All Timing Inputs Edge Sensitive for Easy Processor
Interface
■
Fast Conversion Time: 2.5µs
■
Latched Three-State Outputs
■
Single 5V Operation
■
No External Clock
■
Overflow Output Allows Cascading
■
TC Input Allows User Adjustable Conversion Time
■
0.3" Wide 20-Pin PDIP
U
KEY SPECIFICATIO S
■
Resolution: 8-Bits
■
Conversion Time: 2.5µs (RD Mode)
2.5µs (WR/RD Mode)
■
Slew Rate Limit (Internal S/H): 2.5V/µs
■
Low Power: 75mW Max
■
Total Unadjusted Error
LTC1099: ±1 LSB
LTC1099A: ±0.75 LSB
The LTC®1099 is a high speed microprocessor compatible
8-bit analog-to-digital converter (A/D). An internal sampleand-hold (S/H) allows the A/D to convert inputs up to the
full Nyquist limit. With a conversion rate of 2.5µs, this
allows 156kHz 5V
input signals or slew rates as high as
P-P
2.5V/µs, to be digitized without the need for an external
S/H.
Two modes of operation, Read (RD) mode and Write-Read
(WR-RD) mode, allow easy interface with processors. All
timing is internal and edge sensitive which eliminates the
need for external pulse shaping circuits. The Stand-Alone
(SA) mode is convenient for those applications not involving a processor.
Data outputs are latched with three-state control to allow
easy interface to a processor data bus or I/O port. An
overflow output (OFL) is provided to allow cascading for
higher resolution.
, LTC and LT are registered trademarks of Linear Technology Corporation.
TYPICAL APPLICATION
Infinite Hold Time Sample-and-Hold (T
SAMPLE
HOLD
V
INV
13
REF
LTC1099
7
MODE
1
IN
6
WR/RDY
8
RD
CS
GNDREF
5V
1220
+
10
V
CC
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
10k
14
+
REF
1
17
16
15
14
5
4
3
2
–
11
10k
2
3
4
5
6
7
8
B1
B2
B3
B4
B5
B6
B7
B8
REF
1517
–
U
15V
V
V
= 240ns)Signal-to-Noise Ratio (SNR) vs Input Frequency
ACQ
–36
20
+
18
I
O
I
O
19
–
2.5k
2
3
7
+
LT1022AM6012
–
–15V
6
V
OUT
4
1099 TA01
–38
–40
–42
–44
–46
–48
SIGNAL-TO-NOISE RATIO, SNR (dB)
–50
–52
1
INPUT FREQUENCY (kHz)
10100
TA = 25°C
= 2.5µs
T
C
1099 G08
1
LTC1099
V
IN
DB0
DB1
DB2
DB3
WR/RDY
MODE
RD
INT
GND
1
2
3
4
5
6
7
8
9
10
TOP VIEW
SW PACKAGE
20-LEAD PLASTIC SO
20
19
18
17
16
15
14
13
12
11
V
CC
TC
OFL
DB7
DB6
DB5
DB4
CS
REF
+
REF
–
WW
W
ABSOLUTE AXIU RATIGS
U
(Notes 1, 2)
Supply Voltage (VCC) to GND Voltage ...................... 12V
Analog and Reference Inputs... –0.3V to (VCC + 0.3V)
Digital Inputs .........................................– 0.3V to 12V
Digital Outputs ........................ –0.3V to (VCC + 0.3V)
Power Dissipation.............................................. 500mW
UUW
PACKAGE/ORDER IFORATIO
TOP VIEW
1
V
IN
2
DB0
3
DB1
4
DB2
5
DB3
6
WR/RDY
7
MODE
8
RD
9
INT
10
GND
T
= 150°C, θJA = 100°C/W
JMAX
N PACKAGE
20-LEAD PDIP
V
20
CC
T
19
C
OFL
18
DB7
17
DB6
16
DB5
15
DB4
14
CS
13
+
REF
12
–
REF
11
Consult factory for parts specified with wider operating temperature ranges.
ORDER PART
NUMBER
LTC1099CN
LTC1099ACN
LTC1099AIN
Operating Temperature Range
LTC1099C/LTC1099AC............................ 0°C to 70°C
LTC1099I/LTC1099AI ..........................–40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)..................300°C
ORDER PART
NUMBER
LTC1099CSW
T
= 150°C, θJA = 130°C/W
JMAX
U
CONVERTER CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. VCC = 5V, REF+ = 5V, REF– = 0V and TA = T
noted.
The ● denotes the specifications which apply over the full operating
to T
MIN
LTC1099AI/LTC1099ILTC1099AC/LTC1099C
●±0.75±0.75LSB
●±1±1LSB
–
V
CC
+
CC
–
REF
GNDREF
GNDV
unless otherwise
MAX
V
CC
+
CC
V
V
V
LTC1099
U
DIGITAL AND DC ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.
VCC = 5V, REF+ = 5V, REF– = 0V and TA = T
SYMBOL PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
I
OZ
I
SOURCE
I
SINK
I
CC
High Level Input VoltageAll Digital Inputs, VCC = 5.25V●2.02.0V
Low Level Input VoltageAll Digital Inputs, VCC = 4.75V●0.80.00010.8V
High Level Input CurrentVIH = 5V; CS, RD, Mode●0.000111µA
= 5V; WR●0.000530.00053µA
V
IH
Low Level Input CurrentVIL = 0V; All Digital Inputs●–0.0001–1–0.0001–1µA
High Level Output Voltage DB0-DB7, OFL, INT; VCC = 4.75V
DB0-DB7, RDY; V
Output Source CurrentDB0-DB7, OFL, INT; V
Output Sink CurrentDB0-DB7, OFL, INT, RDY; V
Supply CurrentCS = WR = RD = V
MIN
to T
unless otherwise noted.
MAX
LTC1099AI/LTC1099ILTC1099AC/LTC1099C
= 5V●0.130.13µA
OUT
= 0V●–0.1–3–0.1–3µA
OUT
= 0V●–11–6–11–7mA
OUT
= 5V●147149mA
OUT
CC
●11201115mA
AC CHARACTERISTICS
otherwise specifications are at TA = 25°C. VCC = 5V, REF+ = 5V, REF– = 0V and TA = T
The ● denotes the specifications which apply over the full operating temperature range,
MIN
to T
unless otherwise noted.
MAX
LTC1099AI/LTC1099ILTC1099AC/LTC1099C
SYMBOL PARAMETERCONDITIONSMINTYPMAXMINTYPMAXUNITS
RD Mode (Figure 2) Pin 7 = GND
t
CRD
t
RDY
t
ACC0
t
INTH
t1H, t
t
P
t
ACC2
WR/RD Mode (Figures 3 and 4) Pin 7 = V
t
CWR
t
ACC0
t
ACC2
t
INTH
t
IHWR
t1H, t
t
P
t
WR
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltages are with respect to GND (Pin 10) unless otherwise
Conversion TimeTA = 25°C2.22.52.82.22.52.8µs
●5.03.75µs
Delay From CS↓ to RDY↓CL = 100pF7070ns
Delay From RD↓ to Output Data ValidCL = 100pFt
+ 35t
CRD
+ 35ns
CRD
Delay From RD↑ to INT↑CL = 100pF7070ns
Delay From RD↑ to Hi-Z State on OutputsTest Circuit Figure 17070ns
0H
Delay Time Between Conversions700700ns
Delay Time From RD↓ to Output Data Valid7070ns
CC
Conversion TimeTA = 25°C2.22.52.82.22.52.8µs
●5.03.75µs
Delay Time From WR↓ to Output Data Valid CL = 100pFt
+ 40t
CWR
+ 40ns
CWR
Delay From RD↓ to Output Data ValidCL = 100pF7070ns
Delay From RD↑ to INT↑CL = 100pF7070ns
Delay From WR↓ to INT↑CL = 100pF240240ns
Delay From RD↑ to Hi-Z State on OutputsTest Circuit Figure 17070ns
0H
Delay Time Between Conversions700700ns
Minimum WR Pulse Width5555ns
Note 3: Total unadjusted error includes offset, gain, linearity and hold step
errors.
Note 4: Reference input voltage range is guaranteed but is not tested.
noted.
3
LTC1099
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Supply Current vs Temperature
20
18
16
(mA)
14
CC
12
10
8
6
SUPPLY CURRENT, I
4
2
0
–50 – 250
AMBIENT TEMPERATURE, TA (°C)
25
5075 100 125
Total Error vs Reference Voltage
4
3
2
TOTAL ERROR (LSB)
1
1099 G01
TA = 25°C
T
= 2.5µs
C
VOS Error vs Reference Voltage
4
3
2
ERROR (LSB)
OS
V
1
0
0
13
REFERENCE VOLTAGE, V
2
Conversion Time vs R
100
10
1.0
CONVERSION TIME (µs)
RESISTOR BETWEEN
PIN 19 AND V
CC
RESISTOR BETWEEN
PIN 19 AND GND
EXT
TA = 25°C
T
C
(V)
REF
TA = 25°C
= 2.5µs
4
1099 G02
Linearity Error vs Reference
Voltage
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
LINEARITY ERROR (LBS)
0.2
0.1
0
5
0
Accuracy vs Conversion Time
1.0
0.8
0.6
0.4
0.2
TOTAL UNADJUSTED ERROR (LBS)
1
REFERENCE VOLTAGE, V
3
2
TA = 25°C
= 2.5µs
T
C
4
(V)
REF
TA = 25°C
5
1099 G03
4
0
0
REFERENCE VOLTAGE, V
REF
4
(V)
1099 G04
13
2
Conversion Time vs Temperature
1.8
1.6
1.4
1.2
1.0
0.8
CONVERSION TIME/CONVERSION TIME AT 25°C
0.6
–50
–250
AMBIENT TEMPERATURE, TA (°C)
2575
5
50100 125
0.1
10
1099 G07
RESISTANCE (kΩ)
4.5
4.0
CONVERSION TIME (µs)
3.5
3.0
2.5
2.0
1.5
1001000
1099 G05
Signal-to-Noise Ratio (SNR) vs
Input Frequency
–36
–38
–40
–42
–44
–46
–48
SIGNAL-TO-NOISE RATIO, SNR (dB)
–50
–52
1
0
1.71.9
1.6
1.8
CONVERSION TIME (µs)
INPUT FREQUENCY (kHz)
10100
2.0
TA = 25°C
= 2.5µs
T
C
1099 G08
2.3
2.12.5
2.2
2.4
1099 G06
UUU
PIN FUNCTIONS
LTC1099
VIN (Pin 1): Analog Input.
DB0 to DB3 (Pins 2 to 5): Data Outputs. DB0 = LSB.
WR/RDY (Pin 6): WR/RDY is an input when M0DE = VCC.
Falling edge of WR switches internal S/H to hold then
starts conversion. WR/RDY is an open drain output (active
pull-down) when M0DE = GND. RDY goes low at start of
conversion and pull-down is turned off when conversion
is complete. Resistive pull-up is usually used in this mode.
MODE (Pin 7): WR-RD when MODE = VCC. RD when
M0DE = GND. No internal pull-down.
RD (Pin 8): A Low on RD with CS Low Activates ThreeState Outputs. With MODE = GND and CS low, the falling
edge of RD switches internal S/H to hold and starts
conversion.
TEST CIRCUITS
t
1H
tr = 20ns, CL = 10pF
INT (Pin 9): Output that goes low when the conversion in
process is complete and goes high after data is read.
GND (Pin 10): Ground Connection.
REF– (Pin 11): Low Reference Potential (Analog Ground).
REF+ (Pin 12): High Reference Potential. V
= Full Scale
REF
= (REF+) – (REF–).
CS (Pin 13): Chip Select. When high, data outputs are high
impedance and all inputs are ignored.
DB4 to DB7 (Pins 14 to 17): Data Outputs. DB7 = MSB.
OFL (Pin 18): Overflow Output. Goes low when VIN > V
REF
.
TC (Pin 19): User Adjustable Conversion Time.
VCC (Pin 20): Positive Supply. 4.75V ≤ V
≤ 5.25V.
CC
RD
CS
RD
CS
t
r
V
V
CC
DATA
OUT
C
1k
L
t
0H
tr = 20ns, CL = 10pF
V
CC
V
CC
1k
DATA
OUT
C
L
DATA OUT
DATA OUT
RD
RD
GND
V
GND
V
GND
V
V
CC
10%
0H
CC
10%
CC
0L
t
50%
r
90%
50%
t
1H
90%
t
90%
0H
10%
1099 F01
Figure 1. Three-State Test Circuit
5
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