The LT®3724 is a DC/DC controller used for medium
power, low part count, low cost, high efficiency supplies.
It offers a wide 4V-60V input range (7.5V minimum startup
voltage) and can implement step-down, step-up, inverting
and SEPIC topologies.
The LT3724 includes Burst Mode operation, which reduces quiescent current below 100µA and maintains high
efficiency at light loads. An internal high voltage bias
regulator allows for simple biasing and can be back driven
to increase efficiency.
Additional features include fixed frequency current mode
control for fast line and load transient response; a gate
driver capable of driving large N-channel MOSFETs; a
precision undervoltage lockout function; 10µA shutdown
current; short-circuit protection; and a programmable
soft-start function that directly controls output voltage
slew rates at startup which limits inrush current, minimizes overshoot and facilitates supply sequencing.
The LT3724 is available in a 16-lead thermally enhanced
TSSOP package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 5731694, 6498466, 6611131.
TYPICAL APPLICATIO
V
30V TO
60V
68µF
IN
C
IN
40.2k
120pF680pF
4.99k93.1k
1M
68.1k
200k
High Voltage Step-Down Regulator
V
IN
SHDN
C
SS
Burst_EN
V
FB
V
C
1000pF
SGND
LT3724
U
BOOST
PGND
SENSE
SENSE
Efficiency and Power Loss
vs Load Current
95
0.22µF
TG
10Ω
SW
V
CC
+
–
1µF
SS3H9
Si7852
47µH
0.025Ω
3724 TA01a
V
OUT
24V
75W
+
C
OUT
330µF
90
EFFICIENCY
85
80
EFFICIENCY (%)
75
70
65
0.1
LOSS
VIN = 48V
110
LOAD CURRENT (A)
3724 TA01b
12
10
POWER LOSS (W)
8
6
4
2
0
3724fa
1
LT3724
WW
W
U
ABSOLUTE AXIU RATIGS
(Note 1)
Input Supply Voltage (VIN)......................... 65V to –0.3V
Boosted Supply Voltage (BOOST).............. 80V to – 0.3V
Switch Voltage (SW)(Note 8) ....................... 65V to –1V
Differential Boost Voltage
(BOOST to SW) ..................................... 24V to –0.3V
Bias Supply Voltage (V
SENSE
+
and SENSE– Voltages ................... 40V to – 0.3V
Differential Sense Voltage
+
(SENSE
to SENSE–) .................................. 1V to – 1V
BURST_EN Voltage.................................... 24V to – 0.3V
, VFB, CSS, and SHDN Voltages ................5V to –0.3V
V
C
C
and SHDN Pin Currents ................................... 1mA
SS
Operating Junction Temperature Range (Note 2)
LT3724E (Note 3) ..............................–40°C to 125°C
LT3724I .............................................–40°C to 125°C
Storage Temperature .............................–65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
) .........................24V to –0.3V
CC
UUW
PACKAGE/ORDER IFORATIO
TOP VIEW
1
V
IN
2
NC
3
SHDN
4
C
SS
BURST_EN
V
FB
V
C
SGND
16-LEAD PLASTIC TSSOP
T
= 125°C, θJA = 40°C/W, θJC = 10°C/W
JMAX
EXPOSED PAD IS SGND (PIN 17) MUST BE SOLDERED TO PCB
5
6
7
8
FE PACKAGE
17
ORDER PART NUMBER
LT3724EFE
LT3724IFE
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
BOOST
16
TG
15
SW
14
NC
13
V
12
CC
PGND
11
10
9
SENSE
SENSE
+
–
FE PART MARKING
3724EFE
3724IFE
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at T
Error Amp Output RangeZero Current to Current Limit1.2V
Error Amp Sink/Source Current±30µA
Gate Drive Output On Voltage (Note 7) C
Gate Drive Output Off VoltageC
Gate Drive Rise/Fall Time10% to 90% or 90% to 10%, C
= 3300pF9.8V
LOAD
= 3300pF0.1V
LOAD
= 3300pF60ns
LOAD
Minimum Switch Off Time350ns
Minimum Switch On Time
●
300500ns
SW Pin Sink CurrentVSW = 2V300mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LT3724 includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
Note 3: The LT3724E is guaranteed to meet performance specifications
from 0°C to 125°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LT3724I is guaranteed over the full –40°C to 125°C operating junction
temperature range.
Note 4: VIN voltages below the start-up threshold (7.5V) are only
supported when the V
Note 5: Operating range is dictated by MOSFET absolute maximum V
is externally driven above 6.5V.
CC
GS
.
Note 6: Supply current specification does not include switch drive
currents. Actual supply currents will be higher.
Note 7: DC measurement of gate drive output “ON” voltage is typically
8.6V. Internal dynamic bootstrap operation yields typical gate “ON”
voltages of 9.8V during standard switching operation. Standard operation
gate “ON” voltage is not tested but guaranteed by design.
Note 8: The –1V absolute maximum on the SW pin is a transient
condition. It is guaranteed by design and not subject to test.
3724fa
3
LT3724
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Shutdown Threshold (Rising)
vs Temperature
1.38
1.37
1.36
1.35
1.34
1.33
SHUTDOWN THRESHOLD, RISING (V)
1.32
–502575
–25050100 125
TEMPERATURE (°C)
V
vs I
CC
CC(LOAD)
8.2
TA = 25°CICC = 20mA
8.1
8.0
7.9
(V)
CC
V
7.8
7.7
7.6
3724 G01
Shutdown Threshold (Falling)
vs TemperatureV
1.26
1.25
1.24
1.23
1.22
1.21
SHUTDOWN THRESHOLD, FALLING (V)
1.20
–25050100 125
(V)
CC
V
–50
VCC vs V
9
T
A
8
7
6
5
4
= 25°C
2575
TEMPERATURE (°C)
3724 G02
IN
vs Temperature
CC
8.2
8.1
8.0
7.9
(V)
CC
V
7.8
7.7
7.6
7.5
–502575–25050100 125
TEMPERATURE (°C)
I
Current Limit vs Temperature
CC
70
60
50
40
CURRENT LIMIT (mA)
CC
I
30
ICC = 20mA
3724 G03
7.5
0
510
203035
1525
I
(mA)
CC (LOAD)
VCC UVLO Threshold (Rising)
vs Temperature
6.5
6.4
6.3
6.2
UVLO THRESHOLD, RISING (V)
6.1
CC
V
6.0
–502575–25050100 125
TEMPERATURE (°C)
4
3724 G04
3724 G07
3
4
57
vs VCC (SHDN = 0V)
CC
25
TA = 25°C
20
15
(µA)
CC
I
10
5
0
246
0
11
6
8
VIN (V)
10
9
12
3724 G05
20
–502575–25050100 125
TEMPERATURE (°C)
3724 G06
Error Amp Transconductance
vs TemperatureI
350
345
340
335
330
325
ERROR AMP TRANSCONDUCTANCE (µMhos)
810
VCC (V)
12 1418
16
3724 G08
320
–50
20
–250
TEMPERATURE (°C)
50100 125
2575
3724 G09
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UW
TYPICAL PERFOR A CE CHARACTERISTICS
LT3724
I
(SENSE+ + SENSE–)
V
SENSE (CM)
400
300
200
(µA)
)
–
100
+ SENSE
+
0
(SENSE
I
–100
–200
0
0.5
1.0 1.5 2.0
V
SENSE (CM)
vs
2.54.53.55.04.03.0
Maximum Current Sense
Threshold vs Temperature
160
158
156
154
152
150
148
146
144
CURRENT SENSE THRESHOLD (mV)
142
140
–502575
–250
TEMPERATURE (°C)
50100 125
(V)
Operating Frequency
vs Temperature
TA = 25°C
3724 G10
230
220
210
200
190
OPERATING FREQUENCY (kHz)
180
170
–50
–250
V
UVLO Threshold (Rising)
IN
2575
TEMPERATURE (°C)
50100 125
3724 G11
vs Temperature
4.54
4.52
4.50
4.48
4.46
4.44
UVLO THRESHOLD, RISING (V)
IN
4.42
V
4.40
–502575
–250
TEMPERATURE (°C)
3724 G133724 G143724 G15
50100 125
Error Amp Reference
vs Temperature
1.234
1.233
1.232
1.231
1.230
1.229
ERROR AMP REFERENCE (V)
1.228
1.227
–502575
–250
TEMPERATURE (°C)
V
UVLO Threshold (Falling)
IN
vs Temperature
3.86
3.84
3.82
3.80
3.78
UVLO THRESHOLD, FALLING (V)
IN
V
3.76
–502575
–250
TEMPERATURE (°C)
50100 125
50100 125
3724 G12
3724fa
5
LT3724
U
UU
PI FU CTIO S
VIN (Pin 1): The VIN pin is the main supply pin and should
be decoupled to SGND with a low ESR capacitor located
close to the pin.
NC (Pin 2): No Connection.
SHDN (Pin 3): The SHDN pin has a precision IC enable
threshold of 1.35V (rising) with 120mV of hysteresis. It is
used to implement an undervoltage lockout (UVLO) circuit. See Application Information section for implementing a UVLO function. When the SHDN pin is pulled below
a transistor V
entered, all internal circuitry is disabled and the V
current is reduced to approximately 10µA. Typical pin
input bias current is <10µA and the pin is internally
clamped to 6V.
C
(Pin 4): The soft-start pin is used to program the
SS
supply soft-start function. The pin is connected to V
a ceramic capacitor (CSS) and 200kΩ series resistor.
During start-up, the supply output voltage slew rate is
controlled to produce a 2µA average current through the
soft-start coupling capacitor. Use the following formula to
calculate C
C
= 2µA(tSS/V
SS
See the application section for more information on setting the rise time of the output voltage during start-up.
Shorting this pin to SGND disables the soft-start function.
BURST_EN (Pin 5): The BURST_EN pin is used to enable
or disable Burst Mode operation. Connect the BURST_EN
pin to ground to enable the burst mode function. Connect
the pin to V
(0.7V), a low current shutdown mode is
BE
for a given output voltage slew rate:
SS
)
OUT
to disable the burst mode function.
CC
supply
IN
OUT
via
optimize transient response. Connecting a 100pF or greater
high frequency bypass capacitor from this pin to ground
is recommended. When Burst Mode operation is enabled
(see Pin 5 description), an internal low impedance clamp
on the V
pin is set at 100mV below the burst threshold,
C
which limits the negative excursion of the pin voltage.
Therefore, this pin cannot be pulled low with a low impedance source. If the V
pin must be externally manipulated,
C
do so through a 1kΩ series resistance.
SGND (Pin 8, 17): The SGND pin is the low noise ground
reference. It should be connected to the –V
side of the
OUT
output capacitors. Careful layout of the PCB is necessary
to keep high currents away from this SGND connection.
See the Application Information section for helpful hints
on PCB layout of grounds.
SENSE
the current sense amplifier and is connected to the V
–
(Pin 9): The SENSE– pin is the negative input for
OUT
side of the sense resistor for step-down applications. The
sensed inductor current limit is set to 150mV across the
SENSE inputs.
SENSE
+
(Pin 10): The SENSE+ pin is the positive input for
the current sense amplifier and is connected to the inductor side of the sense resistor for step-down applications.
The sensed inductor current limit is set to 150mV across
the SENSE inputs.
PGND (Pin 11): The PGND pin is the high-current ground
reference for internal low side switch and the V
regulator
CC
circuit. Connect the pin directly to the negative terminal of
the V
decoupling capacitor. See the Application Infor-
CC
mation section for helpful hints on PCB layout of grounds.
(Pin 6): The output voltage feedback pin, VFB, is
V
FB
externally connected to the supply output voltage via a
resistive divider. The VFB pin is internally connected to the
inverting input of the error amplifier. In regulation, V
FB
is
1.231V.
V
(Pin 7): The VC pin is the output of the error amplifier
C
whose voltage corresponds to the maximum (peak) switch
current per oscillator cycle. The error amplifier is typically
configured as an integrator circuit by connecting an RC
network from the V
pin to SGND. This circuit creates the
C
dominant pole for the converter regulation control loop.
Specific integrator characteristics can be configured to
6
VCC (Pin 12): The VCC pin is the internal bias supply
decoupling node. Use low ESR 1µF ceramic capacitor to
decouple this node to PGND. Most internal IC functions
are powered from this bias supply. An external diode
connected from V
to the BOOST pin charges the
CC
bootstrapped capacitor during the off-time of the main
power switch. Back driving the VCC pin from an external DC
voltage source, such as the V
output of the buck
OUT
regulator supply, increases overall efficiency and reduces
power dissipation in the IC. In shutdown mode this pin
sinks 20µA until the pin voltage is discharged to 0V.
NC (Pin 13): No Connection.
3724fa
LT3724
U
UU
PI FU CTIO S
SW (Pin 14): In step-down applications the SW pin is
connected to the cathode of an external clamping Schottky
diode, the drain of the power MOSFET and the inductor.
The SW node voltage swing is from V
of the power MOSFET, to a Schottky voltage drop below
ground during the off-time of the power MOSFET. In startup and in operating modes where there is insufficient
inductor current to freewheel the Schottky diode, an
internal switch is turned on to pull the SW pin to ground
so that the BOOST pin capacitor can be charged. Give
careful consideration in choosing the Schottky diode to
limit the negative voltage swing on the SW pin.
TG (Pin 15): The TG pin is the bootstrapped gate drive for
the top N-Channel MOSFET. Since very fast high currents
are driven from this pin, connect it to the gate of the power
during the on-time
IN
MOSFET with a short and wide, typically 0.02” width, PCB
trace to minimize inductance.
BOOST (Pin 16): The BOOST pin is the supply for the
bootstrapped gate drive and is externally connected to a
low ESR ceramic boost capacitor referenced to SW pin.
The recommended value of the BOOST capacitor,C
is 50 times greater that the total input capacitance of the
topside MOSFET. In most applications 0.1µF is adequate.
The maximum voltage that this pin sees is VIN + VCC,
ground referred, and is limited to 75V.
Exposed Pad (SGND) (Pin 17): The exposed leadframe is
internally connected to the SGND pin. Solder the exposed
pad to the PCB ground for electrical contact and optimal
thermal performance.
BOOST
,
3724fa
7
LT3724
U
U
W
FU CTIO AL DIAGRA
V
IN
UVLO
(<4V)
V
IN
RA
SHDN
RB
BURST_EN
V
R2
C
C
SS
SGND
1
3
5
FB
6
V
C
7
SS
1.185V
4
8
V
IN
C
IN
R1
C
C2
R
C
C
C1
–
–
g
m
ERROR
AMP
SOFT-START
DISABLE/BURST
ENABLE
+
–
8V V
CC
REGULATOR
+
+
1.231V
0.5V
~1V
3.8V
REGULATOR
FEEDBACK
REFERENCE
+
–
–
+
–
+
2µA
V
CC
UVLO
(<6V)
INTERNAL
SUPPLY RAIL
BURST MODE
OPERATION
DRIVE
CONTROL
SWITCH
LOGIC
DRIVE
CONTROL
CURRENT
SENSE
COMPARATOR
NOL
–
BST
UVLO
BOOST
16
C
BOOST
BOOSTED
SWITCH
DRIVER
OSCILLATOR
SQ
R
SLOPE COMP
GENERATOR
15
14
12
11
TG
SW
V
CC
PGND
M1
L1
R
SENSE
D2
C
VCC
D1
D3
(OPTIONAL)
V
OUT
C
OUT
+
+
+
–
10
9
SENSE
SENSE
–
8
3724 FD
3724fa
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