LINEAR TECHNOLOGY LTC2280 Technical data

FEATURES
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Integrated Dual 10-Bit ADCs
Sample Rate: 105Msps
Single 3V Supply (2.85V to 3.4V)
Low Power: 540mW
61.6dB SNR, 85dB SFDR
110dB Channel Isolation at 100MHz
Flexible Input: 1V
575MHz Full Power Bandwidth S/H
Clock Duty Cycle Stabilizer
Shutdown and Nap Modes
Pin Compatible Family
P-P
to 2V
P-P
Range
105Msps: LTC2282 (12-Bit), LTC2280 (10-Bit) 80Msps: LTC2294 (12-Bit), LTC2289 (10-Bit) 65Msps: LTC2293 (12-Bit), LTC2288 (10-Bit) 40Msps: LTC2292 (12-Bit), LTC2287 (10-Bit) 25Msps: LTC2291 (12-Bit), LTC2286 (10-Bit) 10Msps: LTC2290 (12-Bit)
64-Pin (9mm × 9mm) QFN Package
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APPLICATIO S
LTC2280
Dual 10-Bit, 105Msps
Low Noise 3V ADC
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DESCRIPTIO
The LTC®2280 is a 10-bit 105Msps, low noise 3V dual A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2280 is perfect for demanding imaging and communications applications with AC performance that includes 61.6dB SNR and 85dB SFDR for signals at the Nyquist frequency.
DC specs include ±0.1LSB INL (typ), ±0.1LSB DNL (typ) and ±0.6LSB INL, ±0.6LSB DNL over temperature. The transition noise is a low 0.08LSB
A single 3V supply allows low power operation. A separate output supply allows the outputs to drive 0.5V to 3.6V logic.
A single-ended CLK input controls converter operation. An optional clock duty cycle stabilizer allows high perfor­mance at full speed for a wide range of clock duty cycles.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
RMS
.
Wireless and Wired Broadband Communication
Imaging Systems
Spectral Analysis
Portable Instrumentation
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TYPICAL APPLICATIO
ANALOG INPUT A
ANALOG INPUT B
+
INPUT
S/H
CLOCK/DUTY CYCLE
CONTROL
CLOCK/DUTY CYCLE
CONTROL
+
INPUT
S/H
10-BIT PIPELINED ADC CORE
10-BIT PIPELINED ADC CORE
OUTPUT
DRIVERS
OUTPUT
DRIVERS
2280 TA01
OV
D9A
D0A
OGND
MUX
OV
D9B
D0B
OGND
SNR vs Input Frequency,
DD
SNR (dBFS)
DD
65
64
63
62
61
60
59
58
57
56
55
0
–1dB, 2V Range
100
50
INPUT FREQUENCY (MHz)
150
200
2280 TA02
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LTC2280
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WW
W
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ABSOLUTE AXI U RATI GS
OVDD = VDD (Notes 1, 2)
Supply Voltage (VDD) ................................................. 4V
Digital Output Ground Voltage (OGND) ....... –0.3V to 1V
Analog Input Voltage (Note 3) ..... –0.3V to (V
Digital Input Voltage .................... –0.3V to (V
Digital Output Voltage ................ –0.3V to (OV
Power Dissipation............................................ 1500mW
Operating Temperature Range
LTC2280C ............................................... 0°C to 70°C
LTC2280I.............................................–40°C to 85°C
Storage Temperature Range ..................–65°C to 125°C
+ 0.3V)
DD
+ 0.3V)
DD
+ 0.3V)
DD
UUW
PACKAGE/ORDER I FOR ATIO
TOP VIEW
DD
64 GND
63 VDD62 SENSEA
61 VCMA
60 MODE
59 SHDNA
58 OEA
57 OFA
56 DA9
55 DA8
54 DA7
53 DA6
52 DA5
51 DA4
50 OGND
49 OV
1
A
INA+
2
A
INA
REFHA 3 REFHA 4 REFLA 5 REFLA 6
7
V
DD
8
CLKA CLKB 9
10
V
DD
REFLB 11 REFLB 12 REFHB 13 REFHB 14
15
A
INB
+
16
A
INB
19
17
18
DD
V
GND
SENSEB
64-LEAD (9mm × 9mm) PLASTIC QFN
EXPOSED PAD (PIN 65) IS GND AND MUST BE SOLDERED TO PCB
T
65
20
NC 24
OEB 23
MUX 21
VCMB
SHDNB 22
UP PACKAGE
= 125°C, θJA = 20°C/W
JMAX
NC 25
NC 26
NC 27
DB0 28
ORDER PART
NUMBER
DB1 29
QFN PART*
48 DA3 47 DA2 46 DA1 45 DA0 44 NC 43 NC 42 NC 41 NC 40 OFB 39 DB9 38 DB8 37 DB7 36 DB6 35 DB5 34 DB4 33 DB3
32
DD
DB2 30
OV
OGND 31
MARKING
LTC2280CUP
LTC2280UP
LTC2280IUP
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
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CO VERTER CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Resolution (No Missing Codes) 10 Bits
Integral Linearity Error Differential Analog Input (Note 5) –0.6 ±0.1 0.6 LSB
Differential Linearity Error Differential Analog Input –0.6 ±0.1 0.6 LSB
Offset Error (Note 6) –12 ±212 mV
Gain Error External Reference –2.5 ±0.5 2.5 %FS
Offset Drift ±10 µV/°C
Full-Scale Drift Internal Reference ±30 ppm/°C
External Reference ±5 ppm/°C
Gain Matching External Reference ±0.3 %FS
Offset Matching ±2mV
Transition Noise SENSE = 1V 0.08 LSB
The denotes the specifications which apply over the full operating
RMS
2
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LTC2280
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A ALOG I PUT
specifications are at TA = 25°C. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
V
IN,CM
I
IN
I
SENSE
I
MODE
t
AP
t
JITTER
CMRR Analog Input Common Mode Rejection Ratio 80 dB
U
Analog Input Range (A
Analog Input Common Mode (A
Analog Input Leakage Current 0V < A
SENSEA, SENSEB Input Leakage 0V < SENSEA, SENSEB < 1V –3 3 µA
MODE Input Leakage Current 0V < MODE < V
Sample-and-Hold Acquisition Delay Time 0 ns
Sample-and-Hold Acquisition Delay Time Jitter 0.2 ps
Full Power Bandwidth Figure 8 Test Circuit 575 MHz
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DY A IC ACCURACY
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
SNR Signal-to-Noise Ratio 5MHz Input 61.6 dB
SFDR Spurious Free Dynamic Range 5MHz Input 85 dB
2nd or 3rd Harmonic
SFDR Spurious Free Dynamic Range 5MHz Input 85 dB
4th Harmonic or Higher
S/(N+D) Signal-to-Noise Plus Distortion Ratio 5MHz Input 61.6 dB
I
MD
Intermodulation Distortion fIN = 40MHz, 41MHz 85 dB
Crosstalk fIN = 100MHz –110 dB
The denotes the specifications which apply over the full operating temperature range, otherwise
+
–A
IN
) 2.85V < V
IN
+
+A
)/2 Differential Input Drive (Note 7) 1 1.5 1.9 V
IN
IN
Single Ended Input Drive (Note 7)
< 3.4V (Note 7) ±0.5V to ±1V V
DD
0.5 1.5 2 V
+
, A
< V
IN
IN
DD
DD
–1 1 µA
–3 3 µA
RMS
The denotes the specifications which apply over the full operating temperature range,
30MHz Input 61.6 dB
70MHz Input 60 61.5 dB
140MHz Input 61.4 dB
30MHz Input 85 dB
70MHz Input 70 83 dB
140MHz Input 77 dB
30MHz Input 85 dB
70MHz Input 76 85 dB
140MHz Input 85 dB
30MHz Input 61.6 dB
70MHz Input 60 61.5 dB
140MHz Input 61.3 dB
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LTC2280
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I TER AL REFERE CE CHARACTERISTICS
PARAMETER CONDITIONS MIN TYP MAX UNITS
VCM Output Voltage I
VCM Output Tempco ±25 ppm/°C
VCM Line Regulation 2.85V < VDD < 3.4V 3 mV/V
VCM Output Resistance –1mA < I
= 0 1.475 1.500 1.525 V
OUT
(Note 4)
< 1mA 4
OUT
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DIGITAL I PUTS A D DIGITAL OUTPUTS
full operating temperature range, otherwise specifications are at T
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
LOGIC INPUTS (CLK, OE, SHDN, MUX)
V
IH
V
IL
I
IN
C
IN
LOGIC OUTPUTS
OVDD = 3V
C
OZ
I
SOURCE
I
SINK
V
OH
V
OL
OV
= 2.5V
DD
V
OH
V
OL
OVDD = 1.8V
V
OH
V
OL
High Level Input Voltage VDD = 3V 2V
Low Level Input Voltage VDD = 3V 0.8 V
Input Current VIN = 0V to V
Input Capacitance (Note 7) 3 pF
Hi-Z Output Capacitance OE = High (Note 7) 3 pF
Output Source Current V
Output Sink Current V
High Level Output Voltage IO = –10µA 2.995 V
Low Level Output Voltage IO = 10µA 0.005 V
High Level Output Voltage IO = –200µA 2.49 V
Low Level Output Voltage IO = 1.6mA 0.09 V
High Level Output Voltage IO = –200µA 1.79 V
Low Level Output Voltage IO = 1.6mA 0.09 V
= 25°C. (Note 4)
A
= 0V 50 mA
OUT
= 3V 50 mA
OUT
= –200µA 2.7 2.99 V
I
O
I
= 1.6mA 0.09 0.4 V
O
The denotes the specifications which apply over the
DD
–10 10 µA
4
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LTC2280
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POWER REQUIRE E TS
range, otherwise specifications are at T
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
DD
OV
IV
P
DISS
P
SHDN
P
NAP
DD
DD
Analog Supply Voltage (Note 9) 2.85 3 3.4 V
Output Supply Voltage (Note 9) 0.5 3 3.6 V
Supply Current Both ADCs at f
Power Dissipation Both ADCs at f
Shutdown Power (Each Channel) SHDN = H, OE = H, No CLK 2 mW
Nap Mode Power (Each Channel) SHDN = H, OE = L, No CLK 15 mW
= 25°C. (Note 8)
A
The denotes the specifications which apply over the full operating temperature
S(MAX)
S(MAX)
180 210 mA
540 630 mW
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TI I G CHARACTERISTICS
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
f
s
t
L
t
H
t
AP
t
D
t
MD
Pipeline Latency 5 Cycles
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: All voltage values are with respect to ground with GND and OGND wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above V will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup.
Note 4: V drive, unless otherwise noted.
DD
Sampling Frequency (Note 9) 1 105 MHz
CLK Low Time Duty Cycle Stabilizer Off (Note 7) 4.5 4.76 500 ns
CLK High Time Duty Cycle Stabilizer Off (Note 7) 4.5 4.76 500 ns
Sample-and-Hold Aperture Delay 0 ns
CLK to DATA Delay CL = 5pF (Note 7) 1.4 2.7 5.4 ns
MUX to DATA Delay CL = 5pF (Note 7) 1.4 2.7 5.4 ns Data Access Time After OE CL = 5pF (Note 7) 4.3 10 ns
BUS Relinquish Time (Note 7) 3.3 8.5 ns
= 3V, f
= 105MHz, input range = 2V
SAMPLE
The denotes the specifications which apply over the full operating temperature
3 4.76 500 ns
3 4.76 500 ns
= 105MHz, input range = 1V
P-P
with differential
DD
with differential
P-P
Duty Cycle Stabilizer On (Note 7)
Duty Cycle Stabilizer On (Note 7)
Note 5: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –0.5 LSB when the output code flickers between 00 0000 0000 and 11 1111 1111.
Note 7: Guaranteed by design, not subject to test.
, they
Note 8: V drive. The supply current and power dissipation are the sum total for both channels with both channels active.
Note 9: Recommended operating conditions.
= 3V, f
DD
SAMPLE
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LTC2280
CODE
70000
60000
50000
40000
30000
20000
10000
0
511
65528
512
2280 G09
510
0
0
COUNT
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TYPICAL PERFOR A CE CHARACTERISTICS
Crosstalk vs Input Frequency
–100
–105
–110
–115
CROSSTALK (dB)
–120
–125
–130
0
20 40 60 80
INPUT FREQUENCY (MHz)
8192 Point FFT, f
= 5MHz, –1dB,
IN
2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
2280 G01
2280 G04
100
Typical INL, 2V Range, 105Msps Typical DNL, 2V Range, 105Msps
1.0
0.8
0.6
0.4
0.2
0
–0.2
INL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
256 512 1024
0
CODE
768
8192 Point FFT, fIN = 30MHz, –1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
2280 G02
2280 G05
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
256 512 1024
0
CODE
8192 Point FFT, fIN = 70MHz, –1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
768
2280 G03
2280 G06
8192 Point 2-Tone FFT, fIN = 28.2MHz and 26.8MHz, –1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
8192 Point FFT, fIN = 140MHz, –1dB, 2V Range, 105Msps
0
–10
–20
–30
–40
–50
–60
–70
AMPLITUDE (dB)
–80
–90
–100
–110
–120
0 1020304050
FREQUENCY (MHz)
6
2280 G07
Grounded Input Histogram, 105Msps
2280 G08
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC2280
SNR vs Input Frequency, –1dB, 2V Range, 105Msps
65
64
63
62
61
60
59
SNR (dBFS)
58
57
56
55
0
100
50
INPUT FREQUENCY (MHz)
150
200
SNR vs Input Level, fIN = 70MHz, 2V Range, 105Msps
80
70
60
50
40
30
SNR (dBc AND dBFS)
20
10
0
–40 –30
–50
dBFS
dBc
–20
INPUT LEVEL (dBFS)
250
–10
300
2280 G10
2280 G13
350
SFDR (dBFS)
0
SFDR vs Input Frequency, –1dB, 2V Range, 105Msps
95
90
85
80
75
70
65
0
50 100
INPUT FREQUENCY (MHz)
200 300 350
150 250
SFDR vs Input Level, fIN = 70MHz, 2V Range, 105Msps
100
90
80
70
60
50
40
30
SFDR (dBc AND dBFS)
20
10
0
–40
–50
dBFS
dBc
–20
–30
INPUT LEVEL (dBFS)
–10
2280 G11
2280 G14
SNR and SFDR vs Sample Rate, 2V Range, f
90
80
70
SNR AND SFDR (dBFS)
60
50
0
20 40 60 80
I
vs Sample Rate,
VDD
= 5MHz, –1dB
IN
SFDR
SNR
SAMPLE RATE (Msps)
100 120 140
2280 G12
5MHz Sine Wave Input, –1dB
200
190
180
170
160
(mA)
DD
150
IV
140
130
120
0
110
0
2V RANGE
40
20
SAMPLE RATE (Msps)
1V RANGE
60 120
80
100
2280 G15
I
vs Sample Rate, 5MHz Sine
OVDD
Wave Input, –1dB, OVDD = 1.8V
17.5
15.0
12.5
10.0
(mA)
7.5
OVDD
I
5.0
2.5
0
0
20 40
SAMPLE RATE (Msps)
80 120
60 100
2280 G16
SNR vs SENSE, fIN = 5MHz, –1dB
61.8
61.6
61.4
61.2
61.0
SNR (dBFS)
60.8
60.6
60.4
60.2
0.5 0.6 0.8
0.4
0.7
SENSE PIN (V)
0.9 1 1.1
2280 G17
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LTC2280
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UU
PI FU CTIO S
+
A
(Pin 1): Channel A Positive Differential Analog
INA
Input.
A
(Pin 2): Channel A Negative Differential Analog
INA
Input.
REFHA (Pins 3, 4): Channel A High Reference. Short together and bypass to Pins 5, 6 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 5, 6 with an additional 2.2µF ceramic chip capacitor and to ground with a 1µF ceramic chip capacitor.
REFLA (Pins 5, 6): Channel A Low Reference. Short together and bypass to Pins 3, 4 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 3, 4 with an additional 2.2µF ceramic chip capacitor and to ground with a 1µF ceramic chip capacitor.
VDD (Pins 7, 10, 18, 63): Analog 3V Supply. Bypass to GND with 0.1µF ceramic chip capacitors.
CLKA (Pin 8): Channel A Clock Input. The input sample starts on the positive edge.
CLKB (Pin 9): Channel B Clock Input. The input sample starts on the positive edge.
REFLB (Pins 11, 12): Channel B Low Reference. Short together and bypass to Pins 13, 14 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 13, 14 with an additional 2.2µF ceramic chip ca- pacitor and to ground with a 1µF ceramic chip capacitor.
and a ±1V input range. An external reference greater than
0.5V and less than 1V applied to SENSEB selects an input range of ±V
V
(Pin 20): Channel B 1.5V Output and Input Common
CMB
Mode Bias. Bypass to ground with 2.2µF ceramic chip capacitor. Do not connect to V
MUX (Pin 21): Digital Output Multiplexer Control. If MUX is High, Channel A comes out on DA0-DA9, OFA; Channel B comes out on DB0-DB9, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0­DB9, OFB; Channel B comes out on DA0-DA9, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together. (This is not recommended at clock frequencies above 80Msps.)
SHDNB (Pin 22): Channel B Shutdown Mode Selection Pin. Connecting SHDNB to GND and OEB to GND results in normal operation with the outputs enabled. Connecting SHDNB to GND and OEB to V tion with the outputs at high impedance. Connecting SHDNB to VDD and OEB to GND results in nap mode with the outputs at high impedance. Connecting SHDNB to V and OEB to VDD results in sleep mode with the outputs at high impedance.
OEB (Pin 23): Channel B Output Enable Pin. Refer to SHDNB pin function.
NC (Pins 24 to 27, 41 to 44): Do Not Connect These Pins.
. ±1V is the largest valid input range.
SENSEB
.
CMA
results in normal opera-
DD
DD
REFHB (Pins 13, 14): Channel B High Reference. Short together and bypass to Pins 11, 12 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 11, 12 with an additional 2.2µF ceramic chip ca- pacitor and to ground with a 1µF ceramic chip capacitor.
A
(Pin 15): Channel B Negative Differential Analog
INB
Input.
+
A
(Pin 16): Channel B Positive Differential Analog
INB
Input.
GND (Pins 17, 64): ADC Power Ground.
SENSEB (Pin 19): Channel B Reference Programming Pin.
Connecting SENSEB to V and a ±0.5V input range. VDD selects the internal reference
selects the internal reference
CMB
8
DB0 – DB9 (Pins 28 to 30, 33 to 39): Channel B Digital Outputs. DB9 is the MSB.
OGND (Pins 31, 50): Output Driver Ground.
OVDD (Pins 32, 49): Positive Supply for the Output Driv-
ers. Bypass to ground with 0.1µF ceramic chip capacitor.
OFB (Pin 40): Channel B Overflow/Underflow Output. High when an overflow or underflow has occurred.
DA0 – DA9 (Pins 45 to 48, 51 to 56): Channel A Digital Outputs. DA9 is the MSB.
OFA (Pin 57): Channel A Overflow/Underflow Output. High when an overflow or underflow has occurred.
OEA (Pin 58): Channel A Output Enable Pin. Refer to SHDNA pin function.
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