LINEAR TECHNOLOGY LTC3426 Technical data

FEATURES
Internal 2A MOSFET Switch
1.2MHz Switching Frequency
Low 1.6V VIN Operation
Low R
Delivers 5V at 800mA from a 3.3V Input
Delivers 3.3V at 800mA from a 2.5V Input
Uses Small, Low Profile External Components
Low Profile (1mm) SOT-23 (ThinSOTTM) Package
Switch: 100m at 5V Output
DS(ON)
U
APPLICATIO S
White LED Driver Supply
Local 3.3V or 5V Supply
Battery Back-Up
LTC3426
1.2MHz Step-Up DC/DC Converter in SOT-23
U
DESCRIPTIO
®
The LTC output voltage of up to 5.5V from an input voltage as low as 1.6V. Ideal for applications where space is limited, it switches at 1.2MHz, allowing the use of tiny, low cost and low profile external components. Its internal 2A, 100m NMOS switch provides high efficiency even at heavy load, while the constant frequency, current mode architecture results in low, predictable output noise that is easy to filter.
Antiringing circuitry reduces EMI concerns by damping the inductor while in discontinuous mode, and internal soft-start eases inrush current worries. Internal frequency compensation is designed to accommodate ceramic out­put capacitors, further reducing noise. The device features very low shutdown current of 0.5µA.
3426 step-up switching regulator generates an
TYPICAL APPLICATIO
3.3V to 5V Boost Converter Efficiency
V
3.3V
IN
10µF
2.2µH
V
SHDN
SW
IN
LTC3426
GND
V
OUT
FBOFF ON
U
22µF
3426 TA01
V
OUT
5V 800mA
The LTC3426 is available in the 6-lead SOT-23 package.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 6498466, 6611131
100
VIN = 3.3V
95
= 5V
V
OUT
90
85
80
75
70
EFFICIENCY (%)
65
60
55
50
1
10 100 1000
LOAD CURRENT (mA)
3426 TA01b
3426fa
1
LTC3426
W
O
A
(Note 1)
LUTEXI TIS
S
VIN Voltage ................................................. –0.3V to 6V
SW Voltage .................................................. – 0.3V to 6V
SHDN, FB Voltage ....................................... – 0.3V to 6V
V
........................................................... – 0.3V to 6V
OUT
Operating Temperature Range (Note 2) .. –40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec)................ 300°C
A
WUW
U
ARB
G
PACKAGE/ORDER I FOR ATIO
TOP VIEW
SW 1
GND 2
FB 3
S6 PACKAGE
6-LEAD PLASTIC TSOT-23
T
= 125°C, θJA = 165°C/W, θJC = 102°C/W
JMAX
ORDER PART NUMBER
UU
6 V
IN
5 V
OUT
4 SHDN
W
S6 PART NUMBER
LTC3426ES6 LTAJT
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
U
CO VERTER CHARACTERISTICS
temperature range, otherwise specifications are at T
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range SHDN = V
Output Voltage Adjust Range 2.25 5 V
Feedback Voltage
Feedback Input Current VFB = 1.23V 0.1 µA
Quiescent Current (Shutdown) V
Quiescent Current SHDN = VIN, Not Switching 600 1000 µA
Switch Leakage VSW = 5V 0.2 10 µA
Switch On Resistance V
Current Limit
Maximum Duty Cycle VFB = 1.15V 80 85 %
Switching Frequency
SHDN Input High 1V
SHDN Input Low 0.4 V
SHDN Input Current SHDN = 5.5V 1 µA
V
SHDN
OUT OUT
A
IN
= 0V, Not Including Switch Leakage 1 µA
= 3.3V 0.11 = 5V 0.10
The ● denotes the specifications which apply over the full operating
= 25°C. VIN = 1.8V, V
= 3.3V, unless otherwise specified.
OUT
1.6 V
1.173 1.22 1.247 V
2 2.3 A
0.85 1.2 1.5 MHz
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: The LTC3426 is guaranteed to meet performance specifications from 0°C to 85°C. Specifications over the –40°C to 85°C operating temperature are assured by design, characterization and correlation with statistical process controls.
2
Note 3: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
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UW
TYPICAL PERFOR A CE CHARACTERISTICS
Oscillator Frequency vs Temperature
1.40
1.3
1.2
FREQUENCY (MHz)
1.1
1.0 –30 –10 10 30
–50
TEMPERATURE (°C)
50 70 90
3426 G01
Efficiency vs V
100
FIGURE 1 CIRCUIT
98
= 25°C
T
A
= 150mA
I
LOAD
96
= 5V
V
OUT
= 22µF
C
OUT
94
L = 2.2µH
92
90
88
EFFICIENCY (%)
86
84
82
80
1.8
2.2
2.6
IN
3 3.4
VIN (V)
3.8
LT1108 • TPC12
4.2
I
OUT(MAX)
1.3 FIGURE 1 CIRCUIT
T V
1.1 C
L = 2.2µH
0.9
(A)
OUT(MAX)
0.7
I
0.5
0.3
1.8
= 25°C
A OUT OUT
vs V
= 5V = 22µF
2.6 3 3.4
2.2
LTC3426
IN
3.8 4.2
VIN (V)
3426 G03
0.15
0.14
0.13
0.12
0.11
()
0.10
DS(ON)
0.09
R
0.08
0.07
0.06
0.05
R
–50
vs Temperature
DS(ON)
–25
TEMPERATURE (°C)
1V/DIV
50mA/DIV
V
= 2.5V
OUT
V
= 5V
OUT
V
= 3.3V
OUT
0
25 50
75
100
3426 G04
SW Pin Antiringing Operation
SW
I
L
V
= 1.8V
IN OUT
= 3.3V
100ns/DIVV
FB Pin Voltage
1.25
1.24
1.23
1.22
FB VOLTAGE (V)
1.21
1.20
1.19 –50
–25
3426 G07
02550
TEMPERATURE (°C)
V
OUT
500mV/DIV
I
OUT
200mA/DIV
I
L
500mA/DIV
500mV/DIV
200mA/DIV
75 100
3426 G05
Transient Response
V
OUT
250mA
= 3.3V
V
OUT
= 22µF
C
OUT
L = 2.5µH
40µs/DIVVIN = 1.8V
Switching Waveforms
V
OUT
SW
2V/DIV
I
L
= 1.8V
IN
= 3.3V
V
OUT
= 22µF
C
OUT
L = 2.5µH
500mA
3426 G08
100ns/DIVV
3426 G06
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3
LTC3426
U
UU
PI FU CTIO S
SW (Pin 1): Switch Pin. Connect inductor between SW and V
. A Schottky diode is connected between SW and V
IN
OUT
. Keep these PCB trace lengths as short and wide as possible to reduce EMI and voltage overshoot. If the inductor current falls to zero, an internal 100 antiringing switch is connected from SW to V
to minimize EMI.
IN
GND (Pin 2): Signal and Power Ground. Provide a short direct PCB path between GND and the (–) side of the output capacitor(s).
FB (Pin 3): Feedback Input to the g
Error Amplifier.
m
Connect resistor divider tap to this pin. The output voltage can be adjusted from 2.5V to 5V by:
R
1
V
=+
OUT
122 1
.•
⎜ ⎝
⎞ ⎟
R
2
W
BLOCK DIAGRA
SHDN (Pin 4): Logic Controlled Shutdown Input.
SHDN = High: Normal free running operation
SHDN = Low: Shutdown, quiescent current < 1µA
Typically, SHDN should be connected to VIN through a 1M pull-up resistor.
(Pin 5): Output Voltage Sense Input. The NMOS
V
OUT
switch gate drive is derived from the greater of V V
.
IN
(Pin 6): Input Supply. Must be locally bypassed.
V
IN
OUT
and
1.22V
REFERENCE
V
OUT
SHDN
4
3
FB
R1 (EXTERNAL)
FB
R2 (EXTERNAL)
SHUTDOWN AND
SOFT-START
V
OUT
+
A1
R
C
C
C
GENERATOR
1.2MHz
OSCILLATOR
COMPARATOR
A2
+
Σ
RAMP
Figure 1
5
PWM LOGIC AND DRIVER
V
IN
6
SW
1
+
0.02
2
3426 F01
GND
4
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OPERATIO
LTC3426
U
The LTC3426 is a monolithic 1.2MHz boost converter housed in a 6-lead SOT-23 package. The device features fixed frequency, current mode PWM control for excellent line and load regulation. The low R enables the device to maintain high efficiency over a wide range of load current. Operation of the feedback loop which sets the peak inductor current to keep the output in regulation can be best understood by referring to the Block Diagram in Figure 1. At the start of each clock cycle a latch in the PWM logic is set and the NMOS switch is turned on. The sum of a voltage proportional to the switch current and a slope compensating voltage ramp is fed to the positive input to the PWM comparator. When this voltage exceeds either a voltage proportional to the 2A current limit or the PWM control voltage, the latch in the PWM logic is reset and NMOS switch is turned off. The PWM
NMOS switch
DS(ON)
WUUU
APPLICATIO S I FOR ATIO
Setting the Output Voltage
The output voltage, V
to ground. The divider tap is tied to the FB pin. V
V
OUT
is set by the formula:
V
=+
OUT
122 1
.•
⎜ ⎝
, is set by a resistive divider from
OUT
R
1
⎞ ⎟
R
2
OUT
control voltage at the output of the error amplifier is the amplified and compensated difference between the feed­back voltage on the FB pin and the internal reference voltage of 1.22V. If the control voltage increases, more current is delivered to the output. When the control voltage exceeds the I limited to a minimum of 2A. The current limit helps protect the LTC3426 internal switch and external components connected to it. If the control voltage decreases, less current is delivered to the output. During load transients control voltage may decrease to the point where no switching occurs until the feedback voltage drops below the reference. The LTC3426 has an integrated soft-start feature which slowly ramps up the feedback control node from 0V. The soft-start is initiated when SHDN is pulled high.
to reduce the I handle the peak inductor current without saturating.
Several inductor manufacturers are listed in Table 1.
Table 1. Inductor Manufacturers
Sumida www.sumida.com
reference voltage, the peak current is
LIMIT
2
R power losses, and must be able to
TDK www.tdk.com
Murata www.murata.com
Inductor Selection
The LTC3426 can utilize small surface mount inductors due to its 1.2MHz switching frequency. A 1.5µH or 2.2µH inductor will be the best choice for most LTC3426 appli­cations. Larger values of inductance will allow greater output current capability by reducing the inductor ripple current. Increasing the inductance above 3.3µH will in­crease component size while providing little improve­ment in output current capability. The inductor current ripple is typically set for 20% to 40% of the maximum inductor current (IP). High frequency ferrite core inductor materials reduce frequency dependent power losses com­pared to cheaper powdered iron types, improving effi­ciency. The inductor should have low DCR (DC resistance)
Output and Input Capacitor Selection
Low ESR (equivalent series resistance) capacitors should be used to minimize the output voltage ripple. Multilayer ceramic capacitors are an excellent choice as they have extremely low ESR and are available in small footprints. A 15µF to 30µF output capacitor is sufficient for most applications. X5R and X7R dielectric materials are pre­ferred for their ability to maintain capacitance over wide voltage and temperature ranges.
Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the input supply. It follows that ceramic capacitors are also a good choice for input decoupling and should be located as close as
3426fa
5
LTC3426
WUUU
APPLICATIO S I FOR ATIO
possible to the device. A 10µF input capacitor is sufficient for most applications. Table 2 shows a list of several ceramic capacitor manufacturers. Consult the manufac­turers for detailed information in their entire selection of ceramic parts.
Table 2. Ceramic Capacitor Manufacturers
Taiyo Yuden www.t-yuden.com
Murata www.murata.com
TDK www.component.tdk.com
Diode Selection
A Schottky diode is recommended for use with the LTC3426. Use of a low forward voltage diode such as the ON Semiconductor MBRA210LT3 is recommended. A Schot­tky diode rated at 2A is recommended for use with the LTC3426.
PCB Layout Guidelines
The high speed operation of the LTC3426 demands careful attention to board layout. You will not get advertised performance with careless layout. Figure 2 shows the recommended component placement. A large ground pin copper area will help to lower the chip temperature.
V
IN
6
SW
GND
FB
V
V
OUT
SHDN
IN
5
4
V
OUT
3426 F02
1
2
3
Figure 2. Recommended Component Placement for Single Layer Board
6
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TYPICAL APPLICATIO S
L1
C1 10µF
2.2µH
V
SHDN
L1
1.5µH
V
SHDN
V
IN
3.3V
C1 10µF
C1: TAIYO YUDEN X5R JMK212BJ475ML C2: TAIYO YUDEN X5R JMK316BJ226ML D1: ON SEMICONDUCTOR MBRA210LT3 L1: COILCRAFT D03316P-222
V
IN
1.8V
C1: TDK C1608X5R0J106M C2: TAIYO YUDEN JMK316BJ226ML D1: ON SEMICONDUCTOR MBRM120LT3 L1: TDK RLF7030T-1R5N6R1
SW
IN
LTC3426
GND
IN
LTC3426
GND
V
SW
V
D1
OUT
FBOFF ON
D1
OUT
FBOFF ON
U
R1
95.3k 1%
R2
30.9k 1%
R1
64.9k 1%
R2
61.9k 1%
C2 22µF
3426 TA02a
C2 22µF
3426 TA03a
V 5V 800mA
V
OUT
2.5V 800mA
OUT
100
95
90
85
80
75
70
EFFICIENCY (%)
65
60
55
50
1
100
90
80
70
EFFICIENCY (%)
60
50
1
LTC3426
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA02b
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA03b
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7
LTC3426
TYPICAL APPLICATIO S
V
3V TO 4.2V
V
2.5V
L1
C1 10µF
C1 10µF
2.2µH
V
SHDN
L1
2.5µH
V
SHDN
SW
IN
LTC3426
GND
SW
IN
LTC3426
GND
IN
C1: TDK C1608X5R0J475M C2: TAIYO YUDEN JMK316BJ226ML D1: ON SEMICONDUCTOR MBR120VLSFT1 L1: SUMIDA CDRH4D28-2R2 2
IN
C1: TDK C1608X5R0J106 C2: TAIYO YUDEN JMK316BJ266 D1: ON SEMICONDUCTOR MBRM120LT3 L1: SUMIDA CDRH5D28-2R5 2
D1
V
OUT
FBOFF ON
D1
V
OUT
FBOFF ON
U
R1
95.3k 1%
R2
30.9k 1%
R1 75k 1%
R2
44.2k 1%
V
OUT
5V 750mA AT 3V
C2 22µF
3426 TA04a
V
OUT
3.3V 800mA
C2 22µF
3426 TA05a
100
95
90
85
80
75
70
EFFICIENCY (%)
65
60
55
50
1
100
90
80
70
EFFICIENCY (%)
60
50
1
Efficiency
VIN = 4.2V
VIN = 3V
10 100 1000
LOAD CURRENT (mA)
3426 TA04b
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA05b
8
3426fa
TYPICAL APPLICATIO S
L1
C1 10µF
C1 10µF
1.5µH
V
SHDN
L1
2.2µH
V
SHDN
IN
IN
V
IN
1.8V
C1: TDK C1608X5R0J106M C2: TAIYO YUDEN JMK316BJ226ML D1: ON SEMICONDUCTOR MBRM120LT3 L1: TDK RLF7030T-1R5N6R1
V
IN
1.8V
C1: TDK C1608X5R0J475M C2: TAIYO YUDEN JMK316BJ226ML D1: ON SEMICONDUCTOR MBR120VLSFT1 L1: SUMIDA CDRH4D28-2R2 2
SW
LTC3426
GND
SW
LTC3426
GND
D1
V
OUT
FBOFF ON
D1
V
OUT
FBOFF ON
U
R1 75k 1%
R2
44.2k 1%
R1
95.3k 1%
R2
30.9k 1%
C2 22µF
3426 TA06a
C2 22µF
3426 TA07a
V
OUT
3.3V 540mA
V
OUT
5V 400mA
100
90
80
70
EFFICIENCY (%)
60
50
1
90
80
70
60
EFFICIENCY (%)
50
40
1
LTC3426
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA06b
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA07b
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9
LTC3426
TYPICAL APPLICATIO S
L1
C1 10µF
2.5µH
V
SHDN
IN
V
IN
2.5V
C1: TDK C1608X5R0J106 C2: TAIYO YUDEN JMK316BJ266 D1: ON SEMICONDUCTOR MBRM120LT3 L1: SUMIDA CDRH5D28-2R5
SW
LTC3426
GND
D1
V
OUT
FBOFF ON
U
R1
95.3k 1%
R2
30.9k 1%
C2 22µF
3426 TA08a
V
OUT
5V 550mA
100
90
80
70
EFFICIENCY (%)
60
50
1
Efficiency
10 100 1000
LOAD CURRENT (mA)
3426 TA08b
10
3426fa
PACKAGE DESCRIPTIO
LTC3426
U
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B)
0.62 MAX
3.85 MAX
2.62 REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
0.95 REF
1.22 REF
1.4 MIN
0.30 – 0.50 REF
2.80 BSC
0.09 – 0.20 (NOTE 3)
1.50 – 1.75 (NOTE 4)
1.00 MAX
0.95 BSC
0.80 – 0.90
PIN ONE ID
2.90 BSC (NOTE 4)
1.90 BSC
0.30 – 0.45 6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3426fa
11
LTC3426
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< 1µA, MS8
SD
< 1µA, ThinSOT
SD
< 1µA, MS10
SD
< 1µA, QFN24
SD
< 1µA, QFN32
SD
< 1µA, ThinSOT
SD
OUT(MAX)
OUT(MAX)
= 34V, IQ = 0.9mA, ISD < 6µA, TSSOP16E
OUT(MAX)
= 34V, IQ = 3mA,
OUT(MAX)
= 34V, IQ = 3.2mA,
OUT(MAX)
= 5V, IQ = 19µA/300µA,
= 5.5V, IQ = 38µA,
= 5.25V, IQ = 12µA,
OUT(MAX)
= 5.25V, IQ = 12µA,
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= 5V, IQ = 20µA,
OUT(MAX)
LTC3459 75mA (ISW), 10V Micropower Synchronous Boost VIN: 1.5V to 5.5V, V
Converter in ThinSOT
LTC3464 85mA (ISW), High Efficiency Step-Up DC/DC Converter VIN: 2.3V to 10V, V
with Schottky and PNP Disconnect
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OUT(MAX)
= 34V, IQ = 25µA, ISD < 1µA, ThinSOT
OUT(MAX)
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
3426fa
LT 0307 REV A • PRINTED IN THE USA
© LINEAR TECHNOLOGY CORPORATION 2004
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