3-Phase Current Mode Controller with
Onboard MOSFET Drivers
■
±5% Output Current Matching Optimizes Thermal
Performance and Size of Inductors and MOSFETs
■
4.5V ≤ VCC ≤ 7V; 4.5V ≤ VIN ≤ 32V
■
Differential Amplifier Accurately Senses V
■
Reduced Input and Output Capacitance
■
Reduced Power Supply Induced Noise
■
VID DAC Programmable from 1.1V to 1.85V
OUT
(VRM9.0/9.1)
■
±10% Power Good Output Indicator
■
250kHz to 600kHz Per Phase, PLL, Fixed Frequency
■
PWM, Stage SheddingTM or Burst Mode® Operation
■
OPTI-LOOP® Compensation Minimizes C
■
Adjustable Soft-Start Current Ramping
■
Short-Circuit Shutdown Timer with Defeat Option
■
Overvoltage Soft Latch
■
Small 36-Lead Narrow (0.209") SSOP Package
■
QFN 5mm × 7mm 38-Lead Package
U
OUT
APPLICATIO S
■
Desktop Computers
■
High Performance Notebook Computers
■
High Output Current DC/DC Power Supplies
LTC3732
3-Phase, 5-Bit VID,
600kHz, Synchronous Buck
Switching Regulator Controller
U
DESCRIPTIO
The LTC®3732 is a PolyPhase® synchronous step-down
switching regulator controller that drives all N-channel
external power MOSFET stages in a phase-lockable fixed
frequency architecture. The 3-phase controller drives its
output stages with 120° phase separation at frequencies
of up to 600kHz per phase to minimize the RMS current
losses in both the input and output filter capacitors. The 3phase technique effectively triples the fundamental frequency, improving transient response while operating
each controller at an optimal frequency for high efficiency
and ease of thermal design. Light load efficiency is optimized by using a choice of output Stage Shedding or Burst
Mode technology.
A differential amplifier provides true remote sensing of both
the high and low side of the output voltage at load points.
Soft-start and a defeatable, timed short-circuit shutdown
protect the MOSFETs and the load. A foldback current
circuit also provides protection for the external MOSFETs
under short-circuit or overload conditions.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode, OPTI-LOOP and PolyPhase are registered trademarks of Linear Technology
Corporation. Stage Shedding is a trademark of Linear Technology Corporation
TYPICAL APPLICATIO
V
CC
4.5V TO 7V
POWER GOOD INDICATOR
OPTIONAL SYNC IN
U
LTC3732
SW1
SENSE1
SENSE1
SW2
PGND
SENSE2
SENSE2
SW3
SENSE3
SENSE3
TG1V
BG1
TG2
BG2
TG3
BG3
1µH
0.003Ω
+
–
V
IN
1µH
0.003Ω
+
–
V
IN
1µH
0.003Ω
+
–
+
+
0.1µF
100pF
CC
BOOST1
BOOST2
BOOST3
PGOOD
PLLIN
PLLFLTR
VID0-VID4
I
TH
RUN/SS
SGND
EAIN
–
IN
+
IN
10µF
0.1µF
SW3 SW2 SW1
5 VID BITS
680pF
5k
Figure 1. High Current Triple Phase Step-Down Converter
22µF
35V
V
OUT
1.1V TO 1.85V
55A
C
OUT
470µF
4V
3732 F01
V
IN
5V TO 28V
3732f
1
LTC3732
WWWU
ABSOLUTE AXI U RATI GS
(Note 1)
Topside Driver Voltages (BOOSTN)............38V to –0.3V
Switch Voltage (SWN)...................................32V to –5V
Boosted Driver Voltage (BOOSTN – SWN)....7V to –0.3V
Peak Output Current <1ms (TGN, BGN) ..................... 5A
Supply Voltage (VCC), PGOOD
Pin Voltage .................................................. 7V to –0.3V
RUN/SS, PLLFLTR, PLLIN, FCB Voltages .. VCC to –0.3V
ITH Voltage................................................2.4V to –0.3V
Differential Gain0.9951.0001.005V/V
Input Offset VoltageIN+ = IN
–
= 1.2V, I
= 1mA,0.55mV
OUT
Input Referred; Gain = 1
CMCommon Mode Input Voltage Range0V
+
CMRRCommon Mode Rejection Ratio0V < IN
I
CL
GBPGain Bandwidth ProductI
Output Current1040mA
= 1mA2MHz
OUT
= IN
–
< 5V, I
= 1mA, Input Referred5070dB
OUT
CC
SRSlew RateRL = 2k5V/µs
V
O(MAX)
R
IN
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired. A maximum current of 200µA is allowed to
pull-up the RUN/SS pin to prevent overcurrent shutdown.
Note 2: TJ is calculated from the ambient temperature TA and power
dissipation P
LTC3732CG: TJ = TA + (PD × 95°C/W)
LTC3732CUHF: T
Note 3: The IC is tested in a feedback loop that includes the differential
amplifier in a unity-gain configuration loaded with 100µA to ground driving
the VID DAC into the error amplifier and servoing the resultant voltage to
the midrange point for the error amplifier (V
Maximum High Output VoltageI
= 1mAV
OUT
– 1.2 V
CC
–␣ 0.8V
CC
Input ResistanceMeasured at IN+ Pin80kΩ
Note 4: Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency. See Applications Information.
Note 5: The minimum on-time condition corresponds to an inductor peak-
according to the following formula:
D
= TA + (PD × 34°C/W)
J
to-peak ripple current of ≥40% of I
considerations in the Applications Information Section).
Note 6: ATTEN
specification is in addition to the output voltage
ERR
accuracy specified at VID code = 11111.
(see minimum on-time
MAX
Note 7: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
ITH
= 1.2V).
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
V
4
3732f
UW
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3732
Efficiency vs I
100
V
= OPEN
FCB
90
V
= 5V
FCB
80
70
60
50
40
EFFICIENCY (%)
30
20
10
0
0.1
V
= 0V
FCB
INDUCTOR CURRENT (A)
Reference Voltage vs
Temperature
610
605
600
(Figure 14)
OUT
VIN = 8V
= 1.5V
V
OUT
110100
3732 G01
Efficiency vs V
100
95
90
85
80
75
70
EFFICIENCY (%)
65
60
55
50
0
IL = 50A
5
Error Amplifier gm vs
Temperature
6.0
5.5
(mmho)
m
5.0
(Figure 14)
IN
IL = 20A
10
VIN (V)
15
V
= 1.5V
OUT
f = 250kHz
20
3732 G02
Efficiency vs Frequency (Figure 14)
100
95
VIN = 5V
90
VIN = 12V
85
EFFICIENCY (%)
VIN = 20V
80
25
75
200
Maximum I
300
FREQUENCY (kHz)
SENSE
I
LOAD
V
OUT
VIN = 8V
400
500
Threshold vs
= 20A
= 1.5V
3732 G03
600
Temperature
85
80
VO = 1.8V
THRESHOLD (mV)
75
SENSE
VO = 0.6V
595
REFERENCE VOLTAGE (mV)
590
–301050
–50
–10
TEMPERATURE (°C)
30
70
90
110
3732 G04
4.5
ERROR AMPLIFIER g
4.0
–300
–45
–15
15
TEMPERATURE (°C)
Oscillator Frequency vs
TemperatureOscillator Frequency vs V
700
V
PLLFLTR
600
500
400
V
PLLFLTR
300
FREQUENCY (kHz)
200
V
PLLFLTR
100
0
–300
–45–15
= 2.4V
= 1.2V
= 0V
15
TEMPERATURE (°C)
V
= 5V
PLLFLTR
60
3090
75
45
3732 G07
700
600
500
400
300
FREQUENCY (kHz)
200
100
0
0.61.22.4
01.8
V
60
3090
45
PLLFLTR
PLLFLTR
75
3732 G05
3732 G08
70
MAXIMUM I
65
–300
–45–15
TEMPERATURE (°C)
3090
15
Undervoltage Reset Voltage vs
Temperature
5
4
3
2
UNDER VOLTAGE RESET (V)
1
0
–300
–45–15
TEMPERATURE (°C)
3090
15
60
75
45
3732 G06
60
45
75
3732 G09
3732f
5
LTC3732
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Short-Circuit Arming and Latchoff
vs TemperatureSupply Current vs Temperature
Shed Mode at 1Amp, Light Load
Current (Circuit of Figure 14)
3732 G18
135
90
PHASE (DEG)
45
0
–45
–90
–135
GAIN (dB)
–12
–15
V
OUT
AC, 20mV/DIV
V
SW1
10V/DIV
V
SW2
10V/DIV
V
SW3
10V/DIV
–3
–6
–9
0001
0.01
0.1
FREQUENCY (MHz)
1
Burst Mode at 1Amp, Light Load
Current (Circuit of Figure 14)
3732 G19
10
–45
–90
–135
–180
–225
PHASE (DEG)
V
OUT
AC, 20mV/DIV
V
SW1
10V/DIV
V
SW2
10V/DIV
V
SW3
10V/DIV
= 12V
V
IN
V
= 1.5V
OUT
= V
V
FCB
CC
FREQUENCY = 250kHz
4µs/DIV4µs/DIV
3732 G20
Continuous Mode at 1Amp, Light
Load Current (Circuit of Figure 14)
VIN = 12V
V
= 1.5V
OUT
V
= 0V
FCB
FREQUENCY = 250kHz
4µs/DIV20µs/DIV
3732 G223732 G23
V
OUT
AC, 20mV/DIV
20A/DIV
= 12V
V
IN
V
= 1.5V
OUT
= OPEN
V
FCB
FREQUENCY = 250kHz
3732 G21
Transient Load Current Response: 0Amp
to 50Amp (Circuit of Figure 14)
I
L
= 12V
V
IN
V
= 1.5V
OUT
V
= V
FCB
CC
FREQUENCY = 250kHz
3732f
7
LTC3732
U
UU
PI FU CTIO S
VID0 to VID4: Output Voltage Programming Input Pins. A
3µA internal pull-up current is provided on each input pin.
See Table 1 for details. Do not apply voltage to these pins
prior to the application of voltage on the VCC pin.
PLLIN: Synchronization Input to Phase Detector. This pin
is internally terminated to SGND with 50kΩ. The phaselocked loop will force the rising top gate signal of controller 1 to be synchronized with the rising edge of the PLLIN
signal.
PLLFLTR: The phase-locked loop’s lowpass filter is tied to
this pin. Alternatively, this pin can be driven with an AC or
DC voltage source to vary the frequency of the internal
oscillator. (Do not apply voltage directly to this pin prior to
the application of voltage on the VCC pin.)
FCB: Forced Continuous Control Input. The voltage applied to this pin sets the operating mode of the controller.
The forced continuous current mode is active when the
applied voltage is less than 0.6V. Burst Mode operation
will be active when the pin is allowed to float and a stage
shedding mode will be active if the pin is tied to the VCC pin.
(Do not apply voltage directly to this pin prior to the
application of voltage on the VCC pin.)
IN+, IN–: Inputs to a precision, unity-gain differential
amplifier with internal precision resistors. This provides
true remote sensing of both the positive and negative load
terminals for precise output voltage control.
DIFFOUT: Output of the Remote Output Voltage Sensing
Differential Amplifier.
EAIN: This is the input to the error amplifier which compares the VID divided, feedback voltage to the internal
0.6V reference voltage.
PADDLE (UHF Package Only): This pin is connected to
the heat spreading metal pad at the center of the package
bottom and is tied to the IC’s substrate. It must be
connected to the SGND pin.
SGND: Signal Ground. This pin must be routed separately
under the IC to the PGND pin and then to the main ground
plane.
SENSE1+, SENSE2+, SENSE3+, SENSE1–, SENSE2–,
SENSE3–: The Inputs to Each Differential Current Com-
parator. The ITH pin voltage and built-in offsets between
SENSE– and SENSE+ pins, in conjunction with R
the current trip threshold level.
SENSE
, set
RUN/SS: Combination of Soft-Start, Run Control Input
and Short-Circuit Detection Timer. A capacitor to ground
at this pin sets the ramp time to full current output as well
as the time delay prior to an output voltage short-circuit
shutdown. A minimum value of 0.01µF is recommended
on this pin.
ITH: Error Amplifier Output and Switching Regulator Compensation Point. All three current comparator’s thresholds
increase with this control voltage.
PGND: Driver Power Ground. This pin connects directly to
the sources of the bottom N-channel external MOSFETs
and the (–) terminals of CIN.
BG1 to BG3: High Current Gate Drives for Bottom NChannel MOSFETs. Voltage swing at these pins is from
ground to VCC.
VCC: Main Supply Pin. Because this pin supplies both the
controller circuit power as well as the high power pulses
supplied to drive the external MOSFET gates, this pin
needs to be very carefully and closely decoupled to the IC’s
PGND pin.
DRVCC (UHF Package Only): This pin provides power to
the bottom MOSFET on-chip drivers. Tie this pin to the V
pin and carefully decouple this pin to the PGND pin with a
minimum of 5µF of ceramic capacitance immediately
adjacent to the IC package.
SW1 to SW3: Switch Node Connections to Inductors.
Voltage swing at these pins is from a Schottky diode
(external) voltage drop below ground to VIN (where V
the external MOSFET supply rail).
TG1 to TG3: High Current Gate Drives for Top N-channel
MOSFETs. These are the outputs of floating drivers with a
voltage swing equal to the boost voltage source superimposed on the switch node voltage SW.
BOOST1 to BOOST3: Positive Supply Pins to the Topside
Floating Drivers. Bootstrapped capacitors, charged with
external Schottky diodes and a boost voltage source, are
connected between the BOOST and SW pins. Voltage
swing at the BOOST pins is from boost source voltage
(typically VCC) to this boost source voltage + VIN (where
V
is the external MOSFET supply rail).
IN
PGOOD: This open-drain output is pulled low when the
output voltage has been outside the PGOOD tolerance
window for the V
delay of approximately 100µs.
PGDLY
IN
CC
is
8
3732f
LTC3732
U
U
W
FU CTIO AL DIAGRA
F
IN
R
C
PGOOD
PLLIN
PLLFLTR
LP
LP
FCB
0.6V
100µs
DELAY
–
IN
+
IN
DIFFOUT
EAIN
0.600V
0.660V
I
TH
C
C
R
C
VID0 VID1 VID2 VID3 VID4
PHASE DET
50k
OSCILLATOR
+
–
PROTECTION
R1
20k
V
FB
–
EA
+
+
–
5-BIT VID DECODER
FCB
40k40k
–
A1
+
40k40k
OV
R2 VARIABLE
CLK1
CLK2
CLK3
–
+
–
+
0.66V
EAIN
0.54V
LATCH
DUPLICATE FOR SECOND AND THIRD
CONTROLLER CHANNELS
BOOST
DROP
OUT
DET
BOT
+
–
+–
B
+–
3mV
SHED
RUN
SOFT-
START
FORCE BOT
FCB
SHDN
–
+
54k54k
INTERNAL
I
2.4V
SUPPLY
6V
5(VFB)
1.5µA
SLOPE
COMP
CLAMP
SRQ
I
1
SS
5(V
Q
0.55V
–
+
SHDN
RST
FCB
)
FB
RS
V
CC
SWITCH
LOGIC
2
0.600V
UV/ OVERTEMP
TOP
VCC/DRVCC*
BOT
RESET
TG
SW
BG
PGND
V
CC
SENSE
36k
SENSE
36k
V
REF
V
SGND
RUN/SS
V
CC
+
R
SENSE
–
V
CC
CC
+
V
IN
D
B
C
B
L
+
C
IN
C
OUT
+
V
OUT
C
CC
C
SS
Figure 2
U
OPERATIO
Main Control Loop
The IC uses a constant frequency, current mode stepdown architecture. During normal operation, each top
MOSFET is turned on each cycle when the oscillator sets
the RS latch, and turned off when the main current
comparator, I1, resets each RS latch. The peak inductor
(Refer to Functional Diagram)
3732 F02
* UHF PACKAGE CONNECTION
current at which I1 resets the RS latch is controlled by the
voltage on the I
pin, which is the output of the error
TH
amplifier EA. The EAIN pin receives a portion of this
voltage feedback signal via the DIFFOUT pin through the
internal VID DAC and is compared to the internal reference
3732f
9
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