θJA °C/W)
J
Note 4: Dynamic supply current is higher due to gate charge being
delivered at the switching frequency.
Note 5: The LTC3809 is tested in a feedback loop that servos I
specified voltage and measures the resultant V
Note 6: Peak current sense voltage is reduced dependent on duty cycle to
a percentage of value as shown in Figure 1.
voltage.
FB
to a
TH
3809fa
3
LTC3809
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs Load CurrentEfficiency vs Load Current
100
FIGURE 10 CIRCUIT
95
V
= 3.3V
OUT
90
85
80
V
= 1.8V
75
EFFICIENCY (%)
70
65
60
11001k10k
OUT
10
LOAD CURRENT (mA)
V
= 2.5V
OUT
V
= 1.2V
OUT
SYNC/MODE = V
VIN = 5V
IN
3809 G01
100
FIGURE 10 CIRCUIT
95
= 5V, V
V
IN
90
85
BURST MODE
(SYNC/MODE =
80
V
75
70
EFFICIENCY (%)
65
60
55
50
11001k10k10
= 2.5V
OUT
)
IN
LOAD CURRENT (mA)
FORCED
CONTINUOUS
(SYNC/MODE = 0V)
PULSE SKIPPING
(SYNC/MODE = 0.6V)
T
= 25°C unless otherwise noted.
A
Maximum Current Sense Voltage
vs ITH Pin Voltage
3809 G02
100
80
60
40
20
CURRENT LIMIT (%)
0
–20
Burst Mode OPERATION
(I
TH
Burst Mode OPERATION
(I
TH
FORCED CONTINUOUS
MODE
PULSE SKIPPING
MODE
0.5
RISING)
FALLING)
11.5
ITH VOLTAGE (V)
2
3809 G03
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
Load Step
(Burst Mode Operation)
I
L
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = V
FIGURE 10 CIRCUIT
100µs/DIV
IN
Load Step (Pulse Skipping Mode)
I
L
3809 G04
V
OUT
200mV/DIV
AC COUPLED
2A/DIV
Load Step
(Forced Continuous Mode)
I
L
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = 0V
FIGURE 10 CIRCUIT
100µs/DIV
Start-Up with Internal Soft-Start
3809 G05
V
OUT
1.8V
500mV/DIV
4
V
= 3.3V
IN
= 1.8V
V
OUT
= 300mA TO 3A
I
LOAD
SYNC/MODE = V
FIGURE 10 CIRCUIT
FB
100µs/DIV
3809 G06
= 4.2V
V
IN
= 1Ω
R
LOAD
FIGURE 10 CIRCUIT
200µs/DIV
3809 G07
3809fa
UW
TEMPERATURE (°C)
–60
–10
–8
–6
NORMALIZED FREQUENCY (%)
–4
–2
0
4
–2020
60
100
3809 G13
8
2
6
10
–400
40
80
INPUT VOLTAGE (V)
2
70
SLEEP CURRENT (µA)
80
100
46
8
10
3809 G16
120
90
110
130
35
7
9
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3809
TA = 25°C unless otherwise noted.
Regulated Feedback Voltage
vs Temperature
0.606
0.604
0.602
0.600
0.598
FEEDBACK VOLTAGE (V)
0.596
0.594
–60
–2020
–400
TEMPERATURE (°C)
60
40
Maximum Current Sense
Threshold vs Temperature
135
IPRG = FLOAT
130
125
120
MAXIMUM CURRENT SENSE THRESHOLD (mV)
115
–60
–400
–2020
TEMPERATURE (°C)
40
60
80
80
3809 G11
3809 G08
100
100
Undervoltage Lockout Threshold
vs Temperature
2.55
2.50
2.45
2.40
2.35
2.30
INPUT VOLTAGE (V)
2.25
2.20
2.15
–60
–400
VIN RISING
VIN FALLING
–2020
TEMPERATURE (°C)
SYNC/MODE Pull-Down Current
vs Temperature
2.80
2.75
2.70
2.65
2.60
2.55
2.50
2.45
SYNC/MODE PULL-DOWN CURRENT (µA)
2.40
–60
–400
–2020
TEMPERATURE (°C)
Shutdown (RUN) Threshold
vs Temperature
1.20
1.15
1.10
RUN VOLTAGE (V)
1.05
1.00
–60
–400
40
60
80
100
3809 G09
–2020
TEMPERATURE (°C)
40
60
80
100
3809 G10
Oscillator Frequency
vs Temperature
40
60
80
100
3809 G12
Oscillator Frequency
vs Input Voltage
5
4
3
2
1
0
–1
–2
–3
NORMALIZED FREQUENCY SHIFT (%)
–4
–5
2
35
46
INPUT VOLTAGE (V)
7
Shutdown Quiescent Current
vs Input Voltage
18
16
14
12
10
8
6
4
SHUTDOWN CURRENT (µA)
2
8
9
10
3809 G14
0
2
35
46
INPUT VOLTAGE (V)
7
8
9
10
3809 G15
Sleep Current vs Input Voltage
3809fa
5
LTC3809
U
UU
PI FU CTIO S
PLLLPF (Pin 1): Frequency Set/PLL Lowpass Filter. When
synchronizing to an external clock, this pin serves as the
low pass filter point for the phase-locked loop. Normally,
a series RC is connected between this pin and ground.
When not synchronizing to an external clock, this pin serves
as the frequency select input. Tying this pin to GND selects
300kHz operation; tying this pin to VIN selects 750kHz
operation. Floating this pin selects 550kHz operation.
Connect a 2.2nF capacitor between this pin and GND, and
a 1000pF capacitor between this pin and the SYNC/MODE
when using spread spectrum modulation operation.
SYNC/MODE (Pin 2): This pin performs four functions: 1)
auxiliary winding feedback input, 2) external clock synchronization input for phase-locked loop, 3) Burst Mode,
pulse skipping or forced continuous mode select, and 4)
enable spread spectrum modulation operation in pulse
skipping mode. Applying a clock with frequency between
250kHz to 750kHz causes the internal oscillator to phaselock to the external clock and disables Burst Mode operation but allows pulse skipping at low load currents.
To select Burst Mode operation at light loads, tie this pin
to VIN. Grounding this pin selects forced continuous
operation, which allows the inductor current to reverse.
Tying this pin to VFB selects pulse skipping mode. In these
cases, the frequency of the internal oscillator is set by the
voltage on the PLLLPF pin. Tying to a voltage between
1.35V to VIN – 0.5V enables spread spectrum modulation
operation. In this case, an internal 2.6µA pull-down cur-
rent source helps to set the voltage at this pin by tying a
resistor with appropriate value between this pin and VIN.
Do not leave this pin floating.
RUN (Pin 5): Run Control Input. Forcing this pin below
1.1V shuts down the chip. Driving this pin to VIN or
releasing this pin enables the chip to start-up with the
internal soft-start.
IPRG (Pin 6): Three-State Pin to Select Maximum Peak
Sense Voltage Threshold. This pin selects the maximum
allowed voltage drop between the VIN and SW pins (i.e.,
the maximum allowed drop across the external P-channel
MOSFET). Tie to V
or 125mV respectively.
BG (Pin 7): Bottom (NMOS) Gate Drive Output. This pin
drives the gate of the external N-channel MOSFET. This pin
has an output swing from PGND to V
TG (Pin 8): Top (PMOS) Gate Drive Output. This pin drives
the gate of the external P-channel MOSFET. This pin has an
output swing from PGND to VIN.
VIN (Pin 9): Chip Signal Power Supply. This pin powers the
entire chip, the gate drivers and serves as the positive
input to the differential current comparator.
SW (Pin 10): Switch Node Connection to Inductor. This
pin is also the negative input to the differential current
comparator and an input to the reverse current comparator. Normally this pin is connected to the drain of the
external P-channel MOSFET, the drain of the external
N-channel MOSFET and the inductor.
GND (Pin 11): Exposed Pad. The Exposed Pad is ground
and must be soldered to the PCB ground for electrical
contact and optimum thermal performance.
, GND or float to select 204mV, 85mV
IN
.
IN
VFB (Pin 3): Feedback Pin. This pin receives the remotely
sensed feedback voltage for the controller from an external resistor divider across the output.
ITH (Pin 4): Current Threshold and Error Amplifier Compensation Point. Nominal operating range on this pin is
from 0.7V to 2V. The voltage on this pin determines the
threshold of the main current comparator.
6
3809fa
LTC3809
U
U
W
FU CTIO AL DIAGRA
V
IN
5
11
2
0.4V
2.6µA
1
RUN
GND
SYNC/MODE
PLLLPF
C
IN
9
V
VOLTAGE
REFERENCE
UNDERVOLTAGE
LOCKOUT
V
IN
0.7µA
t = 1ms
INTERNAL
SOFT-START
BURST DEFEAT
CLOCK DETECT
IN
V
REF
0.6V
SENSE
V
IN
UVSD
SS
BURSTDIS
FCB
PHASE
DETECTOR
V
CO
CLK
SLOPE
+
V
IN
0.3V
+
–
ICMP
0.15V
IPRG
6
CLK
S
Q
R
+
–
SLEEP
BURSTDIS
SWITCHING
LOGIC AND
BLANKING
CIRCUIT
FCB
OV
I
REV
+
UV
–
GND
ANTI-SHOOT-
THROUGH
PV
IN
+
–
+
–
+
+
EAMP
–
+
I
REV
RICMP
–
V
REF
0.6V
SS
SW
GND
8
10
7
0.68V
0.54V
V
FB
4
3
TG
SW
BG
I
V
MP
L
C
OUT
MN
TH
R
C
C
C
FB
3809 FD
V
OUT
R
B
R
A
3809fa
7
LTC3809
OPERATIO
U
(Refer to Functional Diagram)
Main Control Loop
The LTC3809 uses a constant frequency, current mode
architecture. During normal operation, the top external
P-channel power MOSFET is turned on when the clock
sets the RS latch, and is turned off when the current
comparator (ICMP) resets the latch. The peak inductor
current at which ICMP resets the RS latch is determined by
the voltage on the ITH pin, which is driven by the output of
the error amplifier (EAMP). The V
voltage feedback signal from an external resistor divider.
This feedback signal is compared to the internal 0.6V
reference voltage by the EAMP. When the load current
increases, it causes a slight decrease in V
0.6V reference, which in turn causes the ITH voltage to
increase until the average inductor current matches the
new load current. While the top P-channel MOSFET is off,
the bottom N-channel MOSFET is turned on until either the
inductor current starts to reverse, as indicated by the
current reversal comparator IRCMP, or the beginning of
the next cycle.
Shutdown and Soft-Start (RUN Pin)
The LTC3809 is shut down by pulling the RUN pin low. In
shutdown, all controller functions are disabled and the
chip draws only 9µA. The TG output is held high (off) and
the BG output low (off) in shutdown. Releasing the RUN
pin allows an internal 0.7µA current source to pull up the
RUN pin to VIN. The controller is enabled when the RUN pin
reaches 1.1V.
The start-up of V
internal soft-start. During soft-start, the error amplifier
EAMP compares the feedback signal VFB to the internal
soft-start ramp (instead of the 0.6V reference), which
rises linearly from 0V to 0.6V in about 1ms. This allows
the output voltage to rise smoothly from 0V to its final
value while maintaining control of the inductor current.
The LTC3809 can be programmed for either high efficiency Burst Mode operation, forced continuous conduction mode or pulse skipping mode at low load currents. To
select Burst Mode operation, tie the SYNC/MODE pin to
VIN. To select forced continuous operation, tie the SYNC/
MODE pin to a DC voltage below 0.4V (e.g., GND). Tying
the SYNC/MODE to a DC voltage above 0.4V and below
1.2V (e.g., VFB) enables pulse skipping mode. The 0.4V
threshold between forced continuous operation and pulse
skipping mode can be used in secondary winding regulation as described in the Auxiliary Winding Control Using
SYNC/MODE Pin discussion in the Applications Information section.
When the LTC3809 is in Burst Mode operation, the peak
current in the inductor is set to approximately one-fourth
of the maximum sense voltage even though the voltage on
the ITH pin indicates a lower value. If the average inductor
current is higher than the load current, the EAMP will
decrease the voltage on the ITH pin. When the ITH voltage
drops below 0.85V, the internal SLEEP signal goes high
and the external MOSFET is turned off.
In sleep mode, much of the internal circuitry is turned off,
reducing the quiescent current that the LTC3809 draws.
The load current is supplied by the output capacitor. As the
output voltage decreases, the EAMP increases the I
voltage. When the ITH voltage reaches 0.925V, the SLEEP
signal goes low and the controller resumes normal operation by turning on the external P-channel MOSFET on the
next cycle of the internal oscillator.
When the controller is enabled for Burst Mode or pulse
skipping operation, the inductor current is not allowed to
reverse. Hence, the controller operates discontinuously.
TH
8
3809fa
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