LINEAR TECHNOLOGY LT3500 Technical data

LT3500

Monolithic 2A Step-Down

Regulator Plus Linear

Regulator/Controller

FEATURES

n

Wide Input Range: 3V to 36V Operating,

40V Maximum

n

Short-Circuit Protected Over Full Input Range

n

2A Output Current Capability

n

Adjustable/Synchronizable Fixed Frequency

Operation from 250kHz to 2.2MHz

n

Soft-Start/Tracking Capability

n

Output Adjustable Down to 0.8V

n

Adjustable Linear Regulator/Driver with 13mA

Output Capability

n

Power Good Comparator with Complimentary

Outputs

n

Low Shutdown Current: 12µA

n

Thermally Enhanced 3mm × 3mm DFN or 16-Pin

MSOP Package

APPLICATIONS

n

Automotive Battery Regulation

n

Industrial Control

n

Wall Transformer Regulation

n

Distributed Power Regulation

DESCRIPTION

The LT®3500 is a current mode PWM step-down DC/DC
converter with an internal 2.3A switch. The wide input range
of 3V to 40V makes the LT3500 suitable for regulating
power from a wide variety of sources, including automo­tive batteries, 24V industrial supplies and unregulated
wall adapters.

Resistor-programmable 250kHz to 2.2MHz frequency
range and synchronization capability enable optimization
between effi ciency and external component size. Cycle­by-cycle current limit, frequency foldback and thermal
shutdown provide protection against a shorted output.
The soft-start feature controls the ramp rate of the output
voltage, eliminating input current surge during start-up,
and also provides output tracking.

The LT3500 contains an internal NPN transistor with feed­back control which can be confi gured as a linear regulator
or as a linear regulator controller.

The LT3500’s low current shutdown mode (<12µA) enables
easy power management in battery-powered systems.

L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.

TYPICAL APPLICATION

Dual Step-Down Converters

V

6V TO 36V

0.47µF

53.6k

IN

2.2µF

330pF

40.2k

IN

SHDN
SS

R

T/

V

C

LT3500

SYNC

BSTV

SW

LDRV

LFB

0.47µF

6.8µH

B240A

42.2k

FB

PG

PG

24.9k

8.06k

8.06k

1k

22µF

3500 TA01a

V

3.3V
1A

OUT2

V
5V
1A

22µF

OUT1

90

85

80

75

70

65

EFFICIENCY (%)

60

VIN = 12V

55

I

OUT2

FREQUENCY = 800kHz

50

0

= 0A

0.4 0.8 1.2 2.01.40.2 0.6 1.0 1.8
LOAD CURRENT (A)

1.6

3500 TA01b

V

V

OUT2

OUT1

= 5V AT 1A

AC COUPLED

2mV/DIV

= 3.3V AT 1A
AC COUPLED

2mV/DIV

Output Voltage RippleSwitching Converter Effi ciency

500ns/DIV

3500 TA01c

3500fb

1

LT3500

ABSOLUTE MAXIMUM RATINGS

(Note 1)

VIN, PG, PG Operating .................................... 40V/–0.3V

SW ............................................................................. V

IN

BST ................................................................ 55V/–0.3V

BST Pin Above SW ....................................................25V

LDRV, SHDN ..............................................................15V

FB, LFB, R
SS, V

/SYNC .......................................................5V

T

......................................................................2.5V

C

PIN CONFIGURATION

TOP VIEW

1

V

IN

2

SHDN

3

SS

PG

V

C

RT/SYNC

12-LEAD (3mm × 3mm) PLASTIC DFN

EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB

θJA = 45°C/W, θ

13

4

5

6

DD PACKAGE

JC(PAD)

12

11

10

9

8

7

= 10°C/W

SW

BST

LDRV

LFB

FB

PG

Operating Junction Temperature Range

LT3500EDD (Note 2) .......................... –40°C to 125°C

LT3500IDD (Note 2) ...........................–40°C to 125°C

LT3500HDD (Note 2).......................... –40°C to 150°C

LT3500EMSE (Note 2)........................ –40°C to 125°C

LT3500IMSE (Note 3) ........................ –40°C to 125°C

LT3500HMSE (Note 2) ....................... –40°C to 150°C

Storage Temperature Range ...................–65°C to 150°C

TOP VIEW

1

NC1

2

V

IN

3

SHDN

4

SS

5

PG

6

V

C

7

RT/SYNC

8

NC8

EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB

θJA = 45°C/W, θ

17

MSE PACKAGE

16-LEAD PLASTIC MSE

JC(PAD)

16
15
14
13
12
11
10
9

= 10°C/W

NC16
SW
BST
LDRV
LFB
FB
PG
NC9

ORDER INFORMATION

LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE

LT3500EDD#PBF LT3500EDD#TRPBF LCRN

LT3500IDD#PBF LT3500IDD#TRPBF LCRN

LT3500HDD#PBF LT3500HDD#TRPBF LDCY

12-Lead (3mm × 3mm) Plastic DFN
12-Lead (3mm × 3mm) Plastic DFN
12-Lead (3mm × 3mm) Plastic DFN

LT3500EMSE#PBF LT3500EMSE#TRPBF 3500 16-Lead Plastic MSE –40°C to 125°C

LT3500IMSE#PBF LT3500IMSE#TRPBF 3500 16-Lead Plastic MSE –40°C to 125°C

LT3500HMSE#PBF LT3500HMSE#TRPBF 3500 16-Lead Plastic MSE –40°C to 150°C

Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based fi nish parts.

For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifi

cations, go to: http://www.linear.com/tapeandreel/

–40°C to 125°C

–40°C to 125°C

–40°C to 150°C

3500fb

2

LT3500

The l denotes the specifi cations which apply over the full operating

ELECTRICAL CHARACTERISTICS

temperature range, otherwise specifi cations are at T

= 25°C. V

J

PARAMETER CONDITIONS MIN TYP MAX UNITS

SHDN Threshold

SHDN Source Current V

= 0.62V 1.5 2.5 3.5 µA

SHDN

SHDN Current Hysterisis 1.25 2 3.25 µA

Minimum Input Voltage (Note 3) V

Supply Shutdown Current V

Supply Quiescent Current V

FB Voltage V

FB Bias Current V

Error Amplifi er g

m

Error Amplifi er Source Current V

Error Amplifi er Sink Current V

Error Amplifi er High Clamp V

Error Amplifi er Switching Threshold V

SS Source Current V

SS Sink Current V

SS POR Sink Current (Note 4) V

= 0V

FB

= 0V

SHDN

= 0.9V 2.5 3.5 mA

FB

= 1V

VC

V

= 0.8V to 1.6V, VIN = 3V to 40V

VC

= 0.8V, VVC = 1V 50 150 nA

FB

VVC = 1V, IVC = ±10µA 150 250 350 µmho

= 0.6V, VVC = 1V 12 16 20 µA

FB

= 1V, VVC = 1V 14 18 22 µA

FB

= 0.6V 1.8 2.0 2.2 V

FB

= 0.6V 0.6 0.8 1.0 V

FB

= 0.4V, VFB = 0.9V 2.25 2.75 3.75 µA

SS

= 0V, VSS = 2V 300 600 900 µA

FB

= 0V, VSS = 2V, Cycle SHDN 400 600 800 µA

FB

SS POR Threshold 50 100 150 mV

SS to FB Offset (V

– VFB)V

SS

PG/PG Leakage V
PG/PG Threshold (Rising) V
PG/PG Hysteresis (Falling) V

PG Sink Current V
PG Sink Current V

/SYNC Reference Voltage VFB = 0.9V, R

R

T

Switching Frequency R

= VFS, VSS = 0.4V 70 100 120 mV

VC

= 0.9V, VPG/VPG = 40V 0.1 1 µA

FB

= 0.4V 0.685 0.708 0.730 V

PG

= 0.4V 20 30 40 mV

PG

= 0.4V, VFB = 0.7V 250 500 750 µA

PG

= 0.4V, VFB = 0.9V 500 800 1100 µA

PG

RT/SYNC

= 90.9k

RT/SYNC

R
R

RT/SYNC
RT/SYNC

= 90.9k
= 15k

SYNC Frequency Range

Minimum Switch On Time V

Minimum Switch Off Time V

= 0.7V, R

FB

= 0.7V, R

FB

RT/SYNC

RT/SYNC

Switch Leakage Current VSW = 0V 1 10 µA

Switch Saturation Voltage I

Switch Peak Current DD Package V

Switch Peak Current MSE Package V

Boost Current I

Minimum Boost Voltage (Note 5) I

= 2A, V

SW

= 18V, VFB = 0.7V

BST

= 18V, VFB = 0.7V

BST

= 2A, V

SW

= 2A, VFB = 0.7V 2.2 3 V

SW

= 18V, VFB = 0.7V 450 mV

BST

= 20V, VFB = 0.7V 20 30 45 mA

BST

= 15V, V

VIN

= 2V, unless otherwise specifi ed.

RT/SYNC

l

l

l

l
l

710 760 780 mV

2.4 2.8 V

12 30 µA

0.784

0.776

0.8

0.8

0.816

0.824

= 15k 0.75 0.850 0.975 V

450

l

425

2

l

250 2500 kHz

500
500

2.4

550
625

2.8

kHz
kHz

MHz

= 90.9k 140 ns

= 90.9k 120 ns

2.3

l

2.1

2.3

l

2.1

2.8

2.8

2.9

2.9

3.5

3.5

3.5

3.7

V
V

A
A

A
A

3500fb

3

LT3500

ELECTRICAL CHARACTERISTICS

The l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at T

= 25°C. V

J

PARAMETER CONDITIONS MIN TYP MAX UNITS

LFB Voltage V

LFB Line/Load Regulation V

– V

SS to LFB Offset (V

SS

)V

LFB

LFB Bias Current V

– V

LDRV Dropout (V

VIN

)V

LDRV

LDRV Maximum Current V

= V

LDRV

LFB

= 3V to 40V, V

VIN

= 0.8V, V

SS

LFB

LDRV

LDRV

LDRV

= 0.8V 115 300 nA

= 3V, I

LDRV

= 5mA

= 0V

LDRV

= V

VIN

= V

LFB

= 15V, V

LFB

= 2V, unless otherwise specifi ed.

RT/SYNC

l

l

l

l

0.784 0.8 0.816 V

0.776 0.8 0.824 V

90 115 140 mV

0.8 1.2 1.6 V

91318mA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.

Note2: The LT3500EDD/LT3500EMSE is guaranteed to meet performance
specifi cations from 0°C to 125°C junction temperature. Specifi cations over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LT3500IDD/LT3500IMSE is guaranteed over the full –40°C to 125°C
operating junction temperature range. The LT3500HDD/LT3500HMSE is
guaranteed over the full –40°C to 150°C operating junction temperature
range. High junction temperatures degrade operating lifetimes. Operating
lifetime is derated at junction temperatures greater than 125°C.

Note 3: Minimum input voltage is defi ned as the voltage where internal
bias lines are regulated so that the reference voltage and oscillator remain
constant. Actual minimum input voltage to maintain a regulated output

will depend upon output voltage and load current. See Applications
Information.

Note 4: An internal power-on reset (POR) latch is set on the positive
transition of the SHDN pin through its threshold. The output of the latch
activates a current source on the SS pin which typically sinks 600µA,
discharging the SS capacitor. The latch is reset when the SS pin is driven
below the soft-start POR threshold or the SHDN pin is taken below its
threshold.

Note 5: This is the minimum voltage across the boost capacitor needed to
guarantee full saturation of the internal power switch.

Note 6: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed the maximum operating junction temperature
when overtemperature protection is active. Continuous operation above
the specifi ed maximum operating junction temperature may impair device
reliability.

TYPICAL PERFORMANCE CHARACTERISTICS

Feedback Voltage vs Temperature

0.820

0.815

0.810

0.805

0.800

VOLTAGE (V)

0.795

0.790

0.785

0.780
–50

–25

0

TEMPERATURE (°C)

FB

50

25

75

LFB

100

125

150

3500 G01

RT/SYNC Voltage vs Temperature

1.10

1.08

1.06
R

= 90.9k

1.04

1.02

1.00

0.98

VOLTAGE (V)

0.96

0.94

0.92

0.90

RT/SYNC

R

–50

–25 25

= 15k

RT/SYNC

0

TEMPERATURE (°C)

50

75

100

125

3500 G02

150

Shutdown Threshold and Minimum
Input Voltage vs Temperature

3.0

2.5

2.0

1.5

VOLTAGE (V)

1.0

0.5

0

–50

MINIMUM INPUT VOLTAGE

SHUTDOWN THRESHOLD

50 100 150125

–25 0

25 75

TEMPERATURE (°C)

3500 G03

4

3500fb

TYPICAL PERFORMANCE CHARACTERISTICS

LT3500

Shutdown Input Currents
vs Temperature

6

5

V

= 0.9V

SHDN

4

3

V

= 0.7V

SHDN

CURRENT (µA)

2

1

0

–50

050

–25 25

TEMPERATURE (°C)

Soft-Start Source Current
vs Temperature

3.5

3.3

3.1

2.9

2.7

2.5

2.3

CURRENT (µA)

2.1

1.9

1.7

1.5
–50

–25 25

0

TEMPERATURE (°C)

Shutdown Quiescent Current
vs Temperature

15.0

12.5

10.0

7.5

CURRENT (µA)

5.0

2.5

0

100

75

125

150

3500 G04

–50

050

–25 25

TEMPERATURE (°C)

100

75

125

150

3500 G05

Soft-Start Feedback Offset
vs Temperature

150

125

LFB

100

VOLTAGE (mV)

75

125

50

100

75

150

3500 G07

50

FB

–50

–25 0 25 50

TEMPERATURE (°C)

75 100 125 150

3500 G08

Error Amplifi er gm vs Temperature

400

350

300

250

200

TRANSCONDUCTANCE (µmhos)

150

100

–50

–25 25

050

TEMPERATURE (°C)

75

VC Switching Threshold
vs Temperature

0.95

0.90

0.85

0.80

0.75

0.70

VOLTAGE (V)

0.65

0.60

0.55

0.50
–50

–25

0

25 150125

50

TEMPERATURE (°C)

75 100

100

125

3500 G09

150

3500 G06

Power Good Thresholds
vs Temperature

0.75

0.74

0.73

0.72

0.71

0.70

0.69

VOLTAGE (V)

0.68

0.67

0.66

0.65
–50

–25

RISING EDGE

FALLING EDGE

25

0

TEMPERATURE (°C)

Power Good Sink Currents
vs Temperature Frequency vs Temperature

1000

900

800

700

600

500

400

CURRENT (µA)

300

200

100

50

75

100

150125

3500 G10

0

–50

–25

PG

PG

50

25

0

TEMPERATURE (°C)

75

100

150125

3500 G11

600

R

RT/SYNC

580

560

540

520

500

480

FREQUENCY (kHz)

460

440

420

400

–50

–25

= 90.9k

50

25

0

TEMPERATURE (°C)

75

100

150125

3500 G12

3500fb

5

LT3500

TYPICAL PERFORMANCE CHARACTERISTICS

Peak Switch Current
vs Temperature

3.5

3.4

3.3

3.2

3.1

3.0

2.9

CURRENT (A)

2.8

2.7

2.6

2.5
–50

DD PACKAGE

–25

0

TEMPERATURE (°C)

MSE PACKAGE

50

25

75

100

150125

3500 G13

LDRV Short-Circuit Current
vs Temperature

20

19

18

17

16

15

14

CURRENT (mA)

13

12

11

10

–50

Minimum Switching Times Frequency vs R

300

275

250

225

200

175

TIME (ns)

150

125

100

75

50

–50

MINIMUM ON TIME

–25 25

0

TEMPERATURE (°C)

MINIMUM OFF TIME

50

100

75

125

150

3500 G16

2500

2250

2000

1750

1500

1250

1000

FREQUENCY (kHz)

750

500

250

0

0

–25

0

4020

50

25

TEMPERATURE (°C)

75

RT/SYNC

120 140 180

8060

100

R

(kΩ)

RT/SYNC

100

TA = 25°C

160

3500 G14

3500 G17

150125

200

External Sync Duty Cycle Range
vs External Sync Frequency

100

90

80

70

60

50

40

DUTY CYCLE (%)

30

20

10

0

250

MAXIMUM DUTY CYCLE

= 25°C

T

A

MINIMUM DUTY CYCLE

750

SYNCHRONIZATION FREQUENCY (kHz)

1250

1750

Switch Saturation Voltage
vs Switch Current

600

500

400

300

–50°C

200

100

SWITCH SATURATION VOLTAGE (mV)

0

25°C

150°C

0.4 0.8 1.2 1.6
SWITCH CURRENT (A)

2250

3500 G15

2.00.20 0.6 1.0 1.4 1.8

3500 G18

Boost Current vs Switch Current

50

45

40

35

30

25

20

15

BOOST CURRENT (mA)

10

5

0

0.40.2

0

–50°C

0.80.6

1.0

SWITCH CURRENT (A)

6

150°C

25°C

1.2 1.4 1.8

1.6

3500 G19

2.0

Minimum Boost Voltages
vs Temperature Minimum Input Voltage

2.7

2.5

2.3

2.1
MINIMUM BOOST FOR
SWITCH SATURATION

1.9

BOOST VOLTAGE (V)

1.7

1.5

–50

050

–25 25

TEMPERATURE (°C)

75

100

125

150

3500 G20

8

TA = 25°C

7

6

5

4

3

INPUT VOLTAGE (V)

2

1

fSW = 1MHz
L = 3.3µH

0

0.4 0.8 1.2 2.01.40.2 0.6 1.0 1.8

0

V

OUT1

V

OUT1

LOAD CURRENT (A)

= 5V

= 3.3V

1.6

3500 G21

3500fb

TYPICAL PERFORMANCE CHARACTERISTICS

LDRV Dropout Voltage
vs Temperature

1.50
I

LDRV

1.45

1.40

1.35

1.30

1.25

1.20

VOLTAGE (V)

1.15

1.10

1.05

1.00

–50

= 5mA

–25 25

0

TEMPERATURE (°C)

125

50

100

75

150

3500 G22

Switcher Dropout Operation

6

I

= 1A

VOUT1

= 25°C

T

A

5

V

4

3

2

OUTPUT VOLTAGE (V)

1

0

2.5

3.5 4.0 4.5

3.0
INPUT VOLTAGE (V)

VOUT1

= 5V

V

VOUT1

= 3.3V

5.0 5.5

3500 G23

Inductor Value for 2A Maximum
Load Current (V
I

RIPPLE

2500

2250

2000

1750

1500

1250

1000

FREQUENCY (kHz)

750

500

250

5

10

= 250mA)

L = 1.5µH

OUT1

L = 1µH

15

20 40

INPUT VOLTAGE (V)

25

LT3500

= 3.3V,

TA = 25°C

L = 2.2µH

L = 3.3µH

L = 4.7µH

L = 6.8µH

L = 10µH

30 35

3500 G24

PIN FUNCTIONS

VIN: The VIN pin powers the internal control circuitry and
is monitored by an undervoltage comparator. The V
is also connected to the collectors of the internal power
NPN switch and linear output NPN. The V

pin has high

IN

dI/dt edges and must be decoupled to ground close to
the pin of the device.

SHDN: The SHDN pin is used to shut down the LT3500
and reduce quiescent current to a typical value of
12µA. The accurate 0.76V threshold and input current
hysteresis can be used as an undervoltage lockout, prevent­ing the regulator from operating until the input voltage has
reached a predetermined level. Force the SHDN pin above
its threshold or let it fl oat for normal operation.

SS: The SS pin is used to control the slew rate of the
output of both the switching and linear regulators. A
single capacitor from the SS pin to ground determines
the regulators’ ramp rate. For soft-start details see the
Applications Information section.

PG: The power good pin is an open-collector output that
sinks current when the FB or LFB falls below 90% of its

IN

pin

nominal regulating voltage. For V
state remains true, although during SHDN, V

above 2V, its output

IN

undervoltage

IN

lockout, or thermal shutdown, its current sink capability
is reduced

: The VC pin is the output of the error amplifi er and the

V

C

input to the peak switch current comparator. It is normally
used for frequency compensation, but can also be used
as a current clamp or control loop override. If the error
amplifi er drives V

above the maximum switch current

C

level, a voltage clamp activates. This indicates that the
output is overloaded and current to be pulled from the
SS pin reducing the regulation point.

/SYNC: This RT/SYNC pin provides two modes of setting

R

T

the constant switch frequency.

Connecting a resistor from the R
will set the R

/SYNC pin to a typical value of 1V. The

T

/SYNC pin to ground

T

resultant switching frequency will be set by the resistor
value. The minimum value of 15kΩ and maximum value
of 200kΩ set the switching frequency to 2.5MHz and
250kHz respectively.

3500fb

7

LT3500

PIN FUNCTIONS

Driving the RT/SYNC pin with an external clock signal
will synchronize the switch to the applied frequency.
Synchronization occurs on the rising edge of the clock
signal after the clock signal is detected. Each rising clock
edge initiates an oscillator ramp reset. A gain control loop
servos the oscillator charging current to maintain a con­stant oscillator amplitude. Hence, the slope compensation
remains unchanged. If the clock signal is removed, the
oscillator reverts to resistor mode and reapplies the 1V
bias to the R
circuitry times out. The clock source impedance should
be set such that the current out of the R
resistor mode generates a frequency roughly equivalent
to the synchronization frequency. Floating or holding the

/SYNC pin above 1.1V will not damage the device, but

R

T

will halt oscillation.
PG: The power good bar pin is an open-collector output

that sinks current when the FB or LFB rises above 90%
of its nominal regulating voltage.

FB: The FB pin is the negative input to the switcher error
amplifi er. The output switches to regulate this pin to 0.8V
with respect to the exposed ground pad. Bias current
fl ows out of the FB pin.

LFB: The LFB pin is the negative input to the linear error
amplifi er. The L
with respect to the exposed ground pad. Bias current fl ows
out of the LFB pin.

/SYNC pin after the synchronization detection

T

/SYNC pin in

T

pin servo’s to regulate this pin to 0.8V

DRV

LDRV: The LDRV pin is the emitter of an internal NPN that
can be confi gured as an output of a linear regulator or as
the drive for an external NPN high current regulator. Cur­rent fl ows out of the LDRV pin when the LFB pin voltage is
below 0.8V. The LDRV pin has a typical maximum current
capability of 13mA.

BST: The BST pin provides a higher than V
the power NPN to ensure a low switch drop. A compara­tor to V
the BST pin voltage drops too low. Forcing a SW off time
allows the boost capacitor to recharge.

SW: The SW pin is the emitter of the on-chip power NPN.
At switch off, the inductor will drive this pin below ground
with a high dV/dt. An external catch diode to ground, close
to the SW pin and respective V
ground, must be used to prevent this pin from excessive
negative voltages.

Exposed Pad: GND. The Exposed Pad is the only ground
connection for the device. The Exposed Pad should be
soldered to a large copper area to reduce thermal resis­tance. The GND pin also serves as small-signal ground.
For ideal operation all small-signal ground paths should
connect to the GND pin at a single point, avoiding any
high current ground returns.

NC Pins (MSE Package Only): No Connection. The NC pins
are electrically isolated from the LT3500. The NC pins may
be connected to PCB traces to aid PCB layout.

imposes a minimum off time on the SW pin if

IN

decoupling capacitor’s

IN

base drive to

IN

8

3500fb

BLOCK DIAGRAM

–

+

–

+

+

–

+

+

–

+

–

–

+

INTERNAL

REGULATOR

AND REFERENCES

OSCILLATOR

AND AGC

POWER ON RESET

THERMAL

OVERLOAD

SQR

PRE

SQR

2µA

2.75µA

2.5µA

C1

0.76V

–

+

100mV

R5

R6

V

IN

GND

SHDN

R

T

/SYNC

V

C

SS

DRIVER

CIRCUITRY

SLOPE

COMPENSATION

0.8V
SS

115mV

LDRV

R3

R1

R2

R4

C5

D2

D1

V

OUT2

V

OUT1

3500 BD

LFB

SW

FB

PG

PG

0.8V

100mV

0.7V

LFB

SS

C6

L1

C2

C4C3

C7

+

+

LT3500

Figure 1. LT3500 Block Diagram

3500fb

9

LT3500

OPERATION

The LT3500 is a constant frequency, current mode buck
converter with an internal 2.3A switch plus a linear regula­tor with 13mA output capability. Control of both outputs
is achieved with a common SHDN pin, internal regulator,
oscillator, undervoltage detect, soft-start, thermal shut­down and power-on reset.

If the SHDN pin is taken below its 0.8V threshold, the
LT3500 will be placed in a low quiescent current mode.
In this mode the LT3500 typically draws 12µA from the

pin.

V

IN

When the SHDN pin is fl oated or driven above 0.76V, the
internal bias circuits turn on generating an internal regu­lated voltage, 0.8(V

) and 1V(RT/SYNC) references, and

FB

a POR signal which sets the soft-start latch.

As the R

/SYNC pin reaches its 1V regulation point, the

T

internal oscillator will start generating a clock signal at a
frequency determined by the resistor from the R

/SYNC

T

pin to ground. Alternatively, if a synchronization signal is
detected by the LT3500 at the R

/SYNC pin, a clock signal

T

will be generated at the incoming frequency on the rising
edge of the synchronization pulse. In addition, the internal
slope compensation will be automatically adjusted to pre­vent subharmonic oscillation during synchronization.

The LT3500 is a constant frequency, current mode step­down converter. Current mode regulators are controlled
by an internal clock and two feedback loops that control
the duty cycle of the power switch. In addition to the
normal error amplifi er, there is a current sense amplifi er
that monitors switch current on a cycle-by-cycle basis.
This technique means that the error amplifi er commands
current to be delivered to the output rather than voltage.

A voltage fed system will have low phase shift up to the
resonant frequency of the inductor and output capacitor,
then an abrupt 180° shift will occur. The current fed system
will have 90° phase shift at a much lower frequency, but
will not have the additional 90° shift until well beyond
the LC resonant frequency. This makes it much easier to
frequency compensate the feedback loop and also gives
much quicker transient response.

During power up, the POR signal sets the soft-start latch,
which discharges the SS pin to ensure proper start-up
operation. When the SS pin voltage drops below 100mV,

pin is driven low disabling switching and the soft-

the V

C

start latch is reset. Once the latch is reset the soft-start
capacitor starts to charge with a typical value of 2.75µA.

As the voltage rises above 100mV on the SS pin, the V

C

pin will be driven high by the error amplifi er. When the
voltage on the V

pin exceeds 0.8V, the clock set-pulse sets

C

the driver fl ip-fl op which turns on the internal power NPN
switch. This causes current from V

, through the NPN

IN

switch, inductor and internal sense resistor, to increase.
When the voltage drop across the internal sense resistor
exceeds a predetermined level set by the voltage on the

pin, the fl ip-fl op is reset and the internal NPN switch

V

C

is turned off. Once the switch is turned off the inductor
will drive the voltage at the SW pin low until the external
Schottky diode starts to conduct, decreasing the current
in the inductor. The cycle is repeated with the start of each
clock cycle. However, if the internal sense resistor voltage
exceeds the predetermined level at the start of a clock cycle,
the fl ip-fl op will not be set resulting in a further decrease in
inductor current. Since the output current is controlled by

voltage, output regulation is achieved by the error

the V

C

amplifi er continually adjusting the V

pin voltage.

C

The error amplifi er is a transconductance amplifi er that
compares the FB voltage to either the SS pin voltage minus
100mV or an internally regulated 800mV, whichever is
lowest. Compensation of the loop is easily achieved with
a simple capacitor or series resistor/capacitor from the

pin to ground.

V

C

Since the SS pin is driven by a constant current source, a
single capacitor on the soft-start pin will generate controlled
linear ramp on the output voltage.

If the current demanded by the output exceeds the maxi­mum current dictated by the V

pin clamp, the SS pin

C

will be discharged, lowering the regulation point until the
output voltage can be supported by the maximum current.
When overload is removed, the output will soft-start from
the overload regulation point.

10

3500fb

OPERATION

LT3500

VIN undervoltage detection or thermal shutdown will
set the soft-start latch, resulting in a complete soft-start
sequence.

The switch driver operates from either the V

or BST volt-

IN

age. An external diode and capacitor are used to generate
a drive voltage higher than V

to saturate the output NPN

IN

and maintain high effi ciency.

In addition to the switching regulator, the LT3500 contains
a NPN linear regulator with a 0.8V reference, and 13mA
current capability. The 0.8 reference will track the SS pin

APPLICATIONS INFORMATION

Choosing the Output Voltage

The output voltage is programmed with a resistor divider
between the output and the FB pin. Choose the 1% resis­tors according to:

V



R1= R2





OUT1

0.8V

R2 should be 10.0k or less to avoid bias current errors.
Reference designators refer to the Block Diagram in
Figure 1.

Choosing the Switching Frequency

The LT3500 switching frequency is set by resistor R5 in
Figure 1. The R
Setting resistor R5 sets the current in the R
which determines the oscillator frequency as illustrated
in Figure 2.

The switching frequency is typically set as high as pos­sible to reduce overall solution size. The LT3500 employs
techniques to enhance dropout at high frequencies but
effi ciency and maximum input voltage decrease due to
switching losses and minimum switch on times. The



–1





/SYNC pin is internally regulated at 1V.

T

/SYNC pin

T

in the same manner as the switching regulator. The linear
output can also be confi gured to drive an external NPN to
provide a linear regulator with higher current capability.

A power good comparator with 30mV of hysteresis trips
when both FB and LFB are above 90% of the 0.8V refer­ence. The PG output is an open collector NPN that is off
when the output is in regulation allowing a resistor to pull
the PG pin to a desired voltage. The PG output is an open­collector NPN that is on when the output is in regulation
providing either drive for an output disconnect transistor
or inverted power good logic.

maximum recommended frequency can be approximated
by the equation:

Frequency (Hz)=

where

VD is the forward voltage drop of the catch diode
(D1 Figure 1),
switch, and t

+ V

OUT1

VIN− VSW+ V

D

D

VSW is the voltage drop of the internal

ON(MIN)

is the minimum on time of the

•
t

ON(MIN)

1

V

switch, all at maximum load current.

2500

2250

2000

1750

1500

1250

1000

FREQUENCY (kHz)

750

500

250

0

Figure 2. Frequency vs RT/SYNC Resistance

4020

0

8060

R

RT/SYNC

120 140 180

100

(kΩ)

160

200

3500 F02

3500fb

11

LT3500

APPLICATIONS INFORMATION

The following example along with the data in Table 1
illustrates the tradeoffs of switch frequency selection.

Example.

= 25V, V

V

IN

OUT1

= 3.3V, I

OUT1

= 2.0A,

Temperature = 0°C to 85°C

t

ON(MIN)

tics graph),

Max Frequency =

= 185ns (85°C from Typical Characteris-

VD

= 0.6V,

3.3 + 0.6

25 − 0.4+ 0.6

VSW = 0.4V (85°C)

1

•

~ 835kHz

185ns

RT/SYNC ~ 49.9k
Frequency ≅ 820kHz

Input Voltage Range

Once the switching frequency has been determined, the
input voltage range of the regulator can be determined.
The minimum input voltage is determined by either the
LT3500’s minimum operating voltage of ~2.8V or by its
maximum duty cycle. The duty cycle is the fraction of time
that the internal switch is on during a clock cycle. The
maximum duty cycle can be determined from the clock
frequency and the minimum off time from the typical
characteristics graph.

This leads to a minimum input voltage of:

V

+ V

V

IN(MIN)

OUT1

=

DC

MAX

D

− VD+ V

SW

where VSW is the voltage drop of the internal switch,
and

DC

MAX

= 1 – t

OFF(MIN)

• Frequency.

Figure 3 shows a typical graph of minimum input voltage
vs load current for 3.3V and 5V applications.

The maximum input voltage is determined by the absolute
maximum ratings of the V

and BST pins and by the

IN

frequency and minimum duty cycle.

The minimum duty cycle is defi ned as:

DC

MIN

= t

ON(MIN)

• Frequency

Maximum input voltage as:

V

+ V

V

IN(MAX)

Figure 3. Minimum Input Voltage vs Load Current

OUT1

=

DC

8

7

6

5

4

INPUT VOLTAGE (V)

3

2

0

0.2 0.4 0.6 0.8 1.41.2

D

− VD+ V

MIN

V
V
V
V

1.0 1.6 1.8

LOAD CURRENT (A)

SW

= 5V START-UP

OUT1

= 5V RUNNING

OUT1

= 3.3V START-UP

OUT1

= 3.3V RUNNING

OUT1

fSW = 1MHz
L = 3.3µH

2.0

3500 F03

Table 1. Effi ciency and Size Comparisons for Different R

FREQUENCY RT/SYNC EFFICIENCY V

2.5MHz 15k 73.6 12 1µ 10µ 24

2.0MHz 20k 81.5 14 1.5µ 10µ 24

1.5MHz 24.9k 84.5 18 2.2µ 10µ 24

1.0MHz 40.2k 87.3 28 3.3µ 22µ 34

500kHz 90.9k 88.9 36 4.7µ 47µ 40

RT/SYNC

Values, V

IN(MAX)

OUT1

= 3.3V

L C C + L AREA

12

(mm

2

)

3500fb

APPLICATIONS INFORMATION

LT3500

Note that the LT3500 will regulate if the input voltage is
taken above the calculated maximum voltage as long as
maximum ratings of the V

and BST pins are not violated.

IN

However operation in this region of input voltage will exhibit
pulse skipping behavior.

Example:

V

OUT1

= 3.3V, I

= 1A, Frequency = 1MHz,

OUT1

Temperature = 25°C,

V
t

= 0.3V, VD = 0.4V, t

SW

OFF(MIN)

DC

V

IN(MIN)

DC

V

IN(MAX)

= 110ns

=1−(110ns)1MHz =89%

MAX

3.3 + 0.4

=

0.89

= t

MIN

ON(MIN)

3.3 + 0.4

=

ON(MIN)

− 0.4+ 0.3= 4.06V

•Frequency = 15%

− 0.4+ 0.3 = 24.57V

0.15

= 150ns,

Inductor Selection and Maximum Output Current

A good fi rst choice for the inductor value is:

(VIN− V

L =

OUT1

VIN•f

)•V

OUT1

For applications with a duty cycle of about 50%, the induc­tor value should be chosen to obtain an inductor ripple
current less than 40% of peak switch current.

Of course, such a simple design guide will not always result
in the optimum inductor for your application. A larger value
provides a slightly higher maximum load current, and will
reduce the output voltage ripple. If your load is lower than

1.5A, then you can decrease the value of the inductor and
operate with higher ripple current. This allows you to use
a physically smaller inductor, or one with a lower DCR
resulting in higher effi ciency.

The current in the inductor is a triangle wave with an
average value equal to the load current. The peak switch
current is equal to the output current plus half the peak-to
peak inductor ripple current. The LT3500 limits its switch
current in order to protect itself and the system from
overload faults. Therefore, the maximum output current
that the LT3500 will deliver depends on the current limit,
the inductor value, switch frequency, and the input and
output voltages. The inductor is chosen based on output
current requirements, output voltage ripple requirements,
size restrictions and effi ciency goals.

When the switch is off, the inductor sees the output volt­age plus the catch diode drop. This gives the peak-to-peak
ripple current in the inductor:

where f is frequency in MHz and L is in µH.

With this value the maximum load current will be ~2A,
independent of input voltage. The inductor’s RMS current
rating must be greater than your maximum load current
and its saturation current should be about 30% higher. To
keep effi ciency high, the series resistance (DCR) should
be less than 0.05.

V

OUT1

+ V

D

1−DC

()

ΔIL=

()

L•f

where f is the switching frequency of the LT3500 and L
is the value of the inductor. The peak inductor and switch
current is:

ΔI

I

SW(PK)=ILPK=IOUT1

L

+

2

3500fb

13

LT3500

APPLICATIONS INFORMATION

To maintain output regulation, this peak current must be

. I

less than the LT3500’s switch current limit, I

LIM

LIM

is
guaranteed to be greater than 2.3A over the entire duty
cycle range. The maximum output current is a function
of the chosen inductor value:

I

OUT1(MAX)=ILIM

ΔI

L

−

=2.3 –

2

ΔI

L

2

If the inductor value is chosen so that the ripple current
is small, then the available output current will be near the
switch current limit.

One approach to choosing the inductor is to start with the
simple rule given above, look at the available inductors
and choose one to meet cost or space goals. Then use
these equations to check that the LT3500 will be able to
deliver the required output current. Note again that these
equations assume that the inductor current is continuous.
Discontinuous operation occurs when I

/2 as calculated above.

I

L

is less than

OUT1

Figure 4 illustrates the inductance value needed for a 3.3V
output with a maximum load capability of 2A. Referring
to Figure 4, an inductor value between 3.3µH and 4.7µH
will be suffi cient for a 15V input voltage and a switch
frequency of 750kHz. There are several graphs in the
Typical Performance Characteristics section of this data
sheet that show inductor selection as a function of input
voltage and switch frequency for several popular output
voltages and output ripple currents. Also, low inductance
may result in discontinuous mode operation, which is
okay, but further reduces maximum load current. For
details of maximum output current and discontinuous
mode operation, see Linear Technology Application Note

44. Finally, for duty cycles greater than 50% (V

OUT1/VIN

> 0.5), there is a minimum inductance required to avoid
subharmonic oscillations. See Application Note 19 for
more information.

2500

2250

2000

1750

1500

1250

1000

FREQUENCY (kHz)

750

500

250

Figure 4. Inductor Values for 2A Maximum Load Current
(V

= 3.3V, I

OUT1

L = 1µH

15

5

10

RIPPLE

20 40

INPUT VOLTAGE (V)

= 1A)

25

L = 1.5µH

L = 2.2µH

L = 3.3µH

L = 4.7µH

L = 6.8µH

30 35

3500 F04

Input Capacitor Selection

Bypass the input of the LT3500 circuit with a 4.7µF or
higher ceramic capacitor of X7R or X5R type. A lower
value or a less expensive Y5V type can be used if there
is additional bypassing provided by bulk electrolytic or
tantalum capacitors. The following paragraphs describe
the input capacitor considerations in more detail.

Step-down regulators draw current from the input sup­ply in pulses with very fast rise and fall times. The input
capacitor is required to reduce the resulting voltage
ripple at the LT3500 and to force this very high frequency
switching current into a tight local loop, minimizing EMI.
The input capacitor must have low impedance at the
switching frequency to do this effectively, and it must
have an adequate ripple current rating.

A conservative value is the RMS input current is given
by:

⎡

I

OUT1VOUT1

I

CIN(RMS)

=

⎣

and is largest when VIN = 2V

•VIN− V

()

V

OUT1

OUT1

IN

(50% duty cycle).

0.5

⎤

I

⎦

OUT1

<

2

14

3500fb

APPLICATIONS INFORMATION

LT3500

The frequency, VIN to V
current requirement of the LT3500 along with the input
supply source impedance, determine the energy storage
requirements of the input capacitor. Determine the worst­case condition for input ripple current and then size the
input capacitor such that it reduces input voltage ripple to
an acceptable level. Typical values for input capacitors run
from 10µF at low frequencies to 2.2µF at higher frequencies.
The combination of small size and low impedance (low
equivalent series resistance or ESR) of ceramic capacitors
make them the preferred choice. The low ESR results in
very low voltage ripple and the capacitors can handle plenty
of ripple current. They are also comparatively robust and
can be used in this application at their rated voltage. X5R
and X7R types are stable over temperature and applied
voltage, and give dependable service. Other types (Y5V and
Z5U) have very large temperature and voltage coeffi cients
of capacitance, so they may have only a small fraction of
their nominal capacitance in your application. While they
will still handle the RMS ripple current, the input voltage
ripple may become fairly large, and the ripple current may
end up fl owing from your input supply or from other by­pass capacitors in your system, as opposed to being fully
sourced from the local input capacitor. An alternative to a
high value ceramic capacitor is a lower value along with
a larger electrolytic capacitor, for example a 1µF ceramic
capacitor in parallel with a low ESR tantalum capacitor.
For the electrolytic capacitor, a value larger than 10µF will
be required to meet the ESR and ripple current require­ments. Because the input capacitor is likely to see high
surge currents when the input source is applied, tantalum
capacitors should be surge rated. The manufacturer may
also recommend operation below the rated voltage of the
capacitor. Be sure to place the 1µF ceramic as close as
possible to the V
noise immunity.

and GND pins on the IC for optimal

IN

ratio, and maximum load

OUT1

A fi nal caution regarding the use of ceramic capacitors for
input bypassing. A ceramic input capacitor can combine
with stray inductance to form a resonant tank circuit. If
power is applied quickly (for example, by plugging the
circuit into a live power source) this tank can ring, doubling
the input voltage and damaging the LT3500. The solution is
to either clamp the input voltage or dampen the tank circuit
by adding a lossy capacitor in parallel with the ceramic
capacitor. For details see Application Note 88.

Output Capacitor Selection

Typically step-down regulators are easily compensated with
an output crossover frequency that is 1/10 of the switch­ing frequency. This means that the time that the output
capacitor must supply the output load during a transient
step is ~2 or 3 switching periods. With an allowable 5%
drop in output voltage during the step, a good starting
value for the output capacitor can be expressed by:

C

Example:

V
2A

C

The calculated value is only a suggested starting value.
Increase the value if transient response needs improvement
or reduce the capacitance if size is a priority. The output
capacitor fi lters the inductor current to generate an output
with low voltage ripple. It also stores energy in order to
satisfy transient loads and to stabilize the LT3500’s control
loop. The switching frequency of the LT3500 determines

=

VOUT1

= 3.3V, Frequency = 1MHz, Max Load Step =

OUT1

=

VOUT1

Max Load Step

Frequency • 0.05• V

2

1MHz • 0.05• 3.3

=12μF

OUT1

3500fb

15

LT3500

APPLICATIONS INFORMATION

the value of output capacitance required. Also, the current
mode control loop doesn’t require the presence of output
capacitor series resistance (ESR). For these reasons, you
are free to use ceramic capacitors to achieve very low
output ripple and small circuit size. Estimate output ripple
with the following equations:

ΔI

V

RIPPLE

=

8 •Frequency •C

L

OUT1

For ceramic capacitors and,

RIPPLE

= ΔIL • ESR

V

For electrolytic (tantalum and aluminum)
where ΔIL is the peak-to-peak ripple current in the

inductor.

The RMS content of this ripple is very low, and the RMS
current rating of the output capacitor is usually not of
concern.

Another constraint on the output capacitor is that it must
have greater energy storage than the inductor; if the stored
energy in the inductor is transferred to the output, you
would like the resulting voltage step to be small compared
to the regulation voltage. For a 5% overshoot, this require­ment becomes:

I

LIM

OUT1

2






C



> 10 •L

OUT1



V



Finally, there must be enough capacitance for good transient
performance. The last equation gives a good starting point.
Alternatively, you can start with one of the designs in this
data sheet and experiment to get the desired performance.
This topic is covered more thoroughly in the section on
loop compensation.

The high performance (low ESR), small size and robust­ness of ceramic capacitors make them the preferred type
for LT3500 applications. However, all ceramic capacitors
are not the same. As mentioned above, many of the high
value capacitors use poor dielectrics with high tempera­ture and voltage coeffi cients. In particular, Y5V and Z5U
types lose a large fraction of their capacitance with ap­plied voltage and temperature extremes. Because the loop
stability and transient response depend on the value of

, you may not be able to tolerate this loss. Use X7R

C

OUT1

and X5R types. You can also use electrolytic capacitors.
The ESRs of most aluminum electrolytics are too large to
deliver low output ripple. Tantalum and newer, lower ESR
organic electrolytic capacitors intended for power supply
use, are suitable and the manufacturers will specify the
ESR. The choice of capacitor value will be based on the
ESR required for low ripple. Because the volume of the
capacitor determines its ESR, both the size and the value
will be larger than a ceramic capacitor that would give you
similar ripple performance. One benefi t is that the larger
capacitance may give better transient response for large
changes in load current.

Catch Diode

The diode D1 conducts current only during switch off
time. Use a Schottky diode to limit forward voltage drop to
increase effi ciency. The Schottky diode must have a peak
reverse voltage that is equal to regulator input voltage and
sized for average forward current in normal operation.
Average forward current can be calculated from:

I

=

OUT1

•VIN− V

()

V

IN

OUT1

I

D(AVG)

16

3500fb

APPLICATIONS INFORMATION

LT3500

The only reason to consider a larger diode is the worst­case condition of a high input voltage and shorted output.
With a shorted condition, diode current will increase to a
typical value of 3A, determined by the peak switch current
limit of the LT3500. This is safe for short periods of time,
but it would be prudent to check with the diode manu­facturer if continuous operation under these conditions
can be tolerated.

BST Pin Considerations

The capacitor and diode tied to the BST pin generate
a voltage that is higher than the input voltage. In most
cases a 0.47µF capacitor and fast switching diode (such
as the CMDSH-3 or FMMD914) will work well. Almost
any type of fi lm or ceramic capacitor is suitable, but the
ESR should be <1Ω to ensure it can be fully recharged
during the off time of the switch. The capacitor value can
be approximated by:

− V

•DC

BST(MIN)

•f

I

C

=

BST

OUT1(MAX)

50 • V

()

OUT1

where I
V

BST(MIN)

OUT1(MAX)

is the minimum boost voltage to fully saturate

is the maximum load current, and

the switch.

Figure 5 shows four ways to arrange the boost circuit.
The BST pin must be more than 2.2V above the SW pin
for full effi ciency.

Generally, for outputs of 3.3V and higher the standard
circuit (Figure 5a) is the best. For outputs between 2.8V
and 3.3V, replace the D2 with a small Schottky diode such
as the PMEG4005.

For lower output voltages the boost diode can be tied to
the input (Figure 5b). The circuit in Figure 5a is more ef­fi cient because the BST pin current comes from a lower
voltage source.

Figure 5c shows the boost voltage source from the linear
output that is set to greater than 2.5V (any available DC
sources that are greater than 2.5V is suffi cient). The highest
effi ciency is attained by choosing the lowest boost volt­age above 2.5V. You must also be sure that the maximum
voltage at the BST pin is less than the maximum specifi ed
in the Absolute Maximum Ratings section.

LT3500

= VIN+ V

LDRV

OUT1

BST

SW

OUT1

V

IN

C3

D1

D2

V

OUT1

V

IN

V

– VSW = V

BST

V

BST(MAX)

V

IN

V

IN

V

– VSW = V

BST

V

BST(MAX)

(5a)

V

IN

V

IN

V

BST

V

BST(MAX)

V

OUT2

LT3500

– VSW = V

= VIN+ V

≥ 2.5V

LDRV

D2

BST

C3

SW

D1

OUT2

OUT2

V

V

OUT2

OUT1

V

IN

V

IN

V

– VSW = V

BST

V

BST(MAX)

LT3500

= 2 •V

(5b)

LT3500

= V

X

LDRV

IN

IN

LDRV

X

BST

SW

BST

SW

D2

C3

V

OUT1

D1

D2

VX > VIN + 3V

V

OUT1

D1

3500 F05

(5d)(5c)

Figure 5. BST Pin Considerations

3500fb

17

LT3500

APPLICATIONS INFORMATION

The boost circuit can also run directly from a DC voltage
that is higher than the input voltage by more than 2.5V, as
in Figure 5d. The diode is used to prevent damage to the
LT3500 in case V

is held low while VIN is present. The

X

circuit eliminates a capacitor, but effi ciency may be lower
and dissipation in the LT3500 may be higher. Also, if V

is

X

absent, the LT3500 will still attempt to regulate the output,
but will do so with very low effi ciency and high dissipation
because the switch will not be able to saturate, dropping

1.5V to 2V in conduction.

The minimum input voltage of an LT3500 application is
limited by the minimum operating voltage (<2.8V) and by
the maximum duty cycle as outlined above. For proper
start-up, the minimum input voltage is also limited by
the boost circuit. If the input voltage is ramped slowly, or
the LT3500 is turned on with its SS pin when the output
is already in regulation, then the boost capacitor may not
be fully charged. Because the boost capacitor is charged
with the energy stored in the inductor, the circuit will rely
on some minimum load current to get the boost circuit
running properly. This minimum load will depend on
input and output voltages and on the arrangement of the
boost circuit.

The Typical Performance Characteristics section shows
plots of the minimum load current to start and to run as a
function of input voltage for 3.3V and 5V outputs. In many
cases the discharged output capacitor will present a load
to the switcher which will allow it to start. The plots show
the worst-case situation where V

is ramping very slowly.

IN

Use a Schottky diode for the lowest start-up voltage.

Frequency Compensation

The LT3500 uses current mode control to regulate the
output. This simplifi es loop compensation. In particular, the
LT3500 does not require the ESR of the output capacitor
for stability so you are free to use ceramic capacitors to
achieve low output ripple and small circuit size. Frequency
compensation is provided by the components tied to the

pin. Generally a capacitor and a resistor in series to

V

C

ground determine loop gain. In addition, there is a lower
value capacitor in parallel. This capacitor is not part of
the loop compensation but is used to fi lter noise at the
switching frequency.

Loop compensation determines the stability and transient
performance. Designing the compensation network is a bit
complicated and the best values depend on the application
and in particular the type of output capacitor. A practical
approach is to start with one of the circuits in this data
sheet that is similar to your application and tune the com­pensation network to optimize the performance. Stability
should then be checked across all operating conditions,
including load current, input voltage and temperature.

The LT1375 data sheet contains a more thorough discus­sion of loop compensation and describes how to test the
stability using a transient load.

Figure 6 shows an equivalent circuit for the LT3500 control
loop. The error amp is a transconductance amplifi er with
fi nite output impedance. The power section, consisting
of the modulator, power switch, and inductor, is modeled
as a transconductance amplifi er generating an output

18

LT3500

CURRENT MODE

POWER STAGE

= 3mho

g

m

V

C

C

C

F

C

R

C

4M

ERROR AMP

= 250µmhos

g

m

Figure 6. Model for Loop Response

SW

C

R1 ESR

FB

–
+

0.8V

R2

PL

TANTALUM

OR

POLYMER

V

OUT1

C1 C1

CERAMIC

3500 F06

3500fb

APPLICATIONS INFORMATION

LT3500

current proportional to the voltage at the VC pin. Note that
the output capacitor integrates this current, and that the
capacitor on the V

pin (CC) integrates the error amplifi er

C

output current, resulting in two poles in the loop. In
most cases a zero is required and comes from either the
output capacitor ESR or from a resistor in series with C

.

C

This simple model works well as long as the value of the
inductor is not too high and the loop crossover frequency
is much lower than the switching frequency. A phase lead
capacitor (C

) across the feedback divider may improve

PL

the transient response.

Synchronization

The R
to an external clock source. Driving the R

/SYNC pin can be used to synchronize the LT3500

T

/SYNC resistor

T

with a clock source triggers the synchronization detection
circuitry. Once synchronization is detected, the rising edge
of SW will be synchronized to the rising edge of the R

/SYNC

T

pin signal. An AGC loop will adjust slope compensation
to avoid subharmonic oscillation.

If the synchronization signal is not present during regu­lator start-up (for example, the synchronization circuitry
is powered from the regulator output) the R

/SYNC pin

T

must see an equivalent resistance to ground between 15k
and 200k until the synchronization circuitry is active for
proper start-up operation.

If the synchronization signal powers up in an undetermined
state (V

, VOH, Hi-Z), connect the synchronization clock

OL

to the LT3500 as shown in Figure 7. The circuit as shown
will isolate the synchronization signal when the output
voltage is below 90% of the regulated output. The LT3500
will start-up with a switching frequency determined by the
resistor from the R

LT3500

/SYNC pin to ground.

T

LDRV

PG

/SYNC

R

T

V

CC

SYNCHRONIZATION

CIRCUITRY

CLK

3500 F07

The synchronizing clock signal input to the LT3500 must
have a frequency between 250kHz and 2.5MHz, a duty
cycle between 20% and 80%, a low state below 0.5V and
a high state above 1.6V. Synchronization signals outside
of these parameters will cause erratic switching behavior.
The R
running frequency ((V

/SYNC resistor should be set such that the free

T

RT/SYNC

– V

SYNCLO

)/R

RT/SYNC

) is
approximately equal to the synchronization frequency. If
the synchronization signal is halted, the synchronization
detection circuitry will timeout in typically 10µs at which
time the LT3500 reverts to the free-running frequency based
on the current through R

/SYNC. If the RT/SYNC pin is held

T

above 1.1V at any time, switching will be disabled.

Figure 7. Synchronous Signal Powered from Regulator’s Output

If the synchronization signal powers up in a low impedance
state (V

), connect a resistor between the RT/SYNC pin

OL

and the synchronizing clock. The equivalent resistance
seen from the R

/SYNC pin to ground will set the start-up

T

frequency.

If the synchronization signal powers up in a high impedance
state (Hi-Z), connect a resistor from the R
ground. The equivalent resistance seen from the R

/SYNC pin to

T

/SYNC

T

pin to ground will set the start-up frequency.

3500fb

19

LT3500

APPLICATIONS INFORMATION

If the synchronization signal changes between high and
low impedance states during power up (V

, Hi-Z), connect

OL

the synchronization circuitry to the LT3500 as shown in
the Typical Applications section. This will allow the LT3500
to start up with a switching frequency determined by the
equivalent resistance from the R

/SYNC pin to ground.

T

Shutdown and Undervoltage Lockout

Figure 8 shows how to add an undervoltage lockout (UVLO)
to the LT3500. Typically, UVLO is used in situations where
the input supply is current limited, or has a relatively high
source resistance. A switching regulator draws constant
power from the source, so source current increases as
source voltage drops. This looks like a negative resistance
load to the source and can cause the source to current limit
or latch low under low source voltage conditions. UVLO
prevents the regulator from operating at source voltages
where these problems might occur.

V

IN

2.5µA

R1

2µA

SHDN

R2C1

Figure 8. Undervoltage Lockout

0.76V

+
–

3500 F08

An internal comparator will force the part into shutdown
below the minimum V

of 2.8V. This feature can be

IN

used to prevent excessive discharge of battery-operated
systems.

If an adjustable UVLO threshold is required, the SHDN
pin can be used. The threshold voltage of the SHDN pin
comparator is 0.76V. A 2.5µA internal current source de­faults the open-pin condition to be operating (see Typical
Performance Characteristics). Current hysteresis is added

above the SHDN threshold. This can be used to set voltage
hysteresis of the UVLO using the following:

− V

V

H

L

2μA

0.76

VH− 0.76

R1

+ 2.5μA

R1=

R2 =

VH = Turn-on threshold

= Turn-off threshold

V

L

Example: switching should not start until the input is above

4.75V and is to stop if the input falls below 3.75V.

= 4.75V

V

H

= 3.75

V

L

4.75 − 3.75

R1=

~ 499k

2μA

R2 =

4.75 − 0.76

499k

0.76
~ 71.5k

+ 2.5μA

Keep the connections from the resistors to the SHDN
pin short and make sure that the interplane or surface
capacitance to switching nodes is minimized. If high re­sistor values are used, the SHDN pin should be bypassed
with a 1nF capacitor to prevent coupling problems from
the switch node.

Soft-Start

The outputs of the LT3500 regulate to either the SS pin
voltage minus 100mV or an internally regulated 800mV,
whichever is lowest. A capacitor from the SS pin to ground
is charged by an internal 2.75µA current source resulting
in a linear output ramp from 0V to the regulated output
whose duration is given by:

CSS• 0.9V

t

=

RAMP

2.75μA

20

3500fb

APPLICATIONS INFORMATION

LT3500

At power-up, a reset signal sets the soft-start latch and
discharges the SS pin to approximately 0V to ensure
proper start-up. When the SS pin is fully discharged the
latch is reset and the internal 2.75µA current source starts
to charge the SS pin.

When the SS pin voltage is below 100mV, the V

pin is

C

pulled low which disables switching. As the SS pin voltage
rises above 100mV, the V

pin is released and the outputs

C

are regulated to the SS voltage. When the SS pin voltage
minus 100mV exceeds the internal 0.8V reference, the
outputs are regulated to the reference. The SS pin voltage
will continue to rise until it is clamped at 2V.

In the event of a V

undervoltage lockout, the SHDN pin

IN

driven below 0.8V, or the internal die temperature exceeding
its maximum rating during normal operation, the soft-start
latch is set, triggering a start-up sequence.

In addition, if the load exceeds the maximum output switch
current (switching regulator only), the output will start to
drop causing the V

pin is clamped, the SS pin will be discharged. As

the V

C

pin clamp to be activated. As long as

C

a result, the output will be regulated to the highest volt­age that the maximum output current can support. For
example, if a 6V output is loaded by 1Ω the SS pin will
drop to 0.5V, regulating the output at 3V (typical current
limit time load, 3A • 1Ω). Once the overload condition is
removed, the output will soft-start from the temporary
voltage level to the normal regulation point.

Since the SS pin is clamped at 2V and has to discharge to

0.9V before taking control of regulation, momentary over­load conditions will be tolerated without a soft-start recov­ery. The typical time before the SS pin takes control is:

CSS• 1.1V

t

SS(CONTROL)

=

600μA

The PG pin has a sink capability of 400µA when the FB and
LFB pins are below the threshold and can withstand 40V
when the outputs are in regulation. The PG pin is typically
connected to the output with a resistor and is used as an
error fl ag. The resistor value should be chosen to allow the
PG voltage to drop below 0.4V in an error condition.

Example:

V

R

= 5V, PGSINK

OUT1

= (5 – 0.4)/200µA = 23kΩ

PG

(MIN)

= 200µA

The PG pin has a sink capability of 800µA when the FB
and LFB pins are above the threshold and can withstand
40V when the outputs are not in regulation. The PG pin is
typically used as a drive signal for an output disconnect
device. The PG pull-up resistor should be sized in the
same manner as the PG pull-up resistor.

Linear Regulator

The LT3500 contains an error amplifi er and a NPN output
device which can be confi gured as a linear regulator or as
a linear regulator controller.

With the LFB and LDRV pins confi gured as shown in
Figure 1, the LDRV pin outputs a regulated voltage with a
typical current limit of 13mA.

The LDRV voltage is programmed with a resistor divider
between the output and the LFB pin. Choose the 1% resis­tors according to:

R3 = R4






LDRV

0.8V

–1






V

R4 should be 10.0k or less to avoid bias current errors.
Reference designators refer to the Block Diagram in
Figure 1.

Power Good Indicators

The PG and PG pins are collector outputs of an internal
comparator. The comparator compares the voltages of
the FB and LFB pins to 90% of the reference voltage with
30mV of hysterisis.

The reference voltage for the linear regulator (LFB pin)
will track the SS pin in the same manner as the FB pin of
the switching regulator.

3500fb

21

LT3500

APPLICATIONS INFORMATION

V

OUT2

AC COUPLED

20mV/DIV

LOAD STEP

2.5mA TO 7.5mA
5mA/DIV

20µs/DIV

Figure 9. Linear Regulator Transient Response

To compensate the linear regulator, simply add a ceramic
capacitor from the LDRV pin to ground. Typical values
range from 0.01µF to 1µF. Figure 9 illustrates the transient
response with a 0.47µF output capacitor.

3500 F09

NMOS times the output current of the regulator. This also
increases the overall effi ciency of the system. However,
the minimum V

increases to 2V plus the VGS at full load

IN

of the transistor. Additionally, due to a lack of beta current
limiting, a shorted output can cause the switcher output
of the LT3500 to collapse.

Since the collector of the LDRV npn is connected internally

, you must consider the impact of LDRV current on

to V

IN

effi ciency and die temperature when confi guring the linear
regulator/controller. For example, with V

3.3V and I

= 10mA, power dissipation on the die will

LDRV

= 25V, LDRV =

IN

be 217mW. For a typical 3.3V/1A switcher application,
this represents an additional 7% effi ciency loss and ap­proximately 10 degrees rise in die temperature.

Linear Controller

By adding an external follower (NPN or NMOS), the LFB
and LDRV pins can be confi gured as a controller (Fig­ure 10) for a low dropout regulator with increased output
capability.

The output current capability of Figure 10’s circuit is a
product of the LDRV current limit and beta of the external
NPN which is normally less than the current capability of
the LT3500. The dropout voltage for the circuit is set by the
saturation voltage of the external NPN, which is typically
300mV. The minimum V

for the circuit to function prop-

IN

erly is 2V plus the base emitter drop of the external NPN.

Replacing the NPN in Figure 10 with a NMOS transistor
can reduce the dropout voltage down to the R

4.5V TO 36V

0.47µF

R6

40.2k

C1

2.2µF

C2

C3

220pF

R5

49.9k

DS(ON)

IN

LT3500

SHDN
SS

R

SYNC

T/

V

C

of the

BSTV

SW

FB

LDRV

PG

PG

LFB

If the linear output of the LT3500 is not used, the LDRV
pin should be shorted to the LFB Pin.

PCB Layout

For proper operation and minimum EMI, care must be
taken during printed circuit board (PCB) layout. Figure 11
shows the high di/dt paths in the buck regulator circuit.
Note that large switched currents fl ow in the power switch,
the catch diode and the input capacitor. The loop formed
by these components should be as small as possible.
These components, along with the inductor and output
capacitor, should be placed on the same side of the circuit
board and their connections should be made on that layer.
Place a local, unbroken ground plane below these com­ponents, and tie this ground plane to system ground at
one location, ideally at the ground terminal of the output

D2

BAT54

C5

L1

0.47µF

D1
B240A

3.3µH

27.4k

R1

R2

8.06k

R3

24.9k

R4

8.06k

C7
22µF

3500 F10

V

OUT1

3.5V

V

OUT2

3.3V
1A
C6
22µF

22

Figure 10. Linear Controller

3500fb

APPLICATIONS INFORMATION

LT3500

LT3500

V

IN

Figure 11. Subtracting the Current when the Switch is On (11a) from the Current when the Switch is Off (11b) Reveals the Path of the
High Frequency Switching Current (11c). Keep this Loop Small. The Voltage on the SW and BST Traces will Also be Switched; Keep
These Traces as Short as Possible. Finally, Make Sure the Circuit is Shielded with a Local Ground Plane

SW

GND

(11a)

LT3500

V

IN

SW

GND

(11b)

LT3500

V

IN

SW

GND

3500 F11

(11c)

should be tied to other copper layers below with thermal
vias; these layers will spread the heat dissipated by the
LT3500. Place additional vias near the catch diodes. Adding
more copper to the top and bottom layers and tying this
copper to the internal planes with vias can further reduce
thermal resistance. With these steps, the thermal resis­tance from die (or junction) to ambient can be reduced to

= 45°C/W for the DD Package, and θJA = 45°C/W for

θ

JA

the MSE Package.

Power dissipation within the LT3500 can be estimated
by calculating the total power loss from an effi ciency
measurement and subtracting the catch diode loss. The
die temperature is calculated by multiplying the LT3500
power dissipation by the thermal resistance from junction
to ambient.

Figure 12. LT3500 Demonstration Circuit Board DC1069A

capacitor C2. Additionally, the SW and BST traces should
be kept as short as possible. The topside metal from the
DC1069A demonstration board in Figure 12 illustrates
proper component placement and trace routing.

Thermal Considerations

The PCB must also provide heat sinking to keep the
LT3500 cool. The exposed metal on the bottom of the
package must be soldered to a ground plane. This ground

The power dissipation in the other power components
such as catch diodes, boost diodes and inductors, cause
additional copper heating and can further increase what
the IC sees as ambient temperature. See the LT1767 data
sheet’s Thermal Considerations section.

Other Linear Technology Publications

Application notes AN19, AN35 and AN44 contain more
detailed descriptions and design information for buck
regulators and other switching regulators. The LT1376
data sheet has a more extensive discussion of output
ripple, loop compensation and stability testing. Design
note DN100 shows how to generate a dual (+ and –) output
supply using a buck regulator.

3500fb

23

LT3500

TYPICAL APPLICATIONS

4.5V TO 36V
C1

2.2µF

C2

0.47µF

C3

220pF

R6

40.2k

High Effi ciency Linear Regulator

T/

LT3500

SYNC

GND

BSTV

SW

LDRV

PG

PG

LFB

C5

0.47µF

D1
B240A

FB

R5

49.9k

IN

SHDN
SS

R

V

C

D2

BAT54

L1

3.3µH

25.5k

R4

8.06k

R1

R3

24.9k

R2

8.06k

R7

10k

C7
22µF

3500 TA02a

M1
ZXMN2A03E6

V

OUT2

3.3V

C8
22µF

Effi ciency vs Load Current

90

80

70

EFFICIENCY (%)

60

50

0 0.2

0.8

0.6

0.4
LOAD CURRENT (A)

1.0

1.2

1.4

3500 TA02b

24

3500fb

TYPICAL APPLICATIONS

5V/1.5A, 3.3V/0.5A Step-Down with Output Disconnect

6V TO 32V

2.2µF

0.47µF

220pF

R7

40.2k

C1

C2

C3

R6

49.9k

IN

SHDN
SS

SYNC

R

T/

V

C

LT3500

GND

BSTV

SW

LDRV

PG

PG

LFB

LT3500

D2

BAT54

L1

C5

4.7µH

0.47µF

D1
B240A

FB

8.06k

R1

42.2k

8.06k

R4

R5

24.9k

C7

R2

22µF

Q1
ZXTCM322

C6
22µF

3500 TA03

V

OUT1

5V

1.5A

R8
100k

V

OUT2

3.3V

0.5A

I89
ZXMP3A17E6

6V TO 32V

2.2µF

0.47µF

220pF

R7

40.2k

5V/2A Step-Down with Power Good LED

D2

BAT54

T/

SYNC

LT3500

GND

BSTV

SW

LDRV

LFB

PG

PG

R4

8.06k

L1

4.7µH

42.2k

V

OUT1

5V
2A

R2

R5
100k

C7
22µF

R8

8.06k

3500 TA04

M1
ZXM61N02F
1

R1

8.06k

C8
1µF

C5

0.47µF

D1
B240A

FB

R3

42.2k

R6

49.9k

IN

SHDN
SS

R

V

C

C1

C2

C3

3500fb

25

LT3500

PACKAGE DESCRIPTION

DD Package

12-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1725 Rev A)

0.70 ±0.05

3.50 ±0.05

2.10 ±0.05

0.25 ± 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

2.38 ±0.05

1.65 ±0.05

PACKAGE
OUTLINE

0.45 BSC

2.25 REF

3.00 ±0.10

(4 SIDES)

0.75 ±0.05

TOP AND BOTTOM OF PACKAGE

0.00 – 0.05

R = 0.115

TYP

2.38 ±0.10

1.65 ± 0.10

2.25 REF

BOTTOM VIEW—EXPOSED PAD

0.40 ± 0.10

127

16

0.23 ± 0.05

0.45 BSC

(DD12) DFN 0106 REV A

PIN 1 NOTCH
R = 0.20 OR

0.25 × 45°
CHAMFER

26

3500fb

PACKAGE DESCRIPTION

2.845 p 0.102
(.112 p .004)

MSE Package

16-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1667 Rev A)

BOTTOM VIEW OF

EXPOSED PAD OPTION

0.889 p 0.127

(.035 p .005)

2.845 p 0.102
(.112 p .004)

1

LT3500

8

0.35
REF

5.23

(.206)

MIN

0.305 p 0.038

(.0120 p .0015)

TYP

RECOMMENDED SOLDER PAD LAYOUT

0.254

(.010)

GAUGE PLANE

0.18

(.007)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

1.651 p 0.102
(.065 p .004)

(.0197)

DETAIL “A”

DETAIL “A”

0.50

BSC

0o – 6o TYP

0.53 p 0.152

(.021 p .006)

3.20 – 3.45

(.126 – .136)

SEATING

PLANE

4.90 p 0.152

(.193 p .006)

(.043)

0.17 –0.27

(.007 – .011)

TYP

1.10

MAX

(.0197)

16

4.039 p 0.102
(.159 p .004)

(NOTE 3)

1615 14 1312 11 10

12345678

0.50

BSC

1.651 p 0.102
(.065 p .004)

DETAIL “B”

9

9

3.00 p 0.102
(.118 p .004)

0.12 REF

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.280 p 0.076
(.011 p .003)

REF

(NOTE 4)

0.86

(.034)

REF

0.1016 p 0.0508
(.004 p .002)

MSOP (MSE16) 0608 REV A

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa­tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

3500fb

27

LT3500

TYPICAL APPLICATION

1.8V/2A Step-Down Regulator

4.5V TO 36V

R5

40.2k

2.2µF

0.47µF

220pF

C1

C2

C3

R6

49.9k

IN

SHDN
SS

R

T

V

C

LT3500

/SYNC

LDRVV

BST

LFB

SW

R3

24.9k

C5

0.47µF

FB

PG

PG

R4

8.06k

D1

2.2µH

C6
1µF

D2

L1

R1
10k

R2

8.06k

3500 TA05

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PART NUMBER DESCRIPTION COMMENTS

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), 200kHz High Effi ciency Step-Down DC/DC

OUT

Converter

LT1933 36V, 500mA (I

), 500kHz Step-Down Switching Regulator in

OUT

SOT-23

LT1936 36V, 1.4A (I

), 500kHz High Effi ciency Step-Down DC/DC

OUT

Converter

LT1940 Dual 25V, 1.4A (I

), 1.1MHz High Effi ciency Step-Down DC/DC

OUT

Converter

LTC3407/LTC3407-2 Dual 600mA/800mA, 1.5MHz/2.25MHz Synchronous Step-Down

DC/DC Converter

LT3434/LT3435 60V, 2.4A (I

), 200kHz/500kHz High Effi ciency Step-Down DC/DC

OUT

Converters with Burst Mode Operation

LT3437 60V, 400mA (I

), Micropower Step-Down DC/DC Converter with

OUT

Burst Mode Operation

LT3493 36V, 1.4A (I

), 750kHz High Effi ciency Step-Down DC/DC

OUT

Converter

LT3501 Dual 25V, 3A (I

), 1.5MHz High Effi ciency Step-Down DC/DC

OUT

Converter

LT3502/LT3502A 40V, 500mA (I

), 1.1MHz/2.2MHz High Effi ciency Step-Down

OUT

DC/DC Converter

LT3503 20V, 1A (I

LT3505 36V, 1.2A (I

LT3506/LT3506A Dual 25V, 1.6A (I

), 2.2MHz High Effi ciency Step-Down DC/DC Converter VIN: 3.6V to 20V, V

OUT

), 3MHz High Effi ciency Step-Down DC/DC Converter VIN: 3.6V to 36V, V

OUT

), 575kHz/1.1MHz High Effi ciency Step-Down

OUT

DC/DC Converters

LT3508 Dual 36V, 1.4A (I

), 2.5MHz High Effi ciency Step-Down DC/DC

OUT

Converter

LT3510 Dual 25V, 2A (I

), 1.5MHz High Effi ciency Step-Down DC/DC

OUT

Converter

LTC3548 Dual 400mA/800mA, 2.25MHz Synchronous Step-Down DC/DC

Converter

LT3680 36V, 3.5A (I

), 2.4MHz High Effi ciency Step-Down DC/DC

OUT

Converter

ThinSOT is a trademark of Linear Technology Corporation

Linear Technology Corporation

28

1630 McCarthy Blvd., Milpitas, CA 95035-7417

[phone] ● FAX: [phone] ● www.linear.com

VIN: 5.5V to 60V, V
16-Lead TSSOPE Package

VIN: 3.6V to 36V, V
ThinSOT™ Package

VIN: 3.6V to 36V, V
8-Lead MS8E Package

VIN: 3.6V to 25V, V
16-Lead TSSOPE Package

VIN: 2.5V to 5.5V, V
3mm × 3mm DFN and 10-Lead MS10E Packages

VIN: 3.3V to 60V, V
16-Lead TSSOPE Package

VIN: 3.3V to 60V, V
10-Lead 3mm × 3mm DFN, 16-Lead TSSOPE Package

VIN: 3.6V to 36V, V
6-Lead 2mm × 3mm DFN Package

VIN: 3.3V to 25V, V
20-Lead TSSOPE Package

VIN: 3V to 40V, V
8-Lead 2mm × 2mm DFN Package

6-Lead 2mm × 3mm DFN Package

8-Lead 3mm × 3mm DFN and MSE Packages

VIN: 3.6V to 25V, V
16-Lead 4mm × 5mm DFN and TSSOPE Packages

VIN: 3.6V to 36V, V
24-Lead 4mm × 4mm QFN and 16-Lead TSSOPE Packages

VIN: 3.3V to 25V, V
20-Lead TSSOPE Package

VIN: 2.5V to 5.5V, V
3mm × 3mm DFN and 10-Lead MSE Packages

VIN: 3.6V to 36V, V
3mm × 3mm DFN and MS10E Packages

V

3.3V
10mA

V

1.8V
2A

C7
22µF

OUT2

OUT1

= 1.20V, IQ = 2.5mA, ISD = 25µA,

OUT(MIN)

= 1.2V, IQ = 1.6mA, ISD < 1µA,

OUT(MIN)

= 1.2V, IQ = 1.9mA, ISD < 1µA,

OUT(MIN)

= 1.20V, IQ = 3.8mA, ISD < 30µA,

OUT(MIN)

= 0.6V, IQ = 40µA, ISD < 1µA,

OUT(MIN)

= 1.20V, IQ = 100µA, ISD < 1µA,

OUT(MIN)

= 1.25V, IQ = 100µA, ISD < 1µA,

OUT(MIN)

= 0.8V, IQ = 1.9mA, ISD < 1µA,

OUT(MIN)

= 0.8V, IQ = 3.7mA, ISD < 10µA,

OUT(MIN)

= 0.8V, IQ = 1.5mA, ISD < 2µA,

OUT(MIN)

= 0.78V, IQ = 1.9mA, ISD < 1µA,

OUT(MIN)

= 0.78V, IQ = 2mA, ISD < 2µA,

OUT(MIN)

= 0.8V, IQ = 3.8mA, ISD < 30µA,

OUT(MIN)

= 0.8V, IQ = 4.3mA, ISD < 1µA,

OUT(MIN)

= 0.8V, IQ = 3.7mA, ISD < 10µA,

OUT(MIN)

= 0.6V, IQ = 40µA, ISD < 1µA,

OUT(MIN)

= 0.79V, IQ = 75µA, ISD < 1µA,

OUT(MIN)

LT 1008 REV B • PRINTED IN USA

© LINEAR TECHNOLOGY CORPORATION 2007

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