Datasheet LTC3728 Datasheet (LINEAR TECHNOLOGY)

CHANGE NOTIFICATION
Linear Technology Corporation
(408) 432-1900
August 15, 2008
Dear Sir/Madam: Subject: Please be advised that Linear Technology Corporation has made a minor change to the LTC3728
datasheet to more accurately reflect the device performance and optimize limits. The changes are shown on the attached page of the marked up datasheet. There was no change made to the die. The product shipped after September 15, 2008 will be tested to the new limits.
Should you have any further questions, please feel free to contact me at (408)-432-1900 ext. 2519, or by e-mail at NGIRN@linear.com. If I do not hear from you by September 15, 2008, we will consider this change to be approved by your company.
Sincerely,
Naib Girn Quality Assurance Manager
Notification of Change to LTC3728 Datasheet
1630 McCarthy Blvd., Milpitas, CA 95035-7417
Confidential Statement
This change notice is for Linear Technology’s Customers only.
Distribution or notification to third parties is prohibited
FEATURES
LTC3728
Dual, 550kHz, 2-Phase
Synchronous Step-Down Switching Regulator
U
DESCRIPTIO
Dual, 180° Phased Controllers Reduce Required Input Capacitance and Power Supply Induced Noise
OPTI-LOOP® Compensation Minimizes C
±1% Output Voltage Accuracy
Power Good Output Voltage Indicator
Phase-Lockable Fixed Frequency 250kHz to 550kHz
Dual N-Channel MOSFET Synchronous Drive
Wide VIN Range: 3.5V to 36V Operation
Very Low Dropout Operation: 99% Duty Cycle
Adjustable Soft-Start Current Ramping
Foldback Output Current Limiting
Latched Short-Circuit Shutdown with Defeat Option
Output Overvoltage Protection
Remote Output Voltage Sense
Low Shutdown IQ: 20µA
5V and 3.3V Regulators
3 Selectable Operating Modes: Constant Frequency, Burst Mode
Available in 32-Pin 5mm × 5mm QFN and
®
Operation and PWM
OUT
28-Pin SSOP Packages
U
APPLICATIO S
Notebook and Palmtop Computers
Telecom Systems
Portable Instruments
Battery-Operated Digital Devices
DC Power Distribution Systems
The LTC
®
3728 is a dual high performance step-down switching regulator controller that drives all N-channel synchronous power MOSFET stages. A constant fre­quency current mode architecture allows phase-lockable frequency of up to 550kHz. Power loss and noise due to the ESR of the input capacitors are minimized by operating the two controller output stages out of phase.
OPTI-LOOP compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values. The precision 0.8V reference and power good output indicator are compatible with future microproces­sor generations, and a wide 3.5V to 30V (36V maximum) input supply range encompasses all battery chemistries.
A RUN/SS pin for each controller provides both soft-start and optional timed, short-circuit shutdown. Current foldback limits MOSFET dissipation during short-circuit conditions when overcurrent latchoff is disabled. Output overvoltage protection circuitry latches on the bottom MOSFET until V
returns to normal. The FCB mode pin
OUT
can select among Burst Mode, constant frequency mode and continuous inductor current mode or regulate a secondary winding. The LTC3728 includes a power good output pin that indicates when both outputs are within
7.5% of their designed set point.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. Burst Mode and OPTI-LOOP are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 5481178, 5929620, 6177787, 6144194, 6100678, 5408150, 6580258, 6304066, 5705919.
TYPICAL APPLICATIO
3.2µH
R
SENSE1
0.01
V
OUT1
5V 5A
C
+
47µF 6V SP
M1, M2: FDS6982S
U
+
OUT1
4.7µF
M1
L1
R2
105k
1%
R1 20k 1%
1000pF
C 220pF
R
C1
15k
C1
C
B1
500kHz
, 0.1µF
f
IN
D3
C
0.1µF
SS1
VINPGOOD INTV
TG1 TG2
BOOST1 BOOST2
SW1 SW2
LTC3728
BG1 BG2
PLLIN
+
SENSE1
SENSE1 V
OSENSE1
I
TH1
RUN/SS1 RUN/SS2
SGND
PGND
SENSE2
SENSE2
V
OSENSE2
CC
I
TH2
+
C
0.1µF
C
B2
SS2
Figure 1. High Efficiency Dual 5V/3.3V Step-Down Converter
D4
, 0.1µF
1000pF
220pF
1µF
C
C2
R
C2
15k
V
IN
5.2V TO 28V
C
IN
22µF 50V
M2
L2
3.2µH
R
SENSE2
0.01
V
+
3728 F01
3.3V 5A
OUT2
3728fc
R4
63.4k C
1%
R3 20k 1%
56µF
OUT
6V
SP
1
LTC3728
323331 30 29 28 27 26 25
9 10 11 12 13
TOP VIEW
14 15 16
17
18
19
20
21
22
23
24
8
7
6
5
4
3
2
1V
OSENSE1
PLLFLTR
PLLIN
FCB
I
TH1
SGND
3.3V
OUT
I
TH2
BOOST1
V
IN
BG1
EXTV
CC
INTV
CC
PGND
BG2
BOOST2
NC
SENSE1–SENSE1+NC
RUN/SS1
PGOOD
TG1
SW1
V
OSENSE2
NC
SENSE2
SENSE2
+
RUN/SS2
TG2
SW2
NC
WWWU
ABSOLUTE AXI U RATI GS
(Note 1)
Input Supply Voltage (VIN).........................36V to –0.3V
Top Side Driver Voltages
(BOOST1, BOOST2) ...................................42V to –0.3V
Switch Voltage (SW1, SW2) .........................36V to – 5V
INTV
EXTVCC, RUN/SS1, RUN/SS2, (BOOST1-SW1),
CC,
(BOOST2-SW2), PGOOD ............................. 7V to – 0.3V
SENSE1 SENSE2
+
, SENSE2+, SENSE1–,
Voltages ........................ (1.1)INTVCC to –0.3V
PLLIN, PLLFLTR, FCB, Voltage ............ INTVCC to –0.3V
I
TH1, ITH2
, V
OSENSE1
, V
OSENSE2
Peak Output Current <10µs (TG1, TG2, BG1, BG2) ... 3A INTV
Peak Output Current ................................ 50mA
CC
Operating Temperature Range (Note 7) ... –40°C to 85°C
Junction Temperature (Note 2)............................. 125°C
Storage Temperature Range ................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec)
(G Package Only) .................................................. 300°C
UU
W
PACKAGE/ORDER I FOR ATIO
TOP VIEW
RUN/SS1
SENSE1
SENSE1
V
OSENSE1
PLLFLTR
PLLIN
FCB
I
SGND
3.3V
OUT
I
V
OSENSE2
SENSE2
SENSE2
1
+
2
3
4
5
6
7
8
TH1
9
10
11
TH2
12
13
+
14
G PACKAGE
28-LEAD PLASTIC SSOP
T
= 125°C, θJA = 95°C/W
JMAX
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PGOOD
TG1
SW1
BOOST1
V
IN
BG1
EXTV
CC
INTV
CC
PGND
BG2
BOOST2
SW2
TG2
RUN/SS2
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/
ORDER PART
NUMBER
LTC3728EG
32-LEAD (5mm × 5mm) PLASTIC QFN
EXPOSED PAD IS SGND (MUST BE SOLDERED TO PCB)
UH PACKAGE
T
= 125°C, θJA = 34°C/W
JMAX
Voltages ...2.7V to –0.3V
ORDER PART
NUMBER
LTC3728EUH
UH PART
MARKING
3728
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. VIN = 15V, V
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Main Control Loops
V
I V
V
2
OSENSE1, 2
VOSENSE1, 2
REFLNREG
LOADREG
Regulated Feedback Voltage (Note 3); I
Feedback Current (Note 3) –5 – 50 nA Reference Voltage Line Regulation VIN = 3.6V to 30V (Note 3) 0.002 0.02 %/V
Output Voltage Load Regulation (Note 3)
Measured in Servo Loop; ∆I Measured in Servo Loop; ∆I
The ● denotes the specifications which apply over the full operating
= 5V unless otherwise noted.
0.792 0.800 0.808 V
0.1 0.5 %
–0.1 –0.5 %
Voltage = 1.2V
TH1, 2
RUN/SS1, 2
Voltage = 1.2V to 0.7V
TH
Voltage = 1.2V to 2.0V
TH
3728fc
LTC3728
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at T
The ● denotes the specifications which apply over the full operating
= 25°C. VIN = 15V, V
A
RUN/SS1, 2
= 5V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
g
m1, 2
g
mGBW1, 2
Transconductance Amplifier g
m
Transconductance Amplifier GBW I
I
= 1.2V; Sink/Source 5uA; (Note 3) 1.3 mmho
TH1, 2
= 1.2V; (Note 3) 3 MHzI
TH1, 2
Input DC Supply Current (Note 4)
V
FCB
I
FCB
V
BINHIBIT
Normal Mode V Shutdown V
= 15V; EXTVCC Tied to V
IN RUN/SS1, 2
= 0V 20 35 µA
Forced Continuous Threshold Forced Continuous Pin Current V
= 0.85V – 0.50 – 0.18 –0.1 µA
FCB
Burst Inhibit (Constant Frequency) Measured at FCB pin 4.3 4.8 V
OUT1
; V
= 5V 450 µA
OUT1
0.76 0.800 0.84 V
Threshold UVLO Undervoltage Lockout VIN Ramping Down
V
OVL
I
SENSE
DF
MAX
I
RUN/SS1, 2
V
RUN/SS1, 2
V
RUN/SS1, 2
I
SCL1, 2
I
SDLHO
V
SENSE(MAX)
Feedback Overvoltage Lockout Measured at V
Sense Pins Total Source Current (Each Channel); V
OSENSE1, 2
SENSE1–, 2–
Maximum Duty Factor In Dropout 98 99.4 %
Soft-Start Charge Current V
ON RUN/SS Pin ON Threshold V LT RUN/SS Pin Latchoff Arming Threshold V
RUN/SS1, 2
RUN/SS1, VRUN/SS2
RUN/SS1, VRUN/SS2
= 1.9V 0.5 1.2 µA
RUN/SS Discharge Current Soft Short Condition V
= 4.5V
= 0.5V 1.6 5 µA = 0.7V,V
= 0.7V,V
Shutdown Latch Disable Current V
Maximum Current Sense Threshold V
V
RUN/SS1, 2
OSENSE1, 2
OSENSE1, 2
V
OSENSE1, 2
= V
SENSE1+, 2+
= 0V – 85 – 60 µA
Rising 1.0 1.5 1.9 V Rising from 3V 3.8 4.5 V
OSENSE1, 2
SENSE1–, 2 SENSE1–, 2
= 0.5V; 0.5 2 4 µA
= 5V 65 75 85 mV
= 5V
0.84 0.86 0.88 V
62 75 88 mV
3.5 4 V
TG Transition Time: (Note 5) TG1, 2 t TG1, 2 t
Rise Time C
r
Fall Time C
f
= 3300pF 50 90 ns
LOAD
= 3300pF 50 90 ns
LOAD
BG Transition Time: (Note 5) BG1, 2 t BG1, 2 t
TG/BG t
BG/TG t
t
ON(MIN)
Rise Time C
r
Fall Time C
f
1D
Top Gate Off to Bottom Gate On Delay
Synchronous Switch-On Delay Time C
2D
Bottom Gate Off to Top Gate On Delay
Top Switch-On Delay Time C
Minimum On-Time Tested with a Square Wave (Note 6) 100 ns
= 3300pF 40 90 ns
LOAD
= 3300pF 40 80 ns
LOAD
= 3300pF Each Driver 90 ns
LOAD
= 3300pF Each Driver 90 ns
LOAD
INTVCC Linear Regulator
V
INTVCC
V
INT INTVCC Load Regulation ICC = 0 to 20mA, V
LDO
V
EXT EXTVCC Voltage Drop ICC = 20mA, V
LDO
V
EXTVCC
V
LDOHYS
Internal VCC Voltage 6V < VIN < 30V, V
EXTVCC
EXTVCC Switchover Voltage ICC = 20mA, EXTV
= 4V 4.8 5.0 5.2 V
EXTVCC
= 4V 0.2 1.0 %
EXTVCC
= 5V 80 160 mV
Ramping Positive
CC
4.5 4.7 V
EXTVCC Hysteresis 0.2 V
Oscillator and Phase-Locked Loop
f
NOM
f
LOW
f
HIGH
R
PLLIN
I
PLLFLTR
Nominal Frequency V
Lowest Frequency V
Highest Frequency V
= 1.2V 360 400 440 kHz
PLLFLTR
= 0V 230 260 290 kHz
PLLFLTR
2.4V 480 550 590 kHz
PLLFLTR
PLLIN Input Resistance 50 k
Phase Detector Output Current
Sinking Capability f Sourcing Capability f
PLLIN PLLIN
< f > f
OSC OSC
–15 µA
15 µA
Q
3728fc
3
LTC3728
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at T
The ● denotes the specifications which apply over the full operating
= 25°C. VIN = 15V, V
A
RUN/SS1, 2
= 5V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
3.3V Linear Regulator
V
3.3OUT
V
3.3IL
V
3.3VL
I
3.3LEAK
3.3V Regulator Output Voltage No Load
3.3V Regulator Load Regulation I
= 0 to 10mA 0.5 2 %
3.3
3.3V Regulator Line Regulation 6V < V
Leakage Current of 3.3V Regulator V
RUN/SS1, 2
3.25 3.35 3.45 V
< 30V 0.05 0.2 %
IN
= 0V, VIN = 30V
10 50 µA
in Shutdown
PGOOD Output
V
PGL
I
PGOOD
V
PG
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliabilty and lifetime.
Note 2: T dissipation P
LTC3728: T
Note 3: The LTC3728 is tested in a feedback loop that servos V specified voltage and measures the resultant V
Note 4: Dynamic supply current is higher due to the gate charge being
PGOOD Voltage Low I
PGOOD Leakage Current V
PGOOD Trip Level, Either Controller V
is calculated from the ambient temperature TA and power
J
according to the following formulas:
D
= TA + (PD • 95 °C/W)
J
OSENSE1, 2.
PGOOD
PGOOD
OSENSE
V
OSENSE
V
OSENSE
ITH1, 2
= 2mA 0.1 0.3 V
= 5V ±1 µA
with Respect to Set Output Voltage
Ramping Negative – 6 –7.5 – 9.5 % Ramping Positive 6 7.5 9.5 %
delivered at the switching frequency. See Applications Information. Note 5: Rise and fall times are measured using 10% and 90% levels. Delay
times are measured using 50% levels. Note 6: The minimum on-time condition is specified for an inductor
peak-to-peak ripple current 40% of I
(see minimum on-time
MAX
considerations in the Applications Information section). Note 7: The LTC3728E is guaranteed to meet performance specifications
to a
from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs Output Current and Mode (Figure 13)
100
Burst Mode
90
OPERATION
80
70
60
50
40
EFFICIENCY (%)
30
20
10
0
0.001
0.01 OUTPUT CURRENT (A)
FORCED CONTINUOUS MODE (PWM)
CONSTANT FREQUENCY (BURST DISABLE)
0.1
VIN = 15V V
OUT
f = 250kHz
1
= 5V
10
3728 G01
Efficiency vs Output Current (Figure 13)
100
90
80
70
EFFICIENCY (%)
60
50
0.001
VIN = 7V
VIN = 10V
= 15V
V
IN
V
= 20V
IN
0.01
0.1
OUTPUT CURRENT (A)
V
OUT
f = 250kHz
1
= 5V
3728 G02
Efficiency vs Input Voltage (Figure 13)
100
90
80
70
EFFICIENCY (%)
60
50
10
5
15
INPUT VOLTAGE (V)
25
V
= 5V
OUT
= 3A
I
OUT
f = 250kHz
3728 G03
35
4
3728fc
UW
TEMPERATURE (°C)
–50
INTV
CC
AND EXTV
CC
SWITCH VOLTAGE (V)
4.95
5.00
5.05
25 75
3728 G06
4.90
4.85
–25 0
50 100 125
4.80
4.70
4.75
INTVCC VOLTAGE
EXTVCC SWITCHOVER THRESHOLD
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3728
Supply Current vs Input Voltage and Mode (Figure 13)
1000
800
600
400
SUPPLY CURRENT (µA)
200
0
05
BOTH CONTROLLERS ON
SHUTDOWN
10
INPUT VOLTAGE (V)
20
15
Internal 5V LDO Line Regulation
5.1 I
= 1mA
LOAD
5.0
4.9
4.8
VOLTAGE (V)
4.7
CC
INTV
4.6
4.5
4.4
0
510
INPUT VOLTAGE (V)
20 30 35
15 25
INTVCC and EXTVCC Switch
EXTVCC Voltage Drop
250
200
150
100
VOLTAGE DROP (mV)
CC
EXTV
50
30
35
3728 G04
25
0
10
0
CURRENT (mA)
30
40
20
50
3728 G05
Voltage vs Temperature
Maximum Current Sense Threshold
3728 G07
Maximum Current Sense Threshold vs Duty Factor
75
50
(mV)
SENSE
V
25
0
0
20 40 60 80
DUTY FACTOR (%)
100
3728 G08
vs Percent of Nominal Output Voltage (Foldback)
80
70
60
50
(mV)
40
SENSE
V
30
20
10
0
0
25
PERCENT ON NOMINAL OUTPUT VOLTAGE (%)
50
75
100
3728 G09
80
60
(mV)
40
SENSE
V
20
0
Maximum Current Sense Threshold vs V
V
SENSE(CM)
0
(Soft-Start)
RUN/SS
= 1.6V
1234
V
(V)
RUN/SS
56
3728 G10
Maximum Current Sense Threshold vs Sense Common Mode Voltage
80
76
72
(mV)
SENSE
68
V
64
60
1
0
2
COMMON MODE VOLTAGE (V)
3
Current Sense Threshold
Voltage
vs I
TH
90
80
70
60
50
40
(mV)
30
20
SENSE
V
10
0
–10
–20
4
5
3728 G11
–30
0.5
0
1.5
2
3728 G12
3728fc
2.5
1
V
(V)
ITH
5
LTC3728
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Load Regulation
0.0
–0.1
(%)
OUT
–0.2
NORMALIZED V
–0.3
–0.4
1
0
2
LOAD CURRENT (A)
Maximum Current Sense Threshold vs Temperature
80
78
76
(mV)
SENSE
74
V
72
70
–50 –25
25
0
TEMPERATURE (°C)
V
vs V
ITH
RUN/SS
2.5 V
0
OSENSE
= 0.7V
234
1
V
RUN/SS
(V)
56
3728 G14
FCB = 0V
= 15V
V
IN
2.0
1.5
(V)
ITH
V
1.0
0.5
3
4
5
3728 G13
0
SENSE Pins Total Source Current
100
50
(µA)
0
SENSE
I
–50
–100
0
24
V
COMMON MODE VOLTAGE (V)
SENSE
6
3728 G15
Dropout Voltage vs Output Current (Figure 14)
4
V
= 5V
OUT
3
2
R
= 0.015
SENSE
DROPOUT VOLTAGE (V)
1
R
= 0.010
SENSE
0
0
50
75
100
125
3728 G17
0.5 1.0 1.5 2.0 OUTPUT CURRENT (A)
2.5 3.0 3.5 4.0
3728 G18
RUN/SS Current vs Temperature
1.8
1.6
1.4
1.2
1.0
0.8
0.6
RUN/SS CURRENT (µA)
0.4
0.2
0
–50 –25
0 25 125
TEMPERATURE (°C)
75 10050
3728 G25
6
Soft-Start Up (Figure 13)
V
OUT
5V/DIV
V
RUN/SS
5V/DIV
I
L
2A/DIV
V
= 15V 5ms/DIV
IN
V
= 5V
OUT
3728 G19
V
OUT
200mV/DIV
2A/DIV
Load Step (Figure 13)
I
L
V
= 15V 20µs/DIV
IN
V
= 5V
OUT
V
= 0V
PLLFLTR
LOAD STEP = 0A TO 3A Burst Mode OPERATION
3728 G20
V
OUT
200mV/DIV
2A/DIV
Load Step (Figure 13)
I
L
= 15V 20µs/DIV
V
IN
V
= 5V
OUT
V
= 0V
PLLFLTR
LOAD STEP = 0A TO 3A CONTINUOUS MODE
3728 G21
3728fc
TEMPERATURE (°C)
–50
400
500
700
25 75
3728 G28
300
200
–25 0
50 100 125
100
0
600
FREQUENCY (kHz)
V
PLLFLTR
= 5V
V
PLLFLTR
= 1.2V
V
PLLFLTR
= 0V
UW
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3728
Input Source/Capacitor Instantaneous Current (Figure 13)
I
IN
2A/DIV
V
IN
200mV/DIV
V
SW1
10V/DIV
V
SW2
10V/DIV
V
= 15V 1µs/DIV
IN
V
= 5V
OUT
= 0V
V
PLLFLTR
I
= I
OUT3.3
= 2A
OUT5
Current Sense Pin Input Current vs Temperature
35
V
= 5V
OUT
33
31
3728 G22
Burst Mode Operation (Figure 13)
V
OUT
20mV/DIV
I
L
0.5A/DIV
= 15V 10µs/DIV
V
IN
V
= 5V
OUT
= 0V
V
PLLFLTR
V
= OPEN
FCB
= 20mA
I
OUT
EXTVCC Switch Resistance vs Temperature
10
8
6
3728 G23
Constant Frequency (Burst Inhibit) Operation (Figure 13)
V
OUT
20mV/DIV
I
L
0.5A/DIV
= 15V 2µs/DIV
V
IN
V
= 5V
OUT
= 0V
V
PLLFLTR
V
= 5V
FCB
= 20mA
I
OUT
Oscillator Frequency vs Temperature
3728 G24
CURRENT SENSE INPUT CURRENT (µA)
29
27
25
–50 –25
0
TEMPERATURE (°C)
50
25
75
100
Undervoltage Lockout vs Temperature
3.50
3.45
3.40
3.35
3.30
UNDERVOLTAGE LOCKOUT (V)
3.25
3.20 –50
–25 0
TEMPERATURE (°C)
125
3728 G26
50 100 125
25 75
SWITCH RESISTANCE ()
CC
EXTV
4
2
0
–50 –25
3728 G29
50
25
0
TEMPERATURE (°C)
100
125
3728 G27
75
Shutdown Latch Thresholds vs Temperature
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
SHUTDOWN LATCH THRESHOLDS (V)
0
–50 –25
LATCH ARMING
LATCHOFF
THRESHOLD
0 25 125
TEMPERATURE (°C)
75 10050
3728 G30
3728fc
7
LTC3728
U
PI FU CTIO S
UU
G Package/UH Package
RUN/SS1, RUN/SS2 (Pins 1, 15/Pins 28, 13): Combina-
tion of soft-start, run control inputs and short-circuit detec­tion timers. A capacitor to ground at each of these pins sets the ramp time to full output current. Forcing either of these pins back below 1.0V causes the IC to shut down the circuitry required for that particular controller. Latchoff overcurrent protection is also invoked via this pin as de­scribed in the Applications Information section.
SENSE1
to the Differential Current Comparators. The I and controlled offsets between the SENSE pins in conjunction with R
+
, SENSE2+ (Pins 2, 14/Pins 30, 12): The (+) Input
pin voltage
th
and SENSE
set the current trip thresh-
SENSE
+
old.
SENSE1
, SENSE2– (Pins 3, 13/Pins 31, 11): The (–) Input
to the Differential Current Comparators.
V
OSENSE1
, V
OSENSE2
(Pins 4, 12/Pins 1, 9): Receives the
remotely-sensed feedback voltage for each controller from an external resistive divider across the output.
PLLFLTR (Pin 5/Pin 2): The Phase-Locked Loop’s Low­pass Filter is Tied to This Pin. Alternatively, this pin can be driven with an AC or DC voltage source to vary the fre­quency of the internal oscillator.
PLLIN (Pin 6/Pin 3): External Synchronization Input to Phase Detector. This pin is internally terminated to SGND with 50k. The phase-locked loop will force the rising top gate signal of controller 1 to be synchronized with the rising edge of the PLLIN signal.
FCB (Pin 7/Pin 4): Forced Continuous Control Input. This input acts on both controllers and is normally used to regulate a secondary winding. Pulling this pin below 0.8V will force continuous synchronous operation.
I
TH1, ITH2
(Pins 8, 11/Pins 5, 8): Error Amplifier Output and
Switching Regulator Compensation Point. Each associated channels’ current comparator trip point increases with this control voltage.
SGND (Pin 9/Pin 6): Small Signal Ground common to both controllers, must be routed separately from high current grounds to the common (–) terminals of the C
capacitors.
OUT
3.3V
(Pin 10/Pin 7): Output of a linear regulator capable
OUT
of supplying 10mA DC with peak currents as high as 50mA.
NC (Pins 10, 16, 29, 32 UH Package Only): No Connect.
PGND (Pin 20/Pin 19): Driver Power Ground. Connects to the
sources of bottom (synchronous) N-channel MOSFETs, an­odes of the Schottky rectifiers and the (–) terminal(s) of C
INTV
Dropout Regulator and the EXTV
(Pin 21/Pin 20): Output of the Internal 5V Linear Low
CC
Switch. The driver and
CC
IN
.
control circuits are powered from this voltage source. Must be decoupled to power ground with a minimum of 4.7µF tantalum or other low ESR capacitor.
EXTV
Internal Switch Connected to INTV and supplies V out regulator, whenever EXTV EXTV
(Pin 22/Pin 21): External Power Input to an
CC
. This switch closes
CC
power, bypassing the internal low drop-
CC
is higher than 4.7V. See
CC
connection in Applications section. Do not exceed
CC
7V on this pin.
BG1, BG2 (Pins 23, 19/Pins 22, 18): High Current Gate Drives for Bottom (Synchronous) N-Channel MOSFETs. Voltage swing at these pins is from ground to INTV
V
(Pin 24/Pin 23): Main Supply Pin. A bypass capacitor
IN
CC
.
should be tied between this pin and the signal ground pin.
BOOST1, BOOST2 (Pins 25, 18/Pins 24, 17): Bootstrapped Supplies to the Top Side Floating Drivers. Capacitors are connected between the boost and switch pins and Schot­tky diodes are tied between the boost and INTV Voltage swing at the boost pins is from INTV INTV
CC
).
CC
pins.
CC
to (VIN +
SW1, SW2 (Pins 26, 17/Pins 25, 15): Switch Node Connections to Inductors. Voltage swing at these pins is from a Schottky diode (external) voltage drop below ground to V
IN
.
TG1, TG2 (Pins 27, 16/Pins 26, 14): High Current Gate Drives for Top N-Channel MOSFETs. These are the outputs of floating drivers with a voltage swing equal to INTV
CC
0.5V superimposed on the switch node voltage SW.
PGOOD (Pin 28/Pin 27): Open-Drain Logic Output. PGOOD is pulled to ground when the voltage on either V
OSENSE
pin
is not within ±7.5% of its set point.
Exposed Pad (Pin 33) SGND: The exposed pad must be soldered to PCB ground for elecrical contact and rated thermal performance.
8
3728fc
LTC3728
U
U
W
FU CTIO AL DIAGRA
PLLIN
F
IN
PLLFLTR
R
LP
C
LP
PGOOD
V
SEC
R6
FCB
R5
3.3V
V
IN
V
IN
EXTV
INTV
5V
+
SGND
50k
0.18µA
OUT
CC
CC
PHASE DET
OSCILLATOR
1.5V
+
4.7V
4.5V
0.8V
CLK1
CLK2
0.86V
+
V
OSENSE1
+
0.74V
0.86V
+
V
OSENSE2
+
0.74V
BINH
+
+
FCB
V
REF
+
5V LDO REG
INTERNAL
SUPPLY
DUPLICATE FOR SECOND CONTROLLER CHANNEL
0.86V
4(VFB)
SLOPE COMP
1.2µA
6V
DROP
OUT DET
BOT
FCB
45k
+
+ +
SHDN
4(VFB)
RST
B
3mV
TOP ON
SHDN
START
+
45k
OV
RUN
SOFT
2.4V
SRQ
Q
0.55V
I1 I2
+
SWITCH
EA
LOGIC
+
+
INTV
BOOST
CC
INTV
30k
30k
CC
TG
SW
BG
PGND
SENSE
SENSE
V
OSENSE
I
TH
RUN/SS
+
TOP
BOT
INTV
V
FB
0.80V
0.86V
V
CC
IN
D
B
C
B
D
SEC
R2
R1
C
C
C
C2
C
SS
+
C
1
SENSE
IN
C
OUT
+
V
OUT
+
C
SEC
D
R
R
C
Figure 2
U
OPERATIO
Main Control Loop
The LTC3728 uses a constant frequency, current mode step-down architecture with the two controller channels operating 180 degrees out of phase. During normal opera­tion, each top MOSFET is turned on when the clock for that channel sets the RS latch, and turned off when the main current comparator, I1, resets the RS latch. The peak
(Refer to Functional Diagram)
3728 FD/F02
inductor current at which I1 resets the RS latch is con­trolled by the voltage on the I each error amplifier EA. The V
pin, which is the output of
TH
OSENSE
pin receives the voltage feedback signal, which is compared to the internal reference voltage by the EA. When the load current in­creases, it causes a slight decrease in V
OSENSE
the 0.8V reference, which in turn causes the I
relative to
voltage to
TH
3728fc
9
LTC3728
OPERATIO
U
(Refer to Functional Diagram)
increase until the average inductor current matches the new load current. After the top MOSFET has turned off, the bottom MOSFET is turned on until either the inductor current starts to reverse, as indicated by current compara­tor I
, or the beginning of the next cycle.
2
The top MOSFET drivers are biased from floating boot­strap capacitor C
, which normally is recharged during
B
each off cycle through an external diode when the top MOSFET turns off. As V
, the loop may enter dropout and attempt to turn on
V
OUT
decreases to a voltage close to
IN
the top MOSFET continuously. The dropout detector de­tects this and forces the top MOSFET off for about 400ns every tenth cycle to allow C
to recharge.
B
The main control loop is shut down by pulling the RUN/SS pin low. Releasing RUN/SS allows an internal 1.2µA current source to charge soft-start capacitor CSS. When C
reaches 1.5V, the main control loop is enabled with the
SS
voltage clamped at approximately 30% of its maximum
I
TH
value. As C
continues to charge, the I
SS
pin voltage is
TH
gradually released allowing normal, full-current opera­tion. When both RUN/SS1 and RUN/SS2 are low, all LTC3728 controller functions are shut down, including the 5V and 3.3V regulators.
Low Current Operation
The FCB pin is a multifunction pin providing two func­tions: 1) to provide regulation for a secondary winding by temporarily forcing continuous PWM operation on both controllers; and 2) select between
two
modes of low
current operation. When the FCB pin voltage is below
0.8V, the controller forces continuous PWM current mode operation. In this mode, the top and bottom MOSFETs are alternately turned on to maintain the output voltage independent of direction of inductor current. When the FCB pin is below V
INTVCC
– 1V but greater than
0.8V, the controller enters Burst Mode operation. Burst Mode operation sets a minimum output current level before inhibiting the top switch and turns off the synchro­nous MOSFET(s) when the inductor current goes nega­tive. This combination of requirements will, at low cur­rents, force the ITH pin below a voltage threshold that will
temporarily inhibit turn-on of both output MOSFETs until the output voltage drops. There is 60mV of hysteresis in the burst comparator B tied to the I
pin. This hysteresis
TH
produces output signals to the MOSFETs that turn them on for several cycles, followed by a variable “sleep” interval depending upon the load current. The resultant output voltage ripple is held to a very small value by having the hysteretic comparator after the error amplifier gain block.
Frequency Synchronization
The phase-locked loop allows the internal oscillator to be synchronized to an external source via the PLLIN pin. The output of the phase detector at the PLLFLTR pin is also the DC frequency control input of the oscillator that operates over a 250kHz to 550kHz range corresponding to a DC voltage input from 0V to 2.4V. When locked, the PLL aligns the turn on of the top MOSFET to the rising edge of the synchronizing signal. When PLLIN is left open, the PLLFLTR pin goes low, forcing the oscillator to minimum frequency.
Constant Frequency Operation
When the FCB pin is tied to INTV
, Burst Mode operation
CC
is disabled and the forced minimum output current requirement is removed. This provides constant frequency, discontinuous (preventing reverse inductor current) current operation over the widest possible output current range. This constant frequency operation is not as efficient as Burst Mode operation, but does provide a lower noise, constant frequency operating mode down to approxi­mately 1% of designed maximum output current.
Continuous Current (PWM) Operation
Tying the FCB pin to ground will force continuous current operation. This is the least efficient operating mode, but may be desirable in certain applications. The output can source or sink current in this mode. When sinking current while in forced continuous operation, current will be forced back into the main power supply.
10
3728fc
OPERATIO
LTC3728
U
(Refer to Functional Diagram)
INTVCC/EXTVCC Power
Power for the top and bottom MOSFET drivers and most other internal circuitry is derived from the INTV When the EXTV dropout linear regulator supplies INTV is taken above 4.7V, the 5V regulator is turned off and an internal switch is turned on connecting EXTV This allows the INTV efficiency external source such as the output of the regu­lator itself or a secondary winding, as described in the Applications Information section.
Output Overvoltage Protection
An overvoltage comparator, OV, guards against transient overshoots (>7.5%) as well as other more serious condi­tions that may overvoltage the output. In this case, the top MOSFET is turned off and the bottom MOSFET is turned on until the overvoltage condition is cleared.
Power Good (PGOOD) Pin
The PGOOD pin is connected to an open drain of an internal MOSFET. The MOSFET turns on and pulls the pin low when either output is not within ± 7.5% of the nominal output level as determined by the resistive feedback divider. When both outputs meet the ± 7.5% requirement, the MOSFET is turned off within 10µs and the pin is allowed to be pulled up by an external resistor to a source of up to 7V.
Foldback Current, Short-Circuit Detection and Short-Circuit Latchoff
The RUN/SS capacitors are used initially to limit the inrush current of each switching regulator. After the controller has been started and been given adequate time to charge up the output capacitors and provide full load current, the RUN/SS capacitor is used in a short-circuit time-out circuit. If the output voltage falls to less than 70% of its nominal output voltage, the RUN/SS capacitor begins discharging on the assumption that the output is in an overcurrent and/or short-circuit condition. If the condi­tion lasts for a long enough period as determined by the size of the RUN/SS capacitor, the controller will be shut down until the RUN/SS pin(s) voltage(s) are recycled.
pin is left open, an internal 5V low
CC
power. If EXTV
CC
to INTVCC.
CC
power to be derived from a high
CC
CC
pin.
CC
This built-in latchoff can be overridden by providing a >5µA pull-up at a compliance of 5V to the RUN/SS pin(s). This current shortens the soft start period but also pre­vents net discharge of the RUN/SS capacitor(s) during an overcurrent and/or short-circuit condition. Foldback cur­rent limiting is also activated when the output voltage falls below 70% of its nominal level whether or not the short­circuit latchoff circuit is enabled. Even if a short is present and the short-circuit latchoff is not enabled, a safe, low output current is provided due to internal current foldback and actual power wasted is low due to the efficient nature of the current mode switching regulator.
THEORY AND BENEFITS OF 2-PHASE OPERATION
The LTC1628 and the LTC3728 dual high efficiency DC/DC controllers bring the considerable benefits of 2-phase operation to portable applications for the first time. Note­book computers, PDAs, handheld terminals and automo­tive electronics will all benefit from the lower input filtering requirement, reduced electromagnetic interference (EMI) and increased efficiency associated with 2-phase opera­tion.
Why the need for 2-phase operation? Up until the 2-phase family, constant-frequency dual switching regulators op­erated both channels in phase (i.e., single-phase opera­tion). This means that both switches turned on at the same time, causing current pulses of up to twice the amplitude of those for one regulator to be drawn from the input capacitor and battery. These large amplitude current pulses increased the total RMS current flowing from the input capacitor, requiring the use of more expensive input capacitors and increasing both EMI and losses in the input capacitor and battery.
With 2-phase operation, the two channels of the dual­switching regulator are operated 180 degrees out of phase. This effectively interleaves the current pulses drawn by the switches, greatly reducing the overlap time where they add together.
The result is a significant reduc­tion in total RMS input current, which in turn allows less expen
sive input capacitors to be used, reduces shielding requirements for EMI and improves real world operating efficiency.
3728fc
11
LTC3728
OPERATIO
Figure 3. Input Waveforms Comparing Single-Phase (a) and 2-Phase (b) Operation for Dual Switching Regulators Converting 12V to 5V and 3.3V at 3A Each. The Reduced Input Ripple with the LTC1628 2-Phase Regulator Allows Less Expensive Input Capacitors, Reduces Shielding Requirements for EMI and Improves Efficiency
U
(Refer to Functional Diagram)
I
= 2.53A
IN(MEAS)
RMS
(a)
DC236 F03a
5V SWITCH
20V/DIV
3.3V SWITCH 20V/DIV
INPUT CURRENT
5A/DIV
INPUT VOLTAGE
500mV/DIV
I
IN(MEAS)
= 1.55A
(b)
DC236 F03b
RMS
Figure 3 compares the input waveforms for a representa­tive single-phase dual switching regulator to the LTC1628 2-phase dual switching regulator. An actual measurement of the RMS input current under these conditions shows that 2-phase operation dropped the input current from
2.53A
RMS
to 1.55A
. While this is an impressive reduc-
RMS
tion in itself, remember that the power losses are propor-
2
tional to I
, meaning that the actual power wasted is
RMS
reduced by a factor of 2.66. The reduced input ripple voltage also means less power is lost in the input power path, which could include batteries, switches, trace/con­nector resistances and protection circuitry. Improvements in both conducted and radiated EMI also directly accrue as a result of the reduced RMS input current and voltage.
Of course, the improvement afforded by 2-phase opera­tion is a function of the dual switching regulator’s relative duty cycles which, in turn, are dependent upon the input voltage V
(Duty Cycle = V
IN
OUT/VIN
). Figure 4 shows how the RMS input current varies for single-phase and 2-phase operation for 3.3V and 5V regulators over a wide input voltage range.
It can readily be seen that the advantages of 2-phase operation are not just limited to a narrow operating range, but in fact extend over a wide region. A good rule of thumb for most applications is that 2-phase operation will reduce the input capacitor requirement to that for just one channel operating at maximum current and 50% duty cycle.
A final question: If 2-phase operation offers such an advantage over single-phase operation for dual switching
regulators, why hasn’t it been done before? The answer is that, while simple in concept, it is hard to implement. Constant-frequency current mode switching regulators require an oscillator derived “slope compensation” signal to allow stable operation of each regulator at over 50% duty cycle. This signal is relatively easy to derive in single­phase dual switching regulators, but required the develop­ment of a new and proprietary technique to allow 2-phase operation. In addition, isolation between the two channels becomes more critical with 2-phase operation because switch transitions in one channel could potentially disrupt the operation of the other channel.
These 2-phase parts are proof that these hurdles have been surmounted. They offer unique advantages for the ever-expanding number of high efficiency power supplies required in portable electronics.
3.0
SINGLE PHASE
2.5
2.0
1.5
1.0
INPUT RMS CURRENT (A)
0.5 VO1 = 5V/3A
= 3.3V/3A
V
O2
0
0
Figure 4. RMS Input Current Comparison
DUAL CONTROLLER
2-PHASE
DUAL CONTROLLER
10 20 30 40
INPUT VOLTAGE (V)
3728 F04
3728fc
12
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APPLICATIO S I FOR ATIO
LTC3728
Figure 1 on the first page is a basic LTC3728 application circuit. External component selection is driven by the load requirement, and begins with the selection of R
SENSE
and the inductor value. Next, the power MOSFETs and D1 are selected. Finally, C
and C
IN
are selected. The
OUT
circuit shown in Figure 1 can be configured for operation up to an input voltage of 28V (limited by the external MOSFETs).
R
R
Selection For Output Current
SENSE
is chosen based on the required output current.
SENSE
The LTC3728 current comparator has a maximum thresh­old of 75mV/R
and an input common mode range of
SENSE
SGND to 1.1(INTVCC). The current comparator threshold sets the peak of the inductor current, yielding a maximum average output current I
equal to the peak value less
MAX
half the peak-to-peak ripple current, ∆IL.
Allowing a margin for variations in the LTC3728 and external component values yields:
mV
R
SENSE
50
=
I
MAX
When using the controller in very low dropout conditions, the maximum output current level will be reduced due to the internal compensation required to meet stability crite­rion for buck regulators operating at greater than 50% duty factor. A curve is provided to estimate this reducton in peak output current level depending upon the operating duty factor.
Operating Frequency
2.5
2.0
1.5
1.0
PLLFLTR PIN VOLTAGE (V)
0.5
0
200 250 300 350 550400 450 500
OPERATING FREQUENCY (kHz)
3728 F05
Figure 5. PLLFLTR Pin Voltage vs Frequency
is increased the gate charge losses will be higher, reducing efficiency (see Efficiency Considerations). The maximum switching frequency is approximately 550kHz.
Inductor Value Calculation
The operating frequency and inductor selection are inter­related in that higher operating frequencies allow the use of smaller inductor and capacitor values. So why would anyone ever choose to operate at lower frequencies with larger components? The answer is efficiency. A higher frequency generally results in lower efficiency because of MOSFET gate charge losses. In addition to this basic trade-off, the effect of inductor value on ripple current and low current operation must also be considered.
The inductor value has a direct effect on ripple current. The inductor ripple current ∆I tance or frequency and increases with higher V
decreases with higher induc-
L
:
IN
The LTC3728 uses a constant frequency phase-lockable architecture with the frequency determined by an internal capacitor. This capacitor is charged by a fixed current plus an additional current which is proportional to the voltage applied to the PLLFLTR pin. Refer to Phase-Locked Loop and Frequency Synchronization in the Applications Infor­mation section for additional information.
A graph for the voltage applied to the PLLFLTR pin vs frequency is given in Figure 5. As the operating frequency
I
1
=
L OUT
()( )
fL
1
V
⎜ ⎝
V
OUT
V
IN
⎞ ⎟
Accepting larger values of ∆IL allows the use of low inductances, but results in higher output voltage ripple and greater core losses. A reasonable starting point for setting ripple current is ∆I
=0.3(I
L
). The maximum ∆I
MAX
L
occurs at the maximum input voltage.
3728fc
13
LTC3728
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APPLICATIO S I FOR ATIO
The inductor value also has secondary effects. The transi­tion to Burst Mode operation begins when the average inductor current required results in a peak current below 25% of the current limit determined by R inductor values (higher ∆I
) will cause this to occur at
L
SENSE
. Lower
lower load currents, which can cause a dip in efficiency in the upper range of low current operation. In Burst Mode operation, lower inductance values will cause the burst frequency to decrease.
Inductor Core Selection
Once the value for L is known, the type of inductor must be selected. High efficiency converters generally cannot afford the core loss found in low cost powdered iron cores, forcing the use of more expensive ferrite,
®
molypermalloy, or Kool Mµ
cores. Actual core loss is independent of core size for a fixed inductor value, but it is very dependent on inductance selected. As inductance increases, core losses go down. Unfortunately, increased inductance requires more turns of wire and therefore copper losses will increase.
Ferrite designs have very low core loss and are preferred at high switching frequencies, so design goals can con­centrate on copper loss and preventing saturation. Ferrite core material saturates “hard,” which means that induc­tance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate!
The peak-to-peak drive levels are set by the INTV
CC
voltage. This voltage is typically 5V during start-up (see EXTV
Pin Connection). Consequently, logic-level
CC
threshold MOSFETs must be used in most applications. The only exception is if low input voltage is expected
< 5V); then, sub-logic level threshold MOSFETs
(V
IN
(V BV
< 3V) should be used. Pay close attention to the
GS(TH)
specification for the MOSFETs as well; most of the
DSS
logic level MOSFETs are limited to 30V or less.
Selection criteria for the power MOSFETs include the “ON” resistance R
, reverse transfer capacitance C
DS(ON)
RSS
, input voltage and maximum output current. When the LTC3728 is operating in continuous mode the duty cycles for the top and bottom MOSFETs are given by:
V
Main SwitchDuty Cycle
Synchronous Switch Duty Cycle
OUT
=
V
IN
VV
IN OUT
=
V
IN
The MOSFET power dissipations at maximum output current are given by:
P
MAIN
V
OUT
=
V
IN
2
kV I C f
IN MAX RSS
()( )( )()
2
IR
MAX DS ON
()
+
1 δ
()
()
+
Molypermalloy (from Magnetics, Inc.) is a very good, low loss core material for toroids, but it is more expensive than ferrite. A reasonable compromise from the same manu­facturer is Kool Mµ. Toroids are very space efficient, especially when you can use several layers of wire. Be­cause they generally lack a bobbin, mounting is more difficult. However, designs for surface mount are available that do not increase the height significantly.
Power MOSFET and D1 Selection
Two external power MOSFETs must be selected for each controller in the LTC3728: One N-channel MOSFET for the top (main) switch, and one N-channel MOSFET for the bottom (synchronous) switch.
14
VV
P
SYNC
IN OUT
=
V
IN
where δ is the temperature dependency of R
2
IR
MAX DS ON
()
+
1 δ
()
()
DS(ON)
and k
is a constant inversely related to the gate drive current.
Both MOSFETs have I
2
R losses while the topside N-channel equation includes an additional term for transition losses, which are highest at high input voltages. For V
< 20V the
IN
high current efficiency generally improves with larger MOSFETs, while for VIN > 20V the transition losses rapidly increase to the point that the use of a higher R with lower C
Kool Mµ is a registered trademark of Magnetics, Inc.
actually provides higher efficiency. The
RSS
DS(ON)
device
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APPLICATIO S I FOR ATIO
LTC3728
synchronous MOSFET losses are greatest at high input voltage when the top switch duty factor is low or during a short-circuit when the synchronous switch is on close to 100% of the period.
The term (1+δ) is generally given for a MOSFET in the form of a normalized R δ = 0.005/°C can be used as an approximation for low voltage MOSFETs. C FET characteristics. The constant k = 1.7 can be used to estimate the contributions of the two terms in the main switch dissipation equation.
The Schottky diode D1 shown in Figure 1 conducts during the dead-time between the conduction of the two power MOSFETs. This prevents the body diode of the bottom MOSFET from turning on, storing charge during the dead­time and requiring a reverse recovery period that could cost as much as 3% in efficiency at high VIN. A 1A to 3A Schottky is generally a good compromise for both regions of operation due to the relatively small average current. Larger diodes result in additional transition losses due to their larger junction capacitance. Schottky diodes should be placed in parallel with the synchronous MOSFETs when operating in pulse-skip mode or in Burst Mode operation.
vs Temperature curve, but
DS(ON)
is usually specified in the MOS-
RSS
battery currents down. 20µF to 40µF is usually sufficient for a 25W output supply operating at 200kHz. The ESR of the capacitor is important for capacitor power dissipation as well as overall battery efficiency. All of the power (RMS ripple current • ESR) not only heats up the capacitor but wastes power from the battery.
Medium voltage (20V to 35V) ceramic, tantalum, OS-CON and switcher-rated electrolytic capacitors can be used as input capacitors, but each has drawbacks: ceramic voltage coefficients are very high and may have audible piezoelec­tric effects; tantalums need to be surge-rated; OS-CONs suffer from higher inductance, larger case size and limited surface-mount applicability; electrolytics’ higher ESR and dryout possibility require several to be used. Multiphase systems allow the lowest amount of capacitance overall. As little as one 22µF or two to three 10µF ceramic capaci- tors are an ideal choice in a 20W to 35W power supply due to their extremely low ESR. Even though the capacitance at 20V is substantially below their rating at zero-bias, very low ESR loss makes ceramics an ideal candidate for highest efficiency battery operated systems. Also con­sider parallel ceramic and high quality electrolytic capaci­tors as an effective means of achieving ESR and bulk capacitance goals.
and C
C
IN
The selection of C tecture and its impact on the worst-case RMS current drawn through the input network (battery/fuse/capacitor). It can be shown that the worst case RMS current occurs when only one controller is operating. The controller with the highest (V formula below to determine the maximum RMS current requirement. Increasing the output current, drawn from the other out-of-phase controller, will actually decrease the input RMS ripple current from this maximum value (see Figure 4). The out-of-phase technique typically re­duces the input capacitor’s RMS ripple current by a factor of 30% to 70% when compared to a single phase power supply solution.
The type of input capacitor, value and ESR rating have efficiency effects that need to be considered in the selec­tion process. The capacitance value chosen should be sufficient to store adequate charge to keep high peak
Selection
OUT
OUT
is simplified by the multiphase archi-
IN
)(I
) product needs to be used in the
OUT
In continuous mode, the source current of the top N-chan­nel MOSFET is a square wave of duty cycle V prevent large voltage transients, a low ESR input capacitor sized for the maximum RMS current of one channel must be used. The maximum RMS capacitor current is given by:
VVV
()
[]
C quiredI I
Re
IN RMS MAX
This formula has a maximum at VIN = 2V I
= I
RMS
monly used for design because even significant deviations do not offer much relief. Note that capacitor manufacturer’s ripple current ratings are often based on only 2000 hours of life. This makes it advisable to further derate the capacitor, or to choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design. Always consult the manufacturer if there is any question.
/2. This simple worst case condition is com-
OUT
OUT IN OUT
OUT/VIN
V
IN
OUT
. To
/
12
, where
3728fc
15
LTC3728
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The benefit of the LTC3728 multiphase can be calculated by using the equation above for the higher power control­ler and then calculating the loss that would have resulted if both controller channels switch on at the same time. The total RMS power lost is lower when both controllers are operating due to the interleaving of current pulses through the input capacitor’s ESR. This is why the input capacitor’s requirement calculated above for the worst-case control­ler is adequate for the dual controller design. Remember that input protection fuse resistance, battery resistance and PC board trace resistance losses are also reduced due to the reduced peak currents in a multiphase system.
The overall benefit of a multiphase design will only be fully realized when the source impedance of the power supply/ battery is included in the efficiency testing.
The drains of the two top MOSFETS should be placed within 1cm of each other and share a common C and C resonances at V
The selection of C
may produce undesirable voltage and current
IN
.
IN
is driven by the required effective
OUT
(s). Separating the drains
IN
series resistance (ESR). Typically once the ESR require­ment is satisfied the capacitance is adequate for filtering. The output ripple (∆V
∆∆V I ESR
+
OUT L
⎜ ⎝
Where f = operating frequency, C and I
= ripple current in the inductor. The output ripple
L
is highest at maximum input voltage since ∆I with input voltage. With ∆I ripple will typically be less than 50mV at max V
) is determined by:
OUT
1
OUT
= 0.3I
L
⎟ ⎠
= output capacitance,
OUT
8
fC
OUT(MAX)
increases
L
the output
assum-
IN
ing:
Recommended ESR < 2 R
C
OUT
and C
> 1/(8fR
OUT
SENSE
)
SENSE
The first condition relates to the ripple current into the ESR of the output capacitance while the second term guarantees that the output capacitance does not signifi­cantly discharge during the operating frequency period due to ripple current. The choice of using smaller output
capacitance increases the ripple voltage due to the dis­charging term but can be compensated for by using capacitors of very low ESR to maintain the ripple voltage at or below 50mV. The I
pin OPTI-LOOP compensation
TH
components can be optimized to provide stable, high performance transient response regardless of the output capacitors selected.
Manufacturers such as Nichicon, United Chemicon and Sanyo can be considered for high performance through­hole capacitors. The OS-CON semiconductor dielectric capacitor available from Sanyo has the lowest (ESR)(size) product of any aluminum electrolytic at a somewhat higher price. An additional ceramic capacitor in parallel with OS-CON capacitors is recommended to reduce the inductance effects.
In surface mount applications multiple capacitors may need to be used in parallel to meet the ESR, RMS current handling and load step requirements of the application. Aluminum electrolytic, dry tantalum and special polymer capacitors are available in surface mount packages. Spe­cial polymer surface mount capacitors offer very low ESR but have lower storage capacity per unit volume than other capacitor types. These capacitors offer a very cost-effec­tive output capacitor solution and are an ideal choice when combined with a controller having high loop bandwidth. Tantalum capacitors offer the highest capacitance density and are often used as output capacitors for switching regulators having controlled soft-start. Several excellent surge-tested choices are the AVX TPS, AVX TPSV or the KEMET T510 series of surface mount tantalums, available in case heights ranging from 2mm to 4mm. Aluminum electrolytic capacitors can be used in cost-driven applica­tions providing that consideration is given to ripple current ratings, temperature and long term reliability. A typical application will require several to many aluminum electro­lytic capacitors in parallel. A combination of the above mentioned capacitors will often result in maximizing per­formance and minimizing overall cost. Other capacitor types include Nichicon PL series, NEC Neocap, Cornell Dubilier ESRE and Sprague 595D series. Consult manu­facturers for other specific recommendations.
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LTC3728
INTVCC Regulator
An internal P-channel low dropout regulator produces 5V at the INTV
pin from the VIN supply pin. INTVCC powers
CC
the drivers and internal circuitry within the LTC3728. The INTV
pin regulator can supply a peak current of 50mA
CC
and must be bypassed to ground with a minimum of
4.7µF tantalum, 10µF special polymer, or low ESR type electrolytic capacitor. A 1µF ceramic capacitor placed directly adjacent to the INTV
and PGND IC pins is highly
CC
recommended. Good bypassing is necessary to supply the high transient currents required by the MOSFET gate drivers and to prevent interaction between channels.
Higher input voltage applications in which large MOSFETs are being driven at high frequencies may cause the maxi­mum junction temperature rating for the LTC3728 to be exceeded. The system supply current is normally domi­nated by the gate charge current. Additional external loading of the INTV
and 3.3V linear regulators also
CC
needs to be taken into account for the power dissipation calculations. The total INTV either the 5V internal linear regulator or by the EXTV
current can be supplied by
CC
CC
input pin. When the voltage applied to the EXTVCC pin is less than 4.7V, all of the INTV
current is supplied by the
CC
internal 5V linear regulator. Power dissipation for the IC in this case is highest: (V
IN
)(I
), and overall efficiency
INTVCC
is lowered. The gate charge current is dependent on operating frequency as discussed in the Efficiency Consid­erations section. The junction temperature can be esti­mated by using the equations given in Note 2 of the Electrical Characteristics. For example, the LTC3728 V
IN
current is limited to less than 24mA from a 24V supply when not using the EXTV
= 70°C + (24mA)(24V)(95°C/W) = 125°C
T
J
pin as follows:
CC
Use of the EXTVCC input pin reduces the junction tempera­ture to:
T
= 70°C + (24mA)(5V)(95°C/W) = 81°C
J
Dissipation should be calculated to also include any added current drawn from the internal 3.3V linear regulator. To prevent maximum junction temperature from being exceeded, the input supply current must be checked operating in continuous mode at maximum V
IN
.
EXTV
Connection
CC
The LTC3728 contains an internal P-channel MOSFET switch connected between the EXTV When the voltage applied to EXTV
and INTVCC pins.
CC
rises above 4.7V, the
CC
internal regulator is turned off and the switch closes, connecting the EXTV
pin to the INTV
CC
pin thereby
CC
supplying internal power. The switch remains closed as long as the voltage applied to EXTV
remains above 4.5V.
CC
This allows the MOSFET driver and control power to be derived from the output during normal operation (4.7V < V
< 7V) and from the internal regulator when the output
OUT
is out of regulation (start-up, short-circuit). If more current is required through the EXTV
switch than is
CC
specified, an external Schottky diode can be added be­tween the EXTV than 7V to the EXTV
and INTVCC pins. Do not apply greater
CC
pin and ensure that EXTVCC<VIN.
CC
Significant efficiency gains can be realized by powering INTV
from the output, since the VIN current resulting
CC
from the driver and control currents will be scaled by a factor of (Duty Cycle)/(Efficiency). For 5V regulators this supply means connecting the EXTVCC pin directly to V
OUT
. However, for 3.3V and other lower voltage regulators, additional circuitry is required to derive INTV
power
CC
from the output.
The following list summarizes the four possible connec­tions for EXTV
1. EXTVCC Left Open (or Grounded). This will cause INTV
CC:
CC
to be powered from the internal 5V regulator resulting in an efficiency penalty of up to 10% at high input voltages.
2. EXTV
Connected directly to V
CC
. This is the normal
OUT
connection for a 5V regulator and provides the highest efficiency.
3. EXTVCC Connected to an External supply. If an external supply is available in the 5V to 7V range, it may be used to power EXTV
providing it is compatible with the MOSFET
CC
gate drive requirements.
4. EXTV
Connected to an Output-Derived Boost Net-
CC
work. For 3.3V and other low voltage regulators, efficiency gains can still be realized by connecting EXTVCC to an output-derived voltage that has been boosted to greater than 4.7V. This can be done with either the inductive boost
3728fc
17
LTC3728
EXTV
CC
V
IN
TG1
SW
BG1
PGND
LTC3728
R
SENSE
V
OUT
VN2222LL
+
C
OUT
3728 F06b
N-CH
N-CH
+
C
IN
+
1µF
V
IN
L1
BAT85 BAT85
BAT85
0.22µF
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APPLICATIO S I FOR ATIO
winding as shown in Figure 6a or the capacitive charge pump shown in Figure 6b. The charge pump has the advantage of simple magnetics.
Topside MOSFET Driver Supply (CB, DB)
External bootstrap capacitors C
connected to the BOOST
B
pins supply the gate drive voltages for the topside MOSFETs. Capacitor C external diode D
in the functional diagram is charged though
B
from INTVCC when the SW pin is low.
B
When one of the topside MOSFETs is to be turned on, the driver places the C
voltage across the gate-source of the
B
desired MOSFET. This enhances the MOSFET and turns on the topside switch. The switch node voltage, SW, rises to V
and the BOOST pin follows. With the topside MOSFET
IN
on, the boost voltage is above the input supply: V V
IN
+ V
. The value of the boost capacitor CB needs
INTVCC
BOOST
=
to be 100 times that of the total input capacitance of the topside MOSFET(s). The reverse breakdown of the exter­nal Schottky diode must be greater than V
IN(MAX)
. When adjusting the gate drive level, the final arbiter is the total input current for the regulator. If a change is made and the input current decreases, then the efficiency has improved. If there is no change in input current, then there is no change in efficiency.
Output Voltage
The LTC3728 output voltages are each set by an external feedback resistive divider carefully placed across the output capacitor. The resultant feedback signal is
compared with the internal precision 0.800V voltage reference by the error amplifier. The output voltage is given by the equation:
08 1
VV
OUT
.
=+
⎜ ⎝
2
R
1
R
where R1 and R2 are defined in Figure 2.
SENSE
+
/SENSE– Pins
The common mode input range of the current comparator sense pins is from 0V to (1.1)INTV
. Continuous linear
CC
operation is guaranteed throughout this range allowing output voltage setting from 0.8V to 7.7V, depending upon the voltage applied to EXTV
. A differential NPN input
CC
stage is biased with internal resistors from an internal
2.4V source as shown in the Functional Diagram. This requires that current either be sourced or sunk from the SENSE pins depending on the output voltage. If the output voltage is below 2.4V current will flow out of both SENSE pins to the main output. The output can be easily preloaded by the V
resistive divider to compensate for the current
OUT
comparator’s negative input bias current. The maximum current flowing out of each pair of SENSE pins is:
I
SENSE
Since V
+
+ I
OSENSE
SENSE
= (2.4V – V
OUT
)/24k
is servoed to the 0.8V reference voltage, we can choose R1 in Figure 2 to have a maximum value to absorb this current.
V
IN
IN
N-CH
N-CH
+
C
IN
R
SENSE
T1
1:N
OPTIONAL EXTV CONNECTION 5V < V
EXTV
R6
FCB
R5
SGND
Figure 6a. Secondary Output Loop & EXTVCC Connection
CC
< 7V
SEC
LTC3728
CC
V
TG1
SW
BG1
PGND
18
V
SEC
+
1µF
V
OUT
+
C
OUT
3728 F06a
Figure 6b. Capacitive Charge Pump for EXTV
CC
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APPLICATIO S I FOR ATIO
124
for V
=
MAX
()
< 2.4V
OUT
⎜ ⎝
Rk
.
08
.–
VV
24
Regulating an output voltage of 1.8V, the maximum value of R1 should be 32K. Note that for an output voltage above
2.4V, R1 has no maximum value necessary to absorb the sense currents; however, R1 is still bounded by the V
OSENSE
feedback current.
V
OUT
⎞ ⎟
V
3.3V OR 5V RUN/SS
*OPTIONAL TO DEFEAT OVERCURRENT LATCHOFF
IN
RSS*
D1
C
SS
(a) (b)
Figure 7. RUN/SS Pin Interfacing
LTC3728
INTV
CC
RSS*
RUN/SS
3728 F07
C
SS
Soft-Start/Run Function
The RUN/SS1 and RUN/SS2 pins are multipurpose pins that provide a soft-start function and a means to shut down the LTC3728. Soft-start reduces the input power source’s surge currents by gradually increasing the controller’s current limit (proportional to V
). This pin
ITH
can also be used for power supply sequencing.
An internal 1.2µA current source charges up the C
SS
capacitor. When the voltage on RUN/SS1 (RUN/SS2) reaches 1.5V, the particular controller is permitted to start operating. As the voltage on RUN/SS increases from 1.5V to 3.0V, the internal current limit is increased from 25mV/ R
SENSE
to 75mV/R
. The output current limit ramps
SENSE
up slowly, taking an additional 1.25s/µF to reach full current. The output current thus ramps up slowly, reduc­ing the starting surge current required from the input power supply. If RUN/SS has been pulled all the way to ground there is a delay before starting of approximately:
15
.
t
DELAY SS SS
t
IRAMP SS SS
V
=
=
CsFC
12
.
A
µ
315
.
VV
12
.
A
µ
125
./
()
125
CsFC
./
()
By pulling both RUN/SS pins below 1V, the LTC3728 is put into low current shutdown (IQ = 20µA). The RUN/SS pins can be driven directly from logic as shown in Figure
7. Diode D1 in Figure 7 reduces the start delay but allows CSS to ramp up slowly providing the soft-start function. Each RUN/SS pin has an internal 6V zener clamp (See Functional Diagram).
Fault Conditions: Overcurrent Latchoff
The RUN/SS pins also provide the ability to latch off the controller(s) when an overcurrent condition is detected. The RUN/SS capacitor, C
, is used initially to turn on and
SS
limit the inrush current. After the controller has been started and been given adequate time to charge up the output capacitor and provide full load current, the RUN/SS capacitor is used for a short-circuit timer. If the regulator’s output voltage falls to less than 70% of its nominal value after CSS reaches 4.1V, CSS begins discharging on the assumption that the output is in an overcurrent condition. If the condition lasts for a long enough period as deter­mined by the size of the CSS and the specified discharge current, the controller will be shut down until the RUN/SS pin voltage is recycled. If the overload occurs during start­up, the time can be approximated by:
t
[CSS(4.1 – 1.5 + 4.1 – 3.5)]/(1.2µA)
LO1
= 2.7 • 10
If the overload occurs after start-up the voltage on C
6
(CSS)
SS
will
begin discharging from the zener clamp voltage:
t
[CSS (6 – 3.5)]/(1.2µA) = 2.1 • 106 (CSS)
LO2
This built-in overcurrent latchoff can be overridden by providing a pull-up resistor to the RUN/SS pin as shown in Figure 7. This resistance shortens the soft-start period and prevents the discharge of the RUN/SS capacitor during an over current condition. Tying this pull-up resis­tor to V Diode-connecting this pull-up resistor to INTV
as in Figure 7a, defeats overcurrent latchoff.
IN
, as in
CC
Figure 7b, eliminates any extra supply current during controller shutdown while eliminating the INTV
loading
CC
from preventing controller start-up.
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Why should you defeat overcurrent latchoff? During the prototyping stage of a design, there may be a problem with noise pickup or poor layout causing the protection circuit to latch off. Defeating this feature will easily allow troubleshooting of the circuit and PC layout. The internal short-circuit and foldback current limiting still remains active, thereby protecting the power supply system from failure. After the design is complete, a decision can be made whether to enable the latchoff feature.
The value of the soft-start capacitor CSS may need to be scaled with output voltage, output capacitance and load current characteristics. The minimum soft-start capaci­tance is given by:
CSS > (C
OUT
)(V
) (10–4) (R
OUT
SENSE
)
The minimum recommended soft-start capacitor of C
= 0.1µF will be sufficient for most applications.
SS
Fault Conditions: Current Limit and Current Foldback
The LTC3728 current comparator has a maximum sense voltage of 75mV resulting in a maximum MOSFET current of 75mV/R generally occurs with the largest V
. The maximum value of current limit
SENSE
at the highest ambi-
IN
ent temperature, conditions that cause the highest power dissipation in the top MOSFET.
The LTC3728 includes current foldback to help further limit load current when the output is shorted to ground. The foldback circuit is active even when the overload shutdown latch described above is overridden. If the output falls below 70% of its nominal output level, then the maximum sense voltage is progressively lowered from 75mV to 25mV. Under short-circuit conditions with very low duty cycles, the LTC3728 will begin cycle skipping in order to limit the short-circuit current. In this situation the bottom MOSFET will be dissipating most of the power but less than in normal operation. The short-circuit ripple current is determined by the minimum on-time t
ON(MIN)
of the LTC3728 (less than 200ns), the input voltage and inductor value:
I
L(SC)
= t
ON(MIN)
(VIN/L)
The resulting short-circuit current is:
mV
I
25 1
=+
SC
R
SENSE
I
LSC
()
2
Fault Conditions: Overvoltage Protection (Crowbar)
The overvoltage crowbar is designed to blow a system input fuse when the output voltage of the regulator rises much higher than nominal levels. The crowbar causes huge currents to flow, that blow the fuse to protect against a shorted top MOSFET if the short occurs while the controller is operating.
A comparator monitors the output for overvoltage condi­tions. The comparator (OV) detects overvoltage faults greater than 7.5% above the nominal output voltage. When this condition is sensed, the top MOSFET is turned off and the bottom MOSFET is turned on until the overvolt­age condition is cleared. The output of this comparator is only latched by the overvoltage condition itself and will therefore allow a switching regulator system having a poor PC layout to function while the design is being debugged. The bottom MOSFET remains on continuously for as long as the OV condition persists; if V
returns to a safe level,
OUT
normal operation automatically resumes. A shorted top MOSFET will result in a high current condition which will open the system fuse. The switching regulator will regu­late properly with a leaky top MOSFET by altering the duty cycle to accommodate the leakage.
Phase-Locked Loop and Frequency Synchronization
The LTC3728 has a phase-locked loop comprised of an internal voltage controlled oscillator and phase detector. This allows the top MOSFET turn-on to be locked to the rising edge of an external source. The frequency range of the voltage controlled oscillator is ±50% around the center frequency fO. A voltage applied to the PLLFLTR pin of 1.2V corresponds to a frequency of approximately 400kHz. The nominal operating frequency range of the LTC3728 is 250kHz to 550kHz.
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LTC3728
The phase detector used is an edge sensitive digital type which provides zero degrees phase shift between the external and internal oscillators. This type of phase detec­tor will not lock up on input frequencies close to the harmonics of the VCO center frequency. The PLL hold-in range, f
, is equal to the capture range, f
H
C:
fH = ∆fC = ± 0.5 fO (250kHz-550kHz)
The output of the phase detector is a complementary pair of current sources charging or discharging the external filter network on the PLLFLTR pin.
If the external frequency (f lator frequency f
, current is sourced continuously,
0SC
) is greater than the oscil-
PLLIN
pulling up the PLLFLTR pin. When the external frequency is less than f
, current is sunk continuously, pulling
0SC
down the PLLFLTR pin. If the external and internal fre­quencies are the same but exhibit a phase difference, the current sources turn on for an amount of time correspond­ing to the phase difference. Thus the voltage on the PLLFLTR pin is adjusted until the phase and frequency of the external and internal oscillators are identical. At this stable operating point the phase comparator output is open and the filter capacitor C
holds the voltage. The
LP
LTC3728 PLLIN pin must be driven from a low impedance source such as a logic gate located close to the pin. When using multiple LTC3728’s (or LTC3729’s, as shown in Figure 14) for a phase-locked system, the PLLFLTR pin of the master oscillator should be biased at a voltage that will guarantee the slave oscillator(s) ability to lock onto the master’s frequency. A DC voltage of 0.7V to 1.7V applied to the master oscillator’s PLLFLTR pin is recommended in order to meet this requirement. The resultant operating frequency can range from 300kHz to 470kHz.
The loop filter components (C
, RLP) smooth out the
LP
current pulses from the phase detector and provide a stable input to the voltage controlled oscillator. The filter components CLP and RLP determine how fast the loop acquires lock. Typically R
=10k and CLP is 0.01µF to
LP
0.1µF.
Minimum On-Time Considerations
Minimum on-time t
ON(MIN)
is the smallest time duration that the LTC3728 is capable of turning on the top MOSFET. It is determined by internal timing delays and the gate charge required to turn on the top MOSFET. Low duty cycle applications may approach this minimum on-time limit and care should be taken to ensure that
V
t
()
ON MIN
<
Vf
OUT
IN
()
If the duty cycle falls below what can be accommodated by the minimum on-time, the LTC3728 will begin to skip cycles. The output voltage will continue to be regulated, but the ripple voltage and current will increase.
The minimum on-time for the LTC3728 is approximately 100ns. However, as the peak sense voltage decreases the minimum on-time gradually increases up to about 150ns. This is of particular concern in forced continuous applica­tions with low ripple current at light loads. If the duty cycle drops below the minimum on-time limit in this situation, a significant amount of cycle skipping can occur with correspondingly larger current and voltage ripple.
FCB Pin Operation
The FCB pin can be used to regulate a secondary winding or as a logic level input. Continuous operation is forced on both controllers when the FCB pin drops below 0.8V. During continuous mode, current flows continuously in the transformer primary. The secondary winding(s) draw current only when the bottom, synchronous switch is on. When primary load currents are low and/or the V
IN/VOUT
ratio is low, the synchronous switch may not be on for a sufficient amount of time to transfer power from the output capacitor to the secondary load. Forced continuous operation will support secondary windings providing there is sufficient synchronous switch duty factor. Thus, the FCB input pin removes the requirement that power must be drawn from the inductor primary in order to extract
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LTC3728
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APPLICATIO S I FOR ATIO
power from the auxiliary windings. With the loop in continuous mode, the auxiliary outputs may nominally be loaded without regard to the primary output load.
The secondary output voltage V
is normally set as
SEC
shown in Figure 6a by the turns ratio N of the transformer:
(N + 1) V
V
SEC
OUT
However, if the controller goes into Burst Mode operation and halts switching due to a light primary load current, then V V
SEC
VV
will droop. An external resistive divider from
SEC
to the FCB pin sets a minimum voltage V
6
R
5
R
SEC MIN()
08 1
. +
⎜ ⎝
SEC(MIN)
:
where R5 and R6 are shown in Figure 2.
If V temporary continuous switching operation until V
drops below this level, the FCB voltage forces
SEC
SEC
is
again above its minimum.
In order to prevent erratic operation if no external connec­tions are made to the FCB pin, the FCB pin has a 0.18µA internal current source pulling the pin high. Include this current when choosing resistor values R5 and R6.
The following table summarizes the possible states avail­able on the FCB pin:
Table 1
FCB Pin Condition
0V to 0.75V Forced Continuous Both Controllers
(Current Reversal Allowed— Burst Inhibited)
0.85V < V
Feedback Resistors Regulating a Secondary Winding
>4.8V Burst Mode Operation Disabled
< 4.0V Minimum Peak Current Induces
FCB
Burst Mode Operation No Current Reversal Allowed
Constant Frequency Mode Enabled No Current Reversal Allowed
No Minimum Peak Current
Voltage Positioning
Voltage positioning can be used to minimize peak-to-peak output voltage excursions under worst-case transient loading conditions. The open-loop DC gain of the control
loop is reduced depending upon the maximum load step specifications. Voltage positioning can easily be added to the LTC3728 by loading the I
pin with a resistive divider
TH
having a Thevenin equivalent voltage source equal to the midpoint operating voltage range of the error amplifier, or
1.2V (see Figure 8).
The resistive load reduces the DC loop gain while main­taining the linear control range of the error amplifier. The maximum output voltage deviation can theoretically be reduced to half or alternatively the amount of output capacitance can be reduced for a particular application. A complete explanation is included in Design Solutions 10. (See www.linear-tech.com)
INTV
CC
R
T2
I
TH
R
R
Figure 8. Active Voltage Positioning Applied to the LTC3728
C
T1
C
C
LTC3728
3728 F08
Efficiency Considerations
The percent efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Percent efficiency can be expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percentage of input power.
Although all dissipative elements in the circuit produce losses, four main sources usually account for most of the losses in LTC3728 circuits: 1) LTC3728 VIN current (in­cluding loading on the 3.3V internal regulator), 2) INTV
CC
regulator current, 3) I2R losses, 4) Topside MOSFET transition losses.
1. The V
current has two components: the first is the DC
IN
supply current given in the Electrical Characteristics table,
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LTC3728
which excludes MOSFET driver and control currents; the second is the current drawn from the 3.3V linear regulator output. V
2. INTV
current typically results in a small (<0.1%) loss.
IN
current is the sum of the MOSFET driver and
CC
control currents. The MOSFET driver current results from switching the gate capacitance of the power MOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from INTV ground. The resulting dQ/dt is a current out of INTV
CC
CC
that
to
is typically much larger than the control circuit current. In continuous mode, I
GATECHG
=f(QT+QB), where QT and Q
B
are the gate charges of the topside and bottom side MOSFETs.
Supplying INTV from an output-derived source will scale the V
power through the EXTVCC switch input
CC
current
IN
required for the driver and control circuits by a factor of (Duty Cycle)/(Efficiency). For example, in a 20V to 5V application, 10mA of INTVCC current results in approxi­mately 2.5mA of V
current. This reduces the mid-current
IN
loss from 10% or more (if the driver was powered directly from V
3. I
) to only a few percent.
IN
2
R losses are predicted from the DC resistances of the fuse (if used), MOSFET, inductor, current sense resistor, and input and output capacitor ESR. In continuous mode the average output current flows through L and R
SENSE
, but is “chopped” between the topside MOSFET and the synchronous MOSFET. If the two MOSFETs have approxi­mately the same R
, then the resistance of one
DS(ON)
MOSFET can simply be summed with the resistances of L, R R
and ESR to obtain I2R losses. For example, if each
SENSE
= 30m, RL = 50m, R
DS(ON)
= 10m and R
SENSE
ESR
= 40m (sum of both input and output capacitance losses), then the total resistance is 130m. This results in losses ranging from 3% to 13% as the output current increases from 1A to 5A for a 5V output, or a 4% to 20% loss for a 3.3V output. Efficiency varies as the inverse square of V
for the same external components and
OUT
output power level. The combined effects of increasingly lower output voltages and higher currents required by high performance digital systems is not doubling but quadrupling the importance of loss terms in the switching regulator system!
4. Transition losses apply only to the topside MOSFET(s), and become significant only when operating at high input voltages (typically 15V or greater). Transition losses can be estimated from:
Transition Loss = (1.7) V
2
I
IN
O(MAX) CRSS
f
Other “hidden” losses such as copper trace and internal battery resistances can account for an additional 5% to 10% efficiency degradation in portable systems. It is very important to include these “system” level losses during the design phase. The internal battery and fuse resistance losses can be minimized by making sure that CIN has adequate charge storage and very low ESR at the switch­ing frequency. A 25W supply will typically require a mini­mum of 20µF to 40µF of capacitance having a maximum of 20m to 50m of ESR. The LTC3728 2-phase architec­ture typically halves this input capacitance requirement over competing solutions. Other losses including Schottky conduction losses during dead-time and inductor core losses generally account for less than 2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at the load current transient response. Switching regulators take several cycles to respond to a step in DC (resistive) load current. When a load step occurs, V amount equal to ∆I series resistance of C discharge C
generating the feedback error signal that
OUT
(ESR), where ESR is the effective
LOAD
OUT
. ∆I
also begins to charge or
LOAD
shifts by an
OUT
forces the regulator to adapt to the current change and return V time V
to its steady-state value. During this recovery
OUT
can be monitored for excessive overshoot or
OUT
ringing, which would indicate a stability problem. OPTI­LOOP compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values.
The availability of the ITH pin not only allows optimization of control loop behavior but also provides a DC coupled and AC filtered closed loop response test point. The DC step, rise time and settling at this test point truly reflects the closed loop response
. Assuming a pre­dominantly second order system, phase margin and/or damping factor can be estimated using the percentage of
3728fc
23
LTC3728
WUUU
APPLICATIO S I FOR ATIO
overshoot seen at this pin. The bandwidth can also be estimated by examining the rise time at the pin. The I
TH
external components shown in the Figure 1 circuit will provide an adequate starting point for most applications.
The I
series RC-CC filter sets the dominant pole-zero
TH
loop compensation. The values can be modified slightly (from 0.5 to 2 times their suggested values) to optimize transient response once the final PC layout is done and the particular output capacitor type and value have been determined. The output capacitors need to be selected because the various types and values determine the loop gain and phase. An output current pulse of 20% to 80% of full-load current having a rise time of 1µs to 10µs will produce output voltage and ITH pin waveforms that will give a sense of the overall loop stability without breaking the feedback loop. Placing a power MOSFET directly across the output capacitor and driving the gate with an appropriate signal generator is a practical way to produce a realistic load step condition. The initial output voltage step resulting from the step change in output current may not be within the bandwidth of the feedback loop, so this signal cannot be used to determine phase margin. This is why it is better to look at the ITH pin signal which is in the feedback loop and is the filtered and compensated control loop response. The gain of the loop will be increased by increasing RC and the bandwidth of the loop will be increased by decreasing C factor that C
is decreased, the zero frequency will be kept
C
. If RC is increased by the same
C
the same, thereby keeping the phase shift the same in the most critical frequency range of the feedback loop. The output voltage settling behavior is related to the stability of the closed-loop system and will demonstrate the actual overall supply performance.
approximately 25 • C
. Thus a 10µF capacitor would
LOAD
require a 250µs rise time, limiting the charging current to about 200mA.
Automotive Considerations: Plugging into the Cigarette Lighter
As battery-powered devices go mobile, there is a natural interest in plugging into the cigarette lighter in order to conserve or even recharge battery packs during operation. But before you connect, be advised: you are plugging into the supply from hell. The main power line in an automobile is the source of a number of nasty potential transients, including load-dump, reverse-battery, and double-bat­tery.
Load-dump is the result of a loose battery cable. When the cable breaks connection, the field collapse in the alternator can cause a positive spike as high as 60V which takes several hundred milliseconds to decay. Reverse-battery is just what it says, while double-battery is a consequence of tow-truck operators finding that a 24V jump start cranks cold engines faster than 12V.
The network shown in Figure 9 is the most straight forward approach to protect a DC/DC converter from the ravages of an automotive power line. The series diode prevents current from flowing during reverse-battery, while the transient suppressor clamps the input voltage during load-dump. Note that the transient suppressor should not conduct during double-battery operation, but must still clamp the input voltage below breakdown of the converter. Although the LTC3728 has a maximum input voltage of 36V, most applications will be limited to 30V by the MOSFET BVDSS.
A second, more severe transient is caused by switching in loads with large (>1µF) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with C
, causing a rapid drop in V
OUT
. No regulator can
OUT
alter its delivery of current quickly enough to prevent this sudden step change in output voltage if the load switch resistance is low and it is driven quickly. If the ratio of C
LOAD
to C
is greater than1:50, the switch rise time
OUT
should be controlled so that the load rise time is limited to
24
RATING
50A I
PK
12V
TRANSIENT VOLTAGE SUPPRESSOR GENERAL INSTRUMENT
1.5KA24A
Figure 9. Automotive Application Protection
V
IN
LTC3728
3728 F09
3728fc
P
V
V
CC
V A pF kHz
mW
MAIN
=
()
°
[]
()
+
()()( )( )
=
18
22
5 1 0 005 50 25
0 042 1 7 22 5 100 300
220
2
2
.
(. )( )
..
WUUU
APPLICATIO S I FOR ATIO
LTC3728
Design Example
As a design example for one channel, assume V 12V(nominal), V
= 22V(max), V
IN
OUT
= 1.8V, I
MAX
=
IN
= 5A,
and f = 300kHz.
The inductance value is chosen first based on a 30% ripple current assumption. The highest value of ripple current occurs at the maximum input voltage. Tie the PLLFLTR pin to a resistive divider using the INTV
pin generating 1V
CC
for 300kHz operation. The minimum inductance for 30% ripple current is:
I
V
OUT OUT
=
L
()( )
fL
1
⎜ ⎝
V
V
IN
A 4.7µH inductor will produce 23% ripple current and a
3.3µH will result in 33%. The peak inductor current will be the maximum DC value plus one half the ripple current, or
5.84A, for the 3.3µH value. Increasing the ripple current will also help ensure that the minimum on-time of 100ns is not violated. The minimum on-time occurs at maximum VIN:
Choosing 1% resistors; R1 = 25.5k and R2 = 32.4k yields an output voltage of 1.816V.
The power dissipation on the top side MOSFET can be easily estimated. Choosing a Siliconix Si4412DY results in; R
DS(ON)
= 0.042, C
= 100pF. At maximum input
RSS
voltage with T(estimated) = 50°C:
A short-circuit to ground will result in a folded back current of:
()
H
µ
=
32
.
A
and δ = (0.005/°C)(20) =
+
200 22
⎜ ⎝
I
SC
mV ns V
25
=
00112
.
with a typical value of R
33
.
DS(ON)
0.1. The resulting power dissipated in the bottom MOSFET is:
.
t
ON MIN
The R
()
SENSE
VfVV kHz
IN MAX
()
resistor value can be calculated by using the
V
OUT
== =
18 ()
22 300
273
ns
maximum current sense voltage specification with some accommodation for tolerances:
mV
R
SENSE
60
≤≈
584
001..
A
Since the output voltage is below 2.4V the output resistive divider will need to be sized to not only set the output voltage but also to absorb the SENSE pins specified input current.
Rk
124
MAX
()
=
⎜ ⎝
=
K
24
.
08
.–
VV
24
.
08
.–.
VV
24 18
V
V
OUT
⎞ ⎟
=
k
32
⎟ ⎠
P
SYNC
22 1 8
–.
VV
=
22
434
=
mW
V
2
32 11 0042
...
A
()()
()
which is less than under full-load conditions.
CIN is chosen for an RMS current rating of at least 3A at temperature assuming only this channel is on. C
OUT
is
chosen with an ESR of 0.02 for low output ripple. The output ripple in continuous mode will be highest at the maximum input voltage. The output voltage ripple due to ESR is approximately:
V
ORIPPLE
= R
(IL) = 0.02(1.67A) = 33mV
ESR
P–P
3728fc
25
LTC3728
WUUU
APPLICATIO S I FOR ATIO
PC Board Layout Checklist
When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3728. These items are also illustrated graphically in the layout diagram of Figure 10. The Figure 11 illustrates the current waveforms present in the various branches of the 2-phase synchronous regulators operating in the continuous mode. Check the following in your layout:
1. Are the top N-channel MOSFETs M1 and M3 located within 1cm of each other with a common drain connection at C
? Do not attempt to split the input decoupling for the
IN
two channels as it can cause a large resonant loop.
1
RUN/SS1
2
R2
R1
INTV
3.3V
R4R3
3
4
5
f
IN
6
7
CC
8
9
10
11
12
13
14
SENSE1
SENSE1
V
OSENSE1
PLLFLTR
PLLIN
FCB
I
TH1
SGND
3.3V
OUT
I
TH2
V
OSENSE2
SENSE2
SENSE2
+
LTC3728
+
RUN/SS2
PGOOD
TG1
SW1
BOOST1
V
BG1
EXTV
INTV
PGND
BG2
BOOST2
SW2
TG2
28
27
26
25
24
IN
23
22
CC
21
CC
20
19
18
17
16
15
2. Are the signal and power grounds kept separate? The combined LTC3728 signal ground pin and the ground return of C
INTVCC
must return to the combined C
OUT
(–) terminals. The path formed by the top N-channel MOSFET, Schottky diode and the C
capacitor should have short
IN
leads and PC trace lengths. The output capacitor (–) terminals should be connected as close as possible to the (–) terminals of the input capacitor by placing the capaci­tors next to each other and away from the Schottky loop described above.
3. Do the LTC3728 V
OSENSE
nect to the (+) terminals of C must be connected between the (+) terminal of C
R
PU
V
PULL-UP
(<7V)
PGOOD
C
C
B1
+
C
INTVCC
B2
M1 M2
R
IN
C
VIN
V
IN
M3 M4
pins resistive dividers con-
? The resistive divider
OUT
OUT
L1
C
+
L2
R
SENSE
D1
C
OUT1
+
IN
V
OUT1
GND
+
C
OUT2
D2
R
SENSE
V
OUT2
and
26
3728 F10
Figure 10. LTC3728 Recommended Printed Circuit Layout Diagram
3728fc
WUUU
APPLICATIO S I FOR ATIO
LTC3728
SW1
D1
V
IN
R
IN
+
C
IN
BOLD LINES INDICATE HIGH, SWITCHING CURRENT LINES. KEEP LINES TO A MINIMUM LENGTH.
SW2
D2
L1
L2
R
SENSE1
R
SENSE2
C
C
OUT1
OUT2
V
V
+
+
OUT1
OUT2
3728 F11
R
L1
R
L2
Figure 11. Branch Current Waveforms
signal ground. The R2 and R4 connections should not be along the high current input feeds from the input capacitor(s).
4. Are the SENSE– and SENSE+ leads routed together with minimum PC trace spacing? The filter capacitor
+
between SENSE
and SENSE– should be as close as possible to the IC. Ensure accurate current sensing with Kelvin connections at the SENSE resistor.
5. Is the INTVCC decoupling capacitor connected close to the IC, between
the INTVCC and the power ground pins?
This capacitor carries the MOSFET drivers current peaks.
An additional 1µF ceramic capacitor placed immediately next to the INTV
and PGND pins can help improve noise
CC
performance substantially.
6. Keep the switching nodes (SW1, SW2), top gate nodes (TG1, TG2), and boost nodes (BOOST1, BOOST2) away from sensitive small-signal nodes, especially from the opposites channel’s voltage and current sensing feedback pins. All of these nodes have very large and fast moving signals and therefore should be kept on the “output side” of the LTC3728 and occupy minimum PC trace area.
3728fc
27
LTC3728
U
WUU
APPLICATIO S I FOR ATIO
7. Use a modified “star ground” technique: a low imped­ance, large copper area central grounding point on the same side of the PC board as the input and output capacitors with tie-ins for the bottom of the INTV decoupling capacitor, the bottom of the voltage feedback resistive divider and the SGND pin of the IC.
PC Board Layout Debugging
Start with one controller on at a time. It is helpful to use a DC-50MHz current probe to monitor the current in the inductor while testing the circuit. Monitor the output switching node (SW pin) to synchronize the oscilloscope to the internal oscillator and probe the actual output voltage as well. Check for proper performance over the operating voltage and current range expected in the appli­cation. The frequency of operation should be maintained over the input voltage range down to dropout and until the output load drops below the low current operation thresh­old—typically 10% to 20% of the maximum designed current level in Burst Mode operation.
The duty cycle percentage should be maintained from cycle to cycle in a well-designed, low noise PCB imple­mentation. Variation in the duty cycle at a subharmonic rate can suggest noise pickup at the current or voltage sensing inputs or inadequate loop compensation. Over­compensation of the loop can be used to tame a poor PC layout if regulator bandwidth optimization is not required. Only after each controller is checked for their individual performance should both controllers be turned on at the same time. A particularly difficult region of operation is when one controller channel is nearing its current com­parator trip point when the other channel is turning on its top MOSFET. This occurs around 50% duty cycle on either channel due to the phasing of the internal clocks and may cause minor duty cycle jitter.
CC
Short-circuit testing can be performed to verify proper overcurrent latchoff, or 5µA can be provided to the RUN/ SS pin(s) by resistors from V latchoff from occurring.
Reduce V regulator in dropout. Check the operation of the under­voltage lockout circuit by further lowering V toring the outputs to verify operation.
Investigate whether any problems exist only at higher output currents or only at higher input voltages. If prob­lems coincide with high input voltages and low output currents, look for capacitive coupling between the BOOST, SW, TG, and possibly BG connections and the sensitive voltage and current pins. The capacitor placed across the current sensing pins needs to be placed immediately adjacent to the pins of the IC. This capacitor helps to minimize the effects of differential noise injection due to high frequency capacitive coupling. If problems are en­countered with high current output loading at lower input voltages, look for inductive coupling between C and the top MOSFET components to the sensitive current and voltage sensing traces. In addition, investigate com­mon ground path voltage pickup between these compo­nents and the SGND pin of the IC.
An embarrassing problem, which can be missed in an otherwise properly working switching regulator, results when the current sensing leads are hooked up backwards. The output voltage under this improper hookup will still be maintained but the advantages of current mode control will not be realized. Compensation of the voltage loop will be much more sensitive to component selection. This behavior can be investigated by temporarily shorting out the current sensing resistor—don’t worry, the regulator will still maintain control of the output voltage.
from its nominal level to verify operation of the
IN
to prevent the short-circuit
IN
while moni-
IN
, Schottky
IN
28
3728fc
TYPICAL APPLICATIO S
LTC3728
U
0.1µF
180pF
20k 1%
33pF
15k
33pF
15k
20k 1%
180pF
59k
105k, 1%
1000pF
1000pF
63.4k 1%
1000pF
1000pF
3.3V
10
11
12
13
14
1
2
3
4
5
6
7
8
9
RUN/SS1
SENSE1
SENSE1
V
OSENSE1
PLLFLTR
PLLIN
FCB
I
TH1
SGND
3.3V
OUT
I
TH2
V
OSENSE2
SENSE2
SENSE2
+
LTC3728
+
PGOOD
TG1
SW1
BOOST1
V
BG1
EXTV
INTV
PGND
BG2
BOOST2
SW2
TG2
RUN/SS2
1M
100k
V
PULL-UP
1µF 10V
(<7V)
PGOOD
0.1µF
CMDSH-3TR
+
4.7µF
CMDSH-3TR
0.1µF
28
27
26
25
24
IN
23
22
CC
21
CC
20
19
18
17
16
15
MBRS1100T3
M1 M2
10
0.1µF
M3 M4
T1, 1:1.8
10µH
22µF
50V
L1
6.3µH
0.015
D1 MBRM 140T3
150µF, 6.3V
PANASONIC SP
+ +
180µF, 4V
PANASONIC SP
D2 MBRM 140T3
0.01
33µF
25V
+
LT1121
220k
100k
V
IN
7V TO 28V
V
OUT2
3.3V 5A; 6A PEAK
V
OUT1
5V
8
3A; 4A PEAK
5
ON/OFF
123
V
OUT3
12V 120mA
+
1µF 25V
GND
0.1µF
VIN: 7V TO 28V
: 5V, 3A/3.3V, 5A/12V, 120mA
V
OUT
SWITCHING FREQUENCY = 250kHz MI, M2, M3, M4: NDS8410A L1: SUMIDA CEP123-6R3MC T1: 10µH 1:1.8 — DALE LPE6562-A262 GAPPED E-CORE OR BH ELECTRONICS #501-0657 GAPPED TOROID
Figure 12. LTC3728 High Efficiency Low Noise 5V/3A, 3.3V/5A, 12V/120mA Regulator
3728 F12
3728fc
29
LTC3728
TYPICAL APPLICATIO S
1
RUN/SS1
0.1µF
27pF
20k 1%
10k
33pF
15k
33pF
15k
20k 1%
27pF
0.01µF
220pF
220pF
105k
1%
63.4k 1%
1000pF
1000pF
f
3.3V
1000pF
SYNC
2
3
4
5
6
7
8
9
10
11
12
13
14
SENSE1
SENSE1
V
OSENSE1
PLLFLTR
PLLIN
FCB
I
TH1
SGND
3.3V
I
TH2
V
OSENSE2
SENSE2
SENSE2
U
OUT
+
LTC3728
+
PGOOD
TG1
SW1
BOOST1
V
BG1
EXTV
INTV
PGND
BG2
BOOST2
SW2
TG2
RUN/SS2
V
PULL-UP
CMDSH-3TR
1µF 10V
(<7V)
PGOOD
0.1µF
+
4.7µF
CMDSH-3TR
0.1µF
10
0.1µF
M1
M2
L1
8µH
22µF
50V
L2
8µH
0.015
47µF
6.3V
56µF, 4V
0.015
V
OUT1
5V 3A; 4A PEAK
+ +
GND
V
IN
5.2V TO 28V
V
OUT2
3.3V 3A; 4A PEAK
28
27
26
25
24
IN
23
22
CC
21
CC
20
19
18
17
16
15
0.1µF
VIN: 5.2V TO 28V V
: 5V, 4A/3.3V, 4A
OUT
SWITCHING FREQUENCY = 250kHz TO 550kHz MI, M2: FDS6982S
L1, L2: 8µH SUMIDA CEP1238R0MC OUTPUT CAPACITORS: PANASONIC SP SERIES
Figure 13. LTC3728 5V/4A, 3.3V/4A Regulator with External Frequency Synchronization
3728 F13
3728fc
30
PACKAGE DESCRIPTIO
U
(For purposes of clarity, drawings are not to scale)
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
9.90 – 10.50* (.390 – .413)
1.25 ±0.12
2526 22 21 20 19 181716 1523242728
LTC3728
5.50 ±0.05
4.10 ±0.05
3.50 REF
(4 SIDES)
7.8 – 8.2
0.42 ±0.03 0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
5.00 – 5.60** (.197 – .221)
0.55 – 0.95
(.022 – .037)
MILLIMETERS
(INCHES)
0.70 ±0.05
3.45 ± 0.05
0.09 – 0.25
(.0035 – .010)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE *
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDE
**
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
3.45 ± 0.05
5.3 – 5.7
12345678 9 10 11 12 1413
0° – 8°
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
UH32 Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693 Rev D)
0.75 ± 0.05
PIN 1 TOP MARK (NOTE 6)
5.00 ± 0.10 (4 SIDES)
R = 0.05
0.00 – 0.05
3.50 REF
(4-SIDES)
7.40 – 8.20
(.291 – .323)
2.0
(.079)
MAX
0.05
(.002)
MIN
G28 SSOP 0204
BOTTOM VIEW—EXPOSED PAD
TYP
R = 0.115
3.45 ± 0.10
TYP
3.45 ± 0.10
PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER
32
31
0.40 ± 0.10
1
2
PACKAGE
0.25 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.50 BSC
OUTLINE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
(UH32) QFN 0406 REV D
0.50 BSC
3728fc
31
LTC3728
TYPICAL APPLICATIO
OPEN
90°
90°
PHASMD
LTC3729
CLKOUT
LTC3728
PLLIN
TG1
TG2
U1
TG1
TG2
U2
U
I
IN
C
O
O
O
IN
/30A
/15A
/15A
I
1
0°
180°
90°
270°
BUCK: 2.5V/15A
BUCK: 2.5V/15A
I
2
I
3
BUCK: 1.5V/15A
BUCK: 1.8V/15A
I
4
2.5V
1.5V
1.8V
3728 F14
Figure 14. Multioutput PolyPhase Application
12V
IN
*
I
IN
I
1
I
2
I
3
I
4
*INPUT RIPPLE CURRENT CANCELLATION INCREASES THE RIPPLE FREQUENCY AND REDUCES THE RMS INPUT RIPPLE CURRENT THUS, SAVING INPUT CAPACITORS
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SENSE
Linear Technology Corporation
32
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
in SO-8
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Controller
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OUT
IN
Controller with Digital 5-Bit Interface 0.925V ≤ V
Components, V
www.linear.com
, Power Good Output Signal, Synchronizable,
OUT
36V, I
IN
up to 20A, 0.8V ≤ V
OUT
, PGOOD
OUT1
3.5V, Current Mode Ensures
IN
36V
36V
IN
2V, 4V VIN 36V, I
OUT
up to 36V
IN
© LINEAR TECHNOLOGY CORPORATION 2006
5V
OUT
up to 36V
IN
36V
(0.9)(VIN),
OUT
up to 20A
OUT
LT 0406 REV C • PRINTED IN USA
3728fc
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