The LTC®2280 is a 10-bit 105Msps, low noise 3V dual
A/D converter designed for digitizing high frequency, wide
dynamic range signals. The LTC2280 is perfect for
demanding imaging and communications applications
with AC performance that includes 61.6dB SNR and 85dB
SFDR for signals at the Nyquist frequency.
DC specs include ±0.1LSB INL (typ), ±0.1LSB DNL (typ)
and ±0.6LSB INL, ±0.6LSB DNL over temperature. The
transition noise is a low 0.08LSB
A single 3V supply allows low power operation. A separate
output supply allows the outputs to drive 0.5V to 3.6V
logic.
A single-ended CLK input controls converter operation. An
optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
RMS
.
■
Wireless and Wired Broadband Communication
■
Imaging Systems
■
Spectral Analysis
■
Portable Instrumentation
U
TYPICAL APPLICATIO
ANALOG
INPUT A
CLK A
CLK B
ANALOG
INPUT B
+
INPUT
S/H
–
CLOCK/DUTY CYCLE
CONTROL
CLOCK/DUTY CYCLE
CONTROL
+
INPUT
S/H
–
10-BIT
PIPELINED
ADC CORE
10-BIT
PIPELINED
ADC CORE
OUTPUT
DRIVERS
OUTPUT
DRIVERS
2280 TA01
OV
D9A
•
•
•
D0A
OGND
MUX
OV
D9B
•
•
•
D0B
OGND
SNR vs Input Frequency,
DD
SNR (dBFS)
DD
65
64
63
62
61
60
59
58
57
56
55
0
–1dB, 2V Range
100
50
INPUT FREQUENCY (MHz)
150
200
2280 TA02
2280fa
1
LTC2280
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WW
W
U
ABSOLUTE AXIU RATIGS
OVDD = VDD (Notes 1, 2)
Supply Voltage (VDD) ................................................. 4V
Digital Output Ground Voltage (OGND) ....... –0.3V to 1V
Analog Input Voltage (Note 3) ..... –0.3V to (V
Digital Input Voltage .................... –0.3V to (V
Digital Output Voltage ................ –0.3V to (OV
Power Dissipation............................................ 1500mW
Operating Temperature Range
LTC2280C ............................................... 0°C to 70°C
LTC2280I.............................................–40°C to 85°C
Storage Temperature Range ..................–65°C to 125°C
+ 0.3V)
DD
+ 0.3V)
DD
+ 0.3V)
DD
UUW
PACKAGE/ORDER IFORATIO
TOP VIEW
DD
64 GND
63 VDD62 SENSEA
61 VCMA
60 MODE
59 SHDNA
58 OEA
57 OFA
56 DA9
55 DA8
54 DA7
53 DA6
52 DA5
51 DA4
50 OGND
49 OV
1
A
INA+
–
2
A
INA
REFHA 3
REFHA 4
REFLA 5
REFLA 6
7
V
DD
8
CLKA
CLKB 9
10
V
DD
REFLB 11
REFLB 12
REFHB 13
REFHB 14
–
15
A
INB
+
16
A
INB
19
17
18
DD
V
GND
SENSEB
64-LEAD (9mm × 9mm) PLASTIC QFN
EXPOSED PAD (PIN 65) IS GND AND MUST BE SOLDERED TO PCB
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
*The temperature grade is identified by a label on the shipping container.
U
CO VERTER CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETERCONDITIONSMINTYPMAXUNITS
Resolution (No Missing Codes)●10Bits
Integral Linearity ErrorDifferential Analog Input (Note 5)●–0.6±0.10.6LSB
Differential Linearity ErrorDifferential Analog Input●–0.6±0.10.6LSB
Offset Error(Note 6)●–12±212mV
Gain ErrorExternal Reference●–2.5±0.52.5%FS
Offset Drift±10µV/°C
Full-Scale DriftInternal Reference±30ppm/°C
External Reference±5ppm/°C
Gain MatchingExternal Reference±0.3%FS
Offset Matching±2mV
Transition NoiseSENSE = 1V0.08LSB
The ● denotes the specifications which apply over the full operating
Sample-and-Hold Acquisition Delay Time Jitter0.2ps
Full Power BandwidthFigure 8 Test Circuit575MHz
W
DYAIC ACCURACY
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4)
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
SNRSignal-to-Noise Ratio5MHz Input61.6dB
SFDRSpurious Free Dynamic Range5MHz Input85dB
2nd or 3rd Harmonic
SFDRSpurious Free Dynamic Range5MHz Input85dB
4th Harmonic or Higher
S/(N+D)Signal-to-Noise Plus Distortion Ratio5MHz Input61.6dB
I
MD
Intermodulation DistortionfIN = 40MHz, 41MHz85dB
CrosstalkfIN = 100MHz–110dB
The ● denotes the specifications which apply over the full operating temperature range, otherwise
+
–
–A
IN
)2.85V < V
IN
+
–
+A
)/2Differential Input Drive (Note 7)●11.51.9V
IN
IN
Single Ended Input Drive (Note 7)
< 3.4V (Note 7)●±0.5V to ±1VV
DD
●0.51.52V
+
–
, A
< V
IN
IN
DD
DD
●–11µA
●–33µA
RMS
The ● denotes the specifications which apply over the full operating temperature range,
30MHz Input61.6dB
70MHz Input●6061.5dB
140MHz Input61.4dB
30MHz Input85dB
70MHz Input●7083dB
140MHz Input77dB
30MHz Input85dB
70MHz Input●7685dB
140MHz Input85dB
30MHz Input61.6dB
70MHz Input●6061.5dB
140MHz Input61.3dB
2280fa
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LTC2280
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UUU
I TER AL REFERE CE CHARACTERISTICS
PARAMETERCONDITIONSMINTYPMAXUNITS
VCM Output VoltageI
VCM Output Tempco±25ppm/°C
VCM Line Regulation2.85V < VDD < 3.4V3mV/V
VCM Output Resistance–1mA < I
= 01.4751.5001.525V
OUT
(Note 4)
< 1mA4Ω
OUT
UU
DIGITAL I PUTS A D DIGITAL OUTPUTS
full operating temperature range, otherwise specifications are at T
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
LOGIC INPUTS (CLK, OE, SHDN, MUX)
V
IH
V
IL
I
IN
C
IN
LOGIC OUTPUTS
OVDD = 3V
C
OZ
I
SOURCE
I
SINK
V
OH
V
OL
OV
= 2.5V
DD
V
OH
V
OL
OVDD = 1.8V
V
OH
V
OL
High Level Input VoltageVDD = 3V●2V
Low Level Input VoltageVDD = 3V●0.8V
Input CurrentVIN = 0V to V
Input Capacitance(Note 7)3pF
Hi-Z Output CapacitanceOE = High (Note 7)3pF
Output Source CurrentV
Output Sink CurrentV
High Level Output VoltageIO = –10µA2.995V
Low Level Output VoltageIO = 10µA0.005V
High Level Output VoltageIO = –200µA2.49V
Low Level Output VoltageIO = 1.6mA0.09V
High Level Output VoltageIO = –200µA1.79V
Low Level Output VoltageIO = 1.6mA0.09V
= 25°C. (Note 4)
A
= 0V50mA
OUT
= 3V50mA
OUT
= –200µA●2.72.99V
I
O
I
= 1.6mA●0.090.4V
O
The ● denotes the specifications which apply over the
DD
●–1010µA
4
2280fa
LTC2280
www.BDTIC.com/LINEAR
WU
POWER REQUIRE E TS
range, otherwise specifications are at T
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
V
DD
OV
IV
P
DISS
P
SHDN
P
NAP
DD
DD
Analog Supply Voltage(Note 9)●2.8533.4V
Output Supply Voltage(Note 9)●0.533.6V
Supply CurrentBoth ADCs at f
Power DissipationBoth ADCs at f
Shutdown Power (Each Channel)SHDN = H, OE = H, No CLK2mW
Nap Mode Power (Each Channel)SHDN = H, OE = L, No CLK15mW
= 25°C. (Note 8)
A
The ● denotes the specifications which apply over the full operating temperature
S(MAX)
S(MAX)
●180210mA
●540630mW
UW
TI I G CHARACTERISTICS
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
f
s
t
L
t
H
t
AP
t
D
t
MD
Pipeline Latency5Cycles
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to ground with GND and OGND
wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above V
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: V
drive, unless otherwise noted.
DD
Sampling Frequency(Note 9)●1105MHz
CLK Low TimeDuty Cycle Stabilizer Off (Note 7)●4.54.76500ns
CLK High TimeDuty Cycle Stabilizer Off (Note 7)●4.54.76500ns
Sample-and-Hold Aperture Delay0ns
CLK to DATA DelayCL = 5pF (Note 7)●1.42.75.4ns
MUX to DATA DelayCL = 5pF (Note 7)●1.42.75.4ns
Data Access Time After OE↓CL = 5pF (Note 7)●4.310ns
BUS Relinquish Time(Note 7)●3.38.5ns
= 3V, f
= 105MHz, input range = 2V
SAMPLE
The ● denotes the specifications which apply over the full operating temperature
●34.76500ns
●34.76500ns
= 105MHz, input range = 1V
P-P
with differential
DD
with differential
P-P
Duty Cycle Stabilizer On (Note 7)
Duty Cycle Stabilizer On (Note 7)
Note 5: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –0.5 LSB when
the output code flickers between 00 0000 0000 and 11 1111 1111.
Note 7: Guaranteed by design, not subject to test.
, they
Note 8: V
drive. The supply current and power dissipation are the sum total for both
channels with both channels active.
8192 Point FFT, fIN = 30MHz,
–1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
2280 G02
2280 G05
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
2565121024
0
CODE
8192 Point FFT, fIN = 70MHz,
–1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
768
2280 G03
2280 G06
8192 Point 2-Tone FFT,
fIN = 28.2MHz and 26.8MHz,
–1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
8192 Point FFT, fIN = 140MHz,
–1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
6
2280 G07
Grounded Input Histogram,
105Msps
2280 G08
2280fa
UW
www.BDTIC.com/LINEAR
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2280
SNR vs Input Frequency, –1dB,
2V Range, 105Msps
65
64
63
62
61
60
59
SNR (dBFS)
58
57
56
55
0
100
50
INPUT FREQUENCY (MHz)
150
200
SNR vs Input Level,
fIN = 70MHz, 2V Range, 105Msps
80
70
60
50
40
30
SNR (dBc AND dBFS)
20
10
0
–40–30
–50
dBFS
dBc
–20
INPUT LEVEL (dBFS)
250
–10
300
2280 G10
2280 G13
350
SFDR (dBFS)
0
SFDR vs Input Frequency, –1dB,
2V Range, 105Msps
95
90
85
80
75
70
65
0
50100
INPUT FREQUENCY (MHz)
200300 350
150250
SFDR vs Input Level,
fIN = 70MHz, 2V Range, 105Msps
100
90
80
70
60
50
40
30
SFDR (dBc AND dBFS)
20
10
0
–40
–50
dBFS
dBc
–20
–30
INPUT LEVEL (dBFS)
–10
2280 G11
2280 G14
SNR and SFDR vs Sample Rate,
2V Range, f
90
80
70
SNR AND SFDR (dBFS)
60
50
0
20406080
I
vs Sample Rate,
VDD
= 5MHz, –1dB
IN
SFDR
SNR
SAMPLE RATE (Msps)
100 120 140
2280 G12
5MHz Sine Wave Input, –1dB
200
190
180
170
160
(mA)
DD
150
IV
140
130
120
0
110
0
2V RANGE
40
20
SAMPLE RATE (Msps)
1V RANGE
60120
80
100
2280 G15
I
vs Sample Rate, 5MHz Sine
OVDD
Wave Input, –1dB, OVDD = 1.8V
17.5
15.0
12.5
10.0
(mA)
7.5
OVDD
I
5.0
2.5
0
0
2040
SAMPLE RATE (Msps)
80120
60100
2280 G16
SNR vs SENSE, fIN = 5MHz, –1dB
61.8
61.6
61.4
61.2
61.0
SNR (dBFS)
60.8
60.6
60.4
60.2
0.50.60.8
0.4
0.7
SENSE PIN (V)
0.911.1
2280 G17
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LTC2280
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U
UU
PI FU CTIO S
+
A
(Pin 1): Channel A Positive Differential Analog
INA
Input.
–
A
(Pin 2): Channel A Negative Differential Analog
INA
Input.
REFHA (Pins 3, 4): Channel A High Reference. Short
together and bypass to Pins 5, 6 with a 0.1µF ceramic chip
capacitor as close to the pin as possible. Also bypass to
Pins 5, 6 with an additional 2.2µF ceramic chip capacitor
and to ground with a 1µF ceramic chip capacitor.
REFLA (Pins 5, 6): Channel A Low Reference. Short
together and bypass to Pins 3, 4 with a 0.1µF ceramic chip
capacitor as close to the pin as possible. Also bypass to
Pins 3, 4 with an additional 2.2µF ceramic chip capacitor
and to ground with a 1µF ceramic chip capacitor.
VDD (Pins 7, 10, 18, 63): Analog 3V Supply. Bypass to
GND with 0.1µF ceramic chip capacitors.
CLKA (Pin 8): Channel A Clock Input. The input sample
starts on the positive edge.
CLKB (Pin 9): Channel B Clock Input. The input sample
starts on the positive edge.
REFLB (Pins 11, 12): Channel B Low Reference. Short
together and bypass to Pins 13, 14 with a 0.1µF ceramic
chip capacitor as close to the pin as possible. Also bypass
to Pins 13, 14 with an additional 2.2µF ceramic chip ca-
pacitor and to ground with a 1µF ceramic chip capacitor.
and a ±1V input range. An external reference greater than
0.5V and less than 1V applied to SENSEB selects an input
range of ±V
V
(Pin 20): Channel B 1.5V Output and Input Common
CMB
Mode Bias. Bypass to ground with 2.2µF ceramic chip
capacitor. Do not connect to V
MUX (Pin 21): Digital Output Multiplexer Control. If MUX
is High, Channel A comes out on DA0-DA9, OFA; Channel B
comes out on DB0-DB9, OFB. If MUX is Low, the output
busses are swapped and Channel A comes out on DB0DB9, OFB; Channel B comes out on DA0-DA9, OFA. To
multiplex both channels onto a single output bus, connect
MUX, CLKA and CLKB together. (This is not recommended
at clock frequencies above 80Msps.)
SHDNB (Pin 22): Channel B Shutdown Mode Selection
Pin. Connecting SHDNB to GND and OEB to GND results
in normal operation with the outputs enabled. Connecting
SHDNB to GND and OEB to V
tion with the outputs at high impedance. Connecting
SHDNB to VDD and OEB to GND results in nap mode with
the outputs at high impedance. Connecting SHDNB to V
and OEB to VDD results in sleep mode with the outputs at
high impedance.
OEB (Pin 23): Channel B Output Enable Pin. Refer to
SHDNB pin function.
NC (Pins 24 to 27, 41 to 44): Do Not Connect These Pins.
. ±1V is the largest valid input range.
SENSEB
.
CMA
results in normal opera-
DD
DD
REFHB (Pins 13, 14): Channel B High Reference. Short
together and bypass to Pins 11, 12 with a 0.1µF ceramic
chip capacitor as close to the pin as possible. Also bypass
to Pins 11, 12 with an additional 2.2µF ceramic chip ca-
pacitor and to ground with a 1µF ceramic chip capacitor.
–
A
(Pin 15): Channel B Negative Differential Analog
INB
Input.
+
A
(Pin 16): Channel B Positive Differential Analog
INB
Input.
GND (Pins 17, 64): ADC Power Ground.
SENSEB (Pin 19): Channel B Reference Programming Pin.
Connecting SENSEB to V
and a ±0.5V input range. VDD selects the internal reference
selects the internal reference
CMB
8
DB0 – DB9 (Pins 28 to 30, 33 to 39): Channel B Digital
Outputs. DB9 is the MSB.
OGND (Pins 31, 50): Output Driver Ground.
OVDD (Pins 32, 49): Positive Supply for the Output Driv-
ers. Bypass to ground with 0.1µF ceramic chip capacitor.
OFB (Pin 40): Channel B Overflow/Underflow Output.
High when an overflow or underflow has occurred.
DA0 – DA9 (Pins 45 to 48, 51 to 56): Channel A Digital
Outputs. DA9 is the MSB.
OFA (Pin 57): Channel A Overflow/Underflow Output.
High when an overflow or underflow has occurred.
OEA (Pin 58): Channel A Output Enable Pin. Refer to
SHDNA pin function.
2280fa
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