All registered trademarks and trademarks are the property of their respective owners.
The LT M®4622A is a complete dual 2A step-down switching
®
mode µModule
(micromodule) regulator in a tiny ultrathin
6.25mm × 6.25mm × 1.82mm LGA and 2.42mm BGA packages. Included in the package are the switching controller,
power FET
s, inductor and support components. Operating
over an input voltage range of 3.6V to 20V, the LTM4622A
supports an output voltage range of 1.5V to 12V, set by a
single external resistor. Its high efficiency design delivers
dual 2A continuous, 3A peak, output current. Only a few
ceramic input and output capacitors are needed.
The LTM4622A supports selectable Burst Mode operation
and output voltage tracking for supply rail sequencing. Its
high switching frequency and current mode control enable
a very fast transient response to line and load changes
without sacrificing stability.
Fault protection features include input overvoltage, output
overcurrent and overtemperature protection.
The LTM4622A is available with SnPb (BGA) or RoHS
compliant terminal finish.
Product Selection Guide
PART NUMBER VIN RANGEV
LTM4622
LTM4622A1.5V to 12VDual 2A or Single 4A
3.6V to 20V
RANGEI
OUT
0.6V to 5.5VDual 2.5A or Single 5A
OUT
TYPICAL APPLICATION
3.3V and 5V Dual Output DC/DC Step-Down µModule Regulator
PGOOD1PGOOD2
V
V
IN
4.7µF
25V
IN1
V
IN2
RUN1
RUN2
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
LTM4622A
GND
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
4622A TA01a
For more information www.analog.comDocument Feedback
8.25k
47µF
47µF
V
OUT1
3.3V, 2A
V
13.3k
12V Input, 3.3V and 5V Output,
Efficiency vs Load Current
Rev B
1
Page 2
LTM4622A
25-LEAD (6.25mm × 6.25mm × 2.42mm)
TOP VIEW
TRACK/SS1
TRACK/SS2
ABSOLUTE MAXIMUM RATINGS
V
, V
IN1
V
OUT
PGOOD1, PGOOD2 ..................................... –0.3V to 18V
RUN1, RUN2 .................................... –0.3V to V
INTV
SYNC/MODE, COMP1, COMP2,
FB1,
PIN CONFIGURATION
................................................... –0.3V to 22V
IN2
........................................................... –0.3V to 16V
+ 0.3V
IN
, TRACK/SS1, TRACK/SS2 ............ –0.3V to 3.6V
CC
FB2 ........................................... –0.3V to INTV
(See Pin Functions, Pin Configuration Table)
TOP VIEW
COMP2
5
PGOOD2
FB2
4
INTV
CC
TRACK/SS2
3
V
IN2
RUN2
2
V
IN2
1
V
OUT2
25-LEAD (6.25mm × 6.25mm × 1.82mm)
T
= 125°C, θ
JMAX
θ
JB
SYNC/
MODE
A
BCDE
LGA PACKAGE
= 17°C/W, θ
JCtop
+ θBA = 22°C/W, θJA = 22°C/W,
WEIGHT = 0.21g
COMP1GNDGND
JCbottom
FREQ
PGOOD1
FB1
V
TRACK/SS1
RUN1
V
GND
V
IN1
IN1
OUT1
= 11°C/ W,
CC
(Note 1)
Operating Internal Temperature Range
(Note 2)
............................................. –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Peak Solder Reflow Body Temperature ................. 260°C
SYNC/
MODE
A
BCDE
BGA PACKAGE
= 17°C/W, θ
JCtop
+ θBA = 22°C/W, θJA = 22°C/W,
WEIGHT = 0.25g
COMP1GNDGND
JCbottom
FREQ
PGOOD1
FB1
V
IN1
RUN1
V
IN1
GND
V
OUT1
= 11°C/ W,
PGOOD2
FB2
INTV
V
RUN2
V
V
OUT2
T
JMAX
COMP2
5
4
CC
3
IN2
2
IN2
1
= 125°C, θ
θ
JB
ORDER INFORMATION
PART NUMBERPAD OR BALL FINISH
LT M4622AEV#PBFAu (RoHS)LT M4622AVe4LGA4–40°C to 125°C
LT M4622AIV#PBFAu (RoHS)LT M4622AVe4LGA4–40°C to 125°C
LT M4622AEY#PBFSAC305 (RoHS)LT M4622AYe1BGA4–40°C to 125°C
LT M4622AIY#PBFSAC305 (RoHS)LT M4622AYe1BGA4–40°C to 125°C
LT M4622AIYSnPb (63/37)LT M4622AYe0BGA4–40°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
2
http://www.linear.com/product/LTM4622A#orderinfo
PART MARKING*
•
Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
•
LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
For more information www.analog.com
PACKAGE
TYPE
RATING
MSL
TEMPERATURE RANGE
(Note 2)DEVICE FINISH CODE
Rev B
Page 3
LTM4622A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). Specified as each individual output channel at TA = 25°C, V
noted per the typical application shown in Figure27.
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
Switching Regulator Section: per Channel
V
IN1
V
IN2
V
OUT(RANGE)
V
OUT(DC)
V
RUN
I
Q(VIN)
I
S(VIN)
I
OUT(DC)
ΔV
OUT(Line)/VOUT
ΔV
OUT(Load)/VOUT
V
OUT(AC)
ΔV
OUT(START)
t
START
ΔV
OUTLS
t
SETTLE
I
OUTPK
V
FB
I
FB
R
FBHI
I
TRACK/SS
t
SS
t
ON(MIN)
t
OFF(MIN)
V
PGOOD
R
PGOOD
V
INTVCC
Input DC Voltage Range
Input DC Voltage Range3.6V < V
Output Voltage RangeV
Output Voltage, Total Variation
with Line and Load
IN1 = VIN2
CIN = 22µF, C
MODE = INT
< 20V
IN1
= 3.6V to 20V
= 100µF Ceramic, RFB = 40.2k,
OUT
VCC,V
IN1 = VIN2
= 3.6V to 20V, I
= 0A to 2A
OUT
RUN Pin On ThresholdRUN Threshold Rising
RUN Threshold Falling
Input Supply Bias CurrentV
IN1 = VIN2
V
IN1 = VIN2
= 12V, V
= 12V, V
= 1.5V, MODE = GND
OUT
= 1.5V, MODE = INTVCC
OUT
Shutdown, RUN1 = RUN2 = 0
Input Supply CurrentV
Output Continuous Current Range V
Line Regulation AccuracyV
Load Regulation AccuracyV
Output Ripple VoltageI
Turn-On OvershootI
Turn-On TimeC
IN1 = VIN2
IN1 = VIN2
OUT
OUT
OUT
V
OUT
OUT
V
OUT
OUT
V
IN1 = VIN2
Peak Deviation for Dynamic LoadLoad: 0% to 50% to 0% of Full Load, C
Internal Soft-Start Time10% to 90% Rise Time (Note 4)400700μs
Minimum On-Time(Note 4)20ns
Minimum Off-Time(Note 4)45ns
PGOOD Trip LevelVFB With Respect to Set Output
V
Ramping Negative
FB
V
Ramping Positive
FB
PGOOD Pull-Down Resistance1mA Load20Ω
Internal VCC VoltageV
IN1 = VIN2
= 3.6V to 20V3.13.33.5V
= V
IN1
l
l
l
l
= 12V, unless otherwise
IN2
3.620V
1.520V
1.512V
1.4771.501.523V
1.20
0.97
1.27
1.00
1.35
1.03
7
500
45
l
02A
l
l
0.010.1%/V
0.21.0%
5mV
30mV
1.25ms
100mV
20µs
l
0.5920.600.608V
–8
–14
8
14
mA
µA
µA
V
V
%
%
For more information www.analog.com
Rev B
3
Page 4
LTM4622A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). Specified as each individual output channel at TA = 25°C, V
noted per the typical application shown in Figure27.
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
Load Reg INTVCC Load RegulationICC = 0mA to 50mA1.3%
V
INTVCC
f
OSC
f
SYNC
I
MODE
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM4622A is tested under pulsed load conditions such that
T
≈ TA. The LTM4622AE is guaranteed to meet performance
J
specifications over the 0°C to 125°C internal operating temperature
range. Specifications over the full –40°C to 125°C internal operating
temperature range are assured by design, characterization and correlation
with statistical process controls. The LTM4622AI is guaranteed to meet
specifications over the full –40°C to 125°C internal operating temperature
range. Note that the maximum ambient temperature consistent with
these specifications is determined by specific operating conditions in
conjunction with board layout, the rated package thermal resistance and
other environmentalfactors.
Oscillator Frequency1MHz
Frequency Sync RangeWith Respect to Set Frequency±30%
MODE Input CurrentMODE = INTV
CC
Note 3: See output current derating curves for different V
Note 4: 100% tested at wafer level.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
SYNC/MODE (C5): Mode Select and External Synchroni
zation Input. Tie this pin to ground to force continuous
synchronous operation at all output loads. Floating this pin
or tying it to INTV
enables high efficiency BurstMode
CC
operation at light loads. Drive this pin with a clock to synchronize the LTM4622A switching frequency. An internal
phase-locked loop will for
ce the bottom power NMOS’s
turn on signal to be synchronized with the rising edge
of the clock signal. When this pin is driven with a clock,
forced continuous mode is automatically selected.
V
OUT1
(D1, E1), V
(A1, B1): Power Output Pins of
OUT2
Each Switching Mode Regulator. Apply output load between
these pins and GND pins. Recommend placing output
decoupling capacitance directly between these pins and
GND pins.
FREQ (C4): Frequency is set internally to 1MHz. An
external resistor can be placed from this pin to GND to
increase frequency, or from this pin to INTV
to reduce
CC
frequency. See the Applications Information section for
frequency adjustment.
RUN1 (D2), RUN2 (B2): Run Control Input of Each Switching Mode Regulator Channel. Enables chip operation by
tying RUN above
1.27V. Tying this pin below 1V shuts
down the specific regulator channel. Do not float this pin.
PGOOD1 (D4), PGOOD2 (B4): Output Power Good with
Open-Drain Logic of Each Switching Mode Regulator
Channel. PGOOD is pulled to ground when the voltage
on the FB pin is not within ±8% (typical) of the internal
0.6V reference.
TRACK/SS1 (E3), TRACK/SS2 (A3): Output Tracking
and Soft-Start Pin of Each Switching Mode Regulator
Channel. It allows the user to control the rise time of the
output voltage. Putting a voltage below 0.6V on this pin
bypasses the internal reference input to the error ampli
fier, instead it servos the FB pin to the TRACK voltage.
Above 0.6V
, the tracking function stops and the internal
reference resumes control of the error amplifier. There’s
an internal 1.4µA pull-up current from INTV
on this pin,
CC
so putting a capacitor here provides soft-start function.
A default internal soft-start ramp forces a minimum softstart time of 400µs.
FB1 (E4), FB2 (A4): The Negative Input of the Error
Amplifier for Each Switching Mode Regulator Channel.
Internally, this pin is connected to V
with a 60.4k preci-
OUT
sion resistor. Different output voltages can be programmed
an additional resistor between FB and GND pins. In
with
PolyPhase
®
operation, tying the FB pins together allows
for parallel operation. See the Applications Information
section for details.
COMP1 (E5), COMP2 (A5): Current Control Threshold
and Error Amplifier Compensation Point of Each Switch
ing Mode Regulator Channel. The current comparator’s
trip threshold is linearly proportional to this voltage,
whose normal range is from
0.3V to 1.8V. Tie the COMP
pins together for parallel operation. The device is internal
compensated. Do not drive this pin.
For more information www.analog.com
Rev B
7
Page 8
LTM4622A
8V TO 20V
4622A BD
BLOCK DIAGRAM
13.3k
8.25k
0.1µF
0.1µF
FB1
FB2
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
RUN1
RUN2
COMP1
COMP2
INTERNAL
COMP
INTERNAL
COMP
2.2µF
V
OUT1
60.4k
POWER CONTROL
V
OUT2
60.4k
2.2µH
2.2µH
0.22µF
0.1µF
0.22µF
0.1µF
PGOOD1
PGOOD2
V
IN1
V
OUT1
GND
V
IN2
V
OUT2
GND
10k
10k
10µF
47µF
10µF
47µF
INTV
INTV
V
OUT1
3.3V
2A
V
OUT2
5V
2A
CC
CC
V
IN
FREQ
324k
Figure1. Simplified LTM4622A Block Diagram
DECOUPLING REQUIREMENTS
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
C
IN
C
OUT
External Input Capacitor Requirement
(V
= 3.6V to 20V, V
IN
OUT
= 1.5V)
External Output Capacitor Requirement
(V
= 3.6V to 20V, V
IN
OUT
= 1.5V)
= 2A4.710µF
I
OUT
= 2A2247µF
I
OUT
8
Rev B
For more information www.analog.com
Page 9
OPERATION
LTM4622A
The LTM4622A is a dual output standalone non-isolated
switch mode DC/DC power supply. It can deliver two 2A
DC, 3A peak output current with few external input and
output ceramic capacitors. This module provides dual
precisely regulated output voltage programmable via two
external resistor from 1.5V to 12V over 3.6V to 20V input
voltage range. The typical application schematic is shown
in Figure27.
The LTM4622A contains an integrated controlled on-time
valley current mode regulator, power MOSFETs, inductors,
and other supporting discrete components. The default
switching frequency is 1MHz. For output voltages above
3.3V, an external resistor is required between FREQ and
GND pins to set the operating frequency to 1.5MHz to
2MHz to optimize inductor current ripple. For switching
noise-sensitive applications, the switching frequency can
be adjusted by external resistors and the μModule regulator
can be externally synchronized to a clock within ±30% of
the set frequency. See the Applications Information section.
With current mode control and internal feedback loop
compensation, the LTM4622A module has sufficient
stability margins and good transient performance with
a wide range of output capacitors, even with all ceramic
output capacitors.
Current mode control provides cycle-by-cycle fast cur
rent limiting. An internal overvoltage and undervoltage
comparators pull the open-drain PGOOD output low if the
output feedback voltage exits a ±8% window around the
regulation point. Furthermore, an input overvoltage protec
tion been utilized by shutting down both power MOSFETs
when V
rises above 22.5V to protect internal devices.
IN
Multiphase operation can be easily employed by connecting
SYNC pin to an external oscillator. Up to 6 phases can be
paralleled to run simultaneously a good current sharing
guaranteed by current mode control loop.
Pulling the RUN pin below 1V forces the controller into
its shutdown state, turning off both power MOSFETs and
most of the internal control circuitry. At light load currents,
Burst Mode operation can be enabled to achieve higher
efficiency compared to continuous mode (CCM) by set
ting MODE pin to INTV
. The TRACK/SS pin is used for
CC
-
power supply tracking and soft-start programming. See
the Applications Information section.
APPLICATIONS INFORMATION
The typical LTM4622A application circuit is shown in
Figure 27. External component selection is primarily
determined by the input voltage, the output voltage and
the maximum load current. Refer to Table7 for specific
external capacitor requirements for a particular application.
to V
V
IN
There are restrictions in the maximum V
down ratio that can be achieved for a given input voltage
due to the minimum off-time and minimum on-time limits
of the regulator. The minimum off-time limit imposes a
maximum duty cycle which can be calculated as:
DC
Step-Down Ratios
OUT
= 1 – t
(MAX)
OFF(MIN)
• f
SW
and V
IN
step
OUT
For more information www.analog.com
where t
OFF(MIN)
LTM4622A, and f
is the minimum off-time, 45ns typical for
is the switching frequency. Conversely
SW
the minimum on-time limit imposes a minimum duty cycle
of the converter which can be calculated as:
DC
(MIN)
where t
= t
ON(MIN)
ON(MIN)
• f
SW
is the minimum on-time, 20ns typical for
LTM4622A. In the rare cases where the minimum duty
cycle is surpassed, the output voltage will still remain
in regulation, but the switching frequency will decrease
from its programmed value. Note that additional thermal
derating may be applied. See the Thermal Considerations
and Output Current Derating section in this data sheet.
Rev B
9
Page 10
LTM4622A
0.6V
OUT
OUT
I
APPLICATIONS INFORMATION
Output V
oltage Programming
The PWM controller has an internal 0.6V reference voltage.
As shown in the Block Diagram, a 60.4k 0.5% internal
feedback resistor connects V
Adding a resistor R
from FB pin to GND programs the
FB
and FB pins together.
OUT
output voltage:
RFB=
V
Table1. VFB Resistor Table vs Various Output Voltages
(1% Resistor)
V
(V)1.51.82.53.35.08.010.012.0
OUT
(k)40.230.119.113.38.254.873.833.16
R
FB
– 0.6V
• 60.4k
Pease note that for output above 3.3V, a higher operating
frequency is required to optimize inductor current ripple.
See Operating Frequency section.
For parallel operation of N-channels LTM4622A, the fol
lowing equation can be used to solve for R
RFB=
0.6V
V
– 0.6V
60.4k
•
N
FB
:
-
Input Decoupling Capacitors
The LTM4622A module should be connected to a low ACimpedance DC source. For each regulator channel, one piece
4.7µF input ceramic capacitor is required for RMS ripple
current decoupling. Bulk input capacitor is only needed
when the input source impedance is compromised by long
inductive leads, traces or not enough source capacitance.
The bulk capacitor can be an electrolytic aluminum capaci
-
tor and polymer capacitor.
Without considering the inductor current ripple, for each
output, the RMS current of the input capacitor can be
estimated as
I
CIN(RMS)
:
OUT(MAX)
=
η%
•D • 1– D
()
where is the estimated efficiency of the power module.
Output Decoupling Capacitors
With an optimized high frequency, high bandwidth design,
only single piece of 47µF low ESR output ceramic capaci
tor is required for each LTM4622A output to achieve low
output voltage ripple and very good transient response.
Additional output filtering may be required by the system
designer, if further reduction of output ripples or dynamic
transient spikes is required. Table7 shows a matrix of dif
ferent output voltages and output capacitors to minimize the
voltage droop and overshoot during a
1A (50%) load step
transient. Multiphase operation will reduce effective output
ripple as a function of the number of phases. Application
Note 77 discusses this noise reduction versus output
ripple current cancellation, but the output capacitance
will be more a function of stability and transient response.
®
The Linear Technology LTpowerCAD
Design Tool is available to download online for output ripple, stability and
transient response analysis and calculating the output
reduction as the number of phases implemented
ripple
increases by N times.
Burst Mode Operation
In applications where high efficiency at intermediate current
are more important than output voltage ripple, Burst Mode
operation could be used by connecting SYNC/MODE pin
to INTV
operation, a current reversal comparator (I
to improve light load efficiency. In Burst Mode
CC
) detects
REV
the negative inductor current and shuts off the bottom
power MOSFET, resulting in discontinuous operation and
increased efficiency. Both power MOSFETs will remain
off and the output capacitor will supply the load current
until the COMP voltage rises above the zero current level
to initiate another cycle.
Force Continuous Current Mode (CCM) Operation
In applications where fixed frequency operation is more
critical than low current efficiency, and where the lowest
output ripple is desired, forced continuous operation should
be used. Forced continuous operation can be enabled by
tying the SYNC/MODE pin to GND. In this mode, induc
tor current is allowed to reverse during low output loads,
the COMP voltage is in control of the current comparator
threshold throughout, and the top MOSFET always turns
10
Rev B
For more information www.analog.com
Page 11
APPLICATIONS INFORMATION
3.2e11
FSET
⎝
⎠
5.67e11
LTM4622A
on with each oscillator pulse. During start-up, forced
continuous mode is disabled and inductor current is
prevented from reversing until the LTM4622A’s output
voltage is in regulation.
Operating Frequency
The operating frequency of the LTM4622A is optimized
to achieve the compact package size and the minimum
output ripple voltage while still keeping high efficiency.
The default operating frequency is internally set to 1MHz.
If any operating frequency other than 1MHz is required by
application, the operating frequency can be increased by
adding a resistor, R
, between the FREQ pin and GND,
FSET
as shown in Figure29. The operating frequency can be
calculated as:
f Hz
=
()
324k||R
Ω
()
Please note a minimum switching frequency is required for
, V
given V
IN
operating conditions to keep a maximum
OUT
peak-to-peak inductor ripple current below 1.2A for the
LTM4622A.
The peak-to-peak inductor ripple current can be calculated as:
V
OUT
V
IN
⎞
⎟
•
⎟
⎟
f
SW
1
(MHz)
⎛
V
OUT
ΔI
=
P-P
2.2
⎜
1−
⎜
⎜
The maximum 1.2A peak-to-peak inductor ripple current
is enforced due to the nature of the valley current mode
control to maintain output voltage regulation at no load.
To reduce switching current ripple, 1.5MHz to 2MHz op
-
erating frequency is suggested for 5V and above output
V
f
FSET
OUT
SW
to GND.
1.5V to 3.3V5V, 8V12V
1MHz1.5MHz1.5MHz to 2MHz
with R
The operating frequency can also be decreased by adding
a resistor between the FREQ pin and INTV
f Hz
=1MHz –
()
R
FSET
Ω
()
, calculated as:
CC
The programmable operating frequency range is from
800kHz to 4MHz.
Frequency Synchronization
The power module has a phase-locked loop comprised
of an internal voltage controlled oscillator and a phase
detector. This allows the internal top MOSFET turn-on
to be locked to the rising edge of the external clock. The
external clock frequency range must be within ±30%
around the set operating frequency. A pulse detection
circuit is used to detect a clock on the SYNC/MODE pin
to turn on the phase-locked loop. The pulse width of the
clock has to be at least 100ns. The clock high level must
be above 2V and clock low level below 0.3V. The presence
of an external clock will place both regulator channels into
forced continuous mode operation. During the start-up of
the regulator, the phase-locked loop function is disabled.
Multiphase Operation
For output loads that demand more than 2A of current, two
outputs in the LTM4622A or even multiple LTM4622As can
be paralleled to run out of phase to provide more output
current without increasing input and output voltage ripples.
A multiphase power supply significantly reduces the
amount of ripple current in both the input and output ca
pacitors. The RMS input ripple current is reduced by, and
the effective ripple frequency is multiplied by
, the number
of phases used (assuming that the input voltage is greater
than the number of phases used times the output voltage).
The output ripple amplitude is also reduced by the number
of phases used when all of the outputs are tied together
to achieve a single high output current design.
The two switching mode regulator channels inside the
LTM4622A are internally set to operate 180° out of phase.
Multiple LTM4622As could easily operate 90 degrees, 60
degrees or 45 degrees shift which corresponds to 4-phase,
6-phase or 8-phase operation by letting SYNC/MODE of
the LTM4622A synchronize to an external multiphase
®
oscillator like LTC
6902. Figure2 shows a 4-phase design
example for clock phasing.
Rev B
For more information www.analog.com
11
Page 12
LTM4622A
4622A F03
0.9
RMS INPUT RIPPLE CURRENT
0.60
APPLICATIONS INFORMATION
200k
V
V
OUT1
OUT2
OUT1
OUT2
0°
180°
90°
270°
8A
4622A F02
3.3V INTV
+
CC
V
PH
DIV
GND
LTC6902
SET
MOD
OUT1
OUT2
0°
90°
SYNC/MODE V
SYNC/MODE V
Figure2. Example of Clock Phasing for 4-Phase
Operation with LTC6902
The LTM4622A device is an inherently current mode
controlled device, so parallel modules will have very
good current sharing. This will balance the thermals on
the design. Please tie RUN, TRACK/SS, FB and COMP pin
of each paralleling channel together. Figure31 shows an
example of parallel operation and pin connection.
INPUT RMS Ripple Current Cancellation
Application Note 77 provides a detailed explanation of
multiphase operation. The input RMS ripple current can
cellation mathematical derivations are presented, and a
graph is displayed representing the RMS ripple current
reduction as a function of the number of interleaved phases.
Figure3 shows this graph.
Soft-Start and Output Voltage Tracking
The TRACK/SS pin provides a means to either soft-start
the regulator or track it to a different power supply. A
capacitor on the TRACK/SS pin will program the ramp rate
of the output voltage. An internal 1.4µA current source
will charge up the external soft-start capacitor towards
INTV
voltage. When the TRACK/SS voltage is below
CC
0.6V, it will take over the internal 0.6V reference voltage
to control the output voltage. The total soft-start time
can be calculated as:
C
tSS= 0.6 •
SS
1.4µA
where CSS is the capacitance on the TRACK/SS pin. Current
foldback and force continuous mode are disabled during
the soft-start process.
The LTM4622A has internal 400μs soft-start time when
TRACK/SS leave floating.
1-PHASE
0.55
0.50
0.45
0.40
0.35
0.30
0.25
DC LOAD CURRENT
0.20
0.15
0.10
0.05
0
2-PHASE
3-PHASE
4-PHASE
6-PHASE
DUTY FACTOR (V
OUT/VIN
0.70.650.60.550.50.450.40.350.30.250.20.150.1
0.8
0.85
)
0.75
Figure3. Input RMS Current Ratios to DC Load Current as a Function of Duty Cycle
Rev B
12
For more information www.analog.com
Page 13
APPLICATIONS INFORMATION
R
OUTPUT VOLTAGE
4622A F06
OUTPUT VOLTAGE
4622A F04
LTM4622A
Output voltage tracking can also be programmed externally
using the TRACK/SS pin. The output can be tracked up and
down with another regulator. Figure4 and Figure5 show
an example waveform and schematic of a Ratiometric
tracking where the slave regulator’s output slew rate is
proportional to the master’s.
MASTER OUTPUT
SLAVE OUTPUT
TIME
Figure4. Output Ratiometric Tracking Waveform
V
4V TO 20V
V
IN
OUT1
0.1µF
60.4k
10µF
25V
40.2k
PGOOD1 PGOOD2
V
IN1
V
IN2
RUN1
RUN2
LTM4622A
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
GND
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
4622A F05
Figure5. Example Schematic of Ratiometric
Output Voltage Tracking
13.3k
47µF
6.3V
47µF
6.3V
V
OUT1
1.5V, 2A
40.2k
V
OUT2
3.3V, 2A
The R
R
TR(BOT)
is the feedback resistor and the R
FB(SL)
TR(TOP)
is the resistor divider on the TRACK/SS pin of
/
the slave regulator, as shown in Figure5.
Following the upper equation, the master’s output slew
rate (MR) and the slave’s output slew rate (SR) in Volts/
Time is determined by:
FB(SL)
MR
R
=
SR
R
TR(TOP)+RTR(BOT)
For example, V
FB(SL)
R
TR(TOP)
OUT(MA)
+ 60.4k
= 1.5V, MR = 1.5V/ms and V
OUT(SL)
= 3.3V, SR = 3.3V/ms. From the equation, we could solve
out that R
TR(TOP)
=60.4k and R
TR(BOT)
= 40.2k is a good
combination for the Ratiometric tracking.
The TRACK pins will have the 1.5µA current source on
when a resistive divider is used to implement tracking on
that specific channel. This will impose an offset on the
TRACK pin input. Smaller values resistors with the same
ratios as the resistor values calculated from the above
equation can be used. For example, where the 60.4k is
used then a 6.04k can be used to reduce the TRACK pin
offset to a negligible value.
The Coincident output tracking can be recognized as a
special Ratiometric output tracking which the master’s
output slew rate (MR) is the same as the slave’s output
slew rate (SR), as waveform shown in Figure6.
Since the slave regulator’s TRACK/SS is connected to
the master’s output through a R
TR(TOP)/RTR(BOT)
resistor
divider and its voltage used to regulate the slave output
voltage when TRACK/SS voltage is below 0.6V, the slave
output voltage and the master output voltage should satisfy
the following equation during the start-up.
R
FB(SL)
R
•
R
+ 60.4k
FB(SL)
R
TR(TOP)
TR(TOP)+RTR(BOT)
=
For more information www.analog.com
V
OUT(SL)
V
OUT(MA)
•
MASTER OUTPUT
SLAVE OUTPUT
TIME
Figure6. Output Coincident Tracking Waveform
Rev B
13
Page 14
LTM4622A
R
R
APPLICATIONS INFORMATION
From the equation, we could easily find out that, in the
coincident tracking, the slave regulator’s TRACK/SS pin
resistor divider is always the same as its feedback divider.
FB(SL)
R
FB(SL)
+ 60.4k
For example, R
=
R
TR(TOP)
good combination for coincident tracking for V
= 1.5V and V
OUT(SL)
= 3.3V application.
TR(BOT)
TR(TOP)+RTR(BOT)
= 60.4k and R
TR(BOT)
= 13.3k is a
OUT(MAX)
Power Good
The PGOOD pins are open drain pins that can be used to
monitor valid output voltage regulation. This pin monitors
a ±8% window around the regulation point. A resistor can
be pulled up to a particular supply voltage for monitoring.
To prevent unwanted PGOOD glitches during transients or
dynamic V
changes, the LTM4622A’s PGOOD falling
OUT
edge includes a blanking delay of approximately 40µs.
Stability compensation
The LTM4622A module internal compensation loop is
designed and optimized for low ESR ceramic output
capacitors only application. Table7 is provided for most
application requirements. The LTpowerCAD Design Tool
is available to down for control loop optimization.
RUN Enable
Pulling the RUN pin to ground forces the LTM4622A into
its shutdown state, turning off both power MOSFETs and
most of its internal control circuitry. Trying the RUN pin
voltage above 1.27V will turn on the entire chip.
Pre-Biased Output Start-Up
There may be situations that require the power supply to
start up with a pre-bias on the output capacitors. In this
case, it is desirable to start up without discharging that
output pre-bias. The LTM4622A can safely power up into
a pre-biased output without discharging it.
The LTM4622A accomplishes this by forcing discontinuous
mode (DCM) operation until the TRACK/SS pin voltage
reaches 0.6V reference voltage. This will prevent the BG
from turning on during the pre-biased output start-up
which would discharge the output.
Overtemperature Protection
The internal overtemperature protection monitors the junc
tion temperature of the module. If the junction temperature
reaches approximately 160°C, both power switches will be
turned off until the temperature drops about 15°C cooler.
Input Overvoltage Protection
In order to protect the internal power MOSFET devices
against transient voltage spikes, the LTM4622A constantly
monitors each V
rises above 22.5V, the regulator suspends operation
V
IN
pin for an overvoltage condition. When
IN
by shutting off both power MOSFETs on the corresponding channel. Once V
drops below 21.5V, the regulator
IN
immediately resumes normal operation. The regulator
executes its soft-start function when exiting an overvolt
age condition.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configura
tion section of the data sheet are consistent with those
parameters defined by JESD51-9 and are intended for
use with finite element analysis (FEA) software modeling
tools that leverage the outcome of thermal modeling,
simulation, and correlation to hardware evaluation per
formed on a µModule package mounted to a hardware test
—also defined by JESD51-9 (Test Boards for Area
board
Array Surface Mount Package Thermal Measurements).
The motivation for providing these thermal coefficients in
found in JESD51-12 (Guidelines for Reporting and Using
Electronic Package Thermal Information).
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to anticipate
the µModule regulator’s thermal performance in their ap
plication at various electrical and environmental operating
conditions to compliment any FEA activities. Without FEA
Rev B
14
For more information www.analog.com
Page 15
APPLICATIONS INFORMATION
AMBIENT
LTM4622A
software, the thermal resistances reported in the Pin Configuration section are in-and-of themselves not relevant to
providing guidance of thermal per
formance; instead, the
derating curves provided in the data sheet can be used in
a manner that yields insight and guidance pertaining to
one’s application usage, and can be adapted to correlate
thermal performance to one’s own application.
The Pin Configuration section typically gives four thermal
coefficients explicitly defined in JESD51-12; these coef
-
ficients are quoted or paraphrased below:
, the thermal resistance from junction to ambi-
θ
1.
JA
ent, is the natural convection junction-to-ambient
air thermal resistance measured in a one cubic foot
sealed enclosure. This environment is sometimes
referred to as still air although natural convection
causes the air to move. This value is determined with
the part mounted to a JE
SD51-9 defined test board,
which does not reflect an actual application or viable
operating condition.
2. θ
JCbottom
, the thermal resistance from junction to
ambient, is the natural convection junction-to-ambient
air thermal resistance measured in a one cubic foot
sealed enclosure. This environment is sometimes
referred to as still air although natural convection
causes the air to move. This value is determined with
the part mounted to a JESD51-9 defined test board,
which does not reflect an actual application or viable
operating condition.
3. θ
, the thermal resistance from junction to top of
JCtop
the product case, is determined with nearly all of the
component power dissipation flowing through the top
of the package. As the electrical connections of the
typical µModule are on the bottom of the package, it
is rare for an application to operate such that most of
the heat flows from the junction to the top of the part.
As in the case of θ
JCbottom
, this value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.
4. θ
, the thermal resistance from junction to the
JB
printed circuit board, is the junction-to-board thermal
resistance where almost all of the heat flows through
the bottom of the µModule and into the board, and
is really the sum of the θ
JCbottom
and the thermal resistance of the bottom of the part through the solder
joints and through a portion of the board. The board
temperature
is measured a specified distance from
the package, using a two sided, two layer board. This
board is described in JESD51-9.
A graphical representation of the aforementioned ther
mal resistances is given in Figure7; blue resistances are
contained within the μModule regulator, whereas green
resistances are external to the µModule.
JUNCTION
µMODULE DEVICE
JUNCTION-TO-AMBIENT THERMAL RESISTANCE COMPONENTS
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
Figure7. Graphical Representation of JESD51-12 Thermal Coefficients
CASE (BOTTOM)-TO-BOARD
RESISTANCE
For more information www.analog.com
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
4622A F07
Rev B
15
Page 16
LTM4622A
APPLICATIONS INFORMATION
As a practical matter, it should be clear to the reader that
no individual or sub-group of the four thermal resistance
parameters defined by JESD51-12 or provided in the Pin
Configuration section replicates or conveys normal op
erating conditions of a μModule. For example, in normal
board-mounted applications, never does 100% of the
’s total power loss (heat) thermally conduct exclu
device
sively through the top or exclusively through bottom of the
µModule—as the standard defines for θ
respectively. In practice, power loss is thermally dissipated
in both directions away from the package—granted, in the
absence of a heat sink and airflow, a majority of the heat
flow is into the board.
Within a SIP (system-in-package) module, be aware there
are multiple power devices and components dissipating
power, with a consequence that the thermal resistances
relative to different junctions of components or die are not
exactly linear with respect to total package power loss. To
reconcile this complication without sacrificing modeling
simplicity—but also, not ignoring practical realities—an
approach has been taken using FEA software modeling
along with laboratory testing in a controlled-environment
chamber to reasonably define and correlate the thermal
resistance values supplied in this data sheet: (1) Initially,
FEA software is used to accurately build the mechanical
geometry of the µModule and the specified PCB with all of
the correct material coefficients along with accurate power
loss source definitions; (2) this model simulates a softwaredefined JEDEC environment consistent with JESD51-12
to predict power loss heat flow and temperature readings
at different interfaces that enable the calculation of the
JEDEC-defined thermal resistance values; (3) the model
and FEA software is used to evaluate the µModule with
heat sink and airflow; (4) having solved for and analyzed
these thermal resistance values and simulated various
operating conditions in the software model, a thorough
laboratory evaluation replicates the simulated conditions
with thermocouples within a controlled-environment
chamber while operating the device at the same power
loss as that which was simulated. An outcome of this
process and due-diligence yields a set of derating curves
provided in other sections of this data sheet. After these
laboratory test have been performed and correlated to the
µModule model, then the θ
and θBA are summed together
JB
JCtop
and θ
JCbottom
-
-
,
to correlate quite well with the µModule model with no
airflow or heat sinking in a properly define chamber. This
+ θBA value is shown in the Pin Configuration section
θ
JB
and should accurately equal the θ
proximately 100% of power loss flows from the junction
through the board into ambient with no air
mounted heat sink.
The 1.5V, 3.3V, 5V, 8V and 12V power loss curves in
Figure8 to Figure12 can be used in coordination with the
load current derating curves in Figure13 to Figure23 for
calculating an approximate θ
LTM4622A (in two-phase single output operation) with no
heat sinking and various airflow conditions. The power loss
curves are taken at room temperature, and are increased
with multiplicative factors of 1.35 assuming junction
temperature at 120°C. The derating curves are plotted
with the output current starting at 4A and the ambient
temperature at 30°C. These output voltages are chosen
to include the lower and higher output voltage ranges
for correlating the thermal resistance. Thermal models
are derived from several temperature measurements in a
controlled temperature chamber along with thermal mod
eling analysis. The junction temperatures are monitored
while ambient temperature is increased with and without
airflow. The power loss increase with ambient temperature
change is factored into the derating curves. The junctions
are maintained at 120°C maximum while lowering output
current or power with increasing ambient temperature. The
decreased output current will decrease the internal module
loss as ambient temperature is increased. The monitored
junction temperature of 120°C minus the ambient operat
ing temperature specifies how much module temperature
rise can be allowed. As an example in Figure16, the load
current is derated to ~3A at ~100°C with 200LFM air but
not heat sink and the power loss for the 5V to 3.3V at 3A
output is about 1.15W. The 1.15W loss is calculated with
the ~0.85W room temperature loss from the 5V to 3.3V
power loss curve at 3A, and the 1.35 multiplying factor.
If the 100°C ambient temperature is subtracted from the
120°C junction temperature, then the difference of 20°C
divided by 1.15W equals a 17.5°C/W θ
tance. Table3 specifies a 17°C/W –
is very close. Tables 2 to 6 provide equivalent thermal
resistances for 1.5V, 3.3V, 5V, 8V and 12V outputs with
JA
value because ap-
JA
flow or top
thermal resistance for the
-
-
thermal resis-
JA
18°C/W value which
Rev B
16
For more information www.analog.com
Page 17
LTM4622A
LOAD CURRENT (A)
0
0.511.522.533.5
4
0
0.5
1.0
1.5
2.0
2.5
POWER LOSS (W)
4622A F08
VIN = 16V
VIN = 12V
VIN = 5V
LOAD CURRENT (A)
0
0.511.522.533.5
4
0
0.5
1.0
1.5
2.0
2.5
POWER LOSS (W)
4622A F09
VIN = 16V
VIN = 12V
VIN = 5V
LOAD CURRENT (A)
0
0.511.522.533.5
4
0
0.5
1.0
1.5
2.0
2.5
POWER LOSS (W)
4622A F10
VIN = 16V
VIN = 12V
LOAD CURRENT (A)
0
0.511.522.533.5
4
0
0.5
1.0
1.5
2.0
2.5
POWER LOSS (W)
4622A F11
VIN = 16V
VIN = 12V
LOAD CURRENT (A)
0
0.511.522.533.5
4
0
0.5
1.0
1.5
2.0
2.5
POWER LOSS (W)
4622A F12
VIN = 16V
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F13
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F14
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F15
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F16
0LFM
200LFM
400LFM
APPLICATIONS INFORMATION
Figure8. 1.5V Output Power LossFigure9. 3.3V Output Power LossFigure10. 5V Output Power Loss
Figure11. 8V Output Power Loss
Figure14. 12V Input to to 1.5V Output
Derating Curve, No Heat Sink
Figure12. 12V Output Power Loss
Figure15. 16V Input to 1.5V Output
Derating Curve, No Heat Sink
For more information www.analog.com
Figure13. 5V Input to 1.5V Output
Derating Curve, No Heat Sink
Figure16. 5V Input to 3.3V Output
Derating Curve, No Heat Sink
Rev B
17
Page 18
LTM4622A
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F17
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F18
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F19
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F20
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F21
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F22
0LFM
200LFM
400LFM
AMBIENT TEMPERATURE (°C)
30405060708090
100
110
120
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
LOAD CURRENT (A)
4622A F23
0LFM
200LFM
400LFM
APPLICATIONS INFORMATION
Figure17. 12V Input to 3.3V Output
Derating Curve, No Heat Sink
Figure20. 16V Input to 5V Output
Derating Curve, No Heat Sink
Figure18. 16V Input to 3.3V Output
Derating Curve, No Heat Sink
Figure21. 12V Input to 8V Output
Derating Curve, No Heat Sink
Figure19. 12V Input to 5V Output
Derating Curve, No Heat Sink
18
Figure22. 16V Input to 8V Derating
Curve, No Heat Sink
For more information www.analog.com
Figure23. 16V Input to 12V Output
Derating Curve, No Heat Sink
Rev B
Page 19
LTM4622A
APPLICATIONS INFORMATION
Table2. 1.5V Output
DERATING CURVEVIN (V)POWER LOSS CURVEAIRFLOW (LFM)HEAT SINKθ
Figures 13, 14, 155, 12, 16Figure80None19–20
Figures 13, 14, 155, 12, 16Figure8200None17–18
Figures 13, 14, 155, 12, 16Figure8400None17–18
Table3. 3.3V Output
DERATING CURVEV
Figures 16, 17, 185, 12, 16Figure90None19–20
Figures 16, 17, 185, 12, 16Figure9200None17–18
Figures 16, 17, 185, 12, 16Figure9400None17–18
Table4. 5V Output
DERATING CURVEV
Figures 19, 2012, 16Figure100None19–20
Figures 19, 2012, 16Figure10200None17–18
Figures 19, 2012, 16Figure10400None17–18
(V)POWER LOSS CURVEAIRFLOW (LFM)HEAT SINKθ
IN
(V)POWER LOSS CURVEAIRFLOW (LFM)HEAT SINKθ
IN
JA(°C/W)
JA(°C/W)
JA(°C/W)
Table5. 8V Output
DERATING CURVEV
Figures21, 225, 12Figure110None19–20
Figures21, 225, 12Figure11200None17–18
Figures21, 225, 12Figure11400None17–18
(V)POWER LOSS CURVEAIRFLOW (LFM)HEAT SINKθ
IN
Table6. 12V Output
DERATING CURVEV
Figure235, 12Figure120None19–20
Figure235, 12Figure12200None17–18
Figure235, 12Figure12400None17–18
(V)POWER LOSS CURVEAIRFLOW (LFM)HEAT SINKθ
IN
JA(°C/W)
JA(°C/W)
For more information www.analog.com
Rev B
19
Page 20
LTM4622A
APPLICATIONS INFORMATION
Table7. Output Voltage Response for Each Regulator Channel vs Component Matrix (Refer to Figure24)
1.0A Load Step Typical Measured Values
C
IN
(CERAMIC)PART NUMBERVALUE
MurataGRM188R61E475KE11# 4.7µF, 25V,
MurataGRM188R61E106MA73# 10µF, 25V,
Taiyo Yuden TMK212BJ475KG-T4.7µF, 25V,
0603, X5R
0603, X5R
0805, X5R
C
OUT1
(CERAMIC)PART NUMBERVALUE
MurataGRM21R60J476ME15#47µF, 6.3V,
MurataGRM188R60J226MEA0# 22µF, 6.3V,
Taiyo
Yuden
JMK212BJ476MG-T47µF, 6.3V,
0805, X5R
0603, X5R
0805, X5R
C
OUT2
(BULK)PART NUMBERVALUE
Panasonic 6TPC150M150µF, 6.3V 3.5
× 2.8 × 1.4mm
C
IN
(CERAMIC)
V
OUT
(V)
1.51001
1.51001 × 4.715005, 12075201.01040.2
2.51001 × 470105, 120112101.01019.1
2.51001 × 4.715005, 12092251.01019.1
3.31001 × 470105, 120144151.01013.3
3.31001 × 4.715005, 120104301.01013.3
51002 × 47010120157251.0108.25
51001 × 4.71500120137501.0108.25
81002 × 47010120234501.0104.87
81002 × 4.71500120149701.0104.87
121003 × 47010160301501.0103.16
121003 × 4.71500160177801.0103.16
(μF)
C
IN
(BULK)
C
C
OUT1
(CERAMIC)
(μF)
× 470105, 12089101.01040.2
OUT2
(BULK)
(μF)
C
FF
(pF)VIN (V)
DROOP
(mV)
P-P
DERIVATION
(mV)
RECOVERY
TIME (μs)
LOAD
STEP (A)
LOAD STEP
SLEW RATE
(A/μs)
(kΩ)
R
FB
20
Rev B
For more information www.analog.com
Page 21
APPLICATIONS INFORMATION
LTM4622A
and without airflow. The derived thermal resistances in
Tables 2 to 6 for the various conditions can be multiplied
by the calculated power loss as a function of ambient
temperature to derive temperature rise above ambient,
thus maximum junction temperature. Room temperature
power loss can be derived from the efficiency curves in
the Typical Performance Characteristics section and ad
justed with the above ambient temperature multiplicative
factors. The printed cir
layer board with two ounce copper for the two outer layers
and one ounce copper for the two inner layers. The PCB
dimensions are 95mm × 76mm.
cuit board is a 1.6mm thick four
-
Figure 24 and Figure 25 show measured temperature
picture of the LTM4622A with no heat sink from 12V
input down to 3.3V and 5V output with 2A DC current on
each and from 12V down to 5V and 8V output with 2A
DC current on each. Both without heat sink and airflow.
SAFETY CONSIDERATIONS
The LTM4622A modules do not provide galvanic isolation
from V
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure. The device does support thermal
shutdown and over current protection.
IN
to V
. There is no internal fuse. If required,
OUT
For more information www.analog.com
Rev B
21
Page 22
LTM4622A
APPLICATIONS INFORMATION
Figure24. Thermal Image, 12V Input, 3.3V and 5V Output,
2AEach, No Airflow and No Heat Sink
22
Figure25. Thermal Image, 12V Input, 5V and 8V Output,
2AEach, No Airflow and No Heat Sink
Rev B
For more information www.analog.com
Page 23
APPLICATIONS INFORMATION
4622A F26
LTM4622A
LAYOUT CHECKLIST/EXAMPLE
The high integration of LTM4622A makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con
-
siderations are still necessary.
Use large PCB copper areas for high current paths,
•
, V
including V
IN1
, GND, V
IN2
OUT1
and V
OUT2
. It helps
to minimize the PCB conduction loss and thermal
stress.
• Place high frequency ceramic input and output capaci
tors next to the V
, PGND and V
IN
pins to minimize
OUT
-
high frequency noise.
• Place a dedicated power ground layer underneath
theunit.
• The two dedicated input decoupling capacitors, one for
each V
, closely placed on each side of the module.
IN
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put via directly on the pad, unless they are
capped or plated over.
• Use a separated SGND ground copper area for com
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
• For parallel modules, tie the V
, VFB, and COMP pins
OUT
together. Use an internal layer to closely connect these
pins together. The TRACK pin can be tied a common
capacitor for regulator soft-start.
• Bring out test points on the signal pins for monitoring.
Figure26 gives a good example of the recommended layout.
GND
V
OUT1
V
IN1
Figure26. Recommended PCB Layout
V
OUT2
V
IN2
For more information www.analog.com
Rev B
23
Page 24
LTM4622A
8V TO 20V
OUT2
5V, 2A
3.3V, 4A
PGOOD
4V TO 20V
OUT2
8V, 2A
16V TO 20V
APPLICATIONS INFORMATION
10µF
V
IN
10µF
0.1µF
0.1µF
PGOOD1 PGOOD2
RUN1
V
IN1
V
IN2
RUN2
LTM4622A
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
GND
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
4622A F27
8.25k
47µF
47µF
V
OUT1
3.3V, 2A
13.3k
Figure27. 8VIN to 20VIN, 3.3V and 5V Output at 2A Design
10µF
V
IN
10µF
0.1µF
PGOOD1 PGOOD2
RUN1
V
IN1
V
IN2
RUN2
LTM4622A
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
GND
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
4622A F28
47µF
×2µF
6.65k
V
V
OUT
Figure29. 16V
Figure28. 4VIN to 20VIN, 3.3V Two Phase in Parallel 4A Design
10µF
V
IN
10µF
0.1µF
0.1µF
to 20VIN, 12V and 8V Output at 2A with 2MHz Switching Frequency
IN
PGOOD1 PGOOD2
RUN1
V
IN1
V
IN2
RUN2
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
324k
LTM4622A
GND
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
4.87k
47µF
4622A F29
47µF
V
OUT1
12V, 2A
V
3.16k
Rev B
24
For more information www.analog.com
Page 25
APPLICATIONS INFORMATION
3.3V, 2A
4V TO 20V
1.5V, 8A
PGOOD
INTV
LTM4622A
RUN1
V
V
RUN2
INTV
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
13.3k
IN1
IN2
PGOOD1 PGOOD2
LTM4622A
CC
COMP1
COMP2
GND
V
OUT1
V
OUT2
4622A F30
FB1
FB2
13.3k
47µF
47µF
V
OUT1
1.5V, 2A
40.2k
V
OUT2
10µF
V
IN
10µF
60.4k
V
OUT1
0.1µF
Figure30. 4VIN to 20VIN, 1.5V and 3.3V Output at 2A Design with Output Coincident Tracking
PGOOD1 PGOOD2
V
V
IN
4V TO 20V
200k
LTC6902
+
CC
1µF
V
DIV
PH
OUT1
OUT2
SET
MOD
GND
OUT4
OUT3
10µF
×4
0.1µF
IN1
V
IN2
RUN1
RUN2
LTM4622A
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
PGOOD1 PGOOD2
V
IN1
V
IN2
RUN1
RUN2
LTM4622A
INTV
CC
SYNC/MODE
TRACK/SS1
TRACK/SS2
FREQ
V
OUT1
V
OUT2
COMP1
COMP2
FB1
FB2
GND
PGOOD
V
OUT1
V
OUT2
COMP1COMP
COMP2
FB1
FB2
GND
4622A F31
COMP
FB
10k
FB
47µF
×4
V
OUT
Figure31. 4 Phase, 1.5V Output at 8A Design with LTC6902
For more information www.analog.com
Rev B
25
Page 26
LTM4622A
PACKAGE DESCRIPTION
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY.
Please refer to http://www.linear.com/product/LTM4622A#packaging for the most recent package drawings.
7
SEE NOTES
PIN 1
E
D
C
B
A
12345
DETAIL A
G
PACKAGE BOTTOM VIEW
3
SEE NOTES
e
F
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010
5. PRIMARY DATUM -Z- IS SEATING PLANE
7PACKAGE ROW AND COLUMN LABELING MAY VARY
6. THE TOTAL NUMBER OF PADS: 25
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
LTM4622A
µModule
LTMXXXXXX
BEVEL
TRAY PIN 1
PIN “A1”
COMPONENT
A
H1
SUBSTRATE
H2
(Reference LTC DWG # 05-08-1949 Rev Ø)
25-Lead (6.25mm×6.25mm × 1.82mm)
X
Y
E
MOLD
D
CAP
aaa Z
DETAIL B
Z
DETAIL B
// bbb Z
Øb (25 PLACES)
PACKAGE TOP VIEW
YXZØ eee
S
0.000
2.540
1.270
0.3175
0.3175
1.270
2.540
DETAIL A
NOTES
1.92
MAX
1.82
NOM
DIMENSIONS
MIN
1.72
A
SYMBOL
0.66
0.63
6.25
0.60
bDE
SUGGESTED PCB LAYOUT
6.25
1.27
e
TOP VIEW
5.08
F
5.08
G
0.37
0.32
0.27
H1
1.55
1.50
1.45
H2
0.15
aaa
0.10
bbb
0.15
TOTAL NUMBER OF LGA PADS: 25
eee
aaa Z
CORNER
PIN “A1”
0.3175
0.3175
1.270
Rev B
27
1.270
4
2.540
For more information www.analog.com
2.540
Page 28
LTM4622A
0.000
0517 REV A
BGA Package
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTM4622A#packaging for the most recent package drawings.
6
SEE NOTES
PIN 1
E
D
C
B
A
12345
DETAIL A
G
PACKAGE BOTTOM VIEW
Z
3
SEE NOTES
e
F
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
!
6PACKAGE ROW AND COLUMN LABELING MAY VARY
5. PRIMARY DATUM -Z- IS SEATING PLANE
LAYOUT CAREFULLY
µModule
LTMXXXXXX
COMPONENT
PIN “A1”
BGA 25
PACKAGE IN TRAY LOADING ORIENTATION
BEVEL
TRAY PIN 1
A
A2
Z
MOLD
CAP
H1
SUBSTRATE
H2
aaa Z
A1
b1
(Reference LTC DWG # 05-08-1502 Rev A)
25-Lead (6.25mm×6.25mm × 2.42mm)
ccc Z
X
Y
E
D
DETAIL B
PACKAGE SIDE VIEW
DETAIL B
// bbb Z
Øb (25 PLACES)
PACKAGE TOP VIEW
X YZddd
M
NOTES
BALL HT
BALL DIMENSION
PAD DIMENSION
2.62
0.70
1.92
0.90
1.82
1.72
0.75
0.60
0.66
0.63
0.60
6.25
6.25
1.27
MAX
Zeee
M
DIMENSIONS
2.42
NOM
MIN
2.22
0.60
0.50
5.08
5.08
SUBSTRATE THK
0.37
0.32
0.27
MOLD CAP HT
1.55
0.15
0.10
0.20
1.50
1.45
0.30
0.15
TOTAL NUMBER OF BALLS: 25
DETAIL A
e
F
D
b1
TOP VIEW
E
G
H1
H2
aaa
ccc
ddd
eee
bbb
0.000
2.540
1.270
0.3175
0.3175
1.270
2.540
A
SYMBOL
b
A1
A2
SUGGESTED PCB LAYOUT
28
aaa Z
CORNER
PIN “A1”
0.3175
0.3175
1.270
Rev B
1.270
4
2.5400.630 ±0.025
2.540
For more information www.analog.com
Page 29
LTM4622A
REVISION HISTORY
REVDATEDESCRIPTIONPAGE NUMBER
A11/17Corrected Pin Configuration. Swapped V
B4/18Corrected R
to GND9, 11
FSET
IN1
and V
.2
IN2
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Formoreinformationwww.analog.com
Rev B
29
Page 30
LTM4622A
PACKAGE PHOTOS
DESIGN RESOURCES
SUBJECTDESCRIPTION
µModule Design and Manufacturing ResourcesDesign:
• Selector Guides
• Demo Boards and Gerber Files
• Free Simulation Tools
µModule Regulator Products Search1. Sort table of products by parameters and download the result as a spread sheet.
2. Search using the Quick Power Search parametric table.
Manufacturing:
• Quick Start Guide
• PCB Design, Assembly and Manufacturing Guidelines
• Package and Board Level Reliability
TechClip VideosQuick videos detailing how to bench test electrical and thermal performance of µModule products.
Digital Power System ManagementLinear Technology’s family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
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