LINEAR TECHNOLOGY LT5525 Technical data

FEATURES
Wide Input Frequency Range: 0.8GHz to 2.5GHz*
Broadband LO and IF Operation
Typical Conversion Gain: –1.9dB at 1900MHz
High LO-RF and LO-IF Isolation
SSB Noise Figure: 15.1dB at 1900MHz
Single-Ended 50 RF and LO Interface
Integrated LO Buffer: –5dBm Drive Level
Low Supply Current: 28mA Typ
Enable Function
Single 5V Supply
16-Lead QFN (4mm × 4mm) Package
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APPLICATIO S
Point-to-Point Data Communication Systems
Wireless Infrastructure
High Performance Radios
High Linearity Receiver Applications
LT5525
High Linearity, Low Power
Downconverting Mixer
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DESCRIPTIO
The LT®5525 is a low power broadband mixer optimized for high linearity applications such as point-to-point data transmission, high performance radios and wireless infra­structure systems. The device includes an internally 50 matched high speed LO amplifier driving a double-bal­anced active mixer core. An integrated RF buffer amplifier provides excellent LO-RF isolation. The RF input balun and all associated 50 matching components are integrated. The IF ports can be easily matched across a broad range of frequencies for use in a wide variety of applications.
The LT5525 offers a high performance alternative to passive mixers. Unlike passive mixers, which require high LO drive levels, the LT5525 operates at significantly lower LO input levels and is much less sensitive to LO power level variations.
, LTC and LT are registered trademarks of Linear Technology Corporation. *Operation over a wider frequency range is achievable with reduced performance. Consult factory for more information.
TYPICAL APPLICATIO
High Signal Level Frequency Downconversion
EN
BIAS
1900MHz
LNA VGA ADC
+
RF
RF
LT5525
LO INPUT
–5dBm
U
IF Output Power and IM3 vs
V
CC
5V DC
140MHz1900MHz
4:1
+
5525 TA01
0.01µF
100pF
150nH
1.2pF 150nH
V
V
CC2
CC1
IF
IF
GND
+
LO
LO
RF Input Power (Two Input Tones)
0
–10
–20
P
OUT
–30
–40
–50
–60
–10
TA = 25°C
= 1900MHz
f
RF
= 1760MHz
f
LO
= 140MHz
f
IF
= –5dBm
P
LO
–5
5525 TA02
–70
–80
OUTPUT POWER (dBm/TONE)
IM3
–90
–100
–15
–20
RF INPUT POWER (dBm/TONE)
0
5525f
1
LT5525
WW
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ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage ...................................................... 5.5V
Enable Voltage ............................... –0.3V to V
LO Input Power ............................................... +10dBm
+
to LO– Differential DC Voltage ......................... ±1V
LO
+
LO
and LO– Common Mode DC Voltage... –0.5V to V
RF Input Power ................................................ +10dBm
RF+ to RF– Differential DC Voltage ..................... ±0.13V
+
RF
and RF– Common Mode DC Voltage ... –0.5V to V
IF+ and IF– Common Mode DC Voltage................... 5.5V
Operating Temperature Range ................ – 40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Junction Temperature (TJ)................................... 125°C
U
+ 0.3V
CC
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PACKAGE/ORDER INFORMATION
TOP VIEW
NC
LO+LO–NC
16 15 14 13
CC1VCC2
NC
12
GND
+
IF
11
IF
10
GND
9
1NC
+
RF
2
CC
CC
Consult LTC Marketing for parts specified with wider operating temperature ranges.
RF
NC
16-LEAD (4mm × 4mm) PLASTIC QFN
T
JMAX
EXPOSED PAD (PIN 17) IS GND,
MUST BE SOLDERED TO PCB.
NC PINS SHOULD BE GROUNDED
17
3
4
5 6 7 8
EN
V
UF PACKAGE
= 125°C, θJA = 37°C/W
ORDER PART
NUMBER
LT5525EUF
UF PART
MARKING
5525
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DC ELECTRICAL CHARACTERISTICS
VCC = 5V, EN = 3V, TA = 25°C (Note 3), unless otherwise noted. Test circuit shown in Figure 1.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Power Supply Requirements (VCC)
Supply Voltage (Note 6) 3.6 5 5.3 V
Supply Current VCC = 5V 28 33 mA
Shutdown Current EN = Low 100 µA
Enable (EN) Low = Off, High = On
EN Input High Voltage (On) 3V
EN Input Low Voltage (Off) 0.3 V
Enable Pin Input Current EN = 5V 55 µA
EN = 0V 0.1 µA
Turn-On Time (Note 5) 3 µs
Turn-Off Time (Note 5) 6 µs
AC ELECTRICAL CHARACTERISTICS
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF Input Frequency Range (Note 4) Requires RF Matching Below 1300MHz 800 to 2500 MHz
LO Input Frequency Range (Note 4) 500 to 3000 MHz
IF Output Frequency Range (Note 4) Requires IF Matching 0.1 to 1000 MHz
VCC = 5V, EN = 3V, TA = 25°C. Test circuit shown in Figure 1. (Notes 2, 3)
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF Input Return Loss ZO = 50 15 dB
LO Input Return Loss ZO = 50, External DC Blocks 15 dB
IF Output Return Loss ZO = 50, External Match 15 dB
LO Input Power –10 to 0 dBm
(Notes 2, 3)
5525f
2
LT5525
AC ELECTRICAL CHARACTERISTICS
IIP3 tests, f = 1MHz), f
= fRF – 140MHz, PLO = –5dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown
LO
VCC = 5V, EN = 3V, TA = 25°C, PRF = –15dBm (–15dBm/tone for 2-tone
in Figure 1. (Notes 2, 3)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Conversion Gain fRF = 900MHz –2.6 dB
= 1900MHz –1.9 dB
f
RF
= 2100MHz –2.0 dB
f
RF
f
= 2500MHz –2.0 dB
RF
Conversion Gain vs Temperature TA = –40°C to 85°C –0.020 dB/°C
Input 3rd Order Intercept fRF = 900MHz 21.0 dBm
= 1900MHz 17.6 dBm
f
RF
= 2100MHz 17.6 dBm
f
RF
f
= 2500MHz 12.0 dBm
RF
Single Sideband Noise Figure fRF = 900MHz 14.0 dB
= 1900MHz 15.1 dB
f
RF
= 2100MHz 15.6 dB
f
RF
f
= 2500MHz 15.6 dB
RF
LO to RF Leakage fLO = 500MHz to 1000MHz ≤–50 dBm
f
= 1000MHz to 3000MHz ≤–43 dBm
LO
LO to IF Leakage fLO = 500MHz to 1400MHz ≤–50 dBm
= 1400MHz to 3000MHz ≤–39 dBm
f
LO
RF to LO Isolation fRF = 500MHz to 3000MHz >38 dB
RF to IF Isolation fRF = 900MHz 62 dB
= 1900MHz 42 dB
f
RF
f
= 2100MHz 40 dB
RF
= 2500MHz 33 dB
f
RF
Input 1dB Compression fRF = 900MHz 7.6 dBm
= 1900MHz 4 dBm
f
RF
f
= 2100MHz 4 dBm
RF
= 2500MHz 3 dBm
f
RF
2RF-2LO Output Spurious Product 900MHz: fRF = 830MHz at –15dBm –63 dBc
= fLO + fIF/2) 1900MHz: fRF = 1830MHz at –15dBm –53 dBc
(f
RF
2100MHz: f 2500MHz: f
3RF-3LO Output Spurious Product 900MHz: fRF = 806.67MHz at –15dBm –74 dBc
= fLO + fIF/3) 1900MHz: fRF = 1806.67MHz at –15dBm –59 dBc
(f
RF
2100MHz: f 2500MHz: f
= 2030MHz at –15dBm –45 dBc
RF
= 2430Hz at –15dBm –42 dBc
RF
= 2006.67MHz at –15dBm –59 dBc
RF
= 2406.67Hz at –15dBm –60 dBc
RF
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The performance is measured with the test circuit shown in Figure 1. For 900MHz measurements, C1 = 3.9pF. For all other measurements, C1 is not used.
Note 3: Specifications over the –40°C to 85°C temperature range are assured by design, characterization and correlation with statistical process controls.
Note 4: Operation over a wider frequency range is possible with reduced performance. Consult the factory for information and assistance.
Note 5: Turn-on and turn-off times correspond to a change in the output level of 40dB.
Note 6: The part is operable below 3.6V with reduced performance.
5525f
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LT5525
RF INPUT POWER (dBm/TONE)
–20
–100
OUTPUT POWER (dBm/TONE)
–90
–70
–60
–50
0
–30
P
OUT
IM3
–15
–10
5525 G09
–80
–20
–10
–40
–5
0
25°C 85°C –40°C
WU
TYPICAL AC PERFOR A CE CHARACTERISTICS
= –15dBm (–15dBm/tone for 2-tone IIP3 tests, f = 1MHz), fLO = fRF – 140MHz, PLO = –5dBm, IF output measured at 140MHz,
P
RF
unless otherwise noted. Test circuit shown in Figure 1.
VCC = 5V, EN = 3V, TA = 25°C, fRF = 1900MHz,
Conversion Gain and IIP3 vs RF Frequency (Low Side LO)
25
20
IIP3
15
10
5
GAIN (dB), IIP3 (dBm)
GAIN
0
–5
900
1300 1700
1100 1500
RF FREQUENCY (MHz)
1900
Conversion Gain and IIP3 vs LO Input Power
25
20
15
IIP3
10
5
GAIN (dB), IIP3 (dBm)
GAIN
0
–5
–12 –8 –4 0
LO INPUT POWER (dBm)
2100
25°C 85°C –40°C
2300
25°C 85°C –40°C
5525 G01
5525 G04
2500
4–14–16 –10 –6 –2 2
Conversion Gain and IIP3 vs RF Frequency (High Side LO)
25
20
IIP3
15
10
5
GAIN (dB), IIP3 (dBm)
GAIN
0
–5
900
1300 1700
1100 1500
RF FREQUENCY (MHz)
1900
SSB Noise Figure vs LO Input Power
20
19
18
17
16
15
NOISE FIGURE (dB)
14
13
12
–14
25°C 85°C –40°C
–12
–10
–8
LO INPUT POWER (dBm)
–6
–4
2100
–2
25°C 85°C –40°C
2300
0
5525 G05
5525 G02
2500
2
SSB NF vs RF Frequency
20
19
18
17
16
15
14
NOISE FIGURE (dB)
13
12
11
12
900
HIGH SIDE LO
LOW SIDE LO
1100 1500
1300
RF FREQUENCY (MHz)
1700
1900
LO-IF, LO-RF and RF-LO Leakage vs Frequency
0
–10
–20
–30
–40
LO-RF
–50
–60
LEAKAGE (dBm)
–70
–80
–90
–100
500
LO-IF
1000
FREQUENCY (MHz)
1500
RF-LO
2000
2100
2500
2300
2500
5525 G03
3000
5525 G06
Conversion Gain and IIP3 vs Supply Voltage
25
20
15
10
IIP3
5
GAIN (dB), IIP3 (dBm)
GAIN
0
–5
2.8
3.2 3.6
4
4 4.8
SUPPLY VOLTAGE (V)
25°C 85°C –40°C
4.4 5.2 5.6
5525 G07
RF, LO and IF Port Return Loss vs Frequency
0
–5
–10
–15
–20
RETURN LOSS (dB)
IF
–25
–30
0
RF
LO
1000 1500 2000
500
FREQUENCY (MHz)
IF Output Power and IM3 vs RF Input Power (Two Input Tones)
2500 3000
5525 G08
5525f
LT5525
WU
TYPICAL AC PERFOR A CE CHARACTERISTICS
= –15dBm (–15dBm/tone for 2-tone IIP3 tests, f = 1MHz), fLO = fRF – 140MHz, PLO = –5dBm, IF output measured at 140MHz,
P
RF
unless otherwise noted. Test circuit shown in Figure 1.
IF
, 2 × 2 and 3 × 3 Spurs
OUT
vs RF Input Power
10
0
–10
–20
–30
–40
–50
–60
–70
OUTPUT POWER (dBm)
–80
–90
–100
–20
IF OUT
= 1900MHz
f
RF
2RF-2LO
= 1830MHz
f
RF
–15 –5–10
RF INPUT POWER (dBm)
3RF-3LO
= 1806.67MHz
f
RF
TA = 25°C f f
= 1760MHz
LO
= 140MHz
IF
0
5525 G10
–30
–40
–50
–60
–70
–80
OUTPUT POWER (dBm)
–90
–100
VCC = 5V, EN = 3V, TA = 25°C, fRF = 1900MHz,
2 × 2 and 3 × 3 Spurs vs LO Input Power
TA = 25°C
= 1760MHz
f
LO
= 140MHz
f
IF
2RF-2LO = 1830MHz
f
RF
3RF-3LO
= 1806.67MHz
f
RF
–12 –8 –4 4
–16
LO INPUT POWER (dBm)
0
5525 G11
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TYPICAL DC PERFOR A CE CHARACTERISTICS
Test circuit shown in Figure 1.
Supply Current vs Supply Voltage Shutdown Current vs Supply Voltage
32
30
28
26
24
22
20
SUPPLY CURRENT (mA)
18
16
14
2.8
3.6
3.2 SUPPLY VOLTAGE (V)
25°C 85°C –40°C
4 5.6
4.4
4.8 5.2
5525 G12
20
15
10
SHUTDOWN CURRENT (µA)
25°C 85°C –40°C
5
0
2.8
3.2 3.6 4 4.4 SUPPLY VOLTAGE (V)
4.8 5.2 5.6
5525 G13
5525f
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LT5525
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PI FU CTIO S
NC (Pins 1, 4, 8, 13, 16): Not Connected Internally. These pins should be grounded on the circuit board for improved LO-to-RF and LO-to-IF isolation.
RF+, RF– (Pins 2, 3): Differential Inputs for the RF Signal. One RF input pin may be DC connected to a low impedance ground to realize a 50 single-ended input at the other RF pin. No external matching components are required. A DC voltage should not be applied across these pins, as they are internally connected through a transformer winding.
EN (Pin 5): Enable Pin. When the input voltage is higher than 3V, the mixer circuits supplied through Pins 6, 7, 10 and 11 are enabled. When the input voltage is less than
0.3V, all circuits are disabled. Typical enable pin input current is 55µA for EN = 5V and 0.1µA when EN = 0V.
V
(Pin 6): Power Supply Pin for the LO Buffer Circuits.
CC1
Typical current consumption is 11mA. This pin should be externally connected to the other VCC pins and decoupled with 1µF and 0.01µF capacitors.
V
(Pin 7): Power Supply Pin for the Bias Circuits.
CC2
Typical current consumption is 2.5mA. This pin should be externally connected to the other VCC pins and decoupled with 1µF and 0.01µF capacitors.
GND (Pins 9, 12): Ground. These pins are internally connected to the Exposed Pad for better isolation. They should be connected to ground on the circuit board, though they are not intended to replace the primary grounding through the Exposed Pad of the package.
and IF+ (Pins 10, 11): Differential Outputs for the IF
IF
Signal. An impedance transformation may be required to match the outputs. These pins must be connected to V
CC
through impedance matching inductors, RF chokes or a transformer center-tap.
LO
, LO+ (Pins 14, 15): Differential Inputs for the Local
Oscillator Signal. The LO input is internally matched to 50. The LO can be driven with a single-ended source through either LO input pin, with the other LO input pin connected to ground. There is an internal DC resistance across these pins of approximately 480. Thus, a DC blocking capacitor should be used if the signal source has a DC voltage present.
Exposed Pad (Pin 17): Circuit Ground Return for the Entire IC. This must be soldered to the printed circuit board ground plane.
BLOCK DIAGRA
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17
EXPOSED PAD
LINEAR
+
RF
2
RF
3
AMPLIFIER
BIAS
EN
15 14
+
LO
LO
HIGH
SPEED
LO BUFFER
GND
12
+
IF
11
IF
10
DOUBLE-
BALANCED
MIXER
V
CC2
75
V
CC1
6
GND
9
5525 BD
5525f
6
TEST CIRCUITS
LT5525
LO
IN
1760MHz
16 15 14 13
+
LO
LO
GND
+
NC
IF
GND
IF
LT5525
V
CC1VCC2
56 78
C2
12
11
10
9
L3
C3
L2
C8
RF
1900MHz
C1
OPTIONAL
IN
900MHz INPUT MATCHING:
C1: 3.9pF
NC NC
17
1
NC
2
+
RF
3
RF
4
NC
EN
EN
REF DES VALUE SIZE PART NUMBER
C1 0402 Frequency Dependent
C2 0.01µF 0402 AVX 04023C103JAT
C3 1.2pF 0402 AVX 04025A1R2BAT
C4 100pF 0402 AVX 04025A101JAT
C8 1µF 0603 Taiyo Yuden LMK107BJ105MA
L2, L3 150nH 1608 Toko LL1608-FSR15J
T2 4:1 SM-22 M/A-COM ETC4-1-2
0.062"
ER = 4.4
0.018"
0.018"
T2
15
C4
2
3
V
CC
5526 F01
RF GND
DC GND
IF
4
OUT
140MHz
Figure 1. Test Schematic
WUUU
APPLICATIO S I FOR ATIO
T
he LT5525 consists of a double-balanced mixer, RF balun, RF buffer amplifier, high speed limiting LO buffer and bias/enable circuits. The IC has been optimized for downconverter applications with RF input signals from
0.8GHz to 2.5GHz and LO signals from 500MHz to 3GHz. With proper matching, the IF output can be operated at frequencies from 0.1MHz to 1GHz. Operation over a wider frequency range is possible, though with reduced performance.
The RF, LO and IF ports are all differential, though the RF and LO ports are internally matched to 50 for single­ended drive. The LT5525 is characterized and production tested using single-ended RF and LO inputs. Low side or high side LO injection can be used.
RF Input Port
The mixer’s RF input, shown in Figure 2, consists of an integrated balun and a high linearity differential amplifier. The primary terminals of the balun are connected to the RF+ and RF– pins (Pins 2 and 3, respectively). The second­ary side of the balun is internally connected to the amplifier’s differential inputs.
For single-ended operation, the RF+ pin is grounded and the RF– pin becomes the RF input. It is also possible to ground the RF– pin and drive the RF+ pin, if desired. If the RF source has a DC voltage present, then a coupling capacitor must be used in series with the RF input pin. Otherwise, excessive DC current could damage the pri­mary winding of the balun.
5525f
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LT5525
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APPLICATIO S I FOR ATIO
+
RF
2
OPTIONAL SERIES
REACTANCE FOR
LOW BAND OR
HIGH BAND
RF
IN
MATCHING
RF
3
Figure 2. RF Input Schematic
As shown in Figure 3, the RF input return loss with no external matching is greater than 12dB from 1.3GHz to
2.3GHz. The RF input match can be shifted down to 800MHz by adding a series 3.9pF capacitor at the RF input. A series 1.2nH inductor can be added to shift the match up to 2.5GHz. Measured return losses with these external components are also shown in Figure 3.
0
–5
–10
–15
–20
RETURN LOSS (dB)
–25
–30
500
1000 1500 2000 2500
NO RF
MATCHING
SERIES 1.2nH
SERIES 3.9pF
RF FREQUENCY (MHz)
Figure 3. RF Input Return Loss Without and with External Matching Components
Figure 4 illustrates the typical conversion gain, IIP3 and NF performance of the LT5525 when the RF input match is shifted lower in frequency using an external series 3.9pF capacitor on the RF input.
RF input impedance and reflection coefficient (S11) ver­sus frequency are shown in Table 1. The listed data is referenced to the RF– pin with the RF+ pin grounded (no external matching). This information can be used to simu­late board-level interfacing to an input filter, or to design a broadband input matching network.
LT5525
5525 F02
3000
5525 F03
25
20
IIP3
15
SSB NF
10
5
GAIN AND NF (dB), IIP3 (dBm)
0
GAIN
–5
800
900 1000
850 950
RF FREQUENCY (MHz)
T
= 25°C
A
= 140MHz
f
IF
LOW SIDE LO HIGH SIDE LO
1100
1050
1150
1200
5525 F04
Figure 4. Typical Gain, IIP3 and NF with Series 3.9pF Matching Capacitor
Table 1. RF Port Input Impedance vs Frequency
FREQUENCY INPUT REFLECTION COEFFICIENT
(MHz) IMPEDANCE MAG ANGLE
50 10.4 + j2.63 0.675 174 500 18.1 + j23.7 0.551 124 700 25.8 + j30.7 0.478 106 900 36.5 + j34.5 0.398 90
1100 48.4 + j33.3 0.321 74 1300 59.5 + j25.7 0.244 57 1500 65.9 + j13.1 0.177 33 1700 65.0 – j1.0 0.131 –3 1900 59.0 – j12.2 0.138 –47 2100 50.2 – j19.0 0.187 –79 2300 41.8 – j22.1 0.250 –97 2500 34.9 – j22.7 0.311 –109 2700 29.1 – j21.9 0.369 –118 3000 23.2 – j19.1 0.435 –130
A broadband RF input match can be easily realized by using both the series capacitor and series inductor as shown in Figure 5. This network provides good return loss at both lower and higher frequencies simultaneously, while maintaining good mid-band return loss. The broad­band return loss is plotted in Figure 6. The return loss is better than 12dB from 700MHz to 2.6GHz using the element values of Figure 5.
LO Input Port
The LO buffer amplifier consists of high speed limiting differential amplifiers designed to drive the mixer core for high linearity. The LO+ and LO– pins are designed for
8
5525f
WUUU
FREQUENCY (MHz)
0
–20
RETURN LOSS (dB)
–15
–10
–5
0
500 1000 1500 2000
5525 F08
2500 3000
APPLICATIO S I FOR ATIO
LT5525
single-ended drive, though differential drive can be used if desired. The LO input is internally matched to 50. A simplified schematic for the LO input is shown in Figure 7. Measured return loss is shown in Figure 8.
If the LO source has a DC voltage present, then a coupling capacitor should be used in series with the LO input pin due to the internal resistive match.
+
RF
2
C5
4.7pF
L3
1.5nH
RF
3
RF
IN
Figure 5. Wideband RF Input Matching
0
–5
NO EXTERNAL
–10
–15
SERIES 1.5nH
–20
AND 4.7pF
RETURN LOSS (dB)
–25
–30
500
RF MATCHING
1000 1500 2000 2500
RF FREQUENCY (MHz)
Figure 6. RF Input Return Loss Using Wideband Matching Network
LO
14
20pF
LO 50
V
CC
IN
+
LO
15
480
20pF
Figure 7. LO Input Schematic
54
3000
5525 F06
LT5525
5525 F07
LT5525
5525 F05
Figure 8. LO Input Return Loss
The LO port input impedance and reflection coefficient (S11) versus frequency are shown in Table 2. The listed data is referenced to the LO+ pin with the LO– pin grounded.
Table 2. Single-Ended LO Input Impedance
FREQUENCY INPUT REFLECTION COEFFICIENT
(MHz) IMPEDANCE MAG ANGLE
100 93.1 – j121 0.686 –30 250 55.8 – j54 0.457 –57
500 47.7 – j28 0.276 –79 1000 42.3 – j14 0.171 –110 1500 38.5 – j9.3 0.166 –135 2000 35.8 – j7.8 0.187 –146 2500 34.8 – j7.8 0.281 –148 3000 34.2 – j8.7 0.214 –149
IF Output Port
A simplified schematic of the IF output circuit is shown in Figure 9. The output pins, IF+ and IF–, are internally con­nected to the collectors of the mixer switching transistors. Both pins must be biased at the supply voltage, which can be applied through the center-tap of a transformer or
LT5525
5525 F09
L3
C3
V
CC
L2
575
0.7pF
+
IF
11
IF
10
V
CC
Figure 9. IF Output with External Matching
4:1
IF
OUT
T2
5525f
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LT5525
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APPLICATIO S I FOR ATIO
through impedance-matching inductors. Each IF pin draws about 7.5mA of supply current (15mA total). For optimum single-ended performance, these differential outputs must be combined externally through an IF transformer or balun.
An equivalent small-signal model for the output is shown in Figure 10. The output impedance can be modeled as a 574 resistor (RIF) in parallel with a 0.7pF capacitor. For most applications, the bond-wire inductance (0.7nH per side) can be ignored.
The external components, C3, L2 and L3 form an imped­ance transformation network to match the mixer output impedance to the input impedance of transformer T2. The values for these components can be estimated using the equations below, along with the impedance values listed in Table 3. As an example, at an IF frequency of 140MHz and RL = 200 (using a 4:1 transformer for T2 with an external 50 load),
n = RIF/RL = 574/200 = 2.87 Q = (n – 1) = 1.368 XC = RIF/Q = 420 C = 1/(ω • XC) = 2.71pF C3 = C – CIF = 2.01pF XL = RL • Q = 274 L2 = L3 = XL/2ω = 156nH
Table 3. IF Differential Impedance (Parallel Equivalent)
FREQUENCY OUTPUT REFLECTION COEFFICIENT
(MHz) IMPEDANCE MAG ANGLE
70 575|| – j3.39k 0.840 –1.8 140 574|| – j1.67k 0.840 –3.5 240 572|| – j977 0.840 –5.9 450 561|| – j519 0.838 –11.1 750 537|| – j309 0.834 –18.6 860 525|| – j267 0.831 –21.3
1000 509|| – j229 0.829 –24.8 1250 474|| – j181 0.822 –31.3 1500 435|| – j147 0.814 –38.0
LT5525
0.7nH L3
R
IF
574
Figure 10. IF Output Small Signal Model
C
IF
0.7pF
0.7nH
+
IF
11
R
C3
IF
10
5525 F10
L
200
L2
element network. This circuit is shown in Figure 11, where L11, L12, C11 and C12 form a narrowband bridge balun. These element values are selected to realize a 180° phase shift at the desired IF frequency, and can be estimated using the equations below. In this case, the load resis­tance, RL, is 50Ω.
RR
LL
11 12
==
IF L
ω
RR
ω
1
IF L
CC
11 12
==
I
nductor L13 or L14 provides a DC path between VCC and the IF+ pin. Only one of these inductors is required. Low cost multilayer chip inductors are adequate for L11, L12 and L13. If L14 is used instead of L13, a larger value is usually required, which may require the use of a wire­wound inductor. Capacitor C13 is a DC block which can also be used to adjust the impedance match. Capacitor C14 is a bypass capacitor.
C12
L14 OPT
L12
L11
C11
L13 OPT
C13
C14
IF 50
5525 F11
OUT
+
IF
IF
V
CC
Low Cost Output Match
For low cost applications in which the required fractional bandwidth of the IF output is less than 25%, it may be possible to replace the output transformer with a lumped-
10
Figure 11. Narrowband Bridge IF Balun
Actual component values for IF frequencies of 240MHz, 360MHz and 450MHz are listed in Table 4. Typical IF port return loss for these examples is shown in Figure 12.
5525f
WUUU
APPLICATIO S I FOR ATIO
LT5525
Conversion gain and IIP3 performance with an RF fre­quency of 1900MHz are plotted vs IF frequency in Figure
13. These results show that the usable IF bandwidth for the lumped element balun is greater than 60MHz, assuming tight tolerance matching components. Contact the factory for applications assistance with this circuit.
0
–5
–10
–15
RETURN LOSS (dB)
–20
–25
200
300 350 400
250
FREQUENCY (MHz)
Figure 12. Typical IF Return Loss Performance with 240MHz, 360MHz and 450MHz Lumped Element Baluns
450 500
5525 F12
20
IIP3
15
10
5
GAIN (dB), IIP3 (dBm)
GAIN
0
–5
200
300 350 400
250
IF FREQUENCY (MHz)
Figure 13. Typical Gain and IIP3 vs IF Frequency with 240MHz, 360MHz and 450MHz Lumped Element Baluns
Table 4. Component Values for Lumped Balun
IF FREQ (MHz) L11, L12 (nH) C11, C12 (pF) C13 (pF) L14 (nH)
240 100 3.9 100 560 360 68 2.7 10 270 450 56 2.2 8.2 180
20
19
18
TA = 25°C
= fRF – f
f
LO
fRF = 1900MHz P P
= –5dBm
LO
= –15dBm
RF
450 500
IF
5525 F13
17
16
15
IIP3 (dBm)
14
13
TA = 25°C
12
f PLO = –5dBm
11
P
10
1200
= fRF – f
LO
= –15dBm
RF
1400
IF
2000
1800
1600
RF FREQUENCY (MHz)
2200
240MHz 360MHz 450MHz
2400
5525 F14
Figure 14. Typical IIP3 vs RF Frequency with Lumped Element Baluns and IF Frequencies of 240MHz, 360MHz and 450MHz
2600
TYPICAL APPLICATIO S
Top Layer Silkscreen
U
Evaluation Board Layouts
Top Layer Metal
5525f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LT5525
PACKAGE DESCRIPTIO
4.35 ± 0.05
2.15 ± 0.05 (4 SIDES)
2.90 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
U
0.30 ±0.05
0.65 BSC
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
4.00 ± 0.10 (4 SIDES)
0.72 ±0.05
PACKAGE OUTLINE
PIN 1 TOP MARK (NOTE 6)
0.75 ± 0.05
2.15 ± 0.10 (4-SIDES)
0.200 REF
0.00 – 0.05
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
0.55 ± 0.20
1615
1
2
(UF) QFN 1103
0.30 ± 0.05
0.65 BSC
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS Infrastructure
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Controlled Gain Control Range
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Linear Technology Corporation
12
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
Matching, Single-Ended LO and RF Ports Operation
Matching, Single-Ended LO and RF Ports Operation
Supply Voltage = 3.15V to 5.25V
50 Single-Ended RF and LO Ports
to 5.3V Supply
Offset Control, Adjustable Gain and Offset
OUT
P-P
Input Ranges
LT/TP 1004 1K • PRINTED IN THE USA
© LINEAR TECHNOLOGY CORPORATION 2004
or 1.35V
P-P
5525f
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